Dummy Components Test Boards Training Aids Tools and Supplies

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1 Dummy Components Test Boards Training Aids Tools and Supplies

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3 Distributor of mechanical IC samples (dummy components), test boards, kits and SMD production tools and equipment. Frequently Asked Questions What are dummy components?* Dummy components are the exact mechanical equialent of functional electronic components. Why use dummy components? Dummies sae money. In cases where only mechanical characteristics are required, dummy components can be used instead of lie functioning components. Since there is no expensie die inside the package, the cost for performing mechanical testing is significantly lower. Who is Practical Components? Practical Components is a team of dedicated electronic industry professionals offering alue pricing, on-time deliery, and superior serice to our customers. The Practical Components team is ready to proide project assistance in the areas of technical component knowledge, drawings, component land patterns, and PCB practice kits. What is a PCB Practice Kit? A PCB Practice Kit contains both the PC practice board and the necessary dummy components so customers can conduct assembly process ealuation without using high-cost, lie components and functional PC boards. Kits are aailable in a single pack for employee hand soldering training or packaged for production equipment ealuation. Both X, Y Theta data and Gerber data are aailable without charge. What other products are offered by Practical Components? In addition to dummy components, Practical carries solder training aids, tools and related equipment, IPC products and designs custom printed circuit boards. Your sales representatie can supply technical information and pricing on all our products. Who uses dummy components? Companies that are inoled with electronic component assembly, testing, ealuation and employee training. Contact Practical Components If you hae any additional questions concerning Practical Components, our products or policies, please contact us. Practical Components, Inc Noel Street Los Alamitos, CA USA Tel: Fax: klaphen@practicalcomponents.com Web Site: Main ...klaphen@practicalcomponents.com Sales...Russell Kido / rkido@practicalcomponents.com Sales / International... Staci Knight / sknight@practicalcomponents.com Sales... Lisa Laphen / llaphen@practicalcomponents.com Technical Support...techsupport@practicalcomponents.com Purchasing...Deanne Herman / dherman@practicalcomponents.com President... Kein Laphen / klaphen@practicalcomponents.com *Disclaimer: Dummy components are only to be used for ealuation and testing purposes. Practical Components is not responsible for product that is used as a lie package using lie die assembly. Dummy samples are not to be used for 1st reliability testing. Practical Components is the exclusie distributor of Amkor Technology Mechanical Components.

4 How To Place Your Order Our sales staff is ready to sere you from 8:00 A.M. to 5 P. M. Pacific Standard Time, Monday through Friday. Our fax lines are open 24 hours eery day. Fax and orders receied after normal business hours are processed the next business day. Please include your telephone and fax numbers so we can confirm your order. Bill / Remit to: Practical Components, Inc. PO Box 1037 Los Alamitos, CA USA Ship to: Practical Components, Inc Noel Street Los Alamitos, CA USA Tel: Fax: klaphen@practicalcomponents.com Web Site: F.O.B. is Los Alamitos, CA USA Terms and Conditions Out Of Stock Items: Items not aailable for immediate shipment will be shipped as they become aailable. Items not aailable at the end of 90 days will be cancelled. The number of back-ordered days may be extended beyond 90 days with customer approal. Return Policy: Returns must be made promptly and accompanied by a return authorization number. Please contact a customer serice representatie to obtain a return authorization number. All returns must be made within 30 days of date of inoice and accompanied by return authorization number. Return freight charges must be prepaid. C.O.D. returns cannot be accepted. Return merchandise in original packaging and in resalable condition. Please note that items returned due to customer error may be subject to a restocking charge of 25%. Non-catalog items are not returnable. Catalog Listings: Not all products listed in this catalog are maintained in stock, and all product specifications for each product are current as of the date of publication. Product listings, specifications and prices for each product are subject to change without notice. Product Liability: Practical Components sole obligation for products that proe to be defectie within 10 days of purchase will be replaced or refunded. Practical Components gies no warranty either expressed or implied and specifically disclaims all other warranties, including warranties for merchantability and fitness. In no eent shall Practical Components liability exceed the buyer s purchase price nor shall Practical Components be liable for any indirect or consequential damages. Shipment Damage: Merchandise is carefully packaged in compliance with carrier requirements. Claims for loss or damage in transit must be made with the carrier by the customer. All shipments should be unpacked and inspected immediately upon receipt. If damage does not become apparent until shipment is unpacked, make a request for inspection by the carrier s agent. Failure to do so will result in the carrier refusing to honor the claim. Non-Catalog Items: Merchandise not listed in our catalog, if aailable from our suppliers, may be subject to minimum order quantities and/or special handling charges. Shipment is made as quickly as delieries are receied from our suppliers. Special order products are sold on a nonreturnable basis. Quotations: All items are subject to prior sale. A quote is alid for 30 days. Dishonored Check Policy: If a check you gie us as payment is dishonored for any reason by the bank or any other institution on which it is drawn, you agree to pay us $20.00 as a serice charge. In addition, you agree to pay any other reasonable charges imposed by any check erification company or collection agency that we may use for collection. Prices/Quantities: Prices are subject to change without notice and quantities may be limited. Handling Charge: A $10.00 handling charge applies to all orders less than $ Terms: We accept Visa, MasterCard and American Express (minimum order is $50.00). Open Account: We bill on a net 30 day basis to customers with approed credit. Large Quantity Quotations: Practical Components will be happy to quote quantities in excess of the amounts shown in the catalog. Freight Charges: On open accounts, actual freight charges are added to the inoice. A packing and handling fee of $4.50 is added to the order. C.O.D accounts will hae the freight charges pre-billed to the C.O.D. total in addition to a $5.00 packing and handling charge. Tray Charge: A $7.00 tray charge is added if customer orders less than a full tray quantity. Special Requirements: Please include specific instructions if you require special packing, marking, shipping, routing or insurance. *All prices are in USD ($).

5 Through Mold Via TMV PoP Through Mold Via Pkg Amkor Technology... 6 PC250 TMV (Through Mold Via) 14mm Drop Test Board & Kit Amkor Technology...10 Package on Package PoP Package on Package Amkor Technology...11 PC200 PoP 12mm Lead Free-Test Kit Amkor Technology...20 PC200 PoP 14mm Lead-Free Test Kit...24 PC200 PoP 15mm Thermal Cycle Board & Kit Amkor Tech...28 Land Grid Array LGA Land Grid Array Amkor Technology...29 Ball Grid Array CVBGA Very Thin ChipArray BGA Amkor Technology...30 CTBGA ChipArray Thin Core BGA Amkor Technology...31 CABGA ChipArray BGA Amkor Technology...32 SuperBGA Amkor Technology...33 PBGA 1.0mm Pitch Amkor Technology...34 PBGA 1.27mm Pitch Amkor Technology...35 Flip Chips WLP Wafer Chip Size Package...36 Flip Chip Pac Tech...38 PC310 Pac Tech Flip Chip Test Die Kits...39 Flip Chips...40 Flip Chip Test Die Kit...42 Industry Acronyms Industry Acronyms...43 CD Case Display Dummy Component Display Case...46 OmQFN OmQFN Open-molded Quad Flat Pack No Leads Quik-Pak...47 MicroLeadFrame MLF MicroLeadFrame Amkor Technology...48 Dual Row MLF Amkor Technology...49 FusionQuad (V)FQFP FusionQuad Amkor Technology...50 PC (128/48) FusionQuad Thermal Cycle Board & Kit Amkor Technology...52 PC ld FusionQuad Drop Test Board & Kit Amkor Tech...53 Quad Flat Packs TQFP Thin Quad Flat Amkor Technology...54 LQFP Low Profile Quad Flat Pack Amkor Technology...55 QFP Quad Flat Pack Amkor Technology...56 CQFP Ceramic Quad Flat Pack...57 LCC Leadless Ceramic Carrier...57 Daisy-Chain Patterns...58 Dual Packages PLCC Plastic Leaded Chip Carrier...59 SOIC/SOJ Small Outline Integrated Circuit...60 TSOP Type I & Type II Thin Small Outline Package Amkor Tech..61 SSOP Small Shrink Outline Package Amkor Technology...62 TSSOP Thin Shrink Small Outline Amkor Technology...63 Contents Passies, Resistors, Discretes SMR Lead-Free Surface Mount Resistors...64 SMC Lead-Free Surface Mount Ceramic Capacitors...65 MELF Resistors Metal Electrode Leadless Face...66 SME Surface Mount Electrolytic Capacitors...67 MELF Diodes Metal Electrode Face Component Diodes...67 SMT Lead-Free Surface Mount Transistors...68 SMTA Surface Mount Molded Tantalum Capacitors...70 Through-Hole PDIP Plastic Dual In-line Pkg...71 Through-Hole Glass Diodes...71 TO Through-Hole Transistors...72 Axial Leaded Resistors...72 Tape and Reel CTReels Empty Carrier Tape Reels...74 Tape and Reel Specifications...75 Printed Circuit Boards and Kits Custom PC Practice Boards and Kits...76 CircuitCAM Software Aegis Industrial Software...77 Kit Identifier (component part/kit numbers)...78 Single Pack Hand Solder Kits...81 PC/WHMA-A620 Wire Harness Kit...82 Conformal Coating Process Flow Chart...83 Test Boards for Cleanliness and Conformal Coating...84 SIR Test Board and Kit...87 PC052 B-52 CRET Cleanliness & Residue Eal. Test Kits...88 SMTA Saber Ealuation Board and Kit...90 WTK-1 Terminal and Wire Kit...91 PC000 Lead-Free Zero-Ohm SMD Resistor Board and Kit...92 PC2009 AIM Print Test Board and Kit AIM...93 PC003 Solder Practice Board and Kit...94 PC005 BGA Variable Pitch and Array Board and Kits...95 PC007 MLF Test Board and Kits...96 PC008 Solder Practice Board and Kits...98 PC009 Mixed Technology Board and Kit PC011 BGA Fine Pitch Board and Kit PC012 BGA Global Daisy-Chain Test Kit PC013 Through-Hole Solder Training Kits PC014 IPC 9850 Attribute Defect Rate Kit PC015 Rework Kits PC016-J-STD IPC Compliant Hand Soldering Kit PC031 Lead-Free Process Capability Validation Kit Cookson PC Traceability & Control Validation Kit Aegis PC049 SMT/PTH Mixed Tech. Pb-Free Kit Indium Corp Practical Production Tools Epoxy Kit CircuitMedic Professional Repair Kit CircuitMedic Micro Drill System CircuitMedic Plated Hole Repair Kit CircuitMedic Beau Tech Soldering Aids Flextac BGA Rework Stencil Kit Practical BGA Reballing Kit International Distributors

6 TMV PoP Through Mold Via Package NEW! After three years of deelopment, Amkor has introduced the next generation PoP solution. This new technology is called Through Mold Via (TMV ). The new TMV technology is used to create interconnect ias through the mold cap, it also proides a more stable bottom package that enables the use of thinner substrates with a larger die to package ratio. TMV enabled POP can support single, stacked die for wirebond and FC designs. TMV technology enables next generation PoPs by: n Remoing bottlenecks for fine pitch memory interfaces n Enhancing warpage control and bottom package thickness reduction n Increasing die to package size ratios n Supporting wirebond, flip chip, stacked die and passie integration n Improing board leel solder joint life White paper articles and technical presentations are aailable on Practical Components web site at or Amkor Technology s web site at TMV PoP Mating Top and Bottom Daisy Chain Samples Part Description I/O Count Pitch Body Size Ball Matrix Ball Alignment 14mm Body Size A-PoP200-.5mm-14mm-DC 200 (top package).5mm 14mm 27x27 Perimeter 119 A-TMV620-.4mm-14mm-DC 620 (bottom package).65mm (top) -.5mm (bottom) 14mm 33x33 Perimeter 119 Quantity Per Tray Notes Fine pitch 0.4mm bottom package footprints. Stacked package heights of 1.2mm nominal (see Stack Up table on following pages). Package configurations compliant with JEDEC standards. Moisture Resistance Testing is JEDEC Leel 260 C. Temp Cycle 55/+125 C, 1000 cycles. HAST 130 C, 85% RH, 96 hours. Temp/Humidity 85 C/85%RH/1000 hours. High Temp Storage 150 C, 1000 hours. Board leel Thermal Cycle 40/+125 C, 1000 cycles. Parts packaged in JEDEC matrix trays. PoPs are only aailable Pb-free (not Tin-Lead). Aailable alloys are: (SAC105) 98.5%Sn/1.0%Ag/0.5%Cu Top Package and (SAC125Ni) 98.2%Sn/1.2%Ag/0.5%Cu/0.5%Ni bottom package. It is recommended that parts be pre-baked at 125 C for 48 hrs before using parts regarding moisture concern. PoP s are not aailable without solder balls. See drawings on the following pages (8 9) for additional technical data. Color coded ersion aailable on our website: Part Description System Amkor A-TMV620-.4mm-14mm-DC-Alloy Through Mold Via Package Stackable I/O Count (Bottom Side Only) Pitch Ball Diameter I/O Count Ball Diameter mm mm For recommended kit see page 10. (SAC105 and SAC125Ni) Daisy Chain Body Size Please Note Amkor supporting data is aailable on our website for: Board Leel Reliability (BLR), PoP application notes, PoP Stencil & Stacking paper for SMT Conditions. IMAPS and SMTA White Paper Articles for additional supporting data aailable on our website: Practical Components is the exclusie distributor of Amkor Technology Mechanical Components. 6 Practical Components, Inc. klaphen@practicalcomponents.com

7 TMV PoP Through Mold Via Package 14mm 620 TMV Bottom Package Design Dimensions Foot print-top (b) Packagesize (a) Die size (d) Foot print-bottom (c) Body (a) Foot Print top (b) Foot Print bottom (c) Die (d) 14 x 14mm 0.50 pitch, 200 ball 27 matrix, 2 row 0.4 pitch, 620 BGA 33 matrix, row 7.6 x 7.6mm mm Daisy Chain 4 Net Design Daisy chain netlist of TMV, Bottom package balls. Daisy chain netlist of TMV corners only. A3, A31 Corner NC pads of top site package. [H17 H18], [H19 H20] Daisy chain netlist of top side (Top FBGA to TMV pin memory interface). Bottom package: Package Stackable TMV. [T8 U8], [V8 W8] * Color diagram of DC Net design aailable on our website. Practical Components, Inc. Tel: Fax:

8 TMV PoP Through Mold Via Package TMV 620 (Bottom Package) Bottom Side Daisy Chain Nets Bottom side of bottom package (top iew through package) 14x14mm, 0.4 mm TMV620, 33x33 ball matrix. TMV 620 (Bottom Package) Top Side Daisy Chain Nets Top side of bottom package (top iew through package) 14x14mm, 0.5 mm PoP200, 27x27 ball matrix. Connected thru bottom side [H17 H18], [H19 H20] A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN Top View Daisy chain pattern of TMV Bottom BGAs corner 24 balls Daisy chain pattern of TMV Bottom BGAs Top side 16 corner ball DC net Top side main DC net A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG Connected thru bottom side [T8 U8], [V8 W8] Top View 200 PoP (Top Package ONLY) Daisy Chain Netlist Top PoP + TMV Daisy Chain Netlist Connected thru bottom side [H17 H18], [H19 H20] A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG Top View Top side main DC net Top side 16 corner ball DC net Top side main DC net Top side 16 corner ball DC net A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG Connected thru bottom side [T8 U8], [V8 W8] Top View * Color diagram of DC Net design aailable on our website. 8 Practical Components, Inc. klaphen@practicalcomponents.com

9 TMV PoP Through Mold Via Package Test Board PWB Netlist Pattern for BLR Testing Stacked iew of 4 DC Nets for BLR testing A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN Top View PWB Pattern for Test Board design PWB Pattern for Test Board design 2-1 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN Top View TMV PoP Oerall Stack Up Table B3 B1 A3 A1 B2 A2 100μm core, 350μm mode cap (Laminate) Symbol Unit Min Nom Max Tolerance A1 (Ball, 0.4 pitch) mm A2 (4L laminate) mm A3 (Mold cap) mm Total Bottom Pkg Height mm B1 (package stand-off) mm B2 Subs mm B3 Mold mm B2 + B3 mm Oerall PoP Stack Height mm * Color diagram of DC Net design aailable on our website. Practical Components, Inc. Tel: Fax:

10 TMV (Through Mold Via) 14mm Board and Kit Drop Test Lead Free Kit NEW! Practical Components new TMV 14MM test board and kit is a basic drop test board designed for the new Amkor TMV (Through Mold Via) components. This test eight layer board is a 3x5 array with 15 components placements per board. The board is 132mm x 77mm in size, and 1.0mm thick. The standard surface finish is OSP. Our test ehicle is designed for the new TMV 620 solder ball.4mm pitch bottom component and the TMV 200 solder ball.5mm top component. Both top and bottom components hae a daisy chain pattern through the substrate of the part. A daisy chain pattern also runs through the test board. The design allows for daisy chain 3 net design. Meaning both top and bottom components as well as the board can be tested indiidually or as a group. This kit allows the end user to test the integrity of their process applications for TMV components. PCB250 14mm TMV Drop Test Board Notes n Board size is 132 x 77mm, 8 layers,.039" thick, no microias. n Board material is IS-410 High Temp. 180Tg. n Standard board finish is OSP Entek CU-106A-HT. n 15 daisy-chain pad placements for 14x TMV component. n Immersion Siler board finish is aailable upon special request. MOQ may apply. n Gerber and X,Y Theta data included at no charge. Practical Components is the exclusie distributor of Amkor Technology Mechanical Components. Order Number: PCB250-14mm-TMVDT (board only) Order Number: A-PoP mm-DC-105 (top component only) Order Number: A-TMV mm-DC-125 (bottom component only) 10 Practical Components, Inc. klaphen@practicalcomponents.com

11 PoP Package on Package Amkor is offering daisy chain samples of their award winning bottom Package Stackable Very Thin Fine Pitch BGA (PSfBGA) and their top PoP optimized for Package on Package (PoP) requirements. PoP has become the solution of choice for an increasing number of mobile consumer applications for 3D integration of logic and memory deices. Amkor s PSfBGA is a high density fine pitch BGA package supporting logic or ASIC deices including base band, application and image processors. PoP stacking allows the OEM greater deice, supplier and time to market flexibility by sourcing the bottom and top deices from their preferred logic and memory suppliers and then stacking the deices in the PWB surface mount assembly flow. A wide range of leading wireless and mobile integrated deice manufacturers are relying on Amkor s technical and industry leadership in PoP. Stacked Package PoP Package on Package Mating Top and Bottom Daisy Chain Samples Part Description I/O Count Pitch Body Size Ball Matrix Ball Alignment 12mm Body Size A-PoP mm-12mm-DC 128 (top package).65mm 12mm 18x18 Perimeter 152 A-MPoP mm-12mm-DC 128 (middle package).65mm 12mm 18x18 Perimeter 152 A-PSfBGA305-.5mm12mm-DC 305 (bottom package).65mm (top) -.5mm (bottom) 12mm 23x23 Perimeter mm Body Size A-PoP mm-14mm-DC 152 (top package).65mm 14mm 21x21 Perimeter 119 A-PSfBGA353-.5mm-14mm-DC 353 (bottom package).65mm (top) -.5mm (bottom) 14mm 26x26 Perimeter mm Body Size A-PoP mm-15mm-DC 160 (top package).65mm 15mm 22x22 Perimeter 112 A-PSfBGA mm-DC 604 (bottom package).65mm (top) -.5mm (bottom) 15mm 28x28 Perimeter 112 Quantity Per Tray Notes Fine pitch 0.5mm bottom package footprints Stacked package heights of 1.2mm to 1.6mm aailable in a ariety of configurations (see Stack Up table on following pages) Wafer thinning / handling < 100 µm Consistent product performance and reliability Package configurations compliant with JEDEC standards Moisture Resistance Testing is JEDEC Leel 260 C Temp Cycle 55/+125 C, 1000 cycles HAST 130 C, 85% RH, 96 hours Temp/Humidity 85 C/85%RH/1000 hours High Temp Storage 150 C, 1000 hours Board leel Thermal Cycle 40/+125 C, 1000 cycles Parts packaged in JEDEC matrix trays PoPs are only aailable Pb-free (not Tin-Lead). Aailable alloys are: SAC305, SAC405, SAC105 and SAC125Ni*. *SAC125Ni (98.25%Sn/1.2%Ag/0.5%Cu/0.5%Ni) is only aailable for bottom packages. It is recommended that parts be pre-baked at 125 C for 48 hrs before using parts regarding moisture concern. PoPs are not aailable without solder balls. See drawings on the following pages (12 27) for additional technical data. Color coded ersion aailable on our website: Part Description System Amkor A-PSfBGA305-.5mm-12mm-DC-Alloy Package Stackable Very Thin Fine Pitch BGA I/O Count (Bottom Side Only) Pitch Ball Diameter I/O Count Ball Diameter mm mm mm mm (SAC305, SAC405, SAC105, and SAC125Ni) Daisy Chain Body Size For recommended kits see pages 20, 24 and 28. Please Note Amkor supporting data is aailable on our website for: Board Leel Reliability (BLR), PoP application notes, PoP Stencil & Stacking paper for SMT Conditions. IMAPS and SMTA White Paper Articles for additional supporting data aailable on our website: Practical Components is the exclusie distributor of Amkor Technology Mechanical Components. Practical Components, Inc. Tel: Fax:

