Using PCIe in Mobile Devices Ofer Rosenberg Senior Staff Engineer Qualcomm Israel LTD
|
|
- Julia Richards
- 6 years ago
- Views:
Transcription
1 Using in Mobile Devices Ofer Rosenberg Senior Staff Engineer Qualcomm Israel LTD 1
2 Disclaimer Presentation Disclaimer: All opinions, judgments, recommendations, etc. that are presented herein are the opinions of the presenter of the material and do not necessarily reflect the opinions of the PCI-SIG. 2
3 Contents Introduction: at Qualcomm Technologies Inc. (QTI) Case Study in MDM QTI Perspective Qualcomm Snapdragon is a product of Qualcomm Technologies Inc. 3
4 Importance to QTI QTI ships around a Billion Application Processors each year Each has one or more Root Complexes Key interface for communicating with Modem/Wi-Fi devices QTI ships XX Modem devices each year Connect as end-points Key interface for connecting the device to QTI or 3 rd Party Application Processors 4
5 Few years ago, QTI identified the need for long-term solution for highspeed Chip-to-Chip (C2C) connection TPT (bps) Motivation Modem, Wifi and Storage speeds increase Existing serial interfaces speed became a bottleneck Needed a long term, evolving, high speed interface which will meet future speed increase a n (20MHz) n (40MHz) ac (wave1) ac (wave2) 54M 300M 600M 1.3G 6.7G Max DL rate (bps) WCDMA HSPA HSPA+ LTE CAT 3 CAT 5 CAT K 14M 28M 100M 300M 450M Max UL rate (bps) 128K 5.7M 11M 51M 75M 100M was chosen due to its extendibility, design philosophy, features and power management capabilities 5
6 at QTI QTI develops both Root-Complex and End-Point Root Complex: Qualcomm Snapdragon Application Processors provide Root-Complex Port/s Qualcomm Server Chips will arrive with Multiple Root Complex Ports End-Point: Qualcomm Gobi Modems connect as EP WLAN Devices connect using EP WiGig Devices connect using EP Other QTI Three Pillars of use High-End C2C High-End Expansion Bus Embedded /Mobile C2C * Qualcomm Gobi is a product of Qualcomm Technologies Inc. 6
7 Mobile Device Chipset Audio Codec Application Processor Modem Storage Wi-Fi Camera WiGig Display 7
8 Case Study in Mobile Data Modem (MDM) Chipset (at system level, including L1ss) 8
9 in Mobile Devices Example for Common Usage: Application Processor connected to External Modem Samsung Galaxy Note 4 9
10 Smart Devices Advantage devices are smart Access different entities inside the SoC (pending on access rights) Autonomously handle data transfers (reads and writes) The Direct & Autonomous access has SoC power management advantages Access Modules & DDR without waking the CPU Access Modules with standalone memory without waking the DDR DDR Mem Interface CPU Modem Chipset Module B Module A SMMU RAM RC EP Application Processor 10
11 Typical LTE Activity LTE works in Bursts of 1mSec The device issues a burst of data write (downlink) and read (uplink), and then remains silent until next subframe Burst length depends on generation (CAT 1-10) Ideal for smart devices which know to handle power states subframe 1mSec #0 #1 #2 #3 #18 #19 Radio Frame 10mSec CAT 1 CAT 2 CAT 3 CAT 5 CAT 10 Max DL rate (bps) Max UL rate (bps) 10M 50M 100M 300M 450M 5M 25M 51M 75M 100M 11
12 Power States Link Initialization L3 L0s FTS Active EIOS L0 PM Msgs. Power ON L2/L3 Ready Power OFF Tx Idle ASPM Msgs. Link Recovery WAKE# Vaux L2 PLL / PIPE RX Idle Detect L0 On On On L1.0 Off On On L1.1 Off Off On L1Mode Substates L1.2 Off Off Off Tx Comn CLKREQ# De-Assert LTR < Threshold L1.1 CLKREQ# Assert L1 (L1.0) CLKREQ# Assert CLKREQ# De-Assert LTR >= Threshold L1.2 12
13 Race to Idle Philosophy The Basics L1.2àL0 L0 L0àL1.0 L1.0 L1.0àL1.1 L1.1 Resume Transmit as fast as possible ( 1/2/3 ) Go back to low-power state L1.2 The Challenges Buffering UL/DL sync Correctly Select L1.1 / L1.2 Link 1mSec. 1mSec. 1mSec 13
14 System Perspective Link inactivity Short intervals, such as 1mSec frames Longer intervals due to data link inactivity Power management is a joint HW-SW effort HW manages short interval transitions (L1ss L0) Host / SW manages deeper transitions (D0 D3/L2) Host & Device in Low Power Host : Low Power Device : Low Power : D3cold / L2 Device enters/exists Low power Device in Low Power Normal Operation Host in Low Power Host : ON Device : Low Power : D0 / L1ss Device enters/exists Low power Host : ON Device : ON : D0 / ASPM Host enters/exists Low power Host : Low Power Device : On : D3cold / L2 14
