Wireless Smart Charging System for Mobile Devices

Transcription

1 Western Washington University Wireless Smart Charging System for Mobile Devices EE 492 Jacie Unpingco 5 June 2016

2 TABLE OF CONTENTS 1. Design Change Form Schematic Sheets a. MCU, Battery, and LEDs Schematic.2 b. Transmitter and Boost Regulator Schematic.3 c. Receiver Board Schematic Board Layouts a. Main Board Top Copper Layer.5 b. Main Board Bottom Copper Layer 6 c. Receiver Board Top Copper Layer.7 d. Receiver Board Bottom Copper Layer D Board Renderings a. Main Board 3D PCB. 9 b. Receiver Board 3D PCB (Enlarged) Complete Bill of Materials a. MCU, Battery, LEDs, and Transmitter Circuit BOM 11 b. Receiver Circuit BOM D Overall Designs from Industrial Design Students a. Justin Janczakowski s Design. 13 b. Calyn McLeod s Design.. 14 c. Emily Bartlett s Design Solder Paste Stencils PCB Boards After Reflow Board Test Procedures Identified Errors/Connections for Next Board Iteration..19

3 Engineering Change Description EE 492 Project Hardware Design Page: 1 of 1 Electrical Engineering Project Name: Wireless Smart Charging System for Mobile Devices Revision: Reason For Change: The original user interface design has since changed Source Signature Date since I submitted my project description due to the designs of the industrial design students I am Originator Jacie Unpingco working with. Instructor Description of Change: Originally, the user interface had the LEDs on the top of the charging pad. With the new interface design in collaboration with the industrial design students, the LEDs will exist on the side of the charging pad along with the on/off switch. The switch and the LEDs are located to the far left of the front panel when looking at the pad straight on. In addition, there is a micro-usb port added to the user interface so that the charging pad itself can recharge the Lithium-Polymer battery within. 1

4 SCHEMATIC SHEETS Figure 1: MCU, Battery, and LEDs Schematic 2

5 Figure 2: Transmitter and Boost Regulator Schematic 3

6 Figure 3: Receiver Board Schematic 4

7 BOARD LAYOUTS 4: Main Board Top Copper Layer 5

8 5: Main Board Bottom Copper Layer 6

9 Figure 6: Receiver Board Top Copper Layer 7

10 Figure 7: Receiver Board Bottom Copper Layer 8

11 3D BOARD RENDERINGS 8: Main Board 3D PCB 9

12 Figure 9: Receiver Board 3D PCB (Enlarged) 10

13 Bill of Materials Transmitter Board Source Data From: Senior_Project.PrjPcb Project: Senior_Project.PrjPcb Variant: None Creation Date: 29 February 2016 Print Date: 5 June 2016 Production Quantity: 1 Currency: USD Description Manufacturer Part # Value Designator Quantity LiPo Battery T2200.1S.20 B1 1 CAP 10uF 6.3V ±10% 0603 (1608 Metric) SMD GRM188R60J106ME47 10uF C1 1 CAP 100nF 50V ±5% 0603 (1608 Metric) SMD GRM188R71H104KA93 100nF C2, C4, C9 3 CAP 1uF 16V ±5% 0603 (1608 Metric) SMD GRM188R61C105KA93 1uF C3, C8, C13 3 CAP 4.7uF 6.3V ±10% 0603 (1608 Metric) SMD GRM188R60J475KE19 4.7uF C5, C6, C14 3 CAP 12pF 50V ±10% 0603 (1608 Metric) SMD GRM1885C1H120JA01 12pF C7, C10 2 CAP 2.2uF 10V ±10% 0603 (1608 Metric) SMD GRM188R61A225KE34 2.2uF C11 1 CAP 470pF 50V ±10% 0603 (1608 Metric) SMD GRM1885C1H471JA01 470pF C12 1 CAP 10pF 50V ±1% 0603 (1608 Metric) SMD GRM1885C1H100JA01 10pF C15 1 CAP 220nF 25V ±10% 0603 (1608 Metric) SMD GRM188R71E224KA88 220nF C16 1 DIODE SCHOTTKY 40V 1A SMA SS14 D pin 0.05" pitch header for JTAG FTSH L-DV-K J1 1 CONN USB MICRO B RECPT SMT R/A LF J2 1 FIXED IND 10UH 3.1A 44.2 MOHM NR8040T100M L1 1 WIRELESS CHARGING COIL ASSEMBLY AWCCA-50N50H35-C01-B L2 1 LED RED CLEAR 0603 SMD LTST-C194KRKT LED1 1 LED GREEN CLEAR 0603 SMD LTST-C194KGKT LED2 - LED5 4 TRANS NPN 40V 0.2A SMD SOT23-3 MMBT F Q1 - Q4, Q9 5 MOSFET N-CH 30V 1.5A SOT-23 NTR4503NT1G Q5 - Q8 4 1K 0.1W 5% 0603 (1608 Metric) SMD RC0603FR-071KL 1k Ohm R1, R19 - R K 0.1W 5% 0603 (1608 Metric) SMD RC0603FR-0710KL 10kOhm R2, R28, R29, R31, R32 5 2K 0.1W 5% 0603 (1608 Metric) SMD RC0603FR-072KL 2k Ohm R3 1 Jumper 0603 (1608 Metric) RC0603FR-070RL 0 Ω R4 - R8, R10 - R12, R17, R18, R25, R27, R30, R M 0.1W 1% 0603 (1608 Metric) SMD CRCW060310MFKEA 10MΩ R R 0.1W 1% 0603 (1608 Metric) SMD RC0603FR-07221RL 221 Ω R13 - R K 0.1W 1% 0603 (1608 Metric) SMD RC0603FR-0751K1L 51k Ω R K 0.1W 5% 0603 (1608 Metric) SMD RC0603FR-07200KL 200k Ω R24 1 1M 0.1W 5% 0603 (1608 Metric) SMD RC0603FR-071ML 1M Ω R Screw Screw - Screw4 4 SWITCH PUSH SPDT 0.25A 50V ELUMEESAQ7C22 SW1 1 TEST POINT PC MINI.040"D BLACK 5001 TP1 - TP17 17 IC CONTROLLR LI-ION 4.2V SOT23-5 MCP73831T-2ACI/OT U1 1 IC MCU ARM 32KB FLASH 32LQFP MKL05Z32VLC4 U2 1 SENSOR TEMP ANLG VOLT SOT-23-3 MCP9701AT-E/TT U3 1 IC REG LDO 3.3V 0.5A (350 mv DROP) SOT23-5 MIC YM5 TR U4 1 IC REG BOOST ADJ 75MA SOT25 AP3015AKTR-G1 U5 1 CRYSTAL KHZ 12.5PF SMD ABS KHZ-T X1 1 CRYSTAL KHZ 9PF SMD KHZ X

