P E N G U IN COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs
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1 P E N G U IN COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs 659 SERIES Unidirectional Fin Heat Sink for AMD Am386, PowerPC 60 4 x 4, 38, 40 mm CQFP Standard Base Dimensions Height Heat Sink Weight AB.45 (36.8) sq (6.5) Black Anodized (22.68) 655 SERIES Pin Fin for PowerPC 60, PowerPC x 7 PGA, 32 mm CQFP 40 mm CQFP Standard Base Dimensions Dimension A Dimension B Heat Sink Weight P/N in. (mm) in. (mm) in. (mm) Finish lbs. (grams) AB.600 (40.6) sq (6.6) 0.25 (3.2) Black Anodized (7.0) AB.600 (40.6) sq (3.3) 0.45 (3.7) Black Anodized (22.68) 658 SERIES Omnidirectional Pin Fin for IntelDX4, AMD Am29240, PowerPC 603 POWERQUAD2, mm CQFP/MQUAD Standard Base Dimensions Dimension A Heat Sink Weight AB.00 (27.9) sq (6.4) Black Anodized 0.03 (5.67) AB.00 (27.9) sq (8.9) Black Anodized 0.05 (6.70) AB.00 (27.9) sq (8.9) Black Anodized 0.09 (8.50) AB.00 (27.9) sq (8.9) Black Anodized 0.03 (4.7) KEY: AB AB AB AB All other products, please contact factory for price, delivery, and minimums. 26 Normally stocked
2 PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs 624 SERIES Omnidirectional Pin Fin Heat Sink for 2mm BGAs Fin Height Standard Base Dimensions A Typical Adhesive Weight P/N in. Sq. in. (mm) Applications Options lbs. (grams) AB.827 (2).250 (6.4) 2mm BGA Pages (4.09) AB.827 (2).350 (8.9) 2mm BGA Pages (4.99) AB.827 (2).450 (.4) 2mm BGA Pages (6.8) AB.827 (2).600 (5.2) 2mm BGA Pages (.80) Material: Aluminum, Black Anodized The 624 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). PRODUCT FEATURES Available in four standard heights,.25 inch,.35 inch,.45 inch, and.60 inch. Available with pressure sensitive adhesives for quick and easy mounting. Pages SERIES 624 THERMAL PERFORMANCE Dimensions: in. 625 SERIES Omnidirectional Pin Fin Heat Sink for 25mm BGAs Fin Height Standard Base Dimensions A Typical Adhesive Weight P/N in. Sq. in. (mm) Applications Options lbs. (grams) AB.984 (25) (6.4) 25 mm BGA Pages (5.45) AB.984 (25) (8.9) 25 mm BGA Pages (6.36) AB.984 (25) (.4) 25 mm BGA Pages (8.7) AB.984 (25) (5.2) 25 mm BGA Pages (3.62) Material: Aluminum, Black Anodized The 625 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). PRODUCT FEATURES Available in four standard heights,.25 inch,.35 inch,.45 inch, and.60 inch. Available with pressure sensitive adhesives for quick and easy mounting. Pages SERIES 625 THERMAL PERFORMANCE Dimensions: in. Normally stocked 27 All other products, please contact factory for price, delivery, and minimums.