15 SUMMARY 15
16 QTI Perspective Full-Fledge topology QTI Mobile typical usage Host CPU Application Processor Root Root Root Switch EndPoint EndPoint EndPoint EndPoint Switch EndPoint EndPoint EndPoint PCI Adapter Bridge PCI-X Adapter Single Bus/Device per RC (Very) Short links Frequent switch between Active & Low-Power 16
17 QTI Perspective What do we like in? Highly extendable interface, from 2.5 GT/s x1 to 8 GT/s x16 Philosophy of Smart devices: Initiate data transactions Handle power state changes Advanced capabilities (TC, MSI, TPH, ATS, IOV and more ) Low-Power States What would we like to enhance in? Optimized behavior for Low-Power / Chip-to-Chip scenarios Revisit Legacy features (such as ECAM) Revisit LTSSM, up/down link time, etc. Enhanced support in interconnect fabrics Example: Ordering Rules 17
18 QTI Vision for Power States transitions cleanup (redundant states, reduce min. duration) Improve Support in Advanced System Buses Optimize Chip-to-Chip scenarios Standardize handling of Host power states More 18
19 TIME FOR QUESTIONS 19
20 Disclaimer Qualcomm Snapdragon and Gobi are trademarks of Qualcomm Incorporated, registered in the United States and other countries, used with permission. Other product and brand names may be trademarks or registered trademarks of their respective owners 20
21 Thank you for attending the Israel 2015 For more information please go to 21
Using PCIe in Mobile Devices Jim Panian Director, Technical Standards Qualcomm Technologies, Inc.
Using in Mobile Devices Jim Panian Director, Technical Standards Qualcomm Technologies, Inc. 1 Disclaimer Presentation Disclaimer: All opinions, judgments, recommendations, etc. that are presented herein
More informationOur Wireless Advantage
Americas Summit Our Wireless Advantage Wireless is The Foundation in Innovation, Development and Commercialization RAJESH PANKAJ, Senior Vice President, Engineering 1 The Fundamental Reason to Buy Smart
More informationPCIe 3.0 Compliance Testing Dan Froelich Serial Enabling Workgroup Co-Chair
PCIe 3.0 Compliance Testing Dan Froelich Serial Enabling Workgroup Co-Chair Copyright 2015, PCI-SIG, All Rights Reserved 1 Agenda PCIe Compliance Program Status PCIe Compliance Process Compliance Test
More informationPeripheral Component Interconnect - Express
PCIe Peripheral Component Interconnect - Express Preceded by PCI and PCI-X But completely different physically Logical configuration separate from the physical configuration Logical configuration is backward
More informationPCI-SIG ENGINEERING CHANGE NOTICE
TITLE: PCI-SIG ENGINEERING CHANGE NOTICE Optimized Buffer Flush/Fill DATE: Updated 30 April 2009, original request: 8 February 2008 AFFECTED DOCUMENTS: SPONSORS: Part I PCI Express Base Specification,
More informationPCI Express Base Specification Revision 3.0. November 10, 2010
PCI Express Base Specification Revision 3.0 November 10, 2010 Revision Revision History DATE 1.0 Initial release. 07/22/2002 1.0a Incorporated Errata C1-C66 and E1-E4.17. 04/15/2003 1.1 Incorporated approved
More information5G Design and Technology. Durga Malladi SVP Engineering Qualcomm Technologies, Inc. October 19 th, 2016
5G Design and Technology Durga Malladi SVP Engineering Qualcomm Technologies, Inc. October 19 th, 2016 Mobile fueled the last 30 years interconnecting people 1980s Analog voice 1990s Digital voice 2000s
More informationThe Internet of Everything. Pete Lancia Sr. Dir., Marketing
The Internet of Everything Pete Lancia Sr. Dir., Marketing 1 The Internet of Everything The Next Era of Networking and Computing, Where Everything is Intelligently Connected 2 The Internet of Everything
More informationSoftware Defined Modem A commercial platform for wireless handsets
Software Defined Modem A commercial platform for wireless handsets Charles F Sturman VP Marketing June 22 nd ~ 24 th Brussels charles.stuman@cognovo.com www.cognovo.com Agenda SDM Separating hardware from
More informationHSPA+ R8. February 2009
HSPA+ R8 February 2009 Disclaimer Nothing in this presentation is an offer to sell any of the parts referenced herein. This presentation may reference and/or show images of parts and/or devices utilizing