12 Package on Package (PoP) 12x12mm Stacked Daisy Chain Package on Package (PoP) 12x12mm, 0.65mm to pitch Stacked Daisy Chain 12mm 305 PSfBGA Bottom Package Design Dimensions 0.27mm Package size (a) Maxdie size (d) Foot print-top (b) Foot print-bottom(c) Body (a) Foot Print top (b) Foot Print bottom (c) Die (d) 12 x 12mm 0.65 pitch, 128 ball 18 matrix, 2 row 0.5 pitch, 292 I/Os 23 matrix, 4 row + 12 NC + A1 ball 305 BGA 7.0 mm 332 Bond Fingers Aailable PoP Daisy Chain 3 Net Design Daisy chain netlist of PSfBGA, Bottom package balls. Daisy chain netlist of top side (Top PoP to PSfBGA 12 corner balls resered for NC or additional supplies as memory combinations may require). L20 M20 Daisy chain netlist of top side (Top PoP to PSfBGA 116 pin memory interface). Bottom package called: Package Stackable ery thin fine pitch BGA (PSfBGA). M4 N4 * Color diagram of DC Net design aailable on our website. 12 Practical Components, Inc. klaphen@practicalcomponents.com

13 Package on Package (PoP) 12x12mm Stacked Daisy Chain Bottom side of bottom package (top iew through package) 12x12mm, 0.5 mm PSfBGA305, 23x23 ball matrix PSfBGA 305 (Bottom Package) Daisy Chain Nets Top side of bottom package Top package interface (top iew) 0.65 mm pitch, 128 pads, 18x18 ball matrix A B C D E F G H J K L M N P R T U V W Y AA AB AC (A) (B) Daisy chain pattern of PSfBGA Top memory pads Top side 12 corner ball DC net A B C D E F G H J K L M N P R T U V Connected thru bottom side (A) * Connected thru bottom side (B) * Daisy chain pattern of PSfBGA -Bottom BGAs 128 PoP (Top Package) Daisy Chain Netlist PoP + PSfBGA Daisy Chain Netlist A B C D E F G H J K L M Top PoP package Bottom side (top iew through package) 12x12 mm, 0.65 mm pitch 128 PoP 18x18 ball matrix 2rows A B C D E F G H J K L M Top PoP stacked onpsfbga (top iew through package Connected thru bottom side (A) *Connected thru bottom side (B) N N P P R R T T U U V V Daisy chain pattern for 12 corner balls (typically resered as NC for applications with no underfill, or option to add additional I/O or memory supplies as required for high density combinations) Daisy chain pattern of Top package for 116I/O memory interface Daisy chain netlist of Top PoP and PSfBGA. * Color diagram of DC Net design aailable on our website. Practical Components, Inc. Tel: Fax:

14 Package on Package (PoP) 12x12mm Stacked Daisy Chain PWB Netlist Pattern for BLR Testing Stacked iew of 3 DC Nets for BLR testing A B C D E F G H J K L M N P R T U V W Y AA AB AC A B C D E F G H J K L M N P R T U V W Y AA AB AC Black line: PWB pattern In: 1-1, 3-1, 4-1 Common: 1-2, 3-2, 4-2 Black line: PWB pattern In: 1-1, 3-1, 4-1 Common: 1-2, 3-2, 4-2 PoP Oerall Stack Up Example B3 B1 A1 B2 A2 PoP +PSfBGA Symbol Unit Min Max Nom A1 (Ball, 0.5 pitch) mm A2 (4L laminate) mm B1 (Ball, 0.65 pitch) mm B2 (2L laminate) mm B3 (Mold cap) mm Oerall Pkg Height mm B2 and B3 may ary depending on top memory PoP (MCP) design rules. Oerall Stack up to be finalized based on top PoP rules. * Color diagram of DC Net design aailable on our website. 14 Practical Components, Inc. klaphen@practicalcomponents.com

15 Package on Package (PoP) 12x12mm, 0.65mm to pitch Stacked Daisy Chain 3 Package Stacking Package on Package (PoP) 12x12mm Stacked Daisy Chain 3 Package Stacking PoP Daisy Chain 3 Net Design 2 Package Stack Daisy Chain netlist of PSfBGA, Bottom package balls L20 M20 Daisy chain netlist of top side (Top FBGA to PSfBGA 116 pin memory interface) Bottom package called: Package Stackable ery thin fine pitch BGA (PSfBGA) M4 N4 PoP Daisy Chain 3 Net Design 3 Package Stack Daisy Chain netlist of PSfBGA, Bottom package balls Daisy chain netlist of middle/bottom side (middle of PSfBGA to bottom of PSfBGA 128 balls) L20 M20 Daisy chain netlist of middle/top side (FBGA to middle PSfBGA 128 balls) Bottom/middle package called: Package Stackable ery thin fine pitch BGA (PSfBGA) M4 N4 Practical Components, Inc. Tel: Fax:

16 Package on Package (PoP) 12x12mm Stacked Daisy Chain 3 Package Stacking PoP Oerall Stack Up 2 Package Stack B3 B1 A1 B2 A2 Symbol Unit Min Nom Max A1 (Ball, 0.5 pitch) mm A2 (4L laminate) mm B1 (Ball, 0.65 pitch) mm B2 (2L laminate) mm B3 (Mold cap) mm Oerall Pkg Height mm Assumed standard DC substrate Thinner stack up feasible in future build PoP Oerall Stack Up 3 Package Stack C3 C1 B1 A1 C2 B2 A2 Symbol Unit Min Nom Max A1 (Ball, 0.5 pitch) mm A2 (4L laminate) mm B1 (Ball, 0.65 pitch) mm B2 (2L laminate) mm C1 (Ball, 0.65 pitch) mm C2 (2L laminate) mm C3 (Mold cap) mm Oerall Pkg Height mm Assumed standard DC substrate Thinner stack up feasible in future build 16 Practical Components, Inc. klaphen@practicalcomponents.com

17 Package on Package (PoP) 12x12mm Stacked Daisy Chain 3 Package Stacking PSfBGA 305 (Bottom Package) Daisy Chain Nets Bottom side of bottom package (top iew through package) 12x12mm, 0.65 mm PSfBGA305, 23x23 ball matrix Top side of bottom package Top/Middle package interface (top iew) 0.65mm pitch, 128 pads, 18x18 ball matrix A B C D E F G H J K L M N P R T U V W Y AA AB AC (A) (B) A B C D E F G H J K L M N P R T U V Connected to bottom side (A) * Connected to bottom side (B) TopView * Daisy chain pattern of PSfBGA Top memory pads Daisy chain pattern of PSfBGA Bottom BGAs Top side 12 corner ball DC net PSfBGA 128 (Middle Package) Daisy Chain Nets Bottom side of middle package (top iew through package) 12x12mm, 0.65 mm PSfBGA128, 18x18 ball matrix Top side of middle package Top package interface (top iew) 0.65mm pitch, 128 pads, 18x18 ball matrix A B C D E F G A B C D E F G H H J K L M (C) J K L M Connected to bottom side (C) Top View N N P P R R T T U U V V Each pad on the top side is connected to the corresponding pad on the bottom side through ia. Practical Components, Inc. Tel: Fax:

18 Package on Package (PoP) 12x12mm Stacked Daisy Chain 3 Package Stacking FBGA 128 (Top Package) Daisy Chain Netlist A B C D E F G H J K L M N P R T U V Top FBGA package Bottom side (top iew through package) 12x12 mm, 0.65 mm pitch FBGA x18 ball matrix 2 rows Top View Middle-to-Bottom Package Connection after 3 PKG Stack A B C D E F G H J K L M N P R T U V Connected thru bottom side (A) * Connected thru bottom side (B) TopView Daisy chain pattern of Top package for 116 I/O memory interface 18 Practical Components, Inc. klaphen@practicalcomponents.com

19 Package on Package (PoP) 12x12mm Stacked Daisy Chain 3 Package Stacking Top-to-Middle Package Connection after 3 PKG Stack A B C D E F G H J K L M N P R T U V Connected to bottom side (A) TopView PWB Netlist Pattern for BLR Testing Stacked View of 3 DC Nets for BLR Testing A B C D E F G H J K L M N P R T U V W Y AA AB AC A B C D E F G H J K L M N P R T U V W Y AA AB AC PWB Pattern In: 1 1, 3 1, 4 1 Common: 1 2, 3 2, 4 2 PWB Pattern In: 1 1, 3 1, 4 1 Common: 1 2, 3 2, 4 2 TopView TopView TopView TopView Practical Components, Inc. Tel: Fax:

20 PoP (Package on Package) 12mm Board and Kit Lead-Free Test Kit PCB200 12mm Board This PoP 12mm Board and Kit is designed as test ehicle for the new Amkor (PSfBGA) 12x PoP package. PoP packages from Amkor focus on high density logic deices. PoP packages are designed for products such as cell phones, digital cameras and other mobile applications benefiting from the combination of stacked packages and small footprint technology. This test board enables the end user to test their process applications on the top and bottom PoP components. With daisy-chain patterns in both packages and the PCB200 Board, customers are able to check for continuity to guarantee the integrity of their process. Notes n Board size is 132 x 77mm, 8-layers,.039" thick, no microias. n Board material is IS-410 High Temp 180Tg. n Standard board finish OSP Entek CU-106A-HT. n Immersion Siler finish is also aailable upon special request. MOQ may apply. n 15 daisy-chain pad placements for 12x PoP component. n Gerber and X,Y Theta data included at no charge. n See page 11 for aailable solder ball alloy s for PoP components. SAC305, SAC405, SAC105 and SAC125Ni is aailable. Practical Components is the exclusie distributor of Amkor Technology Mechanical Components. Order Number: PCB200 12mm (board only) Order Number: A-PoP mm-12mm-DC-SAC105 (top component only) Order Number: A-PSfBGA305-.5mm-12mm-DC-SAC125Ni (bottom component only) 20 Practical Components, Inc. klaphen@practicalcomponents.com

21 Package on Package (PoP) 14x14mm Stacked Daisy Chain Package on Package (POP) 14x14mm Stacked Daisy Chain 14mm 353 PSfBGA Bottom Package Design Dimensions 0.27mm Package size (a) Maxdie size (d) Foot print-top (b) Foot print-bottom(c) Body (a) Foot Print top (b) Foot Print bottom (c) Die (d) 14 x14 mm 0.65 pitch, 152 ball 21 matrix, 2 row 0.5 pitch, 340 I/Os 26 matrix, 4 row + 12 NC + A1 ball 353 BGA Bond Fingers Aailable 8.9 mm 328 to 396 PoP Daisy Chain 3 Net Design Daisy chain netlist of PSfBGA, Bottom package balls Daisy chain netlist of top side (Top PoP to PSfBGA 12 corner balls resered for NC or additional supplies as memory combinations may require). M23 N23 Daisy chain netlist of top side (Top PoP to PSfBGA 140 pin memory interface) Bottom package called: Package Stackable ery thin fine pitch BGA (PSfBGA) M4 N4 * Color diagram of DC Net design aailable on our website. Practical Components, Inc. Tel: Fax:

22 Package on Package (PoP) 14x14mm Stacked Daisy Chain A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF Bottom side (top iew through package) 14x14mm, 0.5 mm PSfBGA353, 26x26 ball matrix PSfBGA 353 (Bottom Package) Daisy Chain Nets Daisy chain pattern of PSfBGA Top memory pads (A) (B) K K Connected Connected with with L L bottom bottom side side (A) (A) Top side 12 corner ball DC net A B C D E F G H J M N P R T U V W Y AA A B C D E F G H J M N P R T U V W Y AA Top side Top package interface (top iew) 0.65 mm pitch, 152 pads, 21x21 ball matrix Top side 12 corner Connected Connected thru thru ball DC net bottom bottom side side (B) (B) Daisy chain pattern of PSfBGA Bottom BGAs Top side 12 corner ball DC net 152 PoP (Top Package) Daisy Chain Netlist Top PoP + PSfBGA Daisy Chain Netlist A B C D E F G H J K L M N P R T Top PoP package Bottom side (top iew through package) 14x14 mm, 0.65 mm 152 PoP 21x21 ball matrix 2tiers Daisy chain pattern of Top package for 140 I/O memory interface A B C D E F G H J K L M N P R T Top PoP stacked on PSfBGA (top iew through package) Connected with bottom side (A) Connected with bottom side (B) U U V V W W Y Y AA AA Daisy chain pattern for 12 corner balls (typically resered as NC for applications with no underfill, or option to add additional I/O or memory supplies as required for high density combinations). Daisy chain netlist of Top FBGA and PSfBGA * Color diagram of DC Net design aailable on our website. 22 Practical Components, Inc. klaphen@practicalcomponents.com

23 Package on Package (PoP) 14x14mm Stacked Daisy Chain PWB Netlist Pattern for BLR Testing PWB (top iew) Stacked View of 3 DC Nets For BLR Testing A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF Black line: PWB pattern In: 1-1, 3-1, 4-1 Common: 1-2, 3-2, 4-2 Black line: PWB pattern In: 1-1, 3-1, 4-1 Common: 1-2, 3-2, 4-2 PoP Oerall Stack Up Example B3 B1 A1 B2 A2 PoP + PSfBGA Symbol Unit Min Max Nom A1 (Ball, 0.5 pitch) mm A2 (4L laminate) mm B1 (Ball, 0.65 pitch) mm B2 (2L laminate) mm B3 (Mold cap) mm Oerall Package Height mm B2 and B3 may ary depending on top memory PoP (MCP) design rules. Oerall Stack up to be finalized based on top PoP rules. * Color diagram of DC Net design aailable on our website. Practical Components, Inc. Tel: Fax:

24 PoP (Package on Package) 14mm Board and Kit Lead-Free Test Kit PCB200 14mm Board This PoP 12mm Board and Kit is designed as test ehicle for the new Amkor (PSfBGA) 14x PoP package. PoP packages from Amkor focus on high density logic deices. PoP packages are designed for products such as cell phones, digital cameras and other mobile applications benefiting from the combination of stacked packages and small footprint technology. This test board enables the end user to test their process applications on the top and bottom PoP components. With daisy-chain patterns in both packages and the PCB200 Board, customers are able to check for continuity to guarantee the integrity of their process. Notes n Board size is 132 x 77mm, 8-layers,.039" thick, no microias. n Board material is IS-410 High Temp 180Tg. n Standard board finish OSP Entek CU-106A-HT. n 15 daisy-chain pad placements for 14x PSfPGA component. n Immersion Siler finish is also aailable upon special request. MOQ may apply. n Gerber and X,Y Theta data included at no charge. n See page 11 for aailable solder ball alloy s for PoP components. SAC305, SAC405, SAC105 and SAC125Ni is aailable. n 12mm PC board and PoP components aailable (see page 11). Practical Components is the exclusie distributor of Amkor Technology Mechanical Components. Order Number: PCB200 14mm (board only) Order Number: A-PoP mm-14mm-DC-LF-SAC105 (top component only) Order Number: A-PSfBGA305-.5mm-14mm-DC-LF-SAC125Ni (bottom component only) 24 Practical Components, Inc. klaphen@practicalcomponents.com

25 Package on Package (PoP) 15x15mm Stacked Daisy Chain 15mm 604 PSfBGA Bottom Package Design Dimensions Foot print-top(b) 0.30mm Package size (a) Maxdie size (d) Foot print-bottom(c) Body (a) Foot Print top (b) Foot Print bottom (c) 15 x 15mm 0.65 pitch, 160 ball 22 matrix, 2 row 0.5 pitch 28 matrix, Central 604 BGA PoP Daisy Chain 3 Net Design Daisy chain netlist of PSfBGA, Bottom package balls, excluding 24 corner balls A5 P18 Daisy chain netlist of bottom package 6 x 4 corner balls A2 A27 Daisy chain netlist of top side (Top FBGA to PSfBGA 160 pin memory interface) Bottom package called: Package Stackable ery thin fine pitch BGA (PSfBGA) P3 P26 Practical Components, Inc. Tel: Fax:

26 Package on Package (PoP) 15x15mm Stacked Daisy Chain PSfBGA 604 (Bottom Package) Daisy Chain Nets Bottom side (top iew through package) 15x15mm, 0.5 mm PSfBGA604, 28x28 ball matrix Top side Top Package interface (top iew) 0.65mm pitch, 160 pads, 22x22 ball matrix A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH A B Top View A B C D E F G H J K L M N P R T U V W Y AA AB Connected with bottom side (A) Top View Connected with bottom side (B) Bottom side 24 corner ball DCnet Daisy chain pattern of PSfBGA Top memory pads Daisy chain pattern of PSfBGA Bottom BGAs Daisy chain pattern of PSfBGA Top memory pads 160 FBGA (Top Package) Daisy Chain Netlist Top FBGA + PSfBGA Daisy Chain Netlist A B C D E F A B C D E F G G H J Top View H J K K L M N L M N Connected with bottom side (A) Top View Connected with bottom side (B) P P R R T T U U V V W W Y Y AA AA AB AB Daisy chain pattern of PSfBGA Top memory pads Daisy chain netlist of Top FBGA and PSfBGA 26 Practical Components, Inc. klaphen@practicalcomponents.com

27 Package on Package (PoP) 15x15mm Stacked Daisy Chain PWB Netlist Pattern for BLR Testing Stacked iew of 3 DC Nets for BLR testing PWB (Top View) PWB (Top View) A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH PWB pattern In: 1 1, 2 1, 3 1 Common: 1 2, 2 2, 3 2 Top View PWB pattern Bottom PSfBGA 604 pin package In: 1 1, 2 1, 3 1 Common: 1 2, 2 2, 3 2 Top View Practical Components, Inc. Tel: Fax:

