S (surface mount) Issue date Manufacturer package code
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1 1. Packag summary Tabl 1. Packag summary plastic, dual in-lin compatibl thrmal nhancd vry thin quad flat packag; 16 trminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body 30 January 2017 Packag information Trminal position cod Packag typ dscriptiv cod Packag typ industry cod Packag styl dscriptiv cod Packag body matrial typ IE packag outlin cod --- JEDE packag outlin cod JEIT packag outlin cod --- Mounting mthod typ Q (quad) DHVQFN16 DHVQFN16 DHVQFN (DIL-compatibl thrmal nhancd vry thin quad flatpack; no lads) P (plastic) MO-241 S (surfac mount) Issu dat Manufacturr packag cod SOT763 Symbol Paramtr Min Typ Nom Max Unit D packag lngth mm E packag width mm satd hight mm 2 packag hight mm nominal pitch mm n 2 actual quantity of trmination
2 2. Packag outlin DHVQFN16: plastic dual in-lin compatibl thrmal nhancd vry thin quad flat packag; no lads; 16 trminals; body 2.5 x 3.5 x 0.85 mm D B E 1 c trminal 1 indx ara dtail X trminal 1 indx ara 1 b 2 7 v M w M B y 1 y L 1 8 E h D h X mm scal DIMENSIONS (mm ar th original dimnsions) UNIT (1) max. 1 b c D (1) D h E (1) Eh 1 L v w y y 1 mm Not 1. Plastic or mtal protrusions of mm maximum pr sid ar not includd. OUTLINE VERSION REFERENES IE JEDE JEIT MO EUROPEN PROJETION ISSUE DTE Fig. 1. Packag outlin DHVQFN16 () ll information providd in this documnt is subjct to lgal disclaimrs. Nxpria B.V ll rights rsrvd Packag information 30 January / 5
3 3. Soldring Footprint information for rflow soldring of DHVQFN16 packag Rfr to th packag outlin drawing for actual layout soldr land soldr past dposit soldr land plus soldr past occupid ara sot763-1_fr Fig. 2. Rflow soldring footprint for DHVQFN16 () ll information providd in this documnt is subjct to lgal disclaimrs. Nxpria B.V ll rights rsrvd Packag information 30 January / 5
4 4. Lgal information Disclaimrs Limitd warranty and liability Information in this documnt is blivd to b accurat and rliabl. Howvr, Nxpria dos not giv any rprsntations or warrantis, xprssd or implid, as to th accuracy or compltnss of such information and shall hav no liability for th consquncs of us of such information. Nxpria taks no rsponsibility for th contnt in this documnt if providd by an information sourc outsid of Nxpria. In no vnt shall Nxpria b liabl for any indirct, incidntal, punitiv, spcial or consquntial damags (including - without limitation - lost profits, lost savings, businss intrruption, costs rlatd to th rmoval or rplacmnt of any products or rwork chargs) whthr or not such damags ar basd on tort (including nglignc), warranty, brach of contract or any othr lgal thory. Notwithstanding any damags that customr might incur for any rason whatsovr, Nxpria aggrgat and cumulativ liability towards customr for th products dscribd hrin shall b limitd in accordanc with th Trms and conditions of commrcial sal of Nxpria. Right to mak changs Nxpria rsrvs th right to mak changs to information publishd in this documnt, including without limitation spcifications and product dscriptions, at any tim and without notic. This documnt suprsds and rplacs all information supplid prior to th publication hrof. ll information providd in this documnt is subjct to lgal disclaimrs. Nxpria B.V ll rights rsrvd Packag information 30 January / 5
5 5. ontnts 1. Packag summary Packag outlin Soldring Lgal information... 4 Nxpria B.V ll rights rsrvd For mor information, plas visit: For sals offic addrsss, plas snd an mail to: salsaddrsss@nxpria.com Dat of rlas: 30 January 2017 ll information providd in this documnt is subjct to lgal disclaimrs. Nxpria B.V ll rights rsrvd Packag information 30 January / 5
S (surface mount) Issue date
very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm 8 February 2016 Package information 1. Package summary Table 1. Package summary Terminal position code Package type descriptive
B (bottom) Package type descriptive code. VFBGA56 Package type industry code. VFBGA56 Package style descriptive code
plastic, very thin fine-pitch ball grid array package; 56 balls; 0.65 mm pitch; 4.5 mm x 7 mm x 0.65 mm 30 January 2017 Package information 1. Package summary Terminal position code (bottom) Package type
B (bottom) Package type descriptive code. BGA658 Package type industry code. BGA658 Package style descriptive code
40 x 40 x 1.75 mm 8 February 2016 Package information 1. Package summary Terminal position code B (bottom) Package type descriptive code BG658 Package type industry code BG658 Package style descriptive
D (double) Package type descriptive code. TSSOP8 Package type industry code. TSSOP8 Package style descriptive code
leads; body width 4.4 mm 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code TSSOP8 Package type industry code TSSOP8 Package style descriptive
D (double) Package type descriptive code. SMT3; MPAK Package type industry code. SMT3; MPAK Package style descriptive code
plastic, surface-mounted package; 3 leads; mm pitch; 2.9 mm x 1.5 mm x 1.15 mm body 30 January 2017 Package information 1. Package summary Terminal position code D (double) Package type descriptive code
Q (quad) Package type descriptive code PLCC52. PLCC (plastic leaded chip carrier) Package style suffix code