More informationPCI Express Base Specification Revision 4.0 Version 0.3. February 19, 2014
PCI Express Base Specification Revision 4.0 Version 0.3 February 19, 2014 Revision Revision History DATE 1.0 Initial release. 07/22/2002 1.0a Incorporated Errata C1-C66 and E1-E4.17. 04/15/2003 1.1 Incorporated
More informationIntroduction Electrical Considerations Data Transfer Synchronization Bus Arbitration VME Bus Local Buses PCI Bus PCI Bus Variants Serial Buses
Introduction Electrical Considerations Data Transfer Synchronization Bus Arbitration VME Bus Local Buses PCI Bus PCI Bus Variants Serial Buses 1 Most of the integrated I/O subsystems are connected to the
More informationRISC-V: Opportunities and Challenges in SoCs
December 5, 2018 @qualcomm Santa Clara, CA RISC-V: Opportunities and Challenges in SoCs Greg Wright Sr Director, Engineering Qualcomm Technologies, Inc. Introductions Who am I? Why am I here? 2 Quick tour
More informationBuilding dense NVMe storage
Building dense NVMe storage Mikhail Malygin, Principal Software Engineer Santa Clara, CA 1 Driven by demand Demand is changing From traditional DBs to NO-SQL Average NO-SQL DB size: 300TB Analytics is
More informationMaking Mobile 5G a Commercial Reality. Peter Carson Senior Director Product Marketing Qualcomm Technologies, Inc.
Making Mobile 5G a Commercial Reality Peter Carson Senior Director Product Marketing Qualcomm Technologies, Inc. Insatiable global data demand First phase of 5G NR will focus on enhanced MBB Enhanced mobile
More informationRon Emerick, Oracle Corporation
PCI Express PRESENTATION Virtualization TITLE GOES HERE Overview Ron Emerick, Oracle Corporation SNIA Legal Notice The material contained in this tutorial is copyrighted by the SNIA unless otherwise noted.
More informationThe mobile computing evolution. The Griffin architecture. Memory enhancements. Power management. Thermal management
Next-Generation Mobile Computing: Balancing Performance and Power Efficiency HOT CHIPS 19 Jonathan Owen, AMD Agenda The mobile computing evolution The Griffin architecture Memory enhancements Power management
More informationPCIe driver development for Exynos SoC
PCIe driver development for Exynos SoC Korea Linux Forum 2013 Jingoo Han Samsung Electronics Introduction S/W engineer at Samsung Electronics since 2005 Linux kernel development for Samsung Exynos ARM
More informationSD Express Cards with PCIe and NVMeTM Interfaces
SD Express Cards with PCIe and NVMeTM Interfaces White Paper June 2018 Conditions for publication Publisher and Copyright Holder: SD Association 2400 Camino Ramon, Suite 375 San Ramon, CA 94583 USA Telephone:
More informationBandRich E600 ODU. E700/E700A/E600/E600A LTE Pro Outdoor CPE(Made in Taiwan) Introduction and Examples
BandRich E600 ODU E700/E700A/E600/E600A LTE Pro Outdoor CPE(Made in Taiwan) Introduction and Examples BandRich Strategic Partnerships Business licensee partner since 2006 Modem/Wi-Fi/Router chipsets supplier
More informationSnapdragon S4 System on Chip
Snapdragon S4 System on Chip Analyst Webinar 10/19/2011 2011 QUALCOMM Incorporated. All rights reserved. 1 2011 QUALCOMM Incorporated. All rights reserved. 2 New Snapdragon Brand and Roadmap Features Overview
More information5 GHz for consumers. Guillaume Lebrun Director 7 th June 2016
5 GHz for consumers Guillaume Lebrun Director 7 th June 2016 More data to more devices in more places ~75% 25-50B Mobile traffic that will be rich content & video 1 by 2020 Connected devices 2 and IoT
More informationBus Example: Pentium II
Peripheral Component Interconnect (PCI) Conventional PCI, often shortened to PCI, is a local computer bus for attaching hardware devices in a computer. PCI stands for Peripheral Component Interconnect
More informationAN 690: PCI Express DMA Reference Design for Stratix V Devices
AN 690: PCI Express DMA Reference Design for Stratix V Devices an690-1.0 Subscribe The PCI Express Avalon Memory-Mapped (Avalon-MM) DMA Reference Design highlights the performance of the Avalon-MM 256-Bit
More informationIntel Virtualization Technology Roadmap and VT-d Support in Xen
Intel Virtualization Technology Roadmap and VT-d Support in Xen Jun Nakajima Intel Open Source Technology Center Legal Disclaimer INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS.