14 Bill of Materials Receiver Board Source Data From: RX_Board.PrjPcb Project: RX_Board.PrjPcb ariant: None Creation Date: 29 February 2016 Print Date: 18-Mar 2016 Production Quantity: 1 Currency USD Description Manufacturer Part # Value Designator Quantity CAP 100nF 50V ±10% 0603 (1608 Metric) SMD GRM188R71H104KA93 100nF C1 1 CAP 10uF 6.3V ±10% 0603 (1608 Metric) SMD GRM188R60J106ME47 10uF C2 1 CAP 1.5nF 50V ±10% 0603 (1608 Metric) SMD GRM1885C1H152JA01 1.5nF C3 1 DIODE GEN PURP 1KV 1A SMA S1M-13-F D1 - D4 4 CONN USB MICRO B RECPT SMT R/A LF J1 1 RECEIVER 1 COIL 1 LAYER L1 1 TEST POINT PC MINI.040"D BLACK 5001 TP1, TP2, TP3 3 IC REG LDO 5V 1A SOT223 LM340MPX-5.0/NOPB U

15 3D OVERALL DESIGNS FROM INDUSTRIAL DESIGN STUDENTS Justin Janczakowski s Industrial Design 13

16 Calyn McLeod s Industrial Design 14

17 Emily Bartlett s Industrial Design 15

18 SOLDER STENCILS Figure 10: Main Board Solder Stencil (Enlarged) Figure 11: Receiver Board Solder Stencil (Enlarged) 16

19 PCB BOARDS AFTER REFLOW Figure 12: Main Board with Parts Placed After Reflow Figure 13: Receiver Board with Parts Placed After Reflow 17

20 BOARD TEST PROCEDURES Main Board MCU and Battery -Apply power and ground to the board using a power supply -Check each test point to ensure that power is flowing through the board -Ensure that the battery regulator circuit is working properly by checking that LED1 is on -Using a DMM measure the charge current flowing through the battery -Connect the 0 Ohm resistor, R7, to connect the low-dropout regulator and boost regulator -Using a DMM, make sure that the LDO is outputting 3.3 V and the boost regulator is outputting 8V -Using a DMM, make sure there are no shorts on the microcontroller pins -Make sure that LED2 through LED5 are on when the board has a full charge -Using the JTAG, add code to the MCU to ensure that it is functioning properly Transmitter Circuit -Apply power and ground to the circuit using a power supply -Check each test point to ensure that power is flowing through the circuit -Test the voltage across the charging coil to ensure the circuit is functioning properly -Connect the 0 Ohm resistor, R21 to connect to the rest of the board Receiver Board -Apply power and ground to the board using a power supply -Check each test point to ensure that power is flowing through the board -Using a DMM, measure the voltage at test point 2 to ensure that it is approximately 5V -Using a DMM, measure the voltage and current at test point 1 to ensure an adequate charging 18

21 IDENTIFIED ERRORS/CONNECTIONS FOR NEXT BOARD ITERATION -Add 0 Ohm resistors to both sides of both the transmitter and receiver coils to be able to simulate a charging voltage without ruining the charging coils -Choose another boost regulator that can handle 8V and higher -Add an additional LED for board life indication to match original project description and industrial students designs 19