Evolution, Qualification and Latest Developments of Printed Hybrid Electronics

Transcription

1 Evolution, Qualification and Latest Developments of Printed Hybrid Electronics Rob Irwin Engineering Manager Printed Electronics

2 Printed Hybrid Electronics Hybrid electronics Molex Printed Electronics Introduction Functional printing techniques Surface capacitive touch (HMI) Image courtesy of Hybrid electronics platform for next generation of custom-designed smart things

3 Hybrid Electronics Print what you can, place what you must Common Terms: - Flexible Hybrid Electronics (FHE) - Functional printing - Organic electronics - Stretchable electronics - Surface Mount Technology (SMT) - Die Attach - Convert - Peel and Stick electronics - Substrate (PET, PEN, PI, TPU, Paper,...) - Ink (Ag, C, Ag/AgCl, Zn, Cu, Au, Pt,...) Common Device Elements: - Base circuit (printed, flexible) - Microcontroller - Wireless communication - Power/battery - Sensor (printed or placed) - Display - Passive components - Adhesive/encapsulation - TRL / MRL (Technology / Manufacturing Readiness Level) - Additive Manufacturing Image courtesy of Electronics on unique substrates, enabling previously unattainable form factors Innovative and new to the world applications

4 Hybrid Electronics Market Opportunities The printed, flexible and organic electronics market will be worth over $73 billion by IDTechEx Source: Image courtesy of Image courtesy of

5 Hybrid Electronics Challenges & Smart MFG Opportunities Application & Functional Requirements Electrical RF Mechanical/Assembly Design Rules Materials Selection Simulation/Modeling Design for MFG/Test/Inspection Firmware/Software Backend Integration?... Use Case Form Factor Regulations Voltage Power Environmental Conditions Reliability Cost Product Volume Time to Market... Materials Properties Factory Tolerances Factory Conditions Supplier Management Efficiencies Equipment/Tooling/Operator Effects on Material Properties Test/Inspection... Visual Electrical Mechanical Thermal RF Material Interactions Reliability Sensor Function Operational Capabilities Processing Conditions Tolerances... Successful FHE Application Varying Manufacturing Readiness Levels (MRL) of products depending on the application and functional requirements, and the materials/components necessary to meet requirements. Opportunities: Standards development, component technology, material/component and design libraries, centralized recipe creation/management, and improved factory & supply chain feedback loop will enable broadscale enhanced MRL. New entrants should work with integrators, consultants, and/or consortia. PE & FHE Consortia: Design & Modeling Fabrication Modified Fishbone diagram for successfully-operationalized hybrid product MRL 1 ~ Not capable MRL 10 ~ Full rate, mature manufacturing / application

6 Enabling Hybrid Technology for the Smart Factory & Supply Chain Opportunities for Advancement of PE & FHE Enabling Design & Process Elements o Novel substrates, inks, adhesives, components, process and design elements to improve performance and/or reduce costs to enable large-scale implementation of wireless/sensor devices Inventory & Supply Chain: Conditions Monitoring, Alerts, Reporting o Sensors, antennas, energy harvesting, wireless communication, data aggregation, smart factory feedback loop Mass Customization o FHE-specific design & modeling tools, standards development, interactive databases, middleware, centralized machine setup => ECAD & Modeling Software Developers Distributed Manufacturing o Minimize distributed global factory differences; Enhanced material/component databases, ERP integration, centralized machine setup

7 Molex Printed Electronics Molex, printing more than 35 years Rocker/Push Switches 1970s Bonded LEDs 1990s Value Add Assemblies 1990s Graphics & Overlays 2000s PEDOT & Backlight 2000s Bonded IC s, Fine line, nano Ag 2010s Functional Printed Inks & Membrane Switches 1980s Automated SMT (LED, 7-seg. & Passives) 1990s Cap Sense 2000s Fluid Sensing 2010s Flexible Batteries 2010s

8 + Deep industry relationships

9 Functional Printing Techniques Digital and Physical Printing* *Each has own raw material and functional output capabilities Direct Digital Techniques Inkjet 2D/Future 3D by layer processing Dispense 2D/Conformal/3D Aerosol 2D/Conformal Digital File to Physical Tool Techniques Screen print 2D; Sheet or R2R processing Gravure 2D; Sheet or R2R processing Flexography 2D; R2R processing Adjacent images courtesy of Image courtesy of Image courtesy of Image courtesy of Image courtesy of Image courtesy of Other Additive Circuitry Techniques MID Digital; 2.5D LDS Digital; 2D/3D (for more, search MID/LDS at

10 Printed Circuit Solutions Molex Hybrid Electronics Printed Technologies Circuit Solutions Conductive circuits Silver, Copper, Carbon Dielectrics Plated copper Radio translucent inks Radio opaque inks Flexible Substrates PET(polyester) Polyimide Paper, Fabrics, Non-Woven Fabrics Stretchable Substrates (Dev) Other Substrates Various thicknesses from 1mil and up Manufacturing Capabilities Continuous roll processing Sheet processing SMT Low temp solder Epoxy attachment Component encapsulation Adhesives

11 Printed Electronics Evolution

12 Enabling Printed Electronics and Hybrid Technologies

13 Miniaturization Fine line printing Compact electronics (PCB) Condensed HMI designs Materials (substrate/ink) Image from Preparation (mesh/emulsion) Image from Equipment (print/curing process) 52 µm

14 Flexible & Capacitive fingertip controls Custom design touch surface applications MRL-10 PEDOT Silver trace Silver GND PEDOT:PSS is an acronym for chemical name poly(3,4-ethylenedioxythiophene) polystyrene sulfonate

15 Capacitive Touch Transparency Translucent Nano-wire MRL-8 High performance translucent touch Higher transparency Less visibility Cost-effective transparent surface touch Picture from:

16 Assembly Advancement: Reflow Solder Process Silver flex hybrid Conductive Epoxy (red) The SMT component placement / curing process results in the epoxy being displaced or squished and potentially shorting the circuit (yellow). It does not supply any self centering characteristic which may cause the component to drift away from pads and misalign the component. Low Temp Solder (grey w/red) - The SMT component placement / heating process allows the solder to wick up the sides of the leads thus avoiding the potential shorting of the polyester pads. The wicking also provides a centering characteristic that causes the component to be aligned with the pads

17 Custom-Design Hybrid Electronics Platform MRL -8/10

18 Flexible Hybrid Electronics Silver flex technology custom-design platform Alternative to PI-based copper etched circuits Innovate printing and component attach Light and flexible Optimal for small power and low-speed signals Substrate relevant lower cost (PET versus PI) Simpler manufacturing processes Sheet-fed or roll-to-roll Additive process: printing versus copper etching No wet chemical etch processes No water treatment and filtration installations Suitable for different substrates PET, woven and non-woven fabrics, paper, PI Selection of ink materials Silver flakes, nano-particles, carbon, dielectrics, graphics Selection depends on application: feature sizes / dimensions, conductivity, mechanical requirements (scratch, bend, stretch)

19 Hybrid Electronics From sophisticated electronics to disposable devices Appliances Automotive Sport & Health Personal diagnostics Medical Fashionables Light Industrial Smart buildings

20 Silver Flex Hybrid Platform Medical wearables Key Features Flexible polyester (PET) substrate Integrate electronics (IC s, sensors, components), circuitry for low power wireless (NFC, RFID, BLE), antennas, battery (+holder), connector Us of Ag/AgCl ink for sensor purposes Light, flexible and bio-compatible (Partly-) disposable solutions Potential applications Body-worn sensors Biosensors Diagnostic and therapeutic devices Blood-glucose monitoring Drug delivery Shock therapy Depression therapy Smart labels and sensor tags for device monitoring Fitness and personal diagnostic devices

21 Silver Flex Hybrid Technology Technical Summary Circuit Manufacturing Sheet Based / Roll to Roll Circuit Layers Single Sided/Double Sided Printed Circuits Thru Vias / X-over Circuit Pitch Narrow traces & spaces 125 µm (5 mils) Qualifying 50 µm (2 mils) in 2018 Component Attach Conductive Epoxies Proprietary Soldering Technique SMT components: (0402) & IC s (IC detail: pitch 0.5mm; QFN; QFP) UV-cured encapsulation

22 Hybrid Electronics Implementation

23 Hybrid Enables Broad Adoption of NFC-based wireless communication systems Sensor System Interrogator/Reader or Phone + App Internet / Network Access Device Sensor System Server Browser Database User Sensor System Front End Back End User Interface Protocol

24 NFC Temperature Sensing Patches Component breakdown No plugs/connectors No batteries = passive patch Printed silver antenna coil All-in-one NFC chip Representative applications Body-worn temperature monitors Tamper detection Industries Medical Food & Beverage Design Tradeoffs Functionality Function limited by power (~3mA at 1.5V) Form factor Antenna area vs read range (38mm dia 5cm) Durability Encapsulation vs conformability (Encap height <1mm)

25 NFC Temperature Datalogging Labels Graphic Inlay Representative applications Shipping sensitive product Cold chain validation Asset monitoring and warranty Shelf life determination Industries Food & beverage Pharmaceutical Medical device Polymer materials Shown on a DVD case Adhesive

26 NFC Temperature Logging Solution CSV Cloud

27 Outlook Roadmap: Hybrid Electronics Custom NFC on PET (MRL-8) Flex chip on PET (MRL-5) In-Mold Electronics (MRL-5)

28 Thank You Rob Irwin Engineering Manager Printed Electronics