More information5g for connected industries
5g for connected industries Johan Torsner Research Manager Ericsson Finland Page 1 5G Use Cases P??? Broadband experience everywhere anytime Mass market personalized media and gaming Meters and sensors,
More informationMaking 5G NR a commercial reality
Making 5G NR a commercial reality Ultra-high fidelity media anywhere Immersive entertainment Safer, more autonomous transportation Connectivity is the new Electricity Reliable access to remote healthcare
More informationPCI Express TM. Architecture. Configuration Space Test Considerations Revision 1.0
PCI Express TM Architecture Configuration Space Test Considerations Revision 1.0 April 26, 2004 REVISION REVISION HISTORY DATE 1.0 Initial Release. 4/26/2004 PCI-SIG disclaims all warranties and liability
More informationMoorestown Platform: Based on Lincroft SoC Designed for Next Generation Smartphones
Moorestown Platform: Based on Lincroft SoC Designed for Next Generation Smartphones HOT CHIPS 2009 August 24 2009 Rajesh Patel Lead Architect, Lincroft SoC Intel Corporation Legal Disclaimer INFORMATION
More informationLatency for Real-Time Machine-to-Machine Communication in LTE-Based System Architecture
Latency for Real-Time Machine-to-Machine Communication in LTE-Based System Architecture Navid Nikaein and Srdjan Krco Achieving LOw-LAtency in Wireless Communications (www.ict-lola.eu) FP7 ICT Objective
More informationPCI Express TM Architecture. PHY Electrical Test Considerations Revision 1.1
PCI Express TM Architecture PHY Electrical Test Considerations Revision 1.1 February 2007 i PHY ELECTRICAL TEST CONSIDERATIONS, REVISION 1.1 REVISION REVISION HISTORY DATE 1.0 Initial Release. 4/26/2004
More informationSnapdragon S4 System on Chip
Snapdragon S4 System on Chip Solutions for a New Mobile Age Reiner Klement, VP Product Marketing October, 2011 2011 QUALCOMM Incorporated. All rights reserved. 1 Snapdragon Delivers a Complete System Solution
More informationCowen and Company 37th Annual Technology Media & Telecom Conference. Cowen and Company 37th Annual Technology Media & Telecom Conference MAY 27, 2009
Cowen and Company 37th Annual Technology Media & Telecom Conference MAY 27, 2009 Matt Grob Senior Vice President, Engineering Safe Harbor Before we proceed with our presentation, we would like to point
More informationInternet of Everything Qualcomm Brings M2M to the World
We all know that everyone and everything is getting connected to the network but one area that is developing very quickly is machine to machine or M2M connectivity. With huge increases in bandwidth and
More information3G Technical Evolution as an evolving broadband solution
ITU-D Regional Development Forum for the Asia Pacific Region NGN and Broadband, Opportunities and Challenges Yogyakarta, Indonesia, 27 29 July 2009 3G Technical Evolution as an evolving broadband solution
More informationDate: 13 June Location: Sophia Antipolis. Integrating the SIM. Dr. Adrian Escott. Qualcomm Technologies, Inc.