3 P E N G U IN COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs 660 SERIES Unidirectional Fin Heat Sink for PowerPC mm, 40 mm C4QFP Standard Base Dimensions Height Heat Sink Weight AB.529 (38.8) x.530 (38.9) (7.2) Black Anodized 0.03 (4.7) MECHANICAL DIMENSIONS 642 SERIES Unidirectional Fin Heat Sink for BGAs BGA Standard Base Dimensions Fin Height "A" Typical Adhesive Weight P/N in. Sq. in. (mm) Applications Options lbs. (grams) AB.378 (35).250 (6.6) 35 mm BGA Pages (9.99) AB.378 (35).350 (8.9) 35 mm BGA Pages (2.26) AB.378 (35).450 (.4) 35 mm BGA Pages (4.07) AB.378 (35).600 (5.2) 35 mm BGA Pages (7.7) Material: Aluminum, Black Anodized The 642 Series is an unidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS). PRODUCT FEATURES Available in four standard heights,.25 inch,.35 inch,.45 inch, and.60 inch. Available with pressure sensitive adhesives for quick and easy mounting. Pages Use T4 when attaching to a plastic device surface and T2 for all other surfaces. 642 SERIES 642 THERMAL PERFORMANCE All other products, please contact factory for price, delivery, and minimums. 28 Normally stocked
4 DELTEM COMPOSITE HEAT SINKS FOR PQFPs, CQFPs, AND BGAs Deltem D Pin Fin Heat Sink for 00-Lead PQFPs, 69 BGA 84, 00 PQFP, 69 BGA Standard Base Dimensions Height Weight P/N in. (mm) in. (mm) lbs. (grams) D (6.5) sq (0.2) 0.03 (5.67) Notes: Available with pressure sensitive adhesives for quick and easy mounting. Pages Deltem D Pin Fin Heat Sink for Intel i960ka, Cyrix Cx486SLC, ASICs PQFP, 33 BGA Standard Base Dimensions Height Weight P/N in. (mm) in. (mm) lbs. (grams) D (2.6) sq (0.2) 0.09 (8.50) Notes: Available with pressure sensitive adhesives for quick and easy mounting. Pages Deltem II D Pin Fin Heat Sink for ASICs, Intel i960ka, Intel 486DX PQFP, PowerQuad 2 PBGA, CBGA Standard Base Dimensions Height Weight P/N in. (mm) in. (mm) lbs. (grams) D (2.6) sq (0.2) 0.09 (8.5) Notes: Available with pressure sensitive adhesives for quick and easy mounting. Pages DELTEM D PIN FIN HEAT SINK DELTEM D PIN FIN HEAT SINK DELTEM II D PIN FIN HEAT SINK Normally stocked 29 All other products, please contact factory for price, delivery, and minimums.
5 PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs 662 SERIES Pin Fin Heat Sink for Limited Height Applications for Intel 80486DX, AMD AM x 7 PGA Standard Base Dimensions Height Heat Sink Weight 662-5AG.73 (43.5) sq 0.50 (3.8) Gold Iridite 0.09 (8.50) 628 SERIES Pin Fin for IntelDX4, Intel 80486DX2, and AM486 DX2, AM486 DX4 7 x 7 PGA Standard Base Dimensions Dimensions A Heat Sink Weight AB.750 (44.5) x.700 (43.2) (5.) Black Anodized 0.03 (4.7) AB.750 (44.5) x.700 (43.2) (6.4) Black Anodized (7.0) AB.750 (44.5) x.700 (43.2) (8.9) Black Anodized (9.84) AB.750 (44.5) x.700 (43.2) (0.2) Black Anodized (22.68) AB.750 (44.5) x.700 (43.2) (6.5) Black Anodized (25.5) NATURAL FORCED KEY: AB AB AB AB AB 663 SERIES Unidirectional Fin Heat Sink for Intel 80486DX/DX2 7 x 7 PGA Standard Base Dimensions Dimensions A Heat Sink Weight AB.535 (39.0) sq (9.0) Black Anodized 0.03 (4.7) All other products, please contact factory for price, delivery, and minimums. 8 Normally stocked
6 PENGUIN COOLERS: HEAT SINKS FOR MICROPROCESSORS AND ASICs 609 SERIES Pin Fin Heat Sink/Clip Assembly for PowerPC 60, 604 (304 C4QFP, 255 CBGA 40mm C4QFP 2mm CBGA Standard Base Dimensions Dimensions A Heat Sink Weight AB (73.5) x (50.8) (2.7) Black Anodized (42.5) AB (7.32) x.700 (43.7).00 (25.4) Black Anodized 0.30 (59.0) Notes:. Optional factory preapplied thermal interface material. Pages FORCED CONVECTION THERMAL PERFORMANCE DATA (FLOW PARALLEL TO EXTRUSION DIRECTION) (609-50AB) (609-00AB) AB HEAT SINK AND CLIP ASSEMBLY 69 SERIES Fan Heat Sink for BGA and PowerPC Packages BGA/Power PC Standard Base Dimensions Height Heat Sink Thermal Weight P/N in. (mm) in. (mm) Finish Performance lbs. (grams) 6995AB24D 2.87 (72.92) x.98 (50.29) (24.2) Black Anodized.2 ± 0. C/W.50 (68.0) 6995AB054D 2.87 (72.92) x.98 (50.29) (24.2) Black Anodized.2 ± 0. C/W.50 (68.0) Notes:. Optional factory preapplied thermal interface material. Pages FEATURES AND BENEFITS: Captivated clips for ease of assembly Low acoustic noise Impingement air flow Accomodates BGA packages up to 45 mm in size Dimensions: in. Normally stocked 9 All other products, please contact factory for price, delivery, and minimums.
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