Validation Test Report
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1 Validation Test Report Spring Finger 1.1H November 11, Tested & Reported By Reviewed By Approved By Test Date From Setember 24, 2013 To November 07, 2013 Classification Unrestricted TE Korea Engineering Validation and Reliability Test Center
2 TE CONNECTIVITY RELIABILITY TEST REPORT Test Name : Validation for Spring Finger 1.1H 1. Introduction 1-1 Purpose Testing was performed on the Spring Finger 1.1H to determine if it conformance to the requirements of Product Specification , Rev.A1 1-2 Scope This report covers the electrical, mechanical, environmental performance requirements of the Spring Finger 1.1H The testing was performed between September 24, 2013 and November 07, Test Samples The test samples were randomly selected from normal current production lots. P/N Spring Finger 1.1H Description 1-4 Conclusion The Spring Finger 1.1H meets the electrical, mechanical and environmental performance requirements of Product Specification , Rev.A1 1-5 Attachment 1) Test Sequence 2) Requirements and Test Procedure 3) Test Result 4) Photograph of Test TE Korea Engineering Validation and Reliability Test Center - 2 -
3 1) Test Sequence TE Korea Engineering Validation and Reliability Test Center - 3 -
4 2) Requirements and Test Procedure TE Korea Engineering Validation and Reliability Test Center - 4 -
5 TE Korea Engineering Validation and Reliability Test Center - 5 -
6 3) Test Result - Test Group NO Test Items Test Condition Acceptance criteria Unit Test Result S1 S2 S3 S4 S5 Min. Max. Avg. Judgment 1 Examination of Product Initial OK OK OK OK OK OK After Resistance to Soldering Heat No physical damage. - OK OK OK OK OK OK After Durability OK OK OK OK OK OK Final OK OK OK OK OK OK 2 Contact Height Initial mm Displacement rate of contact height should be Final under 20% from initial % 0.2% 0.8% 0.7% 0.6% 2.2% OK height. Initial OK 3 Contact Resistance 50mΩ Max. mω Final OK Initial OK 4 Normal Force 40gf Min. gf Final OK TE Korea Engineering Validation and Reliability Test Center - 6 -
7 Test Group 2 NO. Test Items Test Condition Acceptance criteria Unit Test Result S1 S2 S3 S4 S5 Min. Max. Avg. Judgment 1 Examination of Product Initial OK OK OK OK OK OK No physical damage. - Final OK OK OK OK OK OK Solderable area shall have 2 Solderability Initial a minimum of 95% solder - OK OK OK OK OK - - OK coverage. - Test Group 3 NO Test Items Test Condition Acceptance criteria Unit Test Result S1 S2 S3 S4 S5 Min. Max. Avg. Judgment 1 Examination of Product Initial OK OK OK OK OK OK After Damp Heat No physical damage. - OK OK OK OK OK OK Final OK OK OK OK OK OK 2 Contact Height Initial mm Displacement rate of contact height should be Final under 20% from initial % 6.7% 5.3% 6.0% 7.1% 6.9% OK height. Initial OK 3 Contact Resistance 50mΩ Max. mω Final OK TE Korea Engineering Validation and Reliability Test Center - 7 -
8 Test Group 4 NO Test Items Test Condition Acceptance criteria Unit Test Result S1 S2 S3 S4 S5 Min. Max. Avg. Judgment 1 Examination of Product Initial OK OK OK OK OK OK After Thermal Shock No physical damage. - OK OK OK OK OK OK Final OK OK OK OK OK OK 2 Contact Height Initial mm Displacement rate of contact height should be Final under 20% from initial % 1.8% 4.2% 0.9% 0.9% 1.8% OK height. Initial OK 3 Contact Resistance 50mΩ Max. mω Final OK - Test Group 5 NO Test Items Test Condition Acceptance criteria Unit Test Result S1 S2 S3 S4 S5 Min. Max. Avg. Judgment 1 Examination of Product Initial OK OK OK OK OK OK After Salt Spray No physical damage. - OK OK OK OK OK OK Final OK OK OK OK OK OK Initial OK 2 Contact Resistance 50mΩ Max. mω Final OK TE Korea Engineering Validation and Reliability Test Center - 8 -
9 4) Photograph of Test NO. Test Items Photograph Remark NO. Test Items Photograph Remark 1 Contact Resistance - 4 Solderability - 2 Normal Force - 5 Damp Heat - 3 Durability - 6 Thermal Shock - TE Korea Engineering Validation and Reliability Test Center - 9 -
10 NO. Test Items Photograph Remark NO. Test Items Photograph Remark 7 Salt Spray TE Korea Engineering Validation and Reliability Test Center
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