Date: 13 June 2018 @qualcomm Location: Sophia Antipolis Integrating the SIM Dr. Adrian Escott Qualcomm Technologies, Inc. Agenda 1 2 3 4 5 6 Path to isim isim Size benefit Hardware Architecture Certification
More informationQualcomm Snapdragon 450 Mobile Platform
Qualcomm Snapdragon 450 Mobile Platform Kedar Kondap Vice President, Product Management Qualcomm Technologies, Inc. Snapdragon 400 Tier @qualcomm Qualcomm Snapdragon is a product of Qualcomm Technologies,
More informationWelcome to the 5G age
Welcome to the 5G age Cristiano Amon Executive Vice President, Qualcomm Technologies, Inc. and President, Qualcomm CDMA Technologies October 2017 @cristianoamon Mobile technology is powering the global
More informationEnabling Multi-peer Support with a Standard-Based PCI Express Multi-ported Switch
Enabling Multi-peer Support with a Standard-Based PCI Express Multi-ported Switch White Paper Introduction By Kwok Kong There are basically three different types of devices in a native PCI Express (PCIe
More informationAMD HyperTransport Technology-Based System Architecture
AMD Technology-Based ADVANCED MICRO DEVICES, INC. One AMD Place Sunnyvale, CA 94088 Page 1 AMD Technology-Based May 2002 Table of Contents Introduction... 3 AMD-8000 Series of Chipset Components Product
More informationCEC 450 Real-Time Systems
CEC 450 Real-Time Systems Lecture 9 Device Interfaces October 20, 2015 Sam Siewert This Week Exam 1 86.4 Ave, 4.93 Std Dev, 91 High Solutions Posted on Canvas Questions? Monday Went Over in Class Assignment
More informationInput/Output. Today. Next. Principles of I/O hardware & software I/O software layers Disks. Protection & Security
Input/Output Today Principles of I/O hardware & software I/O software layers Disks Next Protection & Security Operating Systems and I/O Two key operating system goals Control I/O devices Provide a simple,
More informationSpectrum for 4G and 5G. Qualcomm Technologies, Inc. July, 2017
Spectrum for 4G and 5G Qualcomm Technologies, Inc. July, 2017 Using all available spectrum types and spectrum bands Licensed spectrum Exclusive use Over 40 bands globally for LTE Shared spectrum New shared
More informationFortune 500 Company. Celebrating more than 25 years of driving the evolution of wireless communications
The Digital Dividend Technological Perspective Geraldo Neto, Manager Government Affairs Montevideo, June 1 st 2012. Fortune 500 Company Celebrating more than 25 years of driving the evolution of wireless
More informationIEEE ah. sub 1GHz WLAN for IoT. What lies beneath Wi-Fi HaLow. Eduard Garcia-Villegas, Elena López-Aguilera Dept. of Network Engineering
by wilgengebroed IEEE 802.11ah sub 1GHz WLAN for IoT What lies beneath Wi-Fi HaLow Eduard Garcia-Villegas, Elena López-Aguilera Dept. of Network Engineering eduardg@entel.upc.edu elopez@entel.upc.edu Contents
More informationIntroduction to ASIC Design
Introduction to ASIC Design Victor P. Nelson ELEC 5250/6250 CAD of Digital ICs Design & implementation of ASICs Oops Not these! Application-Specific Integrated Circuit (ASIC) Developed for a specific application
More informationACER INC. VERITON M200 QUICK SPEC
ACER INC. VERITON M200 QUICK SPEC Designed to meet the demanding needs of your business Veriton M200-Q67 offers uncompromising value for money while focused on providing the maximum expandability that
More informationDr. Bienvenu AGBOKPONTO SOGLO Gov t Affairs Director, West & Central Africa
1 Dr. Bienvenu AGBOKPONTO SOGLO Gov t Affairs Director, West & Central Africa Discussions on the Future of IMT Systems in the UHF Band in Africa : Digital Dividend and WRC-15 FORUM on Future of UHF in
More informationQuickSpecs. HP Mobile Broadband Modules. Overview
Overview Models HP hs3110 HSPA+ Mobile Module New! HP hs2350 HSPA+ Mobile Broadband HP un2430 EV-DO/HSPA W8 Mini Card HP lt4112 LTE/HSPA+ Qualcomm Gobi 4G Module New! HP lt2522 LTE/EV DO Verizon WWAN (US
More informationMarvell Hong Kong Campus Recruitment 2015 HKUST 3/16/2015
Marvell Hong Kong Campus Recruitment 2015 HKUST 3/16/2015 Contents What is Marvell What Marvell Hong Kong does Why choose Marvell Q&A Marvell at a glance Key Facts Founded in 1995 by Berkeley engineers
More informatione-issn: p-issn:
Available online at www.ijiere.com International Journal of Innovative and Emerging Research in Engineering e-issn: 2394-3343 p-issn: 2394-5494 PCIe CHECKER LIBRARY GENERATION OF SEQUENCES & DRIVER COMPONENT
More informationChapter 02: Computer Organization Functional units and components in a computer organization Part 3 Bus Structures
Chapter 02: Computer Organization Functional units and components in a computer organization Part 3 Bus Structures Objective: Understand the IO Subsystem and Understand Bus Structures Understand the functions
More informationUltra-low Power Always-On Computer Vision
March 20, 2019 @qualcomm_tech Sunnyvale, California Ultra-low Power Always-On Computer Vision Edwin Park Principal Engineer Qualcomm Artificial Intelligence (AI) Research Qualcomm Technologies, Inc. Qualcomm
More informationBarclay s 2009 Worldwide Wireless and Wireline Conference
Barclay s 2009 Worldwide Wireless and Wireline Conference MAY 28, 2009 Steve Mollenkopf Executive Vice President, & President, Qualcomm CDMA Technologies Safe Harbor Before we proceed with our presentation,
More informationEUR incl. 19% VAT, plus shipping. Intel WiFi, Intel WiDi! Dual Gigabit LAN! Gigabyte Features! Intel Haswell!