PLCC52 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code PLCC52 Package type industry code PLCC52 Package style descriptive code PLCC
SOD123W. 1. Package summary. plastic, surface mounted package; 2 terminals; 2.6 mm x 1.7 mm x 1 mm body 9 April 2018 Package information
plastic, surface mounted package; 2 terminals; 2.6 mm x 1.7 mm x 1 mm body 9 pril 2018 Package information 1. Package summary Table 1. Package summary Terminal position code Package type descriptive code
plastic surface-mounted package; 5 leads D (double) Package type descriptive code TSOP5 Package type industry code
8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code TSOP5 Package type industry code TSOP5 Package style descriptive code SO (small outline)
S (single) Package type descriptive code. DPAK Package type industry code. DPAK Package style descriptive code
plastic, single-ended surface-mounted package (DPK); 3 leads; 2.285 mm pitch; 6 mm x 6.6 mm x 2.3 30 January 2017 Package information 1. Package summary Terminal position code S (single) Package type descriptive
B (bottom) Package type descriptive code. LFBGA208 Package type industry code. LFBGA208 Package style descriptive code
package; 208 balls; body 15 x 15 x 1.05 mm 8 February 2016 ackage information 1. ackage summary Terminal position code (bottom) ackage type descriptive code LFG208 ackage type industry code LFG208 ackage
D (double) Package type descriptive code. SOD2 Package type industry code. DSN Package style descriptive code
silicon, leadless ultra small package; 2 terminals; mm pitch; 0.6 mm x 0.3 mm x 0.3 mm body 9 March 2017 Package information 1. Package summary Terminal position code D (double) Package type descriptive
SOT404-REFLOW REL Major version date Minor version date Security status
D2PAK plastic single-ended surface-mounted package (D2PAK); 3 terminals (one lead cropped); 2.54 mm pitch; 11 mm x 10 mm x 4.3 mm body 9 January 2017 Package information 1. Package summary Table 1. Package
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SOD Package summary
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SPECIFIC CRITERIA FOR THE GENERAL MOTORS GLOBAL TRADING PARTNER LABEL TEMPLATE:
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DO NOW Geometry Regents Lomac Date. due. Similar by Transformation 6.1 J'' J''' J'''
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Ultra low capacitance ESD protection for Ethernet ports. ESD protection high-frequency AC-coupled Ethernet ports
Rev. 3 17 June 2010 Product data sheet 1. Product profile 1.1 General description The is designed to protect Input/Output (I/O) ports that are sensitive to capacitive loads, such as Ethernet, from destruction
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 multiplexer/demultiplexer switch
1.8 V, wide bandwidth, 4 differential channel, 2 : 1 multiplexer/demultiplexer switch Rev. 1 16 July 2010 Product data sheet 1. General description is an 8-to-4 differential channel multiplexer/demultiplexer
Low forward voltage Ultra small SMD plastic package Low capacitance Flat leads: excellent coplanarity and improved thermal behavior
Rev. 02 15 January 2010 Product data sheet 1. Product profile 1.1 General description Planar Schottky barrier triple diode with an integrated guard ring for stress protection. Three electrically isolated
CBTL General description. 2. Features and benefits. 3. Applications
3.3 V, one differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen3 Rev. 1.0 22 September 2011 Product data sheet 1. General description is a single differential channel, 2-to-1
PESD18VF1BL. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data. 5. Pinning information
10 July 2018 Product data sheet 1. General description Ultra low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a DFN1006-2 (SOD882) leadless ultra small Surface-Mounted Device
Base Schedule Aggregation Portal (BSAP) Interface Specification for BSAP Services
Bas Schdul Aggrgation Portal (BSAP) Intrfac Spcification for BSAP Srvics (Businss Ruls v 9.x(Fall 2017) or latr) Vrsion: 1.3 Dcmbr 19, 2017 Rvision History Dat Vrsion By Dscription 12/19/2017 1.3 WT Additional
running at 133 MHz bus. A Pentium III 1.26GHz with 512K cache running at 133 MHz bus is an available option. Fits Your Needs
3715 Industrial PCs 15.0" LCD Flat Panl Display DS-371500(E) Xycom Automation's nwst gnration of Industrial PCs is dsignd and tstd for th tough nvironmnts rquird for plant floor us. Our standard PC configurations
1 GHz wideband low-noise amplifier with bypass. The LNA is housed in a 6-pin SOT363 plastic SMD package.
Rev. 2 14 September 2010 Product data sheet 1. Product profile 1.1 General description The MMIC is a wideband amplifier with. It is designed specifically for high linearity, low-noise applications over
Gernot Hoffmann Sphere Tessellation by Icosahedron Subdivision. Contents
Grnot Hoffmann Sphr Tssllation by Icosahdron Subdivision Contnts 1. Vrtx Coordinats. Edg Subdivision 3 3. Triangl Subdivision 4 4. Edg lngths 5 5. Normal Vctors 6 6. Subdividd Icosahdrons 7 7. Txtur Mapping
PCA9554; PCA9554A. 1. General description. 2. Features and benefits. 8-bit I 2 C-bus and SMBus I/O port with interrupt
Rev. 10 8 November 2017 Product data sheet 1. General description The PC9554 and PC9554 are 16-pin CMOS devices that provide 8 bits of General Purpose parallel Input/Output (GPIO) expansion for I 2 C-bus/SMBus