Highly reliable IC-size type with gold contact supports automatic insertion. Typical Specifications

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1 to 0 Circuits-designed Type Product Line Soldering Highly reliable IC-size type with gold contact supports automatic insertion Actuator configuration Packaging style Typical Specifications Poles 5 Minimum order unit(pcs.) Japan Export Items Rating (max.)/(min.) (Resistive load) Contact resistance (Initial / After lifetime) Operating force Operating life Without load With load 7,000 5,00,000, Specifications 5mA V DC (At opening and closing) 0.A 50V DC (When energized)/ 50μA V DC 50mΩmax. / 00mΩ max..5±.5n,000 cycles,000 cycles (5mA V DC) Drawing No., , Insertion Stick,00 000, ,00 A000 0, ,00, ,00 A000 00,00, Reflow Taping,000,000, Refer to P.5 for soldering conditions.

2 / to 0 Circuits-designed Type Packing specifications Taping Stick 000 Number of packages(pcs.) reel case /Japan case /export packing 00 Reel width Tape width W(mm) (mm),00, , ,000,000,000 5.,000, Export package measurements (mm) Reel size Unit:mm Number of packages(pcs.) stick case /Japan case /export packing ,00 7,000 Export package measurements (mm) 000 5,00 5, , , , , , ,00 A000 A000 0,00

3 to 0 Circuits-designed Type Dimensions No. A L.5.5 Style PC board mounting hole dimensions (Viewed from direction A) N-ø hole.5 N-ø hole P= Unit:mm A L Terminal No PC board mounting face.5 0. Travel - P= Circuit Diagram(Viewed from Direction A) 57!0!!!!!5! Number of Poles and Outline Dimension(L) Number of poles(n) L(mm)

4 Switches List of Varieties Series Photo Operating temperature range 0 to +5 Automotive use Life cycle Rating(max.)/(min.) (Resistive load) Durability Electrical Operating life Without load With load Contact resistance (Initial / After life time) Insulation resistance 5mA V DC(At opening and closing), 0.A 50V DC(When energized), 50μA V DC,000 cycles,000 cycles(5ma V DC) 50mΩ max. / 00mΩ max. 00MΩ min. 500V DC Mechanical Voltage proof Terminal strength Actuator strength Operating direction Pulling direction 500V AC for minute 5N for minute 0N 0N Cold 0 50h Environmental Dry heat 5 50h Damp heat 0, 0 to 5%RH 50h Page Dual In-line Switches Soldering Conditions 5 Dual In-line Switches Cautions

5 Dual In-line Switches Soldering Conditions Example of Reflow Soldering Condition. Heating method: Double heating method with infrared heater.. Temperature measurement: Thermocouple φ 0. to 0. CA(K)or CC(T)at soldering portion(copper foil surface). A heat resisting tape should be used for fixed measurement.. Temperature profile Temperature ( C ) Room temperature Pre-heating D max. A max. C Time (s) E max. F 0 max. Series(Reflow type) A( ) s max. ( ) C( ) D(s) E(s) F(s) Notes. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. Reference for Hand Soldering Condition Soldering temperature Soldering time 50±5 5s max. Reference for Dip Soldering Condition (For insertion terminal types) Items Preheating temperature Preheating time Dip soldering Soldering temperature Duration of immersion 0 max. 0s max. 70±5 0±s max. 5