28 PoP (Package on Package) 15mm Board and Kit Thermal Cycle Lead Free Kit NEW! The 15mm Package on Package (PoP) Thermal Cycling Test Board is designed for use with Amkor s new 15mm PoP components. Both top and Bottom components can be mounted on the board and connected with a daisy chain pattern to the test board. PCB200 15mm Thermal Cycle Board Thermal Cycling is a diagnostic test for electronic assemblies. The test is seere on solder joints that are under both compressie and tensile strain during cycling as a result of differential thermal expansion. The new 15mm PoP Thermal Cycle Test will allow customers to conduct aluable process testing on new technology components. Customer are encouraged to isit the Practical Components website at or Amkor website at for additional technical information regarding the Amkor 15mm PoP components. Notes n Board size is 132 x 77mm, 8 layers,.039" thick, no microias. n Board material is IS-410 High Temp. 180Tg. n Standard board finish is OSP Entek CU-106A-HT. n 15 daisy-chain pad placements for 15x PSfBGA component. n Immersion Siler board finish is aailable upon special request. MOQ may apply. n Gerber and X,Y Theta data included at no charge. See page 11 for aailable solder ball alloy s for PoP components. SAC305, SAC405, SAC105 and SAC125Ni is aailable. Practical Components is the exclusie distributor of Amkor Technology Mechanical Components. Order Number: PCB200-15mm-TC (board only) Order Number: A-PoP mm-15mm-DC-LF-105 (top component only) Order Number: A-PSfBGA604-.5mm-25mm-DC-LF-125Ni (bottom component only) 28 Practical Components, Inc. klaphen@practicalcomponents.com

29 LGA Land Grid Array Amkor laminate ChipArray packages are aailable without solder balls upon special order. Packages aailable without solder balls include CABGA, CTBGA and CVBGA. The same standard daisy-chained substrate would be used based on open tooling. LGA is another term used for parts without solder balls. The same BOM (bill of material) is used when parts are assembled. LGA parts are used to reduce package height, drop test performance in handheld applications, solder ball attach practice, socket insertion, P&P ealuation, reflow profiling, enhance thermal cycle reliability and other purposes. LGA solder interconnect if formed solely by solder paste applied at board assembly because there are no solder balls attached to the LGA. This results in a lower stand-off height of approximately 0.06mm to 0.10mm, depending on solder paste olume and PCB geometry. Laminate substrate is solder mask defined. Standard ball pad finish is NiAu. Application notes aailable for supporting technical data. Notes n Body sizes range from 5mm ~ 17mm. n Aailable pitches are.4mm,.5mm,.8mm and 1.0mm. n Parts packaged in trays (standard). n Parts aailable on Tape and Reel upon special request. Part Description System (use as an example when ordering) Amkor A-CTBGA-84-.5mm-7mm-LGA Package Type Land Grid Array (without solder balls) I/O Count Pitch Body Size 0.6 mm 1.10 mm 1.30 mm 0.80 mm 1.00 mm 2.71 mm 3.20 mm 0.6 mm 1.1 mm 1.30 mm 1.92 mm 2.20 mm Unmounted deice profile (with balls on left, LGA on right) Practical Components, Inc. Tel: Fax:

30 Body Size CVBGA Very Thin ChipArray BGA.4mm Package ChipArray (CVBGA) is a new package offering by Amkor that has a 0.4mm pitch. In addition to the standard core ChipArray package (CABGA and CTBGA), Amkor offers thinner mold cap thickness of 1.0mm max. By utilizing a thin core laminate, much denser routing can be achieed, thereby enabling more I/O s in a gien footprint. Due to their small size and I/O density, Amkor s ChipArray product family is an excellent choice for new deices requiring a small footprint and low mounted height. CVBGA Very Thin ChipArray BGA Part Description I/O Count Pitch Body Size Ball Matrix Ball Alignment Quantity Per Tray Aailable Lead-Free Alloys A-CVBGA97-.4mm-5mm 97.4mm 5mm 10 x 10 Full Array 624 SAC405, SAC305 or SAC105 A-CVBGA360-.4mm-10mm 360.4mm 10mm 23 x 23 Perimeter 250 SAC405, SAC305 or SAC105 A-CVBGA432-.4mm-13mm 432.4mm 13mm 31 x 31 Perimeter 160 SAC405, SAC305 or SAC105 Notes n Parts are packaged in JEDEC trays. n All components are daisy-chained. n Moisture sensitiity is JEDEC leel 3. n Solder ball material is aailable with Eutectic 63/37 SnPb. n Lead-free parts are aailable with 95.5% Sn/ 4.0% Ag/ 0.5% Cu (SAC405) alloy or 96.5% Sn/ 3.0% Ag/ 0.5% Cu (SAC305) or (SAC105) 98.5%Sn/1.0%Ag/0.5%Cu. n New: CVBGA,CTBGA and CABGA parts are aailable without solder ball, which makes the package LGA. See page 29. Body Size Part Description System Amkor A-CVBGA-97-.4mm-5mm-DC-Alloy ChipArray (SAC305, SAC405, Very Thin and SAC105) Ball Grid Array Daisy Chain I/O Count Pitch Body Size n Add TR to end of Part Description for Tape and Reel. n Add SAC405 or SAC305 or SAC105 to end of part number for Lead-Free. CABGA ChipArray BGA CTBGA Thin ChipArray BGA CVBGA Very Thin ChipArray BGA 1.5 mm (max.) 1.2 mm (max.) 1.0 mm (max.) Mold Compound Die Attach Au Wire Solder Mask Top View A1 Ball Corner Side View Die Ball Pitch Via Eutectic Rigid Laminate For kits see pages 93 and 101. Ball Pitch Bottom View Practical Components is the exclusie distributor of Amkor Technology Mechanical Components. 30 Practical Components, Inc. klaphen@practicalcomponents.com

31 CTBGA ChipArray Thin Core Ball Grid Array Part Description I/O Count Pitch Body Size CTBGA ChipArray Thin Core Ball Grid Array Ball Matrix Ball Alignment Quantity Per Tray Aailable Lead-Free Alloys.5mm Pitch A-CTBGA84-.5mm-6mm 84.5mm 6mm 10 x 10 Perimeter 608 SAC405, SAC105, or SAC305 A-CTBGA84-.5mm-7mm 84.5mm 7mm 12 x 12 Perimeter 476 SAC405, SAC105, or SAC305 A-CTBGA108-.5mm-7mm 108.5mm 7mm 12 x 12 Perimeter 476 SAC405, SAC105, or SAC305 A-CTBGA132-.5mm-8mm 132.5mm 8mm 14 x 14 Perimeter 360 SAC405, SAC105, or SAC305 A-CTBGA228-.5mm-12mm 228.5mm 12mm 22 x 22 Perimeter 189 SAC405, SAC105, or SAC305.8mm Pitch A-CTBGA49-.8mm-6mm 49.8mm 6mm 7 x 7 Full Array 608 SAC405, SAC105, or SAC305 A-CTBGA49-.8mm-7mm 49.8mm 7mm 7 x 7 Full Array 476 SAC405, SAC105, or SAC305 A-CTBGA64-.8mm-7mm 64.8mm 7mm 8 x 8 Full Array 476 SAC405, SAC105, or SAC305 A-CTBGA64-.8mm-8mm 64.8mm 8mm 8 x 8 Full Array 360 SAC405, SAC105, or SAC305 A-CTBGA100-.8mm-10mm 100.8mm 10mm 10 x 10 Full Array 250 SAC405, SAC105, or SAC305 A-CTBGA160-.8mm-12mm 160.8mm 12mm 14 x 14 Perimeter 198 SAC405, SAC105, or SAC305 A-CTBGA176-.8mm-13mm 176.8mm 13mm 15 x 15 Perimeter 160 SAC405, SAC105, or SAC305 A-CTBGA208-.8mm-15mm 208.8mm 15mm 17 x 17 Perimeter 126 SAC405, SAC105, or SAC mm Pitch A-CTBGA mm-13mm mm 13mm 12 x 12 Full Array 160 SAC405, SAC105, or SAC305 Notes Parts are packaged in JEDEC trays when aailable. All components are aailable daisy-chained. <0.12mm (5 mil) coplanarity. Solder ball material is Eutectic 63/37 SnPb. BT (Bismaleimide-Triazine) substrates or equialent. Package thickness is 1.2mm max for 0.8mm and 1.0mm pitch packages. Package thickness is 1.1mm max for 0.5mm pitch packages. Moisture sensitiity is JEDEC leel 3. Lead-free parts are aailable with (SAC405) 95.5% Sn/ 4.0% Ag/0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or (SAC105) 98.5%Sn/1.0%Ag/0.5%Cu is also aailable. New: CABGA, CVBGA and CTBGA parts are aailable without solder balls, which makes the package LGA. See page 29. Part Description System Amkor A-CTBGA84-.5mm-6mm-DC-Alloy ChipArray Thin Core Ball Grid Array I/O Count Pitch Body Size n Add "TR" to end of part description for Tape and Reel n Add "SAC405" or "SAC105" or SAC305" to end of part description for Lead-Free. n Add DC & Alloy to Part Number System after body size: For recommended kit see page 101. (SAC305, SAC405, and SAC105) Daisy Chain Practical Components is the exclusie distributor of Amkor Technology Mechanical Components. Practical Components, Inc. Tel: Fax:

32 CABGA ChipArray Ball Grid Array ChipArray (CABGA) packages are offered in laminate format and are aailable as Ball Grid Array. The near chip size standard outlines offer fixed body sizes and ball counts. Established SMT mounting processes and techniques are compatibly with ChipArray. The package size and design proides ideal RF operation (low inductance) for high speed applications requiring small footprints. ChipArray Ball Grid Array Part Description I/O Count Pitch Body Size Ball Matrix Ball Alignment Quantity Per Tray Aailable Lead-Free Alloys.5mm Pitch A-CABGA40-.5mm-5mm 40.5mm 5mm 8 x 8 Perimeter 624 SAC405, SAC105 or SAC305 A-CABGA56-.5mm-6mm 56.5mm 6mm 10 x 10 Perimeter 408 SAC405, SAC105 or SAC305.8mm Pitch A-CABGA36-.8mm-6mm 36.8mm 6mm 6 x 6 Full Array 608 SAC405, SAC105 or SAC305 A-CABGA49-.8mm-7mm 49.8mm 7mm 7 x 7 Full Array 476 SAC405, SAC105 or SAC305 A-CABGA64-.8mm-8mm 64.8mm 8mm 8 x 8 Full Array 360 SAC405, SAC105 or SAC305 A-CABGA144-.8mm-12mm 100.8mm 12mm 13 x 13 Perimeter 189 SAC405, SAC105 or SAC305 A-CABGA100-.8mm-10mm 100.8mm 10mm 10 x 10 Full Array 250 SAC405, SAC105 or SAC305 A-CABGA160-.8mm-12mm 160.8mm 12mm 14 x 14 Perimeter 189 SAC405, SAC105 or SAC305 A-CABGA176-.8mm-13mm 176.8mm 13mm 15 x 15 Perimeter 160 SAC405, SAC105 or SAC305 A-CABGA192-.8mm-14mm 192.8mm 14mm 16 x 16 Perimeter 119 SAC405, SAC105 or SAC305 A-CABGA208-.8mm-15mm 208.8mm 15mm 17 x 17 Perimeter 126 SAC405, SAC105 or SAC305 A-CABGA288-.8mm-19mm 288.8mm 19mm 22 x 22 Perimeter 84 SAC405, SAC105 or SAC mm Pitch A-CABGA mm-11mm mm 11mm 10 x 10 Full Array 207 SAC405, SAC105 or SAC305 A-CABGA mm-13mm mm 13mm 12 x 12 Full Array 160 SAC405, SAC105 or SAC305 A-CABGA mm-15mm mm 15mm 14 x 14 Full Array 126 SAC405, SAC105 or SAC305 A-CABGA mm-17mm mm 17mm 16 x 16 Full Array 90 SAC405, SAC105 or SAC305 Notes Parts are packaged in JEDEC trays when aailable. All components are aailable daisy-chained. <0.12mm (5 mil) coplanarity. Solder ball material is Eutectic 63/37 SnPb. BT (Bismaleimide-Triazine) substrates or equialent. Package thickness is 1.5mm max for 0.8mm and 1.0mm pitch packages. Package thickness is 1.34mm max for 0.5mm pitch packages. Moisture sensitiity is JEDEC leel 3. Lead-free parts are aailable with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or (SAC105) 98.5%Sn/1.0%Ag/0.5%Cu is also aailable. New: CABGA, CVBGA and CTBGA parts are aailable without solder balls, which makes the package LGA. See page 29. Part Description System Amkor A-CABGA40-.5mm-5mm-DC-Alloy ChipArray (SAC305, SAC405 Ball Grid Array and SAC105) I/O Count Daisy Chain Pitch Body Size n Add "TR" to end of part description for Tape and Reel n Add "SAC405","SAC105" or SAC305" to end of part description for Lead-Free. Solder Ball Diameter/Height (As Receied) A Diameter = Height After Reflow Solder Ball Height After Ball Attach B C Motherboard D For recommended kits see pages 93, 98, 100, 106, 107 and 109. Package Pitch A B C D 1.00/0.80mm 0.50mm 0.46mm 0.30mm 0.48m (± 0.05mm) 0.32mm (± 0.05mm) 0.36mm (± 0.05mm) 0.19mm (± 0.05mm) 0.30mm (± 0.05mm) 0.17mm (± 0.03mm) Note: Typical motherboard non-solder mask defined pad: 0.50 pitch = pitch = pitch = Practical Components, Inc. klaphen@practicalcomponents.com

33 SBGA SuperBGA SuperBGA (SBGA) package is a ery low profile, high-power BGA. The IC is directly attached to an integrated copper heatsink. Since the IC and the I/O are on the same side, signal ias are eliminated. SBGA SuperBGA 1.27mm Pitch Part Description I/O Count Pitch Body Size Ball Matrix Ball Alignment Quantity Per Tray A-SBGA mm-27mm mm 27mm 20 x 20 Perimeter 40 A-SBGA mm-31mm mm 31mm 23 x 23 Perimeter 27 A-SBGA mm-35mm mm 35mm 26 x 26 Perimeter 24 A-SBGA mm-40mm mm 40mm 31 x 31 Perimeter 21 A-SBGA mm-40mm mm 40mm 31 x 31 Perimeter 21 A-SBGA mm-42.5mm mm 42.5mm 33 x 33 Perimeter 12 A-SBGA mm-45mm mm 45mm 35 x 35 Perimeter 12 Notes Superior thermal performance. Light weight Low profile (1.4mm mounted) Moisture resistant (JEDEC leel 3) JEDEC MO-192 standard outlines Enhanced electrical performance > 1 GHz Parts are packaged in JEDEC trays. Call for tape and reel quantity and aailability. Solder ball material is eutectic 63/37 SnPb. BGA packages should be baked at 125 C for 24 hours prior to assembly to preent delamination during assembly process. Parts can be baked and dry-packed. All components are daisy-chained except for 520 I/O. Lead-free parts are aailable with (SAC405 )95.5% Sn/ 4.0% Ag/ 0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305). Sn3.5Ag is also aailable (call for aailablity). SBGAs are not aailable without solder balls. Part Description System Amkor A-SBGA mm-27mm-DC-Alloy SuperBGA (SAC305, SAC405 I/O Count and SnAg) Pitch Body Size Daisy Chain n Add TR to end of part number for Tape and Reel. n Add SAC405 or SAC305 or Sn3.5Ag to end of part number for Lead-Free. Die Copper Heat Spreader Copper Ring Wires Mounting Surface Encapsulant Note: Drawing not to scale. Resin Dam (Part of Substrate) Substrate Solder Balls Solder Ball Diameter/Height (As Receied) Solder Ball Height After Ball Attach Pb Looking for Lead-Free? This symbol indicates that lead-free parts are aailable! A Diameter = Height After Reflow Motherboard B C Practical Components is the exclusie distributor of Amkor Technology Mechanical Components. Package Pitch A B C SBGA All units in mm. Assumptions: 5 mils solder paste. Solder mask defined pad. Typical motherboard no solder mask defined pad: 0.50 Pitch Pitch Pitch 0.38 Practical Components, Inc. Tel: Fax:

34 PBGA Plastic Ball Grid Array Plastic Ball Grid Arrays (PBGA) incorporate adanced assembly processes and designs for low cost, high performance applications. PBGAs are designed for low inductance, improed thermal operation and enhanced SMT-ability. All PBGAs listed on this page are daisy-chained and aailable lead-free. Notes Oerall thickness of 1.0mm pitch PBGA packages will ary (please call for more details). Parts are packaged in JEDEC trays. Call for tape and reel quantity and aailability. Solder ball material is eutectic 63/37 SnPb. All components are daisy-chained. Daisy-chained connections are connections between I/O (input/output) of the component. BT (Bismaleimide-Triazine) substrates. JEDEC MS-034 standard outlines. Ball diameter aries (see chart). BGA packages should be baked at 125ºC for 24 hours prior to assembly to preent delamination during the assembly process. Moisture sensitiity is JEDEC leel 3. Lead-free parts are aailable with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) is also aailable. Sn3.5Ag is also aailable (call for aailability). PBGAs are not aailable without solder balls. PBGA Plastic Ball Grid Array 1.0mm Pitch Part Description I/O Count Pitch Body Size Ball Matrix Ball Alignment Quantity Per Tray Aailable Lead-Free Alloys A-PBGA mm-17mm mm 17mm 16 x 16 Perimeter 90 SAC405, SAC305 or Sn3.5Ag A-PBGA mm-17mm mm 17mm 16 x 16 Full Array 90 SAC405, SAC305 or Sn3.5Ag A-PBGA mm-23mm mm 23mm 22 x 22 Perimeter 60 SAC405, SAC305 or Sn3.5Ag A-PBGA mm-19mm mm 19mm 17 x 17 Full Array 84 SAC405, SAC305 or Sn3.5Ag A-PBGA mm-19mm mm 19mm 18 x 18 Full Array 84 SAC405, SAC305 or Sn3.5Ag A-PBGA mm-23mm mm 23mm 22 x 22 Perimeter 60 SAC405, SAC305 or Sn3.5Ag A-PBGA mm-27mm mm 27mm 26 x 26 Perimeter 40 SAC405, SAC305 or Sn3.5Ag A-PBGA mm-31mm mm 31mm 30 x 30 Perimeter 27 SAC405, SAC305 or Sn3.5Ag A-PBGA mm-35mm mm 35mm 34 x 34 Perimeter 24 SAC405, SAC305 or Sn3.5Ag A-PBGA mm-27mm mm 27mm 26 x 26 Full Array 40 SAC405, SAC305 or Sn3.5Ag A-PBGA mm-35mm mm 35mm 34 x 34 Perimeter 24 SAC405, SAC305 or Sn3.5Ag A-PBGA mm-40mm mm 40mm 39 x 39 Perimeter 21 SAC405, SAC305 or Sn3.5Ag A-PBGA mm-35mm 1, mm 35mm 34 x 34 Full Array 24 SAC405, SAC305 or Sn3.5Ag Part Description System Amkor A-PBGA mm-17mm-DC-Alloy Plastic Ball (SAC305, SAC405 Grid Array and SAC105) I/O Count Daisy Chain Pitch Body Size n Add TR to end of part number for Tape and Reel. n Add SAC405 or SAC305 or Sn3.5Ag to end of part number for Lead-Free. For kits see pages 87, 93, 96, 101, 102, 109, and 112. Practical Components is the exclusie distributor of Amkor Technology Mechanical Components. Practical does not guarantee the chain of custody for moisture sensitiity. This is due to the factory making consolidated shipments and customers quantity being met (breaking full tray quantities). 34 Practical Components, Inc. klaphen@practicalcomponents.com

