CMOSETR Session C1, July 7 (Macroelectronics)
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1 Universal Flexible Hybrid System Development Kit including MCU, ADC and RFIC Prepared for: CMOSETR Session C1, July 7 (Macroelectronics) Doug Hackler President & CEO doughackler@americansemi.com
2 2014 American Semiconductor, Inc. All rights reserved. Beginning Aug 2014 ASI is moving! Flexible Electronic Products and Services Corporate Headquarters Boise, Idaho, USA Engineering Design, Process, Modeling FleX Silicon-on-Polymer Mfg and Assembly Test & Characterization Cleanroom Sales, Marketing, Administration Process Engineering Center Santa Clara, CA Manufacturing pilot SoP operations Small Business Privately Held Founded November, 2001 Product Lines FleX Silicon-on-Polymer (Flexible ICs) Design Services Turnkey Design Solutions Supplier of the Year FHS Rainbow CMOS FleX CMOS2 DoME 45nm CMOS This work is sponsored by the Air Force Research Laboratory)
3 Enabling Technology 2014 American Semiconductor, Inc. All rights reserved. 3 FleX Silicon-on-Polymer (SoP) provides the flexible solution we need TODAY. SoP Single crystalline high mobility FLEXIBLE High performance CMOS High density, low power logic High density memory High speed communications FleX CMOS Currently Available chipset: MCU ADC RFIC Manufacturing Infrastructure 3
4 2014 American Semiconductor, Inc. All rights reserved. Proven Technology FleX-MCU Electrical Testing 4 Feb 2014 Announcement at Flextech Tested before and after FleX processing Tests passing at up to 12MHz (limited by test environment, not silicon) ~2.2M transistors Over 275,000 passing digital test vectors Block Full Thickness FleX Wafer CPU - Opcodes Pass Pass CPU - ALU Pass Pass RAM - 8KB Pass Pass ROM - 1KB Pass Pass I/O Ports Pass Pass Comm Peripherals Pass Pass Timers / Counters Pass Pass
5 FleX Silicon-on-Polymer and Flexible Hybrid Systems 2014 American Semiconductor, Inc. All rights reserved. 5 Printed Sensor Printed Sensor Antenna LNA ADC µctrl FleX ICs High Performance, High Density Physically Flexible Silicon Flexible Hybrid System Combination of flexible printed materials and flexible silicon-based ICs to create a new class of flexible electronics. Data Bus FleX IC Product Roadmap FleX-MCU FleX-NVM adds NVM Non-Volatile Memory FleX-LNA standalone Low Noise Amplifier FleX-MCU FleX-ADC adds 8-bit ADC and RFID 915MHz transmitter standalone 8-bit Analog-to-Digital Converter Printed Electronics Low Cost, R2R, Large Format FleX-MCU FleX-RFIC standalone 915MHz RF transmitter FleX-ASIC custom ICs 8-bit RISC, 1.2V core, 2.5V I/O, UART, I2C, SPI Available In Development Planning
6 2014 American Semiconductor, Inc. All rights reserved. Relevant Markets and Opportunities 6
7 Challenge 2014 American Semiconductor, Inc. All rights reserved. 7 Our greatest industry challenge: Creating & introducing successful products Flexible product development programs are critical Commercial Businesses Research Institutions and Universities Government Low cost flexible electronics platform technology must be available A total system solution is required Proven technology that meets product requirements Technology that is mature enough Technology supported by manufacturing Necessary technology is not available today, but we are getting closer... Development Kits can provide product designers the necessary platform Kit development and availability will be covered in this presentation
8 2014 American Semiconductor, Inc. All rights reserved. Flexible Hybrid Process Integration Flexible Hybrid System Assembly Technology 8 IC Design IC Fabrication Announced at June 13, 2013 Announced at July13, 2013 IC FleX SoP Conversion FleX-MCU FleX-ADC FleX-RFIC Current Focus FHS Assembly (2014) Strain Gauge Antenna Pressure Sensor LNA ADC µctrl Printed Circuits & Sensor Design Printed Electronics Fabrication Development to meet FHS Technology Roadmap Printed electronics capacity and FleX IC Fabrication are well established Current state-of-the-art development is focused on FHS assembly Assembly: FHS Design methods and tools FleX Die singulation and handling Die Attach and connect Encapsulation
9 FleXform Development Kit Market release scheduled Dec American Semiconductor, Inc. All rights reserved. 9 PRODUCTS are what our industry needs Products require concept demonstrations Capability is needed to enable product development New Technology: FleXform FleXform is a kit platform for product developers FleXForm: Flexible development hardware FleX-MCU on a flexible demo board Standard connectors for interfacing to PC and prototyping boards Flexible, printed display and buttons Voltage regulators Serial EEPROM FleXform: Software & Documentation C-compiler and assembler Product specifications User s guide Data sheet Demonstration software
10 2014 American Semiconductor, Inc. All rights reserved. Available Dec FleXform Development Kit 10 User prints or applies flexible sensors and/or displays. User makes connections to from user device to existing printed pads. User Flexible Display Region Connections to printed pads made by user or ASI. Software and Documentation C-compiler & Assembler EEPROM Programming User s Guide & Specifications 54 mm User Printable Sensor Region FleX- MCU ZIF Connector Ribbon Cable 85 mm FleX-MCU 5mm X 5mm 8-bit RISC CPU 8KB SRAM, 2KB ROM UART, SPI, I2C 18 I/O 2.5V CMOS 50 mm Prototyping Board PC interface EEPROM for User Code Voltage Regulators 10
11 2014 American Semiconductor, Inc. All rights reserved. Flexible Hybrid Assembly (State of the Art) 11 Recent HYBRID Research and Development Efforts Karl Ronka Finland (LOPEC May 2014) Bare Die and QFN (3mm x 3mm) on PET with ACA R2R rotary screen print More study needed Mike Clausen UK (LOPEC May 2014) Pick and Place with conductive adhesive Integrated Smart System (ISS) TRL2 Marc Koetse Netherlands (LOPEC May 2014) Print where possible, use Si or Cu where needed ACA - Anisotropic Conductive Adhesive
12 2014 American Semiconductor, Inc. All rights reserved. Flexible Hybrid Assembly (State of the Art) 12 American Semiconductor Integration Semiconductor IC FleX SoP (Mechanical Die used for development) Printed Substrate - PET FHS Die Attach Challenge: Full adhesion with 75um alignment tolerance FHS Die Connect Challenge: Pitch 260um, Min Feature 130um Pad Up (Conductive Adhesive) Flip Chip (ACA) ACA - Anisotropic Conductive Adhesive
13 Electrical Test Data 2014 American Semiconductor, Inc. All rights reserved. 13 ASI Rainbow FCB Test Coupon with MEC Die Attached MEC Die Pad-up Configuration Resistance measurement from point1 to point2 is ~30Ω Resistance of substrate traces from edge to near the mechanical die are 14-15Ω (red/blue) Resistance of die region (green) which consists of two pad-to-trace interconnects and a printed trace on the mechanical die, are in the Ω range Resistance between adjacent traces are >10MEGΩ Flip-chip Configuration Die region on flip-chip board consists of two pad-to-trace contacts made with anisotropic ink/paste and a printed trace on the mechanical die; this (green) section has a resistance of Ω Resistance between adjacent traces are >10MEGΩ
14 Flip-chip 2014 American Semiconductor, Inc. All rights reserved. 14
15 Flip-chip 2014 American Semiconductor, Inc. All rights reserved. 15
16 Pad-up 2014 American Semiconductor, Inc. All rights reserved. 16
17 Pad-up 2014 American Semiconductor, Inc. All rights reserved. Proprietary Information 17
18 2014 American Semiconductor, Inc. All rights reserved. Current Focus Rainbow FHS Assembly 18 Purpose: Assembly Technology Development (demonstrate FHS manufacturing) BOM: FleX test die FleX-MCU flexible IC Flexible printed circuits Rainbow demonstrator Rainbow Demonstrator: Development tool Fully flexible demonstration Electrical verification of assembly methods Verification/demonstration of MCU capability Rainbow demonstrator for Flexible Hybrid System (FHS) demonstration of FleX-MCU
19 Thank You 2014 American Semiconductor, Inc. All rights reserved. American Semiconductor Inc., the American Semiconductor logo, Flexfet, FleX, and the Flexfet logo are trademarks of American Semiconductor, Inc. All other trademarks are the property of their respective owners. American Semiconductor, Inc South Vista Avenue, Suite 230 Boise, ID Tel: Fax:
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2017 American Semiconductor, Inc. All rights reserved. 1
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