139.95 EUR incl. 19% VAT, plus shipping Intel WiFi, Intel WiDi! Dual Gigabit LAN! Gigabyte Features! Intel Haswell! Supports 4 th and 5 th Generation Intel Core processors Intel and Qualcomm Atheros gaming
More informationMaking 5G NR a reality
Making 5G NR a reality Laurent Fournier Sr. Director Technology Development Europe Qualcomm Technologies, Inc. November 17, 2016 DigiWorld Congress Scalability to address diverse service and devices Ultra-low
More informationPilot Walktour Datasheet V3.8 (Android)
c Pilot Walktour Datasheet V3.8 (Android) Contents Contents 1 What's New in This Version... 1 2 Product Overview... 2 3 Main Features... 3 4 Terminals... 6 Samsung Galaxy S7 (G9300)... 6 Hardware Specifications...
More informationACER INDIA VERITON M200-A780 QUICK SPEC
ACER INDIA VERITON M200-A780 QUICK SPEC Designed to meet the demanding needs of your business Veriton M200-A780 offers uncompromising value for money while focused on providing the maximum expandability
More informationVirtex-7 FPGA Gen3 Integrated Block for PCI Express
Virtex-7 FPGA Gen3 Integrated Block for PCI Express Product Guide Table of Contents Chapter 1: Overview Feature Summary.................................................................. 9 Applications......................................................................
More informationLinkwave LTE Modem Board MC7304 Data Sheet
Document Title: Linkwave LTE Modem Board MC7304 Data Sheet.0 Date May 2015 LINKWAVE TECHNOLOGIES LTD. Page 1 of 8 08/12/15 Table of Contents 1. Document Release History... 3 2. Related Documents... 3 3.
More informationHigh Capacity Outdoor LTE-Advanced Pico Base Station with Integrated Wireless Backhaul and Carrier Wi-Fi
AirSynergy 3000 High Capacity Outdoor LTE-Advanced Pico Base Station with Integrated Wireless Backhaul and Carrier Wi-Fi Multi-Function, Compact and Versatile Redefining the economics of LTE-Advanced HetNet
More informationHigh performance and efficient single-chip small cell base station SoC
High performance and efficient single-chip small cell base station SoC Kin-Yip Liu Cavium, Inc. kliu@cavium.com Hot Chips 24, August 2012 Presentation Overview Base station processing overview Why small
More informationSanjeev Athalye, Sr. Director, Product Management Qualcomm Technologies, Inc.
Sanjeev Athalye, Sr. Director, Product Management Qualcomm Technologies, Inc. This presentation addresses potential use cases and views on characteristics of 5G technology and is not intended to reflect
More informationACER INC. VERITON M200 QUICK SPEC
ACER INC. VERITON M200 QUICK SPEC Designed to meet the demanding needs of your business Veriton M200-M61 offers uncompromising value for money while focused on providing the maximum expandability that
More informationDesigning, developing, debugging ARM Cortex-A and Cortex-M heterogeneous multi-processor systems
Designing, developing, debugging ARM and heterogeneous multi-processor systems Kinjal Dave Senior Product Manager, ARM ARM Tech Symposia India December 7 th 2016 Topics Introduction System design Software
More informationOn the road with 3GPP. 3GPP s Long Term Evolution and System Architecture Evolution projects
On the road with 3GPP 3GPP s Long Term Evolution and System Architecture Evolution projects 1 3GPP Evolution LTE AND SAE Francois COURAU TSG RAN Chairman 2 What 3GPP is A collaborative agreement between
More informationLink Master for VoLTE
Link Master for VoLTE CONTENTS. VoLTE Service Preparation and Commercialization in Major Operator.... VoLTE quality measurement method... 5.. Test configuration... 5.. VoLTE service quality report with
More informationEVS Series. Intel Xeon /Core i7/i5/i3 Fanless GPU Computing System with Intel C236 & NVIDIA GeForce GT K Isolated DIO.