35 PBGA Plastic Ball Grid Array Amkor Plastic Ball Grid Arrays (PBGA) incorporate adanced assembly processes and designs for low cost, high performance applications. PBGAs are designed for low inductance, improed thermal operation and enhanced SMT ability. Some PBGAs are aailable daisy-chained. All PBGAs are aailable lead-free. PBGA Plastic Ball Grid Array 1.27mm Pitch Part Description I/O Count Pitch Body Size Ball Matrix Ball Alignment Quantity Per Tray Aailable Lead-Free Alloys A-PBGA mm-23mm* mm 23mm 17 x 17 Perimeter 60 SAC405, or SAC305 or Sn3.5Ag A-PBGA mm-23mm* mm 23mm 17 x 17 Perimeter 60 SAC405, or SAC305 or Sn3.5Ag A-PBGA mm-27mm* mm 27mm 20 x 20 Perimeter 40 SAC405, or SAC305 or Sn3.5Ag A-PBGA mm-27mm* mm 27mm 20 x 20 Perimeter 40 SAC405, or SAC305 or Sn3.5Ag A-PBGA mm-31mm mm 31mm 23 x 23 Perimeter 27 SAC405, or SAC305 or Sn3.5Ag A-PBGA mm-27mm* mm 27mm 20 x 20 Perimeter 40 SAC405, or SAC305 or Sn3.5Ag A-PBGA mm-35mm* mm 35mm 26 x 26 Perimeter 24 SAC405, or SAC305 or Sn3.5Ag A-PBGA mm-35mm mm 35mm 26 x 26 Perimeter 24 SAC405, or SAC305 or Sn3.5Ag A-PBGA mm-35mm mm 35mm 26 x 26 Perimeter 24 SAC405, or SAC305 or Sn3.5Ag A-PBGA mm-40mm* mm 40mm 30 x 30 Perimeter 21 SAC405, or SAC305 or Sn3.5Ag Notes * = DC aailable Parts are packaged in JEDEC trays. Call for tape and reel quantity and aailability. Solder ball material is eutectic 63/37 SnPb. Daisy-chained connections are connections between I/O (input/output) of the component. BT (Bismaleimide-Triazine) substrates. JEDEC MS-034 standard outlines. Ball diameter aries (see chart). BGA packages should be baked at 125ºC for 24 hours prior to assembly to preent delamination during the assembly process. Moisture sensitiity is JEDEC leel 3. Lead-free parts are aailable with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or Sn3.5Ag (call for SnAg aailability) PBGAs are not aailable without solder balls. Part Description System Amkor A-PBGA mm-23mm-DC-Alloy Plastic Ball (SAC305, SAC405 Grid Array and SnAg) I/O Count Body Size Daisy Chain Pitch n Add TR to end of part number for Tape and Reel. n Add SAC405 or SAC305 or Sn3.5Ag to end of part number for Lead-Free. Mold Compound Die Attach Au Wire Die Eutectic Solder Ball Via Rigid Laminate Note: Drawing not to scale. Solder Mask Practical does not guarantee the chain of custody for moisture sensitiity. This is due to the factory making consolidated shipments and customers quantity being met (breaking full tray quantities). Package Pitch Solder Ball Diameter (A) Solder Ball Land On Package and Board Solder Ball Height on Package (B) (1) PBGA (2) PBGA PBGA PBGA *Assumptions: Units = mm Notes (1) applies to 13, 15 and 17mm packages. (2) applies to 23, 27, 31, 35mm, 37.5mm and 40.0mm packages. Solder Joint Height After SMT* (C) 5 mils Solder Paste Solder Mask Defined Pad Solder Ball Diameter/Height (As Receied) A Diameter = Height After Reflow Motherboard For kits see pages 98, 100, 102, 109, and 111. Solder Ball Height After Ball Attach B C Practical Components, Inc. Tel: Fax:

36 WLP Wafer Chip Size Package NEW! WLP uses interconnection technology to effectiely utilize the chip area by making it possible to form electrodes oer the entire chip surface. This eliminates the need for the wire bonding space required by preious wiring methods. Also, electrodes are formed using copper posts for a simple structure. All of this means that the area of the finished package is exactly the same compact size as the original chip. It also simplifies mounting and contributes to easier high-density mounting. WLP is the perfect choice for packaging chips used in portable telephones, digital cameras, and other applications where mounting space is seerely restricted. Part Description I/O Count Pitch Body Size Alloy WLP196-.3mm-4.2mm-DC-SAC mm 4.2mm sq 96.5%Sn/3.0%Ag/0.5%Cu WLP256-.3mm-4.8mm-DC-SAC mm 4.8mm sq 96.5%Sn/3.0%Ag/0.5%Cu WLP264-.3mm-6mm-DC-SAC mm 6mm sq 96.5%Sn/3.0%Ag/0.5%Cu WLP400-.3mm-6mm-DC-SAC mm 6mm sq 96.5%Sn/3.0%Ag/0.5%Cu WLP676-.3mm-7.8mm-DC-SAC mm 7.8mm sq 96.5%Sn/3.0%Ag/0.5%Cu *Aailable on tape and reel Solder Ball WLP Encapsulation Part Description System WLP196-.3mm-4.2mm-DC-SAC305 Wafer Chip Size Package I/O Count Pitch Alloy Daisy Chain Body Size Cu Bump (Post) Re-passiation Encapsulation Protect here by encapsulation Cu Re-distribution Silicon Substrate Cu redistribution + Low-k layer Dicing Surface n Ultra thin type, Ultra miniature, Lightweight n High current capacity and good heat radiation n Stress buffer structure n High reliability of WLP as semiconductor package makes KGD 0.3mm Pitch issues cleared. n Cu-to-Cu wiring structure n Include inductors of high Q alue n Possibility of SMT assembly n Coplanarity (5 to 10 µm) 0.20mm 0.3mm 0.57mm Ref Copper Post pitch Solder Ball min. diameter Copper Post diameter Redistribution thickness Body thickness Redistribution Line/Space PI thickness 36 Practical Components, Inc. klaphen@practicalcomponents.com

37 WLP Wafer Chip Size Package WLP196-.3mm-4.2mm (14x14 Matrix) WLP256-.3mm-4.8mm (16x16 Matrix) WLP264-.3mm-6mm (17x17 Matrix) WLP400-.3mm-6mm (20x20 Matrix) WLP676-.3mm-7.8mm (26x26 Matrix) Practical Components, Inc. Tel: Fax:

38 Flip Chips Flip Chip describes the method of electrically connecting the die to the package carrier. The package carrier, either substrates or leadframe, then proides the connection from the die to the exterior of the package. The interconnection between die and carrier in flip chip packaging is made through a conductie bump that is placed directly on the die surface. The bumped die is then flipped oer and placed face down, with the bumps connecting to the carrier. After the die is solderable, underfill is applied between the die and the substrates, around the solder bumps. The underfill is designed to contract the stress in the solder joints caused by the difference in thermal expansion between the silicon die and carrier. Part Descriptions Pac2.3 FA /400-10mm Die Size 10x10mm 394x394mils No. of Bumps 572 Bump Pitch 200µm/400µm 7.88/15.76mil Flip Chips Bump Height Pac Tech offers a complete set of additional wafer leel and backend serices including: saw, dice, redistribution, repassiation, backside laser mark, backside coating, test die, and assembly. In addition, Pac Tech has the latest in metrology and analytical equipment to help in the deelopment and production proceses, including: x-ray, shear, AOI, ICP, AA, probing, high speed ball pull, chemical analysis, etc For kit see page 39. UBM Diameter Passiation Via 75μm 90μm 80µm UnCut Wafer * "6" Wafer (132) Die Trays 36 per Tray 4" sq Pac2.5 PB mm 10x10mm 394x394mils µm 3.94mils 53μm 37μm 27µm "6" Wafer (132) Die 36 per Tray 4" sq Notes n * = Die count represents expected yield per wafer. n All die is packaged in waffle pack trays unless otherwise specified. n The potential multiple is the number of die repears on the wafer. With the wafer orientated flat down, a right hand coordinate system applies. n Die Size is from scribe line to center-to-center. Scribe width is 0.05mm Passicated. Each bump is electrically connected to one other bump and isolated form all others to facilitate electrical test. n Bump pitch is defined as center-to-center distance between passiation openings. n Bump height is defined as silicon surface to the top of the bump. n Bump diameter is defined as the maximum diameter. n UBM = Under Bump Metallurgy n Unbumped wafers are unaailable upon special request. n Metal Composition is 5µm Ni,.05µm Au n Die are packaged in Waffle Packs n Lead-Free parts aailable with (SAC305) 96.5%Sn/3.0%Ag/0.5%Cu alloy or (SAC405) 95.5%Sn/4.0%Ag/.05%Cu alloy n Other Alloys aailable upon request. Lead-Free Die n All Flip Chips are aailable Lead-Free with (SAC305) 96.5%Sn/3.0%Ag/0.5%Cu or (SAC405) 95.5%Sn/4.0%Ag/0.5%Cu alloys. n When ordering Lead Free-Flip Chips add "305" or "405" to end of part number. Pac2.3-FA /400-10mm Part Description System PB=Perimeter Bump FA=Full Array Number of Bumps Pac2.5-PB mm-DC-Alloy Solder Bump Al, Ni, Cu UBM Al Pad Pitch About Lead-Free Flip Chips Die Passiation Flip Chips are used in ealuating assembly techniques, board contiunity, temperature cycle life test ealuation, underfill procsses and other generic needs to be gien to the appropriate flux, underfill, temperature profile, and pad finish for the assembly. Many companies are deeloping and qualifying alternatie pad finishes sue as immersion Sn. Lead-Free Flip Chips address the need for enironmentally conscious assemblies as well as Alpha particle tolerant packaging. Pac2.5-PB mm (SAC305, SAC405) Daisy Chain Die Dimensions L xw (mm) Die Die size: 10x10mm (394mils sq) Pitch: 200µm/400µm (7.88/15.76mil) Die size: 10x10mm (394mils sq) Pitch: 100µm (3.94mil) 38 Practical Components, Inc. klaphen@practicalcomponents.com

39 Flip Chip Kits PACTECH Flip Chip Test and Ealuation Kit and Board Introduction (taken from Website) The PACTECH Flip Chip Test & Ealuation board is for placement and daisy chain continuity testing after assembly. Substrate has 14 mounting sites for 10 x 10mm Flip Chips. With an increasing number of I/O zs on Integrated Circuits and accompanying requirements for high performance, flip chip type components are a compelling technology for potential users. PACTECH test die are combined with test boards to proide customers with the ability to test a ariety of specs and processes. The components and test board are daisy-chained for continuity. The PCB310 PacTech Board is single sided with 14 pads to accommodate 2 rows of 7 Pac /400-10mm die each. Notes n Board size is 6.3" x 3.95", 2 layers,.062" thick. n Board material is IS410-High Temp 180Tg. n Standard board finish OSP Entek CU-A-HT. n Gerber and X,Y Theta data included at no charge. n See page 38 for aailable solder ball alloys. Order Number: PCB310-PACTECH (board only) Order Number: Pac2.3-FA /400-10mm-DC-305 (Rows 2 and 3) Practical Components, Inc. Tel: Fax:

40 Flip Chips Flip Chip describes the method of electrically connecting the die to the package carrier. The package carrier, either substrate or leadframe, then proides the connection from the die to the exterior of the package. The interconnection between die and carrier in flip chip packaging is made through a conductie bump that is placed directly on the die surface. The bumped die is then flipped oer and placed face down, with the bumps connecting to the carrier. After the die is soldered, underfill is applied between the die and the substrate, around the solder bumps. The underfill is designed to contract the stress in the solder joints caused by the difference in thermal expansion between the silicon die and carrier. UBM is the Al/NiV/Cu (under bump metallization) coering about 1% of the wafer which is under the bumps only. Nitride passiation is an inisible glass-like protectie coating oer 99% of the wafer, except under the bumps. The bumps will not stick to the Nitride, only the UBM. Nitride coating is standard for all Flip Chip wafers. Part Numbers: Die Size FA10-200x200 FA10-400x x 200 mils 400 x 400 mils Flip Chips PB08-200x200 PB08-400x x 200 mils 400 x 400 mils Bump Pitch 254 µm, 10 mil 203 µm, 8 mil Passiation Via 80 µm 73 µm UBM Diameter 102 µm 95 µm Bump Height 120 µm 98 µm Bump Diameter 135 µm 120 µm No. of Bumps Final Metal Pad Size Thickness Type 127 x 127 µm 115 x 115 µm Metal Composition 98/1/1 Al/Cu/Si 98/1/1 Al/Cu/Si Packaging Uncut Wafer* Tray Tape and Reel 5" Wafer 200 x 200 mils (344Die) 400 x 400 mils (86 Die) Sawed 5" Wafer 36 per tray 200 x per tray 400 x 400 Waffle Pack Call For Aailability 5" Wafer 200 x 200 mils (344 Die) 400x400mil (86 Die) Sawed 5" Wafer 36 per tray 200 x per tray 400x400 Waffle Pack Call For Aailability Notes * Die count represents expected yield per wafer. All die is packaged in waffle pack trays unless otherwise specified. All test wafers are currently 5" diameter and are 0.635mm thick. Passiation is one-micron thick plasma Nitride with round ia openings. The potential multiple is the number of die repeats on the wafer. With the wafer orientated flat down, a right hand coordinate system applies. Die size is from scribe line to center-to-center. Scribe width is 0.05mm passiated. Each bump is electrically connected to one other bump and isolated from all others to facilitate electrical test. Bump pitch is defined as center-to-center distance between passiation openings. Bump height is defined as silicon surface to the top of the bump. Bump diameter is defined as the maximum diameter. UBM = Under Bump Metallurgy Lead-free parts are aailable with 95.5% Sn/ 3.5% Ag/ 1.0% Cu alloy. Unbumped wafers are aailable upon special request. Part Number System Pac2.5-PB mm-DC-Alloy PB=Perimeter Bump FA=Full Array Number of Bumps n Add WR to end of part number for Wafer Cut and left in Seal Ring. n Add TR to end of part number for die on Tape and Reel. n Add EUT to end of part number for Eutectic. n Add LF2 to end of part number for Lead-Free. n Add W to end of part number for Uncut Wafer. n Add unbumped to end of part number for unbumped wafer/die. Solder Bump Al, Ni, Cu UBM Al Pad Pitch FCT Bump Structure (SAC305, SAC405) Daisy Chain Die Dimensions L xw (mm) Die Passiation Die For kit see page Practical Components, Inc. klaphen@practicalcomponents.com

41 Flip Chips About Lead-Free Flip Chips Flip Chips are used in ealuating assembly techniques, board continuity, temperature cycle life test ealuation, underfill processes and other generic Flip Chip ealuations. When using Lead-Free Flip Chips, consideration needs to be gien to the appropriate flux, underfill, temperature profile, and pad finish for the assembly. Many companies are deeloping and qualifying alternatie pad finishes such as immersion Sn. Lead-Free Flip Chips address the need for enironmentally conscious assemblies as well as Alpha particle tolerant packaging. Lead-Free Die All Flip Chips are aailable Lead-Free with Alloy LF2 composition 95.5% Sn /3.5% Ag /1.0% Cu. When ordering Lead-Free Flip Chips, add LF2 to end of part number. LF2 was introduced by FCT (the acronym is Lead-Free #2). Daisy-Chain Patterns PB08-200x Die size: 5.08mm sq PB08-400x Die size: 10.16mm sq The PB08 daisy-chain test die is designed with an 8-mil (203µm) solder bump pitch around the perimeter of the deice. Each die contains 99 I/O (44 daisy-chain pairs). The deice comes in two sizes: 200mil x 200mil and 400mil x 400mil. The PB08-400x400 deice consists of a 4 PB08-200x200 deices without the inner I/O s bumped. FA10-200x The FA10 daisy-chain test die is designed with a 10-mil pitch (254µm) array of solder bumps across the surface of the die. They are configured in quad structures for ersatile assembly and ealuation options. The array pattern is an 18 row x 18 column footprint minus four pairs of corner bumps. The addition of a key bump in the upper left corner addresses alignment requirements. Each die contains 317 I/O (158 daisy-chain pairs). This deice is offered with eutectic or Pb-free solder bumps Die size: 5.08mm sq. Practical Components, Inc. Tel: Fax:

42 Flip Chip Test Die Kit With an increasing number of I/O s on Integrated Circuits and accompanying requirements for high performance, flip chip type components become a compelling technology for potential users. Flip Chip Technology test die are combined with factory designed test boards to proide customers the ability to test a ariety of die specs, bump pitches and bump counts. Both components and test boards are daisy-chained for continuity. Laminate Board Laminate board is double-sided. One side has 10 pads for the PB8-2x2 (the back side is no longer aailable for the PB8-4x6, this part has been discontinued). Substrate Information Board Type High Temp FR4 Board Thickness 0.062" Layers 4 (top, bottom, ground, power) inner layers nonfunctional Copper Conductor 1/4 oz. or 1/2 oz. Cu Solder Mask Taiyo PSR-4000 Test Site Die 10 (200 x 200 mil2) sites on one side of the board Pitch 8 mil Minimum Line 4mil Minimum Space 4 mil Wettable Cu Pad 4 x 8 mil2 (defined using a solder mask) Purpose Flip Chip on FR-4 board with daisy chain structure Board Size: 3.5" x 5.5" Board for 400x400 die size is not aailable. Order Number: PB08-2x2-Laminate Laminate Board Laminate is only aailable for FA10-2x2. Single-sided pattern. Substrate Information Board Type High Temp FR4 Board Thickness 0.031" Layers 4 (top, bottom, ground, power) inner layers nonfunctional Copper Conductor 1/4 oz. or 1/2 oz. Cu Solder Mask Taiyo PSR-4000 Test Site Die 10 (200 x 200 mil2) sites on one side of the board Pitch 10 mil array Minimum Line 4 mil; Minimum Space 4 mil Wettable Cu Pad 5 mil diameter, round Through-Hole Via 8 mil drill, 10 mil capture pad Board for 400x400 die size is not aailable. Order Number: FA10-2x2-Laminate Notes Board Size: 3.5" x 5.5" Board finish is Organic Solderability Preseratie (OSP).OSP, also known as ENTEK (CU-106A-HT), is a high performance, copper protectie coating for use on printed wiring board, which replaces hot air solder leeling (HASL) and other metallic PWB surface finishes. ENTEK PLUS maintains surface planarity and inhibits copper oxidation. Technical data is on file upon request. Digitized files proided by Aegis Software included at no charge. 42 Practical Components, Inc. klaphen@practicalcomponents.com

