Advances in FHE Integration using FleXform-ADC. 2016FLEX Conference March 03, 2015

Transcription

1 Advances in FHE Integration using FleXform-ADC 2016FLEX Conference March 03, 2015

2 What are Flexible Hybrid Electronics? Printed Electronics Low Cost, R2R, Large Format Flexible Hybrid System Combination of flexible printed materials and flexible silicon-based ICs to create a new class of flexible electronics. Flexible FleX-ICs High Performance, High Density Molex flexible substrate Printed Electronics Sensors Interconnects Substrates Displays Low Cost, Large Format Roll-To-Roll, Screen, Inkjet Print, American Semiconductor FleX-ICs Sensor Signal Processing Data Processing Data Storage Communications Low Cost, High Performance Compatible with Printed Electronics Foundry CMOS + FleX Processing 2

3 FleXform-ADC Development Kit FleXform-ADC Kits provide: SOTA FHE System Supports printed sensor development User printable FHE with on-board FleX-ADC Integration Board and Software Enables printed device demonstrations Fully supported by ASI flexible technology integration team for design and manufacturing This work sponsored in part by Air Force Research Laboratory FleXform-ADC Kit contents: Quick Start Guide FleXform-ADC printed circuit board (PCB) Two button cell batteries One 8.5 X 5.5 flexible circuit board sheet with two instances of the FleXform-ADC flexible circuit board (FCB) Additional documentation, videos and software development tools are available for download Kit Availability: Limited initial release 2/23/15 Now accepting pre-orders for March deliveries 3

4 FHE Capability Demonstration Brewer Science/American Semiconductor collaboration FleXform-ADC Dev Kit (FleX ADC IC) Temperature and humidity sensors (printed SWCNT) Temperature Testing Humidity Testing 4

5 Flexible ICs FleX-ICs required to achieve a fully flexible system Traditional packaged parts and bare die can be surface mounted to flexible substrates Create rigid islands in flex substrates and/or Rigid parts delaminate with even gentle curvature ~300um ~30um Package Die Bare Die SoP Die Flex Op-Amp functions at 5mm radius of curvature! Test Setup: Vdd = 2.5V FleX OPAMP Vss = 0V Ibias = 10uA In-pos = 1kHz square wave (YELLOW trace on oscilloscope) In-neg = connected to Out, voltage follower configuration (BLUE trace on scope) Out= connected to In-neg, voltage follower configuration (BLUE trace on scope) 5

6 Attach and Interconnect SOTA (In-Production) FleX-ADC/OPAMP 200um/300um Pad Pitch Pad up Silver Epoxy Manual Assembly 5mm RoC Today MRL 8 Flip Chip (fcst 2016) 200um/300um (ADC/OpAmp) 160um/260um (MCU) All FleX ICs Plated Pads ACA/ACI (tbd) Manual Assembly 2014 MRL 4 Flip Chip/ACI (2014) FleX-MCU 160um/260um Pad Pitch AS_MEC1001.fxd AS_MEC4001.fcb ACA manual assembly 2014 MRL 3 Flip Chip (fcst 2017) All FleX ICs <260um pitch ACA/ACI (tbd) Fully Automated This work has been partially funded by NBMC contract FA

7 Interconnect Direct Write 2016 Engineers Showing Off Today MRL First Functional Print 2014 MRL 4 7

8 Encapsulation Reliability Requirements Scratch protection Environmental protection FAIL Beta 2015 RoC 40mm Mechanical Requirements Conformal Thin Flexible Beta Units 600um thickness Rcurve limit 40mm Overlay compare 80% thinner ~90% more flexible Gen 1 Units 120um thickness Rcurve limit <5mm PASS Gen RoC <5mm 8

9 FleXform-ADC Platform FHE Reliability Testing Goals: 1. Dynamic Radius of Curvature (RCurve) Testing 2. Dynamic Complex Bend (Torsion) Testing Test Coupon: Flexible Hybrid Electronics (FHE) system with FleX-OpAmp on a PET substrate 127um (5mil) thick PET substrate with traces screen printed using a silver nanoparticle ink FleX-OpAmp general purpose operational amplifier configured as a voltage follower UV curable, non-conductive adhesives used for die attach and overcoat Thermal cure silver flake conductive adhesive used for interconnect 150mm 9

10 FleXform-ADC Platform Radius of Curvature Testing Robotics system used to dynamically flex the FHE system around a 15mm radius mandrel FHE system tested electrically throughout the curvature cycles Sample 1 10K cycles convex followed by 13.6K cycles concave without failure Sample 2 11K cycles concave followed by 15.8K cycles convex before first failure Failure due to crack in the silver flake conductive adhesive used for interconnect on the VDD line Sample would still function if stress applied to bridge the crack 10

11 FleXform-ADC Platform Axial Torsion Testing Robotics system used to rotate the sample ±60 or ±90 degrees FHE system tested electrically throughout the application of rotational stresses Sample 3 10K cycles of ±60 degrees followed by 92K cycles of ±90 degrees before failure Failure mode indicates a crack in the silver flake conductive adhesive 11

12 Flexible ICs FleXform-ADC Development Kit (AS_DEVA) Immediate availability FleXform-MCU Development Kit (AS_DEVB) Available Q FleX-OPA1 Dual General Purpose Opamps (AS_OPA1) Immediate availability FleX-OPA2 Quad General Purpose Opamps (AS_OPA2) Available Q FleX-OPA3 Quad High Performance Opamps (AS_OPA3) Available Q FleX-OPA4 Quad Output Transconductance Amps (AS_OPA4) Available Q FleX-ADC1 8-channels, 8-bits (AS_ADC1) Immediate availability FleX-ADC2 ADC with 3 Configurable Opamps (AS_ADC2) Available Q FleX-MCU1 8-bit PIC Microcontroller (AS_MCU1) Available Q FleX-MCU2 Microcontroller with ADC (AS_MCU2) Available Q FHE Sensor Reference Design Available Q2 2016

13 Thank you for attending Special thanks to : Air Force Research Lab Brewer Science Molex Boise State University Thank You 2016 American Semiconductor, Inc. All rights reserved. American Semiconductor is a registered trademark of American Semiconductor, Inc. FleXform, FleXform-ADC, FleX, Silicon-on-Polymer, FleX-ADC, FleX- MCU and FleX-IC are trademarks of American Semiconductor, Inc. American Semiconductor, Inc W. Targee St. Boise, ID Tel: Fax: