PowerQUICC Communications Processor

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1 PowerQUICC Communications Processor MPC8548 Product Family Rev. 2.1/2.1.1, and Lead PBGA Package ATMC/Global Foundries 90nm SOI CMOS Qualification Report Standard C5 Spheres: 62% Sn, 36% Pb, 2% Ag MPC8548EPXA/B/C/D MPC8547EPXA/B/C/D MPC8545EPXA/B/C/D MPC8543EPXA/B/C/D MPC8548PXA/B/C/D MPC8547PXA/B/C/D MPC8545PXA/B/C/D MPC8543PXA/B/C/D Pb Free C5 Spheres: 96.5% Sn, 3.5% Ag MPC8548EVTA/B/C/D MPC8547EVTA/B/C/D MPC8545EVTA/B/C/D MPC8543EVTA/B/C/D MPC8548VTA/B/C/D MPC8547VTA/B/C/D MPC8545VTA/B/C/D MPC8543VTA/B/C/D Technology: ATMC/Global Foundries CMOS 90 SOI Package:783leadfree PBGA Page 1 of 8

2 Product Information Product / Technology / Fab / Package Description Package 783 FC-PBGA (PX, VT), 29x29, with footed lid (Rev 2.x) or stamped lid (Rev 3.1.2) Device MPC8548 PowerQUICC 38 Rev Mask Set 5M39E[2.1], 6M39E[2.1.1], 7ME39E[2.1.2], N06D[3.1.2] Die Coating(s) Polyimide Name/ Location of Die Fab Facility ATMC / Austin TX, Global Foundries (Singapore) Process Technology 90nm SOI Poly / Metal layers 1P / 7M, 8M (Global Foundries) Assembly Location Freescale, ASE C4 Bump Location Freescale Chandler, Arizona; Amkor T5, Taiwan Moisture Sensitivity Level MSL3 / 260 C Reflow C5 Sphere Composition Standard: 62% Sn, 36% Pb, 2% Ag Pb Free: 96.5% Sn, 3.5% Ag Substrate Supplier Supplier A and Supplier B (N06D) Technology: ATMC/Global Foundries CMOS 90 SOI Package:783leadfree PBGA Page 2 of 8

3 MPC8548 Rev 2.1 Product Reliability Data Summary High Temperature Operating Life Test (HTOL) V 1.4V, Tj 130ºC Lot / Mask Set / Rev 5 Years 10 +Years (1008 h) DD36847/ 5M39E / Rev / / 137 DD36849 / 5M39E / Rev / 41 0 / 36 D37726 / 5M39E/ Rev / / 105* DD46455 / 6ME39E / Rev / / 203 DD53109 / 7ME39E / Rev / 191** 0 / 189 Totals 1 / 758** 1 / 670* *FA confirmed this to the absence of a redundant via. New Mask spun Rev with addition of redundant via in design and HTOL 1008 hrs /10 years validated corrective action. ** L2 dcache, suspect 1 bit shorted to another but FA unable to determine root cause. 1/670 at a 1008 hrs meets a Fit Rate of 31 at 60% CL [spec<50 Fits] Also meets LTPD criteria of ~ 2 for rev ESD summary Lot / Mask Set / Rev HBM / 2KV (Qual Requirement) MM / 150V MM / 200V (Qual Requirement) CDM / 100V CDM / 200V CDM / 500V (Qual Requirement) LatchUP +/- 500 ma DD20194 / 1M39E / Rev / 3-3 / 3 3 / 3 DD21745 / 1M39E / Rev / / 3 DD21530 / 1M39E / Rev / 3-3 / 3 3 / 3 DD23241 / 1M39E / Rev / 3 2 / 2 0/2 2 / 2 2 / 2 DD22214 / 1M39E / Rev /2 2 / 2 3 / 4 DD22877 / 1M39E / Rev / 3 0 / 3 DD22878 / 1M39E / Rev / 3 0 / 3 0 / 3 DD21209 / 1M39E / Rev / 4 DD24399 / 1M39E / Rev / 3 0 / 3 DD27620 / 2M39E / Rev / 2 2 / 2 0 / 2 2 / 2 0 / 3 DD36847 / 5M39E / Rev / 2 0 / 2 2 / 2 0 / 2 0 / 2 2 / 2 0 / 5 Totals 0 / 17 0 / / 12 0 / 8 6 / 8 11/12 0 / 18 Per Errata : ESD Errata already communicated to customer Note: For ESD Zap no sockets are used for CDM Non-SerDes pins pass CDM ESD at 500V. Technology: ATMC/Global Foundries CMOS 90 SOI Package:783leadfree PBGA Page 3 of 8