EVS-1000 Series Xeon /Core i7/i5/i3 Fanless GPU Computing System with C236 & NVIDIA GeForce GT 1030 Fanless, -25 C to 60 C Operating Temperature LGA 1151 Socket supports workstation-grade 7th generation
More informationPremierWave 2050 Enterprise Wi-Fi IoT Module Evaluation Kit User Guide
PremierWave 2050 Enterprise Wi-Fi IoT Module Evaluation Kit User Guide Part Number 900-765-R Revision A February 2016 Intellectual Property 2016 Lantronix, Inc. All rights reserved. No part of the contents
More informationCEC 450 Real-Time Systems
CEC 450 Real-Time Systems Lecture 9 Device Interfaces and I/O October 19, 2017 Sam Siewert View to End of Semester Exam 1 78.6 Ave, 85 High Exam #1 Solutions - Go over in class Grades Posted on Canvas
More informationOne Box Tester for LTE-Advanced UE Development
Product Introduction One Box Tester for LTE-Advanced UE Development Radio Communication Analyzer MT8821C New Features Version 30.40 released in October 2016 adds the following key items. No limits on DL
More informationIEEE 802.3az Energy Efficient Ethernet
IEEE 802.3az Energy Efficient Ethernet Task Force Update Presented to the P802.1 Working Group Denver, CO July 16, 2008 Mike Bennett mjbennett@ieee.org Acknowledgement Thanks to Dan Dove, Rob Hays, and
More informationDatasheet TeleController TC302
Datasheet TeleController TC302 Introduction The TC302 is a medium sized TeleController in a series of Remote Terminal Units (RTU) that Inter Act has developed for telemetry over internet. It can be used
More informationQualcomm Snapdragon Technologies
March 2018 Game Developer Conference (GDC) Qualcomm Snapdragon Technologies Hiren Bhinde, Director, XR Product Management Qualcomm Technologies, Inc. Qualcomm Technologies announcements & updates Snapdragon
More informationNew Technologies for UAV/UGV
Qualcomm Research New Technologies for UAV/UGV Charles Bergan VP, Engineering Qualcomm Research Qualcomm Technologies, Inc. 2013-2016 QUALCOMM Incorporated and/or its subsidiaries. All rights reserved
More informationInnovative Wireless Technologies for Mobile Broadband
Innovative Wireless Technologies for Mobile Broadband RRS-17-Africa Forum - WRC 19 Agenda : Challenges and Opportunities for Africa Emerging Innovative Technologies Dakar, Senegal, 31 March, 2017 Qualcomm
More informationUnwired One. Main Features. Wireless embedded computer
Main Features High performance 400 MHz MIPS24K processor core Ultra-compact 25 35 4mm form-factor 802.11 b/g/n and Ethernet support Integrated 2.4 GHz Wi-Fi antenna USB 2.0 interface support SPI, UART,
More informationLeading the world to 5G
June 28, 2018 @5GwirelessEDGE Shanghai, China Leading the world to 5G Serge Willenegger SVP & GM, 5G & Industrial IoT Qualcomm Wireless GmbH A unifying connectivity platform to drive growth and innovation
More informationWay-Shing Lee Vice President, Technology Qualcomm Technologies, Inc. July 16, Expanding mobile technologies for the Internet of Things
Way-Shing Lee Vice President, Technology Qualcomm Technologies, Inc. July 16, 2015 Expanding mobile technologies for the Internet of Things TM 1 The evolution of wireless Redefined Computing By mobilizing
More informationSmartwatches (April 12, 2017) Samsung Gear Live, 2014 Samsung S 3G, 2014 Samsung S3 LTE, November 2016
Smartwatches (April 12, 2017) Samsung Gear Live, 2014 Samsung S 3G, 2014 Samsung S3 LTE, November 2016 1 Samsung Gear Live 2 Samsung Gear Live 1.63 Super AMOLED display with a resolution of 320 x 320 pixels
More informationIndustry Landscape in Mobile Comupting.