43 Industry Acronyms AC ACA ACES AEM AF AIAA ALT AMLCD ANSI AOQ AOQL APQ ARAC ARP ASIC ASSC ASSP AST ATC a-si BEM BGA BME BT BV CA CAGR CALCE CB CBGA CCA CCD CCGA CDM CECC CFEM CFF CL CLPT CM CMM CMOS COB COF COGS COTS Cpk CPLD CR CRT CSAM CSP CTE DBC Autoclae Aniosotropic Conductie Adhesie Applied Computational Electromagnetics Society Aircraft Equipment Monitor Acceleration Factor American Institute of Aeronautics and Astronautics Accelerated Life Test Actie Matrix Liquid Crystal Display American National Standards Institute Aerage Outgoing Quality Actual Outgoing Quality Leel Accelerated Product Qualification Aiation Rulemaking Adisory Committee Aerospace Recommended Practice Application Specific Integrated Circuit Application Specific Standard Component Application Specific Standard Product Accelerated Stress Test Accelerated Thermal Cycling AWGIECQ Aionics Working Group Amorphous Silicon Boundary Element Method Ball Grid Array Base Metal Electrode Bismaleimide Triazine Breakdown Voltage Contract Assembly or Contract Assembler Compound Annual Growth Rate Computer Aided Life Cycle Engineering Citizens Band Ceramic Ball Grid Array Circuit Card Assembly Charge Coupled Deice Ceramic Column Grid Array Charged Deice Model Cenelec Electronic Components Committee Conentional Finite Element Method Conductie Filament Formation Confidence Leel Classical Laminated Plate Theory Contract Manufacturing or Contract Manufacturer Component Maintenance Manual Complementary Metal Oxide Semiconductor Chip on Board Chip on Flex Cost of Goods Sold Commercial Off The Shelf Process Capability Index Complex Programmable Logic Deice Contact Resistance Cathode Ray Tube C-mode Scanning Acoustic Microscopy Chip Scale Package Coefficient of Thermal Expansion Direct Bond Copper DBGA DBS DBTF DFR DIP DL DMSMS DOE DOF DRAM DSCC DUT DWV ECL ECM ECMP EDA EDRAM EDS EEPLD EFIS EIA ELD EMC EMC EMCS EMI EMS EN EOL EP EPLD EPSC ESD ESEM ESR ESS EU FAA FADEC FAR FBGA FCC FCOB FCOC FCOF FDTD FEA FED FEM FET FFF FFOP FMEA FMECA Dimple Ball Grid Array Direct Broadcast Satellite Design-Build-Test-Fix Design for Reliability Dual In-line Package Design Life Diminishing Manufacturing Sources and Material Shortages Design of Experiment Degrees of Freedom Dynamic Random Access Memory Defense Supply Center Columbus Deice Under Test Dielectric Withstanding Voltage Emitter-Coupled Logic Electrochemical Migration Electronic Component Management Plan Electronic Design Automation Embedded Dynamic Random Access Memory Electron Disruptie Spectroscopy Electrically Erasable Programmable Logic Deice Electronic Flight Instrumentation System Electronic Industry Association Electroluminiscent Displays Electromagnetic Compatibility Encapsulated Molding Compound Electromagnetic Compatibility Society Electromagnetic Interference Electronic Manufacturing Serices Euro Norms (European Standards End of Life Energy Partitioning Erasable Programmable Logic Deice Electronics Products and Systems Center/Consortium Electrostatic Discharge Enironmental Scanning Electron Microscope Equialent Series Resistance Enironmental Stress Screening European Union Federal Aiation Agency Full Authority Digital Engine Control Federal Aiation Regulations Fine pitch ball grid array Federal Communications Commission Flip Chip On Board Flip Chip On Ceramic Flip Chip on Flex Finite Difference Time Domain Finite Element Analysis Field Emission Displays Finite Element Method Field Effect Transistor Form Fit and Function Failure-Free Operating Period Failure Mode and Effect Analysis Failure Mode Effect and Criticality Analysis Courtesy of CALCE Practical Components, Inc. Tel: Fax:

44 Industry Acronyms FPGA FRACAS FSDT FTA FQFP GA GAL GEM GIDEP GPC GPWS HALT HASS HAST HBM HDL HDTV HM HSDT HSOP HTCC HTOL HTRB HTS HTTP I/O IC IDDQ IDSA IDT IEC IECQ IEEE IFE IGBT IMA IP IPC IPD IR IRC Isat ITO JAN JAR JEDEC LCA LCCC LC LCD LCM LGA LIF Field Programmable Gate Array Failure Reporting, Analysis and Correctie Action System First-order Shear Deformable Theory Fault Tree Analysis FusionQuad Flat Pack Gate Array Generic Array Logic/Lattice Generalized Emulation of Microcircuits Goernment Industry Data Exchange Program Goernment Procurement Committee Ground Proximity Warning System Highly Accelerated Life Test Highly Accelerated Stress Screening Highly Accelerated Stress Test Human Body Model Hardware Description Language High Definition Teleision Health Monitoring Higher-order Shear Deformable Theory Small Outline Package with a Heat Sink High Temperature Cofired Ceramic High Temperature Operation Life High Temperature Reerse Bias High Temperature Storage Hyper-Text Transfer Protocol Input/Output Integrated Circuit Quiescent Current Incremental Damage Superposition Approach Integrated Deice Technology International Electrotechnical Commission International Electrotechnical Commission Quality Assessment System for Electronic Components Institute of Electrical and Electronic Engineers In-Flight Entertainment Integrated Gate Bipolar Transistor Integrated Modular Aionics Intellectual Property Institute for Interconnecting and Packaging Electronic Circuit Integrated Passie Deices Infra Red/Insulation Resistance International Resistie Company Saturation Current Indium tin oxide Joint Army Nay Joint Aiation Regulation Joint Electron Deice Engineering Council Logic Cell Array Leadless Ceramic Chip Carrier Liquid Crystal Liquid Crystal Display Life Consumption Monitoring Land Grid Array Low Insertion Force LIGA Acronym from German words for lithography, electroplating, and molding LM Life Margin LOT Life of Type LPCC Leadless Plastic Chip Carrier LRM Line Replaceable Module LRU Line Replaceable Unit LSI Large Scale Integration LTB Last Time Buy LTOL Low Temperature Operating Life LVCES Low Volume Complex Electronic System LVT Low Voltage (BiCMOS) Technology LWDT Layer-Wise Deformable Theory MAX Multiple Array Matrix MBGA Metal Ball Grid Array MCM Multi-Chip Module MDRR Multi-Domain Rayleigh Ritz MDSDT Material Dependent Shear Deformable Theory MEMS MicroElectroMechanical Systems MFG Mixed Flowing Gases MFOP Maintenance Free Operating Period MLCC Multilayer Ceramic Capacitor MLD Minimum Life Desired MM Machine Model MMC Metal Matrix Composite Mn Metal leel number n MOCA Mitigation of Obsolescence Cost Analysis MoL Method of Lines MoM Method of Moments MOS Metal Oxide Semiconductor MOSFET Metal Oxide Semiconductor Field Effect Transistor MRP Maintenance Recoery Period MSL Moisture Sensitiity Leel MTBF Mean Time Between Failures MTBUR Mean Time Between Unscheduled Remoals MTTF Mean Time to Failure NCMS National Center for Manufacturing Sciences NEC Numerical Electromagnetic Code NEMI National Electronics Manufacturing Initiatie Inc. NEMP Nuclear Electromagnetic Pulse NFEM Nested Finite Element Method NFF No Fault Found NIF Normal Insertion Force NRE Non-Recurring Engineering NSWC Naal Surface Warfare Center OEM Original Equipment Manufacturer OLED Organic Light Emitting Diodes OOR Ordered Oerall Range PAL Programmable Array Logic PASIC Programmable Application Specific Integrated Circuit PBGA Plastic Ball Grid Array PBT Parasitic Bipolar Transistor PC Pre-Conditioning PC FAB Printed Circuit Fabrication Courtesy of CALCE 44 Practical Components, Inc. klaphen@practicalcomponents.com

45 Industry Acronyms PCB PCM PCN PDI PDN PDP PEEC PFC PGA PHM PLA PLCC PoF PoP POS PPM PQFP PSD PT PTH PTV PWA PWB PZT QFP QML QPL QRD RDF RDSON RET RF RFI RH RMS ROI RT S&A SAC SAE SAM SARA SBGA SC SCMOS SDA SDDV SDU SE SEM SI SIA SILC: SM Printed Circuit Board Phase Change Material Product Change Notice Precision Deices Incorporated Product Discontinuance Notice Plasma Displays Panel Partial Element Equialent Circuit Primary Flight Control Pin Grid Array Prognostic Health Monitoring Programmable Logic Array Plastic Leaded Chip Carrier Physics of Failure Package on Package Proof of Screen Parts Per Million Plastic Quad Flat Pack Power Spectral Density Punch Through Plated-Through Hole Plated-Through Via Printed Wiring Assembly Printed Wiring Board Lead Zirconate Titanate Quad Flat Pack Qualified Manufacturer List Qualified Part List Quality Reliability Durability Range Distribution Function Drain to Source On Resistance Reliability Enhancement Test Radio Frequency Radio Frequency Interference Relatie Humidity Root mean square Return On Inestment Room Temperature Safety and Arming Tin Siler Copper (SnAgCu) Society of Automotie Engineers Scanning Acoustic Microscope Simulation Assisted Reliability Assessment Super Ball Grid Array Standard Cell Scalable Complementary Metal Oxide Semiconductor Spectral Domain Approach Stress-Drien Diffusie Voiding Shop Discardable Unit Shielding Effectieness Scanning Electron Microscope Signal Integrity Semiconductor Industry Association Stress Induced Leakage Current Surface Mount SMD SMT SOC SOIC SOP SOWIC SPC SPICE SPLD SRAM SRU SUBM TAB TBGA TC TCAS TCTF TDDB TEM TFT Tg TH THB TI TLM TMM TMV TS TSMC: TTF TTL UBGA UV VCO VDCEP VHDL VHSIC VLSI VQ Vt WEEE WLP xpym ZIF Standard Microcircuit Drawing Surface Mount Technology System-On-Chip Small Outline Integrated Circuit System-On-Package / Small Outline Package Small Outline Wide Integrated Circuit Statistical Process Control Simulation Program with Integrated Circuit Emphasis Simple Programmable Logic Deice Static Random Access Memory Shop Replaceable Unit Submicron Tape Automated Bonding Tape Ball Grid Array Temperature Cycle Traffic-alert Collision Aoidance System Time-, Cycles-to Failure Time-Dependent Dielectric Breakdown Transerse Electromagnetic Thin film transistor Glass Transition Temperature Through Hole Temperature, Humidity and Bias Transfer Impedance Transmission Line Matrix Thermo -Mechanical Microstructural Through Mold Via Thermal Shock Taiwan Semiconductor Manufacturing Corporation Time to Failure Transistor-Transistor Logic Micro Ball Grid Array Ultraiolet Voltage Controlled Oscillator Volume Drien Commercial Electronic Product VHSIC Hardware Description Language Very High-Speed IC Very Large Scale Integration Virtual Qualification Threshold Voltage Waste from Electrical and Electronic Equipment Wafer Leel Package x Polysilicon and y Metal Zero Insertion Force Courtesy of CALCE Practical Components, Inc. Tel: Fax:

46 Dummy Component Display Case Practical Components offers a display case containing a sampling of components. The components included range from the latest in high technology (01005s, PoPs, CVBGAs, and Flip Chips) to standard SMT packages (PBGAs, MLFs, QFPs and TSOPs). The display case is equialent to a CD case for portability. These cases are fun and educational, proiding a quick, portable, show-n-tell representation to students, co-workers, customers and endors. Case Size: 6" x 4" Display Case Contents n n n n n n n n n n n n n n n n n n n n PoP Top Package on Package PSfBGA Bottom Package on Package CVBGA Very Thin ChipArray PBGA Plastic Ball Grid Array QFP Quad Flat Pack LQFP Low Profile Quad Flat Pack MLF MicroLeadFrame QFPQFN Open-molded Quad Flat Pack No Leads TSOP Type I Flip Chip Chip Resistor 0201 Chip Resistor 0402 Chip Resistor 0603 Chip Resistor 0805 Chip Resistor 1206 Chip Resistor SOT23 Transistor SOD80 Diode TO18 Through Hole Transistor 1/4 Watt Axial Leaded Resistor Display Case Order Number: Practical Components, Inc. klaphen@practicalcomponents.com

47 Microelectronic Packaging & Assembly Solutions OmQFN Open-molded Quad Flat Pack No Leads From prototype to production olumes, these pre-molded QFN packages, created by Quik-Pak, proide a high quality, fast solution for your assembly needs. The pre-molded packages come in a ariety of sizes. They are aailable from 3x3mm to 12x12mm body size with lead pitch sizes ranging from.8mm to.4mm. Coers or lids are also aailable for air caity applications. OmQFN Open-molded Quad Flat Pack No Leads Package Part Number Lead Count Body Size Pitch.4mm Pitch QPQFN28-4mm-.4mm 28 4x4mm.4mm QPQFN48-6mm-4mm 48 6x6mm.4mm QPQFN88-10mm-.4mm 88 10x10mm.4mm QPQFN100-12mm-.4mm x12mm.4mm.5mm Pitch QPQFN12-3mm-.5mm 12 3x3mm.5mm QPQFN16-3mm-.5mm 16 3x3mm.5mm QPQFN20-4mm-.5mm 20 4x4mm.5mm QPQFN24-4mm-.5mm 24 4x4mm.5mm QPQFN28-5mm-.5mm 28 5x5mm.5mm QPQFN32-5mm-.5mm 32 5x5mm.5mm QPQFN40-6mm-.5mm 40 6x6mm.5mm QPQFN44-7mm-.5mm 44 7x7mm.5mm QPQFN48-7mm-.5mm 48 7x7mm.5mm QPQFN56-8mm-.5mm 56 8x8mm.5mm QPQFN64-9mm-.5mm 64 9x9mm.5mm QPQFN72-10mm-.5mm 72 10x10mm.5mm QPQFN80-12mm-.5mm 80 12x12mm.5mm.65mm Pitch QPQFN8-3mm-.65mm 8 3x3mm.65mm QPQFN12-3mm-65mm 12 3x3mm.65mm QPQFN16-4mm-65mm 16 4x4mm.65mm QPQFN20-5mm-65mm 20 5x5mm.65mm QPQFN24-5mm-65mm 24 5x5mm.65mm QPQFN28-6mm-65mm 28 6x6mm.65mm QPQFN32-7mm-65mm 32 7x7mm.65mm Notes Larger die paddle area. Supports larger die and ground bonds per gien body size. RoHS and REACH compliant green molding compound. Gold plated. Superior bondability. Custom body sizes and lead counts aailable. Components can be encapsulated or lids are aailable. Part Description System Quik-Pak QP QFN8-3mm-.65mm Quad Flat Pack No Leads Pitch Lead Count Body Size Assembly Solutions Include the following: Wafer Dicing Wire Bonding Custom Packaging Backgrinding Complete Assembly Practical Components, Inc. Tel: Fax:

48 MLF MicroLeadFrame Amkor s MicroLeadFrame Package (MLF ) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to proide electrical contact to the PWB. The package also offers Amkor s ExposedPad technology MLF MicroLeadFrame Part Description Lead Count Body Size Pitch Quantity Per Tube.4mm Pitch A-MLF28-4mm-.4mm 28 4mm.4mm 75 A-MLF48-6mm-.4mm 48 6mm.4mm 50 A-MLF88-10mm-.4mm 88 10mm.4mm 30 A-MLF100-12mm-.4mm mm.4mm 25.5mm Pitch A-MLF12-3mm-.5mm 12 3mm.5mm 100 A-MLF16-3mm-.5mm 16 3mm.5mm 100 A-MLF20-4mm-.5mm 20 4mm.5mm 75 A-MLF24-4mm-.5mm 24 4mm.5mm 75 A-MLF28-5mm-.5mm 28 5mm.5mm 60 A-MLF32-5mm-.5mm 32 5mm.5mm 60 A-MLF36-6mm-.5mm 36 6mm.5mm 50 A-MLF40-6mm-.5mm 40 6mm.5mm 50 A-MLF44-7mm-.5mm 44 7mm.5mm 43 A-MLF48-7mm-.5mm 48 7mm.5mm 43 A-MLF52-8mm-.5mm 52 8mm.5mm 37 A-MLF56-8mm-.5mm 56 8mm.5mm 37 A-MLF64-9mm-.5mm 64 9mm.5mm 33 A-MLF68-10mm-.5mm 68 10mm.5mm 30 A-MLF72-10mm-.5mm 72 10mm.5mm 30.65mm Pitch A-MLF8-3mm-.65mm 8 3mm.65mm 100 A-MLF16-4mm-.65mm 16 4mm.65mm 75 A-MLF20-5mm-.65mm 20 5mm.65mm 60 A-MLF28-6mm-.65mm 28 6mm.65mm 50 A-MLF32-7mm-.65mm 32 7mm.65mm 43 A-MLF44-9mm-.65mm 44 9mm.65mm 33.8mm Pitch A-MLF12-4mm-.8mm 12 4mm.8mm 75 A-MLF16-5mm-.8mm 16 5mm.8mm 60 A-MLF20-6mm-.8mm 20 6mm.8mm 50 A-MLF28-7mm-.8mm 28 7mm.8mm 43 Notes Parts are packaged in tubes (standard). Parts are aailable in trays or on tape and reel upon special request. Solder plating finish aailable is 100% Matte Sn. Moisture sensitiity leel is JEDEC 1. Two MLF designs are aailable: Punch or Saw (see the cross-section drawing). Small size (50% space reduction as compared with TSSOP). MLF package is a near CSP plastic encapsulated package with a copper leadframe substrate. MLF is also known as QFN, MCC or MLP. 0.6mm to 1.5mm maximum height Body sizes ranging from 3 x 3mm to 12 x 12mm. Gold Wire Cu Leadframe Pin counts and body sizes change on an ongoing basis. Please call for updated listing of aailable packages. Mold Compound Down Bond Part Description System Amkor A-MLF12-3mm-.5mm-DC-Sn MicroLeadFrame (100% Matte Sn) Lead Count Daisy Chain Body Size Pitch 48 Practical Components, Inc. klaphen@practicalcomponents.com Die Exposed Die Paddle MAP Design Saw Die Attach Material Ground Bond NiPd Plating as a thermal enhancement by haing the die attach paddle exposed on the bottom of the package surface to proide an efficient heat path when soldered directly to the PWB. Cross-Sections MLF Solder Plating Gold Wire Cu Leadframe Down Bond Mold Compound Die Exposed Die Paddle Die Attach Material Indiidual Unit Design Punch Ag Plating Ground Bond For kits see pages 93, 96, 98, 106 and 109.