4 Non- SerDes pins pass MM ESD at 200V. MPC8548 ATMC 90nm SOI 783 Lead 29mm FC-PBGA Package Qualification Moisture Sensitivity Level 3 Characterization Assy Site / Substrate Supplier / Lots MSL3 / 260ºC ASE / Supplier A / DD / 80 ASE / Supplier A / DD / 80 ASE / Supplier A / DD / 80 Totals 0 / 240 Temperature Cycle / -55ºC to 125ºC Air to Air with MSL3 / 260ºC IR Reflow Assy Site / Substrate Supplier / Lots 500 Cycles 1000 Cycles ASE / Supplier A / DD / 80 0 / 80 ASE / Supplier A / DD / 80 0 / 80 ASE / Supplier A / DD / 80 0 / 80 Totals 0 / / 240 Temperature Humidity Bias / 85ºC, 85%R.H., 1.0v with MSL3 / 260ºC IR Reflow ASE / Supplier A / DD / 15 1 / 15* ASE / Supplier A / DD / 15 1 / 15* ASE / Supplier A / DD / 15 0 / 15 Totals 0 / 45 2 / 45* * FA showed dendrite growth on capacitors caused the failures. Corrective action solder on pad implemented and confirmed To pass THB 1008 hrs below. ASE / Supplier A / DD / 15 0 / 15 ASE / Supplier A / DD / 15 0 / 15 ASE / Supplier A / DD / 15 0 / 15 Totals 0 / 45 0 / 45 High Temperature Bake / 150ºC ASE / Supplier A / DD / 80 0 / 80 ASE / Supplier A / DD / 80 0 / 80 ASE / Supplier A / DD * / 80 1* / 79 Totals 1 */ 240 1* / 239 *FA confirmed this to the absence of a redundant via. New Mask spun Rev spun with addition of redundant via in design and Technology: ATMC/Global Foundries CMOS 90 SOI Package:783leadfree PBGA Page 4 of 8

5 Bake on 1 lot was run again to 10 years ASE / Supplier A / DD / 80 0 / 80 Totals 0 / 80 0 / 80 uhast / 130 C/85%RH/33.3PSI, with MSL3 / 260ºC IR Reflow Assy Site / Substrate Supplier / Lots 96 Hours ASE / Supplier A / DD / 80 ASE / Supplier A / DD / 80 ASE / Supplier A / DD / 80 Totals 0 / 240 Autoclave / 121 C/100%RH/15PSI, with MSL3 / 260ºC IR Reflow Assy Site / Substrate Supplier / Lots 96 Hours ASE / Supplier A / DD / 80 ASE / Supplier A / DD / 80 ASE / Supplier A / DD / 80 Totals 0 / 240 MPC8548 Rev Product Reliability Data Summary Global Foundries (Singapore) High Temperature Operating Life Test (HTOL) V 1.4V, Tj 130ºC Lot / Mask Set / Rev 168 Hrs 5 Years (504 Hrs) 10 +Years (1008 Hrs) QA / N06D / Rev / / / 120 QA / N06D / Rev / / 124 Totals 0 / / / 120 Electrostatic Discharge (ESD) Lot / Mask Set / Rev HBM / 2kV MM / 200V CDM / 500V QA / N06D / Rev / 5 0 / 5 0 / 5 QA / N06D / Rev / 5 0 / 5 0 / 5 Totals 0 / 10 0 / 10 0 / 10 High Temperature Bake / 150ºC QA / Supplier A / N06D / Rev / 48 0 / 48 XHE0G61100 / Supplier B / NO6D / Rev / 80 0 / 80 QA / Supplier A / N06D / Rev / 45 0 / 45 Totals 0 / / 173 Technology: ATMC/Global Foundries CMOS 90 SOI Package:783leadfree PBGA Page 5 of 8

