Solving Integration Challenges for Flexible Hybrid Electronics. High performance flexible electronics
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1 Solving Integration Challenges for Flexible Hybrid Electronics High performance flexible electronics
2 Wearable Sensor System Configurations 2 Wearable Hybrid System Sensor Signal Processing Data Processing Comm User Display
3 Wearable Hybrid Commercial Electronics Manufacturing3 IC Design Printed Circuits & Sensor Design Silicon IC Fabrication SoP Printed Electronics Hybrid FHE Assembly (2014) Integrators are needed (suppliers) 2015 Product Development Requires suppliers 2015?? Products in Market Requires Mfg Capacity. Not yet available.
4 IC s for wearable hybrid systems 4 Silicon-on-Polymer (SoP) converts single crystalline semiconductors into flexible semiconductors. FleX: 200mm CMOS 180nm Wafer Polymer & Bond Pads Circuitry SOI Substrate Polymer & Bond Pads Circuitry SOI Substrate Polymer & Bond Pads Circuitry Permanent Backside Polymer Polymer & Bond Pads Circuitry Permanent Backside Polymer Standard CMOS Wafer Handle Silicon Removed Polymer Substrate Applied SoP Wafer FleX commercial SoP CMOS process.
5 Rainbow FHS Assembly Test & Reliability Tools 5 Purpose: Assembly Technology Development Rainbow Strip Test Coupon:» Flexible circuit board compatible with: MEC die, FleX SoP Die, Std Die» Rcurve Test Platform» Mechanical or Environmental testing Rainbow Strip (fcb) Die (IC) Rainbow Demonstrator:» Development tool» Electrical verification of assembly methods» Functional test board Demonstrator test board (pcb) Tests and Standards in Development
6 Signal processing - The foundation for sensor integration 6 Needs to be done near to sensor. Solution for low power and SNR.
![A[0] A[1] A[2] A[3] A[4] A[5] A[6] A[7] FleX-ADC Flexible Analog-to-Digital Converter Features Operating Voltage 2.](/docs-images/80/80882852/images/7-3.jpg "5V Analog Input Channels 8 Resolution 8 bits Operating Frequency 1MHz Internal Oscillator Yes; 1MHz Conversion rate 100ksps Communication 2-wire I 2 C Conversion Modes Single, Continuous, Scan")
7 A[0] A[1] A[2] A[3] A[4] A[5] A[6] A[7] FleX-ADC Flexible Analog-to-Digital Converter Features Operating Voltage 2.5V Analog Input Channels 8 Resolution 8 bits Operating Frequency 1MHz Internal Oscillator Yes; 1MHz Conversion rate 100ksps Communication 2-wire I 2 C Conversion Modes Single, Continuous, Scan Channel Select User Configurable 8-bit Analog Mux 8-bit SAR ADC Control and Data Registers Internal Oscillator Power-On Reset Controller I 2 C Interface Signal processing solution for wearable hybrid systems I2CCK I2CDA Process Details Technology Interconnect Flexibility TowerJazz 180nm PD-SOI 4-level Aluminum FleX Silicon-on-Polymer Physical Specifications Die Size 2.4mm X 2.4mm Pin Count 24 Pad Opening 160um X 160um Pad Pitch 300um Thickness 24-60um; based on polymer Flexible Yes Conformal Yes Mass 0.23mg Source: 7
8 AS_ADC Bit ADC Conventional vs Flexible 8 Voltage vs ADC Reading 300 VS 250 ADC Reading AS_ADC1002.fxd (FleX die) 50 AS_ADC1002.pkg (Conventional Packaged Die) Voltage
9 Hybrid Assembly IC Design SoP Integration Test FA R&D Hybrid Manufacturing Infrastructure New 9,000 s.f. Manufacturing Facility Goal: Establish an integrator that can provide capacity Groundbreaking Jan 26, 2015 Commercial hybrid manufacturing capacity starting summer 2015 Boise, Idaho Doug Hackler 8/22/2016 9
10 Enabler for Wearable Sensor Product: FleXform-ADC Development Kit FleXform-ADC Platform for new product developers and printed researchers Integrate flexible sensors with electronics Enable concept demonstrations and low volume initial production Support for this work has been provided by AFRL FA C-5010 FHS with SoP ADC Demonstration Board Users can fabricate/mount user s technology on a hybrid electronic substrate with on board flexible ADC capability for development and demonstrations of the user s ideas.
11 FleXform-ADC: User printable FHS User Printable FHS 6 Sensor Areas»Labeled According to ADC Channel»Each supplied with 2.5V and GND»A1 => OPAMP0»A2 => OPAMP1 Practice FCB Integrates novel sensors with flexible electronics. Cut to form after sensor printing 5 ½ (139.7mm) 8 ½ (215.9mm) Doug Hackler 8/22/
12 FleXform-ADC Development Kit FleXform Kits provide: Out-of-the-box proof of FHE feasibility User printable FHE with on-board FleX-ADC Integration Board and Software Enables printed device demonstrations Fully supported by ASI flexible technology integration team for design and manufacturing. Kit Availability: Limited initial release 2/23/15 Now accepting pre-orders for March deliveries. 12
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