Industry Landscape in Mobile Comupting James.cheng@stericsson.com Sales & Marketing Director, CU Americas About ST-Ericsson ST-Ericsson is 50/50 joint venture uniting the wireless semiconductor division
More informationMobile DRAM s Frequently violated parameters Application Note
SEC-Mobile DRAM Mobile DRAM s Frequently violated parameters Application Note Version 1.0 May 2009 Samsung Electronics Copyright c 2009 Samsung Electronics Co.,LTD. Copyright 2009 Samsung Electronics Co,
More informationBuilding blocks for 64-bit Systems Development of System IP in ARM
Building blocks for 64-bit Systems Development of System IP in ARM Research seminar @ University of York January 2015 Stuart Kenny stuart.kenny@arm.com 1 2 64-bit Mobile Devices The Mobile Consumer Expects
More information2010: TRANSITION & TRANSFORMATION
TOWARDS TRANSFORMATION Gilles Delfassy, President & CEO 2009: FORMATION 2010: TRANSITION & TRANSFORMATION 2 FIRST QUARTER SUMMARY Net sales $606 million Net sales Adjusted operating loss $114 million Net
More informationQUALCOMM: Company Overview and Opportunities for Students and Collaboration. Junyi Li Vice President of Technology QUALCOMM
QUALCOMM: Company Overview and Opportunities for Students and Collaboration Junyi Li Vice President of Technology QUALCOMM April 14, 2008 Outline 1. General background on Qualcomm 2. Research and Development
More informationOCP Engineering Workshop - Telco
OCP Engineering Workshop - Telco Low Latency Mobile Edge Computing Trevor Hiatt Product Management, IDT IDT Company Overview Founded 1980 Workforce Approximately 1,800 employees Headquarters San Jose,
More informationPXI Maestro Software that both accelerates wireless device test speed and reduces ATE system development time Data Sheet
PXI Maestro Software that both accelerates wireless device test speed and reduces ATE system development time Data Sheet The most important thing we build is trust Highlights End-to-end ATE for multi-up
More informationImagining Tomorrow's Wireless Landscape
Imagining Tomorrow's Wireless Landscape Wireless Broadband Evolution Rasmus Hellberg, PhD Director, Technical Marketing Qualcomm Wireless Broadband Evolution 3G offers excellent mobile broadband today
More informationDell Studio 1569 Comprehensive Specifications
Dell Studio 1569 Comprehensive Specifications This document provides information that you may need when setting up, updating drivers for, and upgrading your computer. NOTE: Offerings may vary by region.
More informationNetwork Media and Layer 1 Functionality
Network Media and Layer 1 Functionality BSAD 146 Dave Novak Dean, Chapter 3, pp 93-124 Objectives Introduction to transmission media Basic cabling Coaxial Twisted pair Optical fiber Basic wireless (NIC)
More informationIntroduction Enjoy business-class, high-speed wireless and Bluetooth connectivity on your desktop with the Intel ac PCIe x1 Card.
Overview Part Number 3TK89AA Introduction Enjoy business-class, high-speed wireless and Bluetooth connectivity on your desktop with the Intel 9260 802.11ac PCIe x1 Card. 1 1. Intel vpro not supported.
More informationVERITON M2640GQUICK SPEC
ACER INDIA VERITON M2640GQUICK SPEC *The image of the Desktop in the brochure is only pictorial representation which may vary in the actual supply Designed to meet the demanding needs of your business
More informationSPECIFICATION PATENTED
SPECIFICATION PATENTED Part No. : TG.30.8112W Product Name : Apex White Right Angle TG.30 Ultra-Wideband 4G LTE Antenna Feature : LTE / GSM / CDMA /DCS /PCS / WCDMA / UMTS / HSDPA / GPRS / EDGE /GPS /Wi-Fi
More informationDell Latitude E6220. Setup And Features Information. About Warnings. Front And Back View
Dell Latitude E6220 Setup And Features Information About Warnings WARNING: A WARNING indicates a potential for property damage, personal injury, or death. Front And Back View Figure 1. Front View 1. microphone
More informationKey Performance Indicators
USER DESCRIPTION 37/1553-HSC 105 50/1 Uen G Copyright Ericsson AB 2009 2011. All rights reserved. No part of this document may be reproduced in any form without the written permission of the copyright
More information5G the next major wireless standard
5G the next major wireless standard Klaus Doppler Director, Radio Communications Nokia Technologies, LABS DREAMS Seminar, Jan. 13, 2015 1 Nokia 2015 International activities on 5G Strong academic & government
More informationEnergy scalability and the RESUME scalable video codec
Energy scalability and the RESUME scalable video codec Harald Devos, Hendrik Eeckhaut, Mark Christiaens ELIS/PARIS Ghent University pag. 1 Outline Introduction Scalable Video Reconfigurable HW: FPGAs Implementation
More informationQuadpad i MOBILITYMEETSDURABILITY
Quadpad i MOBILITYMEETSDURABILITY QUADURO TOOLS FOR PROFESSIONALS The Quaduro Quadpad I is a slate tablet PC, and its capability is based on an architecture featuring mainstream operating systems, allowing
More informationDell Inspiron 580: Comprehensive Specifications
Dell Inspiron 580: Comprehensive Specifications This document provides information that you may need when setting up, updating drivers for, and upgrading your computer. NOTE: Offerings may vary by region.
More information27 March 2018 Mikael Arguedas and Morgan Quigley
27 March 2018 Mikael Arguedas and Morgan Quigley Separate devices: (prototypes 0-3) Unified camera: (prototypes 4-5) Unified system: (prototypes 6+) USB3 USB Host USB3 USB2 USB3 USB Host PCIe root
More information