6 Moisture Sensitivity Level 3 Characterization Assy Site / Substrate Supplier / Lots MSL3 / 260ºC ASE / Supplier A / XHB8G / 10 ASE / Supplier A / XHB8G / 10 ASE / Supplier A / XHB8G / 10 ASE / Supplier B / XHD5G / 10 ASE / Supplier B / XHD7G / 10 ASE / Supplier B / XHE5G / 10 Totals 0 / 60 Temperature Cycle / -55ºC to 125ºC Air to Air with MSL3 / 260ºC IR Reflow Assy Site / Substrate Supplier / Lots 400 Cycles 700 Cycles 1000 Cycles ASE / Supplier A / DD / 80 0 / 80 0 / 80 ASE / Supplier A / DD / 80 0 / 80 0 / 80 ASE / Supplier A / DD / 80 0 / 80 0 / 80 ASE / Supplier B / XHD5G / 82 0 / 82 0 / 82 ASE / Supplier B / XHD7G / 80 0 / 80 0 / 80 ASE / Supplier B / XHE5G / 80 0 / 80 0 / 80 Totals 0 / / / 482 Temperature Humidity Bias / 85ºC, 85%R.H., 1.0v with MSL3 / 260ºC IR Reflow (using MPC8533/36/72 and 8548) Assy Site / Substrate Supplier / Lots 1008 Hours MPC / 45 MPC / 45 MPC / 45 ASE / Supplier B / XHD5G / 25 ASE / Supplier B / XHD7G / 25 ASE / Supplier B / XHE5G / 25 Totals 0 / 210 uhast / 130 C/85%RH/33.3PSI, with MSL3 / 260ºC IR Reflow Assy Site / Substrate Supplier / Lots 96 Hours ASE / Supplier B / XHD5G / 80 ASE / Supplier B / XHD7G / 80 ASE / Supplier B / XHE5G / 80 Totals 0 / 240 Technology: ATMC/Global Foundries CMOS 90 SOI Package:783leadfree PBGA Page 6 of 8

7 Fit Rate (Failures/1E9 Device Hours) FITs vs Junction Temperature: MPC8548 Thermal and Voltage Acceleration ea = 0.7 ev, Beta = 10.5, 60% Confidence V 1 V 1.1 V Tj 0.9 V 1 V 1.1 V C C C Junction Temperature ( C) Technology: ATMC/Global Foundries CMOS 90 SOI Package:783leadfree PBGA Page 7 of 8

8 MTBF (years) MTBF vs Junction Temperature: MPC8548 Thermal and Voltage Acceleration ea = 0.7 ev, Beta = 10.5, 60% Confidence 1.00E E E E E E E E+01 Tj 0.9 V 1 V 1.1 V 85 C 1.0E+5 3.5E+4 1.2E+4 90 C 7.3E+4 2.5E+4 8.9E C 3.0E+4 1.0E+4 3.7E V 1 V 1.1 V 1.00E Junction Temperature ( C) Revision History Revision History Revision Date Comment Author Original 1/31/08 MPC8548 Rev 2.1 Final Qualification Report Indira Gupta Rev 1 7/7/2008 MPC8548 Rev Final Qualification Report Indira Gupta Rev 2 3/2/2009 MPC8548 Rev Final Qualification Report Indira Gupta Rev 3 12/5/2011 MPC8548 Rev Global Foundries and Amkor C4 bump qualification data added Dean Dreier Rev 3.1 2/28/2012 Substrate B supplier data added (N06D) Dean Dreier Technology: ATMC/Global Foundries CMOS 90 SOI Package:783leadfree PBGA Page 8 of 8

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