49 Dual Row MLF Amkor s new Dual Row MLF (MicroLeadFrame ) package with 2 rows of lands is a cost effectie, high performance solution for deices requiring up to 164 I/O. Typical applications include hard disk dries, USB controllers, and Wireless LAN. The small size and weight, along with excellent thermal and electrical performance, make the MLF package an ideal choice for handheld portable applications such as cell phones and PDAs or any other application where size, weight and package performance are required issues. Dual Row MLF Part Description Lead Count Body Size Pitch Quantity Per Tube A-DualRowMLF124-10mm-.5mm mm.5mm 30 A-DualRowMLF132-10mm-.5mm mm.5mm 30 A-DualRowMLF156-12mm-.5mm mm.5mm 25 A-DualRowMLF164-12mm-.5mm mm.5mm 25 Notes n Parts are packaged in tubes (standard). n Parts are aailable in trays or on tape and reel upon special request. n Solder plating finishes aailable are 85/15 SnPb and 100% Matte Sn. n Moisture sensitiity leel is JEDEC 1. n Process flow is same as standard punch MLF. n Small size (reduce package footprint by 50% or more and improed RF performance) and weight. n Dual row MLF offers enhanced thermal capability. Part Description System Amkor A-DualRowMLF124-10mm-.5mm-DC-Sn Dual Row MLF Lead Count Body Size n Add TR to end of part number for Tape and Reel. n Add Sn to end of part number for Lead-Free. Pitch (100% Matte Sn) Daisy Chain For recommended kits see pages 93 and 96. MQFP 3.93 mm SOIC MQFP 2.33 mm LQFP TSOP 1.6mm CABGA SOT/SC TSOP TQFP 1.2 mm TSSOP 1.1 mm MLF 0.9 mm 0.8 mm 0.6 mm Practical Components is the exclusie distributor of Amkor Technology Mechanical Components. Practical Components, Inc. Tel: Fax:

50 (V)FQFP FusionQuad Amkor s FusionQuad represents a breakthrough in leadframe-based plastic packaging through the effectie integration of ExposedPad QFP and MLF technologies. FusionQuad is based upon the addition of exposed bottom lands within a standard VQFP package format. The noel integration of bottom lands proides a cost-effectie platform for increased lead count in a small form factor. FusionQuad not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also deliers an approximate 50% reduction in package size for a gien leadcount. Additionally, FusionQuad proides excellent RF electrical performance characteristics with short signal paths to the bottom lands and high power dissipation capability with the solderable exposed die attach paddle. Amkor s FusionQuad proides an ideal package format for most IC semiconductor technologies including adanced mixed signal SoCs, motor driers, MCUs, ASICs, DSPs and a ariety of others. FusionQuad is particularly well suited for applications requiring superior electrical or thermal performance in a cost constrained enironment including hard disk dries, laptop PCs, Ethernet communication, digital teleision, data conersion and many others. Part Description Total Lead Count External Leads FusionQuad Internal Leads Body Size Body Thickness Single Row A-(V)FQFP176(128/48)-14mm-.4mm mm sq.8mm.4mm 90 A-(V)FQFP184(128/56)-14mm-.4/.5mm mm sq.8mm.4/.5mm 90 A-(V)FQFP196(148/48)-16mm-.4/.5mm mm sq.8mm.4/.5mm 84 A-(V)FQFP220(148/72)-16mm-.4mm mm sq.8mm.4mm 84 A-(V)FQFP280(224/56)-24mm-.4/.5mm mm sq 1.0mm.4/.5mm 40 A-(V)FQFP304(224/80)-24mm-.4mm mm sq 1.0mm.4mm 40 Dual Row A-(V)FQFP216(100/116)-14mm-.5mm mm sq.8mm.5mm 90 Lead Pitch Quantity Per Tray FusionQuad 176 pin Single Row Design Standard 14mm x 14mm VQFP 128LD 0.5mm External Lead Pitch Mold Compound Gold Wire Die 0.8mm Body less than 1.00mm Seat Height Additional 48 pins on bottom at 0.5mm Pitch SOH:.05 nominal Cu Leadframe Exposed Lands Exposed Die Paddle Single Row Exposed Land Design Order Number: A-VQFP176(128/48)-14mm-0.5-DC-Sn FusionQuad 216 pin Dual Row Design Standard 14mm x 14mm VQFP 100L 0.5mm External Lead Pitch Mold Compound Gold Wire Die 0.8mm Body less than 1.00mm Seat Height Cu Leadframe Exposed Lands Exposed Die Paddle Double Row Exposed Land Design SOH:.05 nominal Additional 116 pins on bottom at 0.5mm Pitch Order Number: A-VQFP216(100/116)-14mm-0.5-DC-Sn For kits see pages 52, 53 and Practical Components, Inc. klaphen@practicalcomponents.com

51 (V)FQFP FusionQuad Daisy-Chain Patterns FusionQuad 176 (128/48) pin Single Row Design Standard 14mm x 14mm VQFP 128LD 0.5mm External Lead Pitch Additional 48 pins on bottom at 0.5mm Pitch FusionQuad 216 (100/116) pin Dual Row Design Standard 14mm x 14mm VQFP 100LD 0.5mm External Lead Pitch Additional 116 pins on bottom at 0.5mm Pitch Practical Components, Inc. Tel: Fax:

52 FusionQuad 176(128/48) Board and Kit Thermal Cycle Lead Free Kit NEW! Practical Components is offering a New Thermal Cycling test board and kit for Amkor s new FusionQuad components. Thermal Cycling is a diagnostic test for electronic assemblies. The test is seere on solder joints that are under both compressie and tensile strain during cycling as a result of differential thermal expansion. PCB (128/48) Thermal Cycle Board Amkor s FusionQuad represents a breakthrough in leadframebased plastic packaging through the effectie integration of ExposedPad TQFP / LQFP, ExposedPad TQFP and MLF technologies. The noel integration of bottom lands in a QFP proides a cost-effectie platform for increased lead count in a small form factor. FusionQuad not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also deliers an approximate 50% reduction in package size for a gien leadcount. Additionally, FusionQuad proides excellent RF Electrical Package Characterization, electrical performance characteristics with short signal paths to the bottom lands and high power dissipation capability with the solderable exposed die attach paddle. The new FusionQuad Thermal Cycle Test Kit will allow customers to conduct aluable process testing on new technology components. Customers are encouraged to isit the Practical Components website at or Amkor website at for additional technical information regarding Amkor FusionQuad components. Notes n Board size is 191 x 74mm, 4 layers,.039" thick, no microias. n Board material is IS-410 High Temp. 180Tg. n Standard board finish is OSP Entek CU-106A-HT. n 15 daisy-chain pad placements for 176(128/48) FusionQuad components. n Gerber and X,Y Theta data included at no charge. Order Number: PCB300-FQ176-TC-OSPHT Order Number: A-(V)FQFP176(128/48)-14mm-.4mm-DC-Sn Practical Components is the exclusie distributor of Amkor Technology Mechanical Components. 52 Practical Components, Inc. klaphen@practicalcomponents.com

53 NEW! FusionQuad 216ld (100/116) Board and Kit Drop Test Lead Free Kit The new FusionQuad 216 ld (100/116) drop test kit contains both the test board and Amkor FusionQuad 216 components. Amkor s new FusionQuad components are particularly well suited for applications requiring superior electrical or thermal performance in a cost constrained enironment, including hard disk dries, laptop PC, Ethernet communication, digital teleision, data conersions and many other applications. PCB ld (100/116) Drop Test Board The new PCB300 FusionQuad test board has daisy chain patterns to test both the components and test board for process ealuation testing. This test boards allows customers to become familiar with some of the handling characteristics of the FusionQuad components. The combination of leads on the outside of the package and pads on the interior of the package will require additional process ealuation methods. The intent of this test kit is to proide a low cost method to deelop process control procedures for new technology components. Additional information concerning the test ehicle or FusionQuad components is aailable on the Practical Components web site at FusionQuad component technical data and characteristics is aailable on the Amkor web at Notes n Board size is 132 x 77mm, 8 layers,.039" thick, no microias. n Board material is IS-410 High Temp. 180Tg. n Standard board finish is OSP Entek CU-106A-HT. n 15 daisy-chain pad placements for 216ld (100/116) FusionQuad component. n Gerber and X,Y Theta data included at no charge. Practical Components is the exclusie distributor of Amkor Technology Mechanical Components. Order Number: PCB300-FQ216-DT-OSPHT Order Number: A-(V)FQFP216(100/116)-14mm-.5mm-DC-LF Practical Components, Inc. Tel: Fax:

54 TQFP Thin Quad Flat Pack Thin Quad Flat Pack (TQFP) packages proide the same benefit of the metric QFP package, but are thinner (body thickness of 1.0mm) and hae a standard lead-frame footprint (2.0mm lead footprint). TQFPs are helping to sole issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 176. Body sizes range from 5 x 5mm to 20 x 20mm. Copper lead-frames are used for the TQFP package. Lead pitches aailable for TQFP package are 0.4mm, 0.5mm, 0.65mm 0.8mm and 1.0mm. TQFP Thin Quad Flat Pack 1.0mm Thick Part Description Number of Pins Body Size Lead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel A-TQFP32-5mm-.5mm-2.0* 32 5mm sq.5mm 2.0mm mm 12mm 1,000 A-TQFP32-7mm-.8mm-2.0* 32 7mm sq.8mm 2.0mm mm 12mm 1,000 A-TQFP40-5mm-.4mm-2.0* 40 5mm sq.4mm 2.0mm mm 12mm 1,000 A-TQFP44-10mm-.8mm-2.0* 44 10mm sq.8mm 2.0mm mm 16mm 1,000 A-TQFP48-7mm-.5mm-2.0 * 48 7mm sq.5mm 2.0mm mm 12mm 1,000 A-TQFP52-10mm-.65mm-2.0 * 52 10mm sq.65mm 2.0mm mm 16mm 1,000 A-TQFP64-7mm-.4mm-2.0* 64 7mm sq.4mm 2.0mm mm 12mm 1,000 A-TQFP64-10mm-.5mm-2.0* 64 10mm sq.5mm 2.0mm mm 16mm 1,000 A-TQFP64-14mm-.8mm-2.0 * 64 14mm sq.8mm 2.0mm 90 32mm 24mm 750 A-TQFP80-12mm-.5mm-2.0 * 80 12mm sq.5mm 2.0mm mm 24mm 1,000 A-TQFP80-14mm-.65mm-2.0* 80 14mm sq.65mm 2.0mm 90 32mm 24mm 750 A-TQFP100-14mm-.5mm-2.0* mm sq.5mm 2.0mm 90 32mm 24mm 750 A-TQFP120-14mm-.4mm-2.0 * mm sq.4mm 2.0mm 90 32mm 24mm 750 A-TQFP128-14mm-.4mm-2.0* mm sq.4mm 2.0mm 90 32mm 24mm 750 A-TQFP128-20mm-.5mm-2.0 * mm sq.5mm 2.0mm 60 44mm 24mm 500 A-TQFP144-20mm-.5mm-2.0 * mm sq.5mm 2.0mm 60 44mm 24mm 500 A-TQFP176-20mm-.4mm-2.0 * mm sq.4mm 2.0mm 60 44mm 24mm 500 Notes TQFP is aailable in die up configurations in 1.0mm thickness only. 5 x 5mm to 20 x 20mm body size (JEDEC Standard). Copper leadframes. 1.0mm body thickness for TQFP. Moisture sensitiity is JEDEC leel 3. Lead-free parts are aailable with SnBi or 100% Matte Sn finish. * = Aailable as an Exposed Pad L/TQFP Package by Amkor. The ExposedPad L/TQFP can increase heat dissipation by as much as 110% oer a standard L/TQFP. The ExposedPad L/TQFP is a cost effectie, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB. Parts may also be aailable NiPdAg-Au & NiPdAu. Call for aailability. Minimums may apply. SnPb parts no longer aailable. Part Description System Amkor A-TQFP32-5mm-.5mm-2.0-DC-Sn (100% Matte Sn Thin Quad Flat Pack and SnBi) Number of Pins Body Size Daisy Chain Lead Pitch Lead Footprint n Add epad to beginning of part number when ordering ExposedPad package. n Add TR to end of part number for Tape and Reel. - Add LF to end of part number for Lead-Free, i.e Sn or SnBi. Cu Leadframe Die Attach Adhesie TQFP Package Mold Compound Die Au Wire 1.0mm Cu Leadframe Exposed Pad L/TQFP Package Mold Compound Au Wire Die Attach Pad Die Up (Standard) Die Attach Exposed Pad Mold Compound Die Die Exposed Pad Die Up (Standard) Die Attach Cu Leadframe Au Wire Die Down (Inerted) 54 Practical Components, Inc. klaphen@practicalcomponents.com

55 LQFP Low Profile Quad Flat Pack Low Profile Quad Flat Pack (LQFP) packages proide the same benefit of the metric QFP packages, but are thinner (body thickness of 1.4mm) and hae a standard lead-frame footprint (2.0mm lead footprint). Daisy-Chain And Lead-Free Parts Aailable! LQFPs help to sole issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 256. Body sizes range from 7 x 7mm to 28 x 28mm. Copper lead-frames are used for the LQFP package. Lead pitches aailable for LQFP package are 0.4mm, 0.5mm, 0.65mm and 0.8mm. Part Description Number of Pins LQFP Low Profile Quad Flat Pack 1.4mm Thick Body Size Lead Pitch Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel Aailable Lead-Free Finishes.4mm Pitch A-LQFP64-7mm-.4mm mm sq.4mm mm 12mm 1,000 Sn or SnBi A-LQFP120-14mm-.4mm mm sq.4mm 90 32mm 24mm 750 Sn or SnBi A-LQFP128-14mm-.4mm mm sq.4mm 90 32mm 24mm 750 Sn or SnBi A-LQFP176-20mm-.4mm mm sq.4mm 60 44mm 24mm 500 Sn or SnBi A-LQFP216-24mm-.4mm mm sq.4mm 40 44mm 32mm 500 Sn or SnBi A-LQFP256-28mm-.4mm mm sq.4mm 36 44mm 40mm 500 Sn or SnBi.5mm Pitch A-LQFP48-7mm-.5mm mm sq.5mm mm 12mm 1,000 Sn or SnBi A-LQFP64-10mm-.5mm mm sq.5mm mm 24mm 1,000 Sn or SnBi A-LQFP100-14mm-.5mm mm sq.5mm 90 32mm 24mm 750 Sn or SnBi A-LQFP128-14x20mm-.5mm x 20mm.5mm 72 44mm 32mm 500 Sn or SnBi A-LQFP128-20mm-.5mm mm sq.5mm 60 44mm 24mm 500 Sn or SnBi A-LQFP144-20mm-.5mm-2.0* mm sq.5mm 60 44mm 24mm 750 Sn or SnBi A-LQFP160-24mm-.5mm mm sq.5mm 40 44mm 32mm 500 Sn or SnBi A-LQFP176-24mm-.5mm-2.0* mm sq.5mm 40 44mm 32mm 500 Sn or SnBi A-LQFP208-28mm-.5mm-2.0* mm sq.5mm 36 44mm 40mm 500 Sn or SnBi.65mm Pitch A-LQFP52-10mm-.65mm mm sq.65mm mm 24mm 1,000 Sn or SnBi A-LQFP80-14mm-.65mm mm sq.65mm 90 32mm 24mm 750 Sn or SnBi A-LQFP100-14x20mm-.65mm x20mm.65mm 72 44mm 32mm 500 Sn or SnBi.8mm Pitch A-LQFP32-7mm-.8mm mm sq.8mm mm 12mm 1,000 Sn or SnBi A-LQFP44-10mm-.8mm mm sq.8mm mm 24mm 1,000 Sn or SnBi A-LQFP64-14mm-.8mm mm sq.8mm 90 32mm 24mm 750 Sn or SnBi 1.0mm A-LQFP44-14mm-1.0mm mm 1.0mm 90 32mm 24mm 750 Sn or SnBiP Notes * = Aailable as an ExposedPad L/TQFP Package by Amkor. The ExposedPad L/TQFP can increase heat dissipation by as much as 110% oer a standard L/TQFP. The ExposedPad L/TQFP is a cost effectie, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB. All LQFPs are standard in trays. LQFPs hae a body thickness of 1.4mm. Tray quantity may ary. Tape type is plastic. Moisture sensitiity is JEDEC leel 3. Lead-free parts are aailable with SnBi or 100% Matte Sn finish. Parts may also be aailable NiPdAg-Au & NiPdAu. Call for aailability. Minimums may apply. SnPb parts no longer aailable. Part Description System Low Profile LQFP48-7mm-.5mm-2.0-DC-Sn Quad Flat Pack (100% Matte Sn Number of Pins and SnBi) Body Size Lead Pitch Lead Footprint Daisy Chain n Add TR to end of part number for Tape and Reel. n Add specific finish to end of part number for Lead-Free, i.e Sn or SnBi. For recommended kits see pages 88, 93, 96, 98, 106, 109, and 112. For drawings, please isit our web site at Practical Components, Inc. Tel: Fax:

56 QFP Quad Flat Pack Daisy-Chain And Lead-Free Parts Aailable! Quad Flat Pack (QFP) components hae four sides with leads extending from the component body on all four sides. QFP components come packaged in trays or on tape and reel to protect the component leads that can be easily damaged. An important measurement for QFPs is coplanarity. When the first lead from the component is placed on the PCB coplanarity is established. Coplanarity ensures the last lead can be placed on the board. The standard for QFP coplanarity is ±4 mils. Part Description Number of Pins Body Size QFP Plastic Quad Flat Pack Body Thickness Lead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity 13" Reel Aailable Lead-Free Finishes.40mm Pitch A-QFP256-28mm-.4mm mm sq 3.37mm.40mm 2.6mm Sn or SnBi.50mm Pitch A-QFP64-10mm-.50mm mm sq 2.0mm.50mm 3.2mm Sn or SnBi A-QFP64-10mm-.50mm mm sq 2.0mm.50mm 3.9mm Sn or SnBi A-QFP100-14mm-.5mm mm sq 2.0/2.67mm.50mm 3.2mm Sn or SnBi A-QFP100-14mm-.5mm mm sq 2.67mm.50mm 3.9mm Sn or SnBi A-QFP128-14x20mm-.5mm x 20mm 2.71mm.50mm 3.2mm Sn or SnBi A-QFP128-14x20mm-.5mm x 20mm 2.71mm.50mm 3.9mm Sn or SnBi A-QFP208-28mm-.5mm mm sq 3.37mm.50mm 2.6mm Sn or SnBi A-QFP208-28mm-.5mm mm sq 3.37mm.50mm 3.2mm Sn or SnBi A-QFP240-32mm-.5mm mm sq 3.4mm.50mm 2.6mm Sn or SnBi.65mm Pitch A-QFP52-10mm-.65mm mm sq 2.0mm.65mm 3.2mm Sn or SnBi A-QFP52-10mm-.65mm mm sq 2.0mm.65mm 3.9mm Sn or SnBi A-QFP80-14mm-.65mm mm sq 2.0/2.67mm.65mm 3.2mm Sn or SnBi A-QFP80-14mm-.65mm mm sq 2.67mm.65mm 3.9mm Sn or SnBi A-QFP100-14x20mm-.65mm x 20mm 2.71mm.65mm 3.2mm Sn or SnBi A-QFP100-14x20mm-.65mm x 20mm 2.71mm.65mm 3.9mm Sn or SnBi A-QFP144-28mm-.65mm mm sq 3.37mm.65mm 2.6mm Sn or SnBi A-QFP144-28mm-.65mm mm sq 3.37mm.65mm 3.2mm Sn or SnBi A-QFP160-28mm-.65mm mm sq 3.37mm.65mm 2.6mm Sn or SnBi A-QFP160-28mm-.65mm mm sq 3.37mm.65mm 3.2mm Sn or SnBi A-QFP160-28mm-.65mm mm sq 3.37mm.65mm 3.9mm Sn or SnBi.80mm Pitch A-QFP44-10mm-.8mm mm sq 2.0mm.80mm 3.2mm Sn or SnBi A-QFP44-10mm-.8mm mm sq 2.0mm.80mm 3.9mm Sn or SnBi A-QFP64-14mm-.8mm mm sq 2.0/2.67mm.80mm 3.2mm Sn or SnBi A-QFP64-14mm-.8mm mm sq 2.67mm.80mm 3.9mm Sn or SnBi A-QFP80-14x20mm-.8mm x 20mm 2.71mm.80mm 3.2mm Sn or SnBi A-QFP80-14x20mm-.8mm x 20mm 2.71mm.80mm 3.9mm Sn or SnBi A-QFP120-28mm-.8mm mm sq 3.37mm.80mm 2.6mm Sn or SnBi A-QFP120-28mm-.8mm mm sq 3.37mm.80mm 3.2mm Sn or SnBi A-QFP128-28mm-.8mm mm sq 3.37mm.80mm 2.6mm Sn or SnBi A-QFP128-28mm-.8mm mm sq 3.37mm.80mm 3.2mm Sn or SnBi 1.00mm Pitch A-QFP52-14mm-1.0mm mm sq 2.0/2.67mm 1.00mm 3.2mm Sn or SnBi A-QFP52-14mm-1.0mm mm sq 2.67mm 1.00mm 3.9mm Sn or SnBi A-QFP64-14x20mm-1.0mm x 20mm 2.71mm 1.00mm 3.2mm Sn or SnBi A-QFP64-14x20mm-1.0mm x 20mm 2.71mm 1.00mm 3.9mm Sn or SnBi Notes All QFPs are standard in JEDEC trays. Tray quantities may ary. Parts aailable on Tape and Reel upon special request. Lead-free parts are aailable with SnBi or 100% Matte Sn finish. Parts may also be aailable NiPdAg-Au & NiPdAu. Call for aailability. Minimums may apply. Part Description System Quad Flat Pack QFP44-10mm-.8mm-3.9mm-DC-Sn Number of Pins (100% Matte Sn and SnBi) Body Size Lead Lead Pitch Footprint Daisy Chain n Add TR to end of part number for Tape and Reel. n Add specific finish to end of part number for Lead-Free, i.e Sn or SnBi.P For kits see pages 88, 90, 93, 94, 98, 100, 107, 109, Practical Components, Inc. klaphen@practicalcomponents.com

57 CQFP Ceramic Quad Flat Pack CQFPs are hermetic packages consisting of true pieces of dry pressed ceramic surrounding a uniformed leadframe with tie bar attached. Lead counts for this package range from 14 to 304, with lead pitch ranging Notes CQFPs are aailable with or without combo lid. Pins are flat (sandwiched) with tie bar. Parts are packaged in non-jedec trays. Due to the custom nature of the package, body size and dimensions can change without notice. Parts aailable with a daisy-chain configuration upon request. Other ceramic packages aailable upon request. Glass or epoxy seal. Footprint compatible with plastic QFP packages. EIAJ and JEDEC standards. Lead-frames are embedded into the glass to create both internal die connection and external PCB connection. This surface mount package consists of a ceramic base that has metalized castellations/pads on the sides and bottom of the package. LCC packages hae pads on all four sides of the package. Lids for LCCs can be either CQFP Ceramic Quad Flat Pack from 15.7mil to 50mils. Package leads are gold or Koar finish and can be solder-coated by special request. Lids are optional for CQFPs, which are sealed oer the package caity at temperatures from 400 to 460 C. Part Description Number Body Size of Pins (Inch) (mm) Pitch 52CQFP-19.0mm-1.27mm " sq 19.0mm sq 1.27mm 68CQFP-24.1mm-1.27mm " sq 24.1mm sq 1.27mm 84CQFP-16.5mm-.65mm " sq 16.5mm sq.65mm 100CQFP-19.0mm-.65mm " sq 19.0mm sq.65mm 132CQFP-24.1mm-.65mm " sq 24.1mm sq.65mm 144CQFP-26.6mm-.65mm " sq 26.6mm sq.65mm 172CQFP-29.2mm-.65mm " sq 29.2mm sq.65mm 196CQFP-32.0mm-.50mm " sq 32.0mm sq.50mm LCC Leadless Ceramic Carrier Part Description System I/O Count 52CQFP 19.0mm 1.27mm Ceramic Quad Flat Pack Body Size LCC Leadless Ceramic Carrier metal or ceramic. Lids are attached after die attach. This allows for a hermetically sealed enironment for the die. Part Description Number of Body Size Castellations (Inch) (mm) Pitch 16LCC-1.27mm-7.36x8.96mm " x.285" 7.36 x 8.96mm 1.27mm 20LCC-1.27mm-8.90mm " sq 8.90mm sq 1.27mm 28LCC-1.27mm-11.5mm " sq 11.50mm sq 1.27mm 32LCC-1.27mm-11.4x14.0mm " x.450" x 14.00mm 1.27mm 40LCC-1.00mm-10.1mm " sq 10.10mm sq 1.00mm 44LCC-1.27mm-16.5mm " sq 16.50mm sq 1.27mm 48LCC-1.00mm-14.2mm " sq 14.20mm sq 1.00mm 52LCC-1.27mm-19.0mm " sq 19.00mm sq 1.27mm 68LCC-1.27mm-24.11mm " sq 24.11mm sq 1.27mm 84LCC-1.27mm-29.2mm " sq 29.20mm sq 1.27mm Lead Pitch Notes LCCs are aailable with or without combo lid. Gold castellations are standard, but can be solder-tinned with 100% Sn or SnPb alloy. Parts are packaged in non-jedec trays. Parts aailable with a daisy-chain configuration upon request. Other types of ceramic packages not listed in catalog are aailable upon request. Part Description System Number of 20LCC 1.27mm 8.90mm Castellations Leadless Pitch Ceramic Carrier Body Size For recommended kit see page 87. Practical Components, Inc. Tel: Fax:

58 Daisy-Chain Patterns The standard daisy chain pattern for non-bga IC s is Een. Example of daisy-chain een pattern for leadframe packages. Pin 1-2, 3-4, 5-6, 7-8, etc. Continuity testing requires dummy components to contain daisychain connections. There is no standard daisy-chain pattern for Ball Grid Array Packages. QFP Quad Flat Packs SOIC Small Outline Integrated Circuits PLCC Plastic Leaded Chip Carriers 58 Practical Components, Inc. klaphen@practicalcomponents.com

59 PLCC Plastic Leaded Chip Carrier Plastic Leaded Chip Carriers (PLCC) are four-sided J Leaded Plastic body packages. Lead counts range from 20 to 84. PLCC packages can be square or rectangle. Body sizes range from.35" to 1.15". PLCCs are JEDEC standard compliant. The PLCC J Lead configuration requires less board space ersus equialent gull leaded components. Daisy-Chained And Lead-Free Parts Aailable! PLCC Plastic Leaded Chip Carrier Part Description (In Tubes) Pin Count Body Size Quantity Per Tube Part Description (Tape and Reel) Tape Width Tape Pitch Quantity 13" Reel PLCC20T mm 48 PLCC20TR 16mm 12mm 1,000 PLCC28T mm 38 PLCC28TR 24mm 16mm 750 PLCC32T x 13mm 30 PLCC32TR 24mm 16mm 750 PLCC44T mm 27 PLCC44TR 32mm 24mm 450/500 PLCC52T mm 24 PLCC52TR 32mm 24mm 450 PLCC68T mm 18 PLCC68TR 44mm 32mm 230/250 PLCC84T mm 15 PLCC84TR 44mm 36mm 250 Notes All PLCCs hae J leads. Standard lead pitch is 1.27mm (50 mils). PLCCs are to JEDEC standards. Tube quantity may ary. 13" reels are standard. Parts aailable on Tape and Reel. Moisture sensitiity is JEDEC leel 3. Lead-free parts are aailable with 100% Matte Sn finish. Part Description System Plastic Leaded Chip Carrier Number of Pins n Packaging: T=Tubes, TR=Tape and Reel. n Add Sn to end of part number for Lead-Free. Au Wire Mold Compound Die PLCC20T Packaging J-Formed Cu Leadframe For kits see pages 90, 93, 94, 98, 100, 106, 107, 111 and 112. H A Z G Die Attach Adhesie Die Attach Pad Y X S J L B E D C Full Radius Optional W P Heel T L PLCC Component Dimensions C Grid Placement Courtyard Component L (mm) S (mm) W (mm) T (mm) A (mm) B (mm) J (mm) H (mm) P (mm) Identifier Min Max Min Max Min Max Min Max Min Max Min Max Ref Max Basic PLCC PLCC PLCC PLCC PLCC PLCC Component Identifier Z (mm) G (mm) X (mm) PLCC Land Patterns Y (mm) C (mm) D (mm) E (mm) Placement Grid Ref Ref Ref Ref (No. of Elements) PLCC x 24 PLCC x 30 PLCC x 40 PLCC x 44 PLCC x 54 PLCC x 66 Practical Components, Inc. Tel: Fax:

60 SOIC Small Outline Integrated Circuit Small Outline Package (SOIC) body size was compressed and the lead pitch tightened to obtain a smaller ersion SOIC. This yields an IC package that is a significant reduction in the size (compared to standard package). All IC assembly processes remain the same as with our standard SOICs. SOIC Small Outline Integrated Circuit Part Description Number of Pins Lead Style Body Width Quantity Per Tube Tape Width Tape Pitch Quantity 13" Reel SO8GT-3.8mm 8 Gull 3.8mm mm 8mm 2,500 SO14GT-3.8mm 14 Gull 3.8mm 50 16mm 8mm 2,500 SO16GT-3.8mm 16 Gull 3.8mm 48 16mm 8mm 2,500 SO16GT-7.6mm 16 Gull 7.6mm 46 16mm 12mm 1,000 SO20GT-7.6mm 20 Gull 7.6mm 38 24mm 12mm 1,000 SO24GT-7.6mm 24 Gull 7.6mm 31 16mm 12mm 1,000 SO28GT-7.6mm 28 Gull 7.6mm 25 24mm 12mm 1,000 Notes Standard lead pitch is 1.27mm. Tube quantity may ary. Parts aailable on Tape and Reel. Lead-free parts are aailable with 100% Matte Sn finish. Part Description System Small Outline Integrated Circuit SO14GT-3.8mm-DC-Sn Number of Pins (100% Matte Sn) Lead Style Daisy Chain Packaging Body Width n Lead Style: G=Gull Wing. n Packaging: T=Tubes, TR=Tape and Reel. n Add Sn to end of part number for Lead-Free. For kits see pages 88, 90, 94, 99, 100, 104, 105, 106, 107, 109, 111, and 112. B Grid Placement Courtyard D A S L C G Z P W H E X Y Component Identifier JEDEC Number SOIC Component Dimensions L (mm) S (mm) W (mm) T (mm) A (mm) B (mm) H (mm) P (mm) Min Max Min Max Min Max Min Max Min Max Min Max Min Max Basic SO8 MS-012 AA SO14 MS-012 AB SO16 MS-012 AC SO16-7.6mm MS-013 AA SO20-7.6mm MS-013 AC SO28-7.6mm MO-119 AB Component Identifier SOIC Land Pattern Dimensions Y (mm) C (mm) D (mm) E (mm) Placement Grid Z (mm) G (mm) X (mm) Ref Ref Ref Ref (No. of Grid Elements) SO x 16 SO x 16 SO x 16 SO16-7.6mm x 22 SO20-7.6mm x 24 SO28-7.6mm x Practical Components, Inc. klaphen@practicalcomponents.com

61 TSOP Thin Small Outline Package Thin Small Outline Packages (TSOP) are thin body size components; thickness is 1.0mm. TSOP packages hae four sides and are rectangular. Type I TSOPs hae the leads protruding from the width portion of the package. Lead counts range from 28 to 48. Package body size ranges from 8x11.8mm to 12x20mm. TSOP Thin Small Outline Package Type I Part Description Number of Pins Body Size Lead Pitch Quantity Per Tray Tape Width Tape Pitch Quantity 13" Reel A-TI-TSOP28-8.1x11.8mm-.55mm x 11.8mm.55mm mm 12mm 1,000 A-TI-TSOP32-8x11.8mm-.5mm 32 8 x 11.8mm.5mm mm 12mm 1,000 A-TI-TSOP32-8x18.4mm-.5mm 32 8 x 18.4mm.5mm mm 12/16mm 1,000 A-TI-TSOP48-12x18.4mm-.5mm x 18.4mm.5mm 96 32mm 16mm 1,000 TSOP Thin Small Outline Package Type II Type II TSOP are becoming obsolete. Practical has some stock. Please call for aailability. Notes Standard packaging is in JEDEC trays or tape and reel (quantities may ary). Body dimensions are measured by body length and width. Type I means that pins extend from the narrow end (the width) of the body. Parts aailable on Tape and Reel upon special request. See chart for 100% Matte Sn, SnPb, and SnBi aailability. Type II means that pins extend from the wide end (the length) of the body. Type II TSOP are becoming obsolete. Practical has some stock. Please call for aailability. Part Description System Amkor A-TI-TSOP28-8.1x11.8mm-.5mm-DC-Sn (100% Matte Sn Type I or SnBi) Thin Small Outline Package Daisy Chain Number of Pins Body Size Lead Pitch n Add T to end of part number for Tray. n Add TR to end of part number for Tape and Reel. n Add specific finish to end of part number for Lead-Free, i.e Sn or SnBi. TYPE I TYPE II Practical Components, Inc. Tel: Fax:

62 SSOP Small Shrink Outline Package The Small Shrink Outline Package (SSOP) body size is compressed and the lead pitch is tightened to obtain a small ersion of the standard SOIC packages. Lead counts range from 8 to 64. Body sizes are 209 and 300 mils. The SSOP package is JEDEC and EIAJ compliant. The package leads are solder plated. SSOP Small Shrink Outline Package Part Description Number of Pins Body Width Pitch Quantity Per Tube Tape Width Tape Pitch Quantity 13" Reel A-SSOP14T-5.3mm mm.65mm mm 12mm 1,000 A-SSOP16T-5.3mm mm.65mm 80 16mm 12mm 1,000 A-SSOP20T-5.3mm mm.65mm 62 16mm 12mm 1,000 A-SSOP24T-5.3mm mm.65mm 66 16mm 12mm 1,000 A-SSOP28T-5.3mm mm.65mm 47 16/24mm 12mm 1,000 A-SSOP36T-7.6mm mm.8mm 31 24mm 12mm 1,000 A-SSOP48T-7.6mm mm.635mm 30 32mm 12/16mm 1,000 A-SSOP56T-7.6mm mm.635mm 26 32mm 12/16mm 500 Notes Tube quantity may ary. Parts aailable on Tape and Reel upon special request. 209 and 300 mil body widths. JEDEC and EIAJ package outline standard compliance. High-conductiity copper leadframes. Eutectic solder plating is 85/15 Sn/Pb. Moisture sensitiity is JEDEC leel 3. Lead-free aailable with 100% Matte Sn alloy. Part Description System Amkor A-SSOP20T-5.3mm-DC-Sn Small Shrink Outline Package (100% Matte Sn) Number of Pins Daisy Chain Packaging Body Width n Add T for Tubes or TR for Tape and Reel to end of part number. n Add epad to beginning of part number when ordering ExposedPad package. n Add Sn to end of part number for Lead-Free. Pb Looking for Lead-Free? This symbol indicates that lead-free parts are aailable! Au Wire Mold Compound Die Cu Leadframe For kits see pages 93, 98, and 112. Cu Leadframe Die Attach Adhesie Die Attach Adhesie Die Attach Pad DiMold Compound Au Wire Practical Components is the exclusie distributor of Amkor Technology Mechanical Components. Die Exposed Pad Exposed Pad Note: Drawings not to scale. 62 Practical Components, Inc. klaphen@practicalcomponents.com

63 TSSOP Thin Shrink Small Outline Package The Thin Shrink Small Outline Package (TSSOP) offers smaller body sizes, smaller lead pitches and package thickness (0.9mm thick) than standard SOIC packages. Body widths are 3.0mm, 4.4mm and 6.1mm. Lead counts range from 8 to 80. This package conforms to JEDEC package outlines. TSSOP Thin Shrink Small Outline Package Part Description Number of Pins Body Width Pitch Tape Width Tape Pitch Quantity Per Tube Quantity Per Reel A-TSSOP8T-3.0mm 8 3.0mm.65mm 12mm 8mm 98 2,500 A-TSSOP8T-4.4mm 8 4.4mm.65mm 12/16mm 8mm 100 1,000/2,500 A-TSSOP10T-3.0mm mm.5mm 12mm 8mm 98 2,500 A-TSSOP14T-4.4mm mm.65mm 12/16mm 8mm 96 1,000/2,500 A-TSSOP16T-4.4mm mm.65mm 12/16mm 8mm 96 1,000/2,500 A-TSSOP20T-4.4mm mm.65mm 16mm 8/12mm 74 1,000/2,500 A-TSSOP24T-4.4mm mm.65mm 16mm 8/12mm 62 1,000/2,500 A-TSSOP28T-4.4mm mm.65mm 16mm 8/12mm 50 1,000 A-TSSOP28T-6.1mm mm.65mm 24mm 12mm 50 1,000 A-TSSOP44T-4.4mm mm.5mm 24mm 12mm 42 1,000 A-TSSOP48T-6.1mm mm.5mm 24mm 12mm 39 1,000 A-TSSOP56T-4.4mm mm.4mm 24mm 12mm 42 1,000 A-TSSOP56T-6.1mm mm.5mm 24mm 12mm 35 1,000 A-TSSOP64T-6.1mm mm.5mm N/A N/A 28 N/A A-TSSOP80T-6.1mm mm.4mm N/A N/A 28 N/A Notes 0.9mm body thickness for 4.4 and 6.1mm body widths. 0.85mm body thickness for 3.0mm body width. JEDEC package outline is standard. High conductiity copper leadframes. Very low-stress mold compound. Tube quantity may ary. Parts aailable on Tape and Reel upon request.. Lead-free aailable with 100% Matte Sn alloy. Part Description System Amkor A-TSSOP8T-3.0mm-DC-Sn Thin Shrink Small Outline Package Number of Pins Packaging (100% Matte Sn) Daisy Chain Body Width n Add T for Tubes or TR for Tape and Reel to end of part number. n Add Sn to end of part number for Lead-Free. TSSOP Package Au Wire Mold Compound Cu Leadframe For recommended kit see page 94. Die Die Attach Pad Die Attach Adhesie Practical Components, Inc. Tel: Fax:

64 SMR Lead-Free Surface Mount Resistors Surface Mount Resistors (SMR) are best suited for commercial industrial and automotie applications. Chip Resistors are suitable for a wide range of solder processes, and are ideal for high-speed electronic assembly equipment. Chip Resistor body size range from to Seeninch reels are standard, but eleen and thirteen-inch reels are aailable upon special request. Paper carrier tape is standard for Chip Resistors. In addition, Zero-Ohm Chip Resistors hae a copper wire internally. This creates a short condition. Zero-Ohm Chip Resistors can be used to check for continuity after soldering. SMR Surface Mount Resistors Lead-Free Part Description Body Size Metric Tape Tape Quantity (Inch) (mm) Width Pitch 7 Reel 01005SMR-PA-Sn-0.01 x x 0.2mm mm 2mm 20, SMR-PA-Sn-0.02 x x.03mm mm 2mm 15, SMR-PA-Sn-0.04 x x 0.5mm mm 2mm 10, SMR-PA-Sn-0.06 x x 0.8mm mm 4mm 5, SMR-PA-Sn-0.08 x x 1.2mm mm 4mm 5, SMR-PA-Sn-0.12 x x 1.6mm mm 4mm 5, SMR-PA-Sn-0.12 x x 2.6mm mm 4mm 4,000 Notes Surface mount resistors come packaged on paper carrier tape and 7" reels (larger quantities are aailable upon request). Plastic carrier tape is non-standard for surface mount resistors. The numeric section of the part number refers to the physical body size (in inches) of the component. For example: Part number 0402SMR-PA has a body size of.04" length by.02" width. Chip resistor arrays are aailable (call for aailability). Resistors are now only aailable standard lead-free with 100% Sn oer Ni. L Part Description System Body SizeinInches 0402SMR PA SurfaceMountResistor n Tape Type: PA=Paper Tape, PL=Plastic Tape. Tape Type C C W For kits see pages 90, 92, 93, 94, 98, 100, 105, 106, 107, 109, 111, and112. H d d SMR Component Dimensions Metric Inch L W H c d * Unit weight/pc / / / / / / / / / / mg / / / / mg / / / / 0.1 2mg / / / / / 0.2 5mg / / / / / mg / / / / / mg Unit: mm *Values for reference 64 Practical Components, Inc. klaphen@practicalcomponents.com

65 SMC Lead-Free Surface Mount Ceramic Capacitors Surface Mount Multilayer Ceramic (SMC) capacitors come in case sizes ranging from to The most popular case sizes are listed in the table below. Parts on tape and reel are aailable on paper tape or plastic tape. Larger size reels are aailable upon special request. Practical Components has lead-free PCB test boards aailable for the through 1206 case sizes. SMC Surface Mount Ceramic Capacitors Plastic Tape Part Description Body Size Body Size Tape Width Tape Pitch Quantity 7" Reel Lead-Free Plating 0805SMC-PL-Sn.08" x.05" 2.0 x 1.2mm 8mm 4mm 4,000 Sn 1206SMC-PL-Sn.12" x.06" 3.2 x 1.6mm 8mm 4mm 3,000 Sn 1210SMC-PL-Sn.12" x.10" 3.2 x 2.6mm 8mm 4mm 4,000 Sn 1812SMC-PL-Sn.18" x.12" 4.5 x 3.2mm 12mm 8mm 1,100 Sn 1825SMC-PL-Sn.18" x.25" 4.5 x 6.4mm 12mm 8mm 1,000 Sn SMC Surface Mount Ceramic Capacitors Paper Tape Part Description Body Size Body Size Tape Width Tape Pitch Quantity 7" Reel Lead-Free Plating 01005SMC-PA-Sn.01" x.005" 0.4 x 0.2mm 8mm 2mm 15K~20K Sn 0201SMC-PA-Sn.02" x.01" 0.6 x 0.3mm 8mm 2mm 15,000 Sn 0402SMC-PA-Sn.04" x.02" 1.0 x 0.5mm 8mm 2mm 10,000 Sn 0603SMC-PA-Sn.06" x.03" 1.6 x 0.8mm 8mm 4mm 4,000 Sn 0805SMC-PA-Sn.08" x.05" 2.0 x 1.2mm 8mm 4mm 5,000 Sn 1206SMC-PA-Sn.12" x.06" 3.2 x 1.6mm 8mm 4mm 4,000 Sn Notes Surface mount capacitors come on standard 7" reels (larger quantity reels are aailable upon request). Plastic carrier tape is non-standard for some carrier sizes. The numeric section of the part number refers to the physical body size (in inches) of the component. For example: Part number 0805SMC-PL has a body size of.08" length by.05" width. Chip capacitor arrays are aailable. Call for details. Capacitors are now only aailable standard lead-free with 100% Sn oer Ni. SnPb is aailable upon request based on aailability. Part Description System Body SizeinInches 0402SMC PA Surface Mount Ceramic Capacitor n Tape Type: PA = Paper Tape, PL = Plastic Tape L C T W X Tape Type For kits see pages 88, 105, 106 and 107. S H Y G Z Grid Placement Courtyard SMC Component Dimensions Component Dimensions L (mm) S (mm) W (mm) T (mm) H (mm) (mm) (in) Min Max Min Max Min Max Min Max Max 0603 (0201) (0402) (0603) (0805) (1206) (1210) (1812) SMC Land Pattern Dimensions Component Identifier Y (mm) C (mm) Placement Grid Z (mm) G (mm) X (mm) (mm) (in) Ref Ref (No. of Grid Elements) 0603 (0201) (0402) x (0603) x (0805) x (1206) x (1210) x (1812) x 12 Practical Components, Inc. Tel: Fax:

66 MELF Resistors Metal Electrode Leadless Face Metal Electrode Leadless Face (MELF) Resistors are round or cylindrical in shape. They are aailable in embossed plastic tape on 7" reels. The terminals on MELF resistors are force-fitted steel caps with Sn plated termination. Parts are also aailable in Zero-Ohm alue. Land pattern sizes for MELF resistors are the same as SMD chip resistor. MELF Metal Electrode Leadless Face Component Resistors Part Description Body Size Tape Width Tape Pitch Quantity (Inch) (mm) 7" Reel 0805SMR-MELF-PL-Sn.08" x.05" 2.0 x 1.27mm 8mm 4mm 3, SMR-MELF-PL-Sn.12" x.06" 3.0 x 1.5mm 8mm 4mm 2, SMR-MELF-PL-Sn.14" x.06" 3.56 x 1.5mm 8mm 4mm 3, SMR-MELF-PL-Sn.23" x.09" 5.84 x 2.29mm 12mm 4mm 1,500 Notes MELF is the acronym for Metal Electrode Leadless Face. 90/10 solder plated end caps. Suitable for reflow and wae soldering. Meets or exceeds EIAJ 8009, EIA PDP 100. Force fitted steel caps are tin plated. SnPb is aailable upon request based on aailability. Tape type is plastic. Part Description System Body Size ininches 0805SMR MELF-PL SurfaceMountResistor Tape Type Cylindrical MELF Type Carbon Film Resistor D3 Case Size Size Code Dimensions L C Min D 1 D 2 Max D 3 Max ±0.1 (0.079±0.004) 0.3 (0.012) 1.25±0.05 (0.049±0.002) 1.35 (0.053) 0.07 (0.003) ±0.2 (0.138±0.008) 1.45±0.10 (0.057±0.004) 1.55 (0.061) 0.10 (0.004) C L D1 D ±0.2 (0.126±0.008) ±0.2 (0.232±0.008) Unit: mm (Inch) 0.5 (0.02) 1.55±0.15 (0.061±0.006) 2.2±0.10 (0.087±0.004) 1.75 (0.069) 2.40 (0.094) 0.10 (0.004) 0.15 (0.006) 66 Practical Components, Inc. klaphen@practicalcomponents.com

67 SME Surface Mount Electrolytic Capacitors Surface Mount Electrolytic (SME) capacitors are measured according to the diameter of the can mounted on top of the terminations. Sizes range from 3mm to 24mm in diameter. The most popular sizes are listed below. Please call if different sizes are needed. These components come packaged on plastic embossed carrier tape. Standard reel sizes are 15". SME Surface Mount Electrolytic Capacitors Part Description Body Size Tape Width Tape Pitch Quantity 15" Reel 3mm-SME-PL-Sn 3mm 12mm 8mm 2,000 4mm-SME-PL-Sn 4mm 12mm 8mm 2,000 5mm-SME-PL-Sn 5mm 12mm 12mm 1, mm-SME-PL-Sn 6.3mm 16mm 12mm 1,000 8mm-SME-PL-Sn 8mm 16mm 12mm 1,000 10mm-SME-PL-Sn 10mm 24mm 16mm mm-SME-PL-Sn 18mm 44mm 32mm 125 Notes Surface mount electrolytic capacitors come standard on 15" reels. Components are measured by the diameter of the electrolytic can. Lead-free aailable with 100% Sn. Part Description System Body Size 3mm SME PL SurfaceMount Electrolytic Capacitor Plastic Carrier Pack Lead spacing and wire diameter Unit: mm ød L A B C W P 4 5.3± ± ± ± ± ± ± ± ± ± ± ± ± ød± Max L B±0.2 W A± ±0.2 C±0.2 P C±0.2 MELF Diodes Metal Electrode Face Components Metal Electrode Face Components (MELF) hae metallized terminals at each end of a cylindrical body. MELF components are designed to fit the same footprints as flat components i.e., 0805 (.08" x.05") and the 0603 (.06" x.03"). MELF packages are aailable on plastic tape and reel. MELF Metal Electrode Face Component Diodes Part Description Body Size Quantity 7" Reel Tape Width Tape Pitch Quantity 13" Reel SOD80-TR-Sn 1.4 x 3.4mm 2,500 8mm 4mm 10,000 SOD80 Package is also known as LL-34 or DO-213AA. SM1-TR-Sn 2.6 x 5.0mm 1,500 12mm 4mm 5,000 Package is also known as DO-213AB. Notes MELF Diodes are cylindrical glass or plastic packages with Sn termination for lead-free. Package SOD80 (LL34) SM1 (LL41) Dimension A 3.4mm 5.0mm Dimension B 1.5mm 2.8mm Part Description System Deice/Package A B SOD80 TR Tape and Reel Practical Components, Inc. Tel: Fax:

68 SMT Lead-Free Surface Mount Transistors SOT package is a rectangular surface mount transistor diode with three or more gull-wing leads. The leads are on the two length sides of the package. SOT packages are JEDEC compliant. Popular sizes are the SOT23, DPAK, SOT223 and SOT89. For kits see pages 90, 94, 98, 100, 105, 106, 108 and 111. SMT Surface Mount Transistors Part Description Number of Pins Body Size "W" Body Leads "L" SC Deice Tape Width Tape Pitch Quantity Per Reel SC90-TR-Sn 3 1.6mm 1.6mm SC-75A 8mm 4mm 3,000 SOT323-TR-Sn 3 2.0mm 2.1mm SC-70 8mm 4mm 3,000 SOT353-TR-Sn 5 2.0mm 2.1mm SC-88A / SOT325 8mm 4mm 3,000 SOT363-TR-Sn 6 2.0mm 2.1mm SC-88 / SOT326 8mm 4mm 3,000 SOT23-TR-Sn 3 2.9mm 2.4mm TO-236AB 8mm 4mm 3,000 SOT25-TR-Sn 5 2.9mm 2.8mm SC-74A 8mm 4mm 3,000 SOT26-TR-Sn 6 2.9mm 2.8mm SC-74 8mm 4mm 3,000 SOT143-TR-Sn 4 2.9mm 2.5mm TO-253AA 8mm 4mm 3,000 SOT89-TR-Sn 3 4.5mm 4.0mm SC-62 / TO-243AA 12mm 8mm 1,000 SOT223-TR-Sn 3 6.5mm 7.0mm SC-73 / TO-261AA 12mm 8mm 1,000 DPAK-TR-Sn 6.5mm 9.5mm SC-63 / TO-252-AA 16mm 8mm 2,500 D2PAK-TR-Sn 10.0mm 15.2mm TO-263AB 24mm 12mm 800/1,000 Notes Carrier pack is plastic for surface mount transistors. Tape type is plastic. Parts only aailable on Tape and Reel. Tin-Lead solder plating aailable upon request based on aailability. Lead-free aailable with 100% Sn alloy. Part Description System Transistor Package L SOT326 TR Packaging SC90 (1) (3) (2) ~ Min (1) Emitter (Source) (2) Base (Gate) (3) Collector (Drain) 1.6 W (1) 0.3 (3) 0.65 (2) SOT ~ ~0.1 (1) Emitter (Source) (2) Base (Gate) (3) Collector (Drain) Each lead has same dimensions 0.2 SOT353 (4) (5) (3) (1) (2) (5) (4) (6) SOT363 (3) (1) (2) ~ Min. Each lead has same dimensions ~ Min. Each lead has same dimensions 68 Practical Components, Inc. klaphen@practicalcomponents.com

69 SMT Lead-Free Surface Mount Transistors SOT (3) (1) (2) SOT (2) (3) (4) (1) (5) ~ Min. Each lead has same dimensions SOT (5) (6) (4) (1) (3) (2) (1) Emitter (Source) (2) Base (Gate) (3) Collector (Drain) ~ ~0.6 Each lead has same dimensions SOT ~0.1.3 ~.6 Each lead has same dimensions SOT (0.10).005(0.13) (0.08).005(0.13).037(0.94).043(1.09) SOT (1.60).067(1.70).098(2.49) Max..014(0.36).018(0.46) Top View.110(2.79).118(3.00).079(2.01) Top View.248(6.30).264(6.71) (1.80).114(2.90).122(3.10).047(1.19).051(1.30).030(0.76).033(0.84) (1) Base (Gate) (2) Collector (Drain) 0.4 (3) Emitter (Source) DPAK TO (1) (1) (2) (3) (2) 0.9 (3) C0.5 D 2 PAK.001(0.03).004(0.10) (0.23).013(0.33) B S (0.84).041(1.04).024(0.61).031(0.79) C A E V.181(4.60).130(3.30).146(3.71).091(2.31).264(6.71).287(7.29) Notes: 1. Dimensioning and tolerancing per ANSI Y14.5M, Controlling Dimension: Inch. Inches Millimeters Dim. Min. Max. Min. Max. A B C D E Min T- G 3 PL D 0.13(0.005) M T K H J G BSC 2.54 BSC H J K S V Practical Components, Inc. Tel: Fax:

70 SMTA Lead-Free Surface Mount Tantalum Capacitors Surface Mount Molded Tantalum Capacitors (SMTA) are polarized capacitors with solderable terminations. Surface Mount Tantalum packages are identified by case size i.e.: A, B, C and D. These case sizes stand for metric footprints of length and width. For example: A = 3.2 x 1.6mm; B = 3.5 x 2.8mm; C = 6.0 x 3.2mm; D = 7.3 x 4.3mm. SMTA Surface Mount Tantalum Capacitors Part Description Body Size Case Size Tape Width Tape Pitch Quantity 7 Reel 1608SMTA-PL-Sn 1.6 x.85mm R (smaller than A case) 8mm 4mm SMTA-PL-Sn 3.2 x 1.6mm A 8mm 4mm 2, SMTA-PL-Sn 3.5 x 2.8mm B 8mm 4mm 2, SMTA-PL-Sn 6.0 x 3.2mm C 12mm 8mm 500/ SMTA-PL-Sn 7.3 x 4.3mm D 12mm 8mm 500/750 Notes Components are molded, surface mount tantalums. Conformal coated tantalums are aailable. Please call for aailability of mil-spec surface mount tantalums. Standard reel size is 7" (larger sizes are aailable upon request). All tantalum capacitors are on plastic carrier tape. Tantalums are now aailable as standard lead-free with 100% Sn finish. SnPb is aailable upon request based on aailability. Part Description System Body Sizein Millimeters 3216SMTA PL SurfaceMount Tantalum Capacitor Plastic Carrier Pack C H1 H2 X W1 W2 S L T 2 Places Y G Z Grid Placement Courtyard 70 Practical Components, Inc. klaphen@practicalcomponents.com

71 PDIP Plastic Dual In-Line Package Plastic Dual In-Line Packages (PDIP) are long-established industry standard through-hole packages. Part Description Number of Pins PDIP Plastic Dual In-Line Package Body Size (body length in inches) 300 mil wide body PDIP " 50 PDIP " 25 PDIP " 25 PDIP " 21 PDIP " 18 PDIP " 15 Quantity Per Tube Daisy-Chain Aailable Notes Eutectic solder plating finish is 85% Sn/15% Pb. High conductiity copper leadframe. JEDEC standard compliant. Parts packaged in anti-static 20" tubes. Lead-free aailable with 100% Sn Matte alloy. Pitch is 100 mils. For kits see pages 93, 94, 100, 104, 106, 107, 109, 111 and 112. Part System Description Plastic Dual In-Line Package PDIP8-300-DC-Alloy Number of Pins (100% Matte Sn) Body Width (Mils) Daisy Chain Die Attach Adhesie Mold Compound Au Wire PDIP Cross-Section Cu Leadframe Die Die Attach Pad Through-Hole Glass Diodes Axial Leaded Through-hole Glass Diode package has been in use for oer 50 years in the electronics industry. The body of these parts are glass and the package is hermetically sealed. The DO prefix is a JEDEC designation for through-hole diodes. The 34 and 35 references case size. These type of components are packaged on ammo pack or bulk. In most cases, these parts are sold as training aids to teach new operators how to solder. Axial Leaded Through-Hole Glass Diode References Case Size Part Description (JEDEC) (EIAJ) (Inch) (mm) Lead Diameter DO-34 DO " x " 1.6 x 3.04mm.55mm DO-35 DO-35 SC " x " 1.85 x 4.25mm.56mm Notes Part is hermetically sealed glass package. Axial leaded (2 leads). Parts are packaged Ammo pack (5K per reel) or bulk. Lead-free aailable with 100% Sn alloy. DO-34 Part Description System Glass Diode DO-34-B Body Size n Add Ammo to end of part number for Ammo T&R. n Add B to end of part number for bulk. (1) Packaging Unit DO-35 b Max D Max G 1 Max L Min mm D L G1 (1) L b Unit b Max D Max G 1 Max L Min mm D L G1 L b Practical Components, Inc. Tel: Fax:

72 TO Through-Hole Transistors TO type components are through-hole transistors. These are basic electronic components deeloped in the last forty years. There are many additional types of TO components not listed. TO components come packaged in tubes, bulk, and tape and reel. Not all components types are aailable in all packaging styles. Please call for aailability. Parts are aailable lead-free with Sn finish. TO Through-Hole Transistors Part Description Number of Pins Case Material TO5-3-B 3 Metal TO18-3-B 3 Metal TO92-3-B 3 Plastic TO220-3-B 3 Plastic TO Maxium Leads Typ. Lead #2 2.54Typ. Lead # Minimum Lead # Lead Codes Pin SCR C G A Transistor E B C TRIAC MT1 G MT2 Dimensions: mm TO Min. EBC (1) Emitter (2) Base (3) Collector Min Part Description System Transistor Package ECB 5 (1) Emitter (2) Collector (3) Base (1) (2) (3) Dimensions: mm For kits see pages 100, 104, 106, 107, 109, 111 and 112. Number of Pins TO5 3 B TO Min Packaging ø (1) Base (1) (2) (3) (2) Collector (3) Emitter (1) (2) (3) Dimensions: mm Axial Leaded Resistors Axial Leaded Resistors are through-hole mounted components. The Practical Components part numbering system for this type of component is based on wattage ratings, i.e.; 1/2 watt = 1/2-W-AR-3.5x9.5MM. AR components are aailable in bulk, tape and reel or ammo pak. Axial Leaded Resistors Part Description Type Dimensions (mm) L C D I d 1/8-W-AR-1.6X3.7mm-TR CF 1/ ± Max 1.70 ± ± ± /4-W-AR-2.3X6.5mm-TR CF 1/ ± Max 2.30 ± ± ± /2-W-AR-3.5X9.5mm-TR CF 1/ ± Max 3.00 ± ± ± 0.05 Notes Parts are conformal coated resistors carbon film type. TR = Tape and Reel Lead-Free and Zero-Ohm alue parts aailable Part Description System Wattage Size 1/8 W AR 1.6x3.7mm TR Tape and Reel Axial Resistor Body Size Package I L ød ød For kits see pages 100, 104, 106, 107, 109, 111 and 112. C 72 Practical Components, Inc. klaphen@practicalcomponents.com

73 Practical Word Search Word Search Directions: Circle each word (hint: you ll hae to look forwards, backwards, up and down!) D X S O D T A N T A L U M S S E I U F A A V V X C M P O M T K R B I M Z U I T O O L S M T C T S D K Y A Q T Y D T L L E A A T U O L M T N E M A A T N T M R C R P O L R O C M O N O S D A I S B I T A I I P U Y P D E T A R G R E T N I S A D M P S E L H A A C A T I R U U O A I D S I G A T V L R M F F C C G Z N B R E P Q A L A R L F K N I V P T M V P O P O Y E M A N C A P A C I T O R E Y S T G E D O I D H R O T S I S E R E B C P B C E M A R F D A E L Alloy Amkor ChipArray Axial Bottom Capacitor Design Diode Dummy Fiducials Intergrated FusionQuad Leadframe MLF Laminate Package Resistor Practical SolderTraining Stacked Terminal Substrate Top PCB Components TMVPoP Tantalum PBGA Trays Matrix CVBGA Tools Practical Components, Inc. Tel: Fax:

74 CTReels Empty Carrier Tape Reels When only the physical characteristics of the tape matter, we offer empty carrier tape reels in a ariety of widths and pitches. Empty carrier tape reels are plastic embossed or paper carrier tape with sealed coer tape to simulate running parts without the cost and mess during feeder applications. CTReels are a cost saing alternatie compared to actual parts on tape. Empty Carrier Tape Reels Part Description Reel Size Tape Width Tape Pitch Standard Pocket Pockets Per Reel Tape Type 7"x8mm-CTR-PA 7" 8mm 2mm 0402SMR 10,000 Paper 4mm 0805SMR 5,000 Paper 7"x8mm-CTR-PL 7" 8mm 2mm 0402SMR 10,000 Plastic 4mm 0805SMR 5,000 Plastic 7"x12mm-CTR-PL 7" 12mm 8mm 1812SMC 1,000 Plastic 7"x16mm-CTR-PL 7" 16mm 12mm SO16-7.6mm 500 Plastic 13"x8mm-CTR-PA 13" 8mm 4mm 0805SMR 10,000 Paper 13"x8mm-CTR-PL 13" 8mm 4mm 0805SMR 10,000 Plastic 13"x12mm-CTR-PL 13" 12mm 8mm SO8-3.8mm 2,500 Plastic 13"x16mm-CTR-PL 13" 16mm 8mm SO14-3.8mm 2,500 Plastic 12mm SO16-7.6mm 1,000 Plastic 12mm SO20-7.6mm 1,000 Plastic 13"x24mm-CTR-PL 13" 24mm 16mm PLCC Plastic 20mm LQFP-12mm 750 Plastic 24mm PBGA-13mm 500 Plastic 12mm T1-TSOP32 1,000 Plastic 13"x32mm-CTR-PL 13" 32mm 16mm T1-TSOP32 1,000 Plastic 24mm PLCC Plastic 16mm T11-TSOP Plastic 20mm TBD 1,000 Plastic 13"x44mm-CTR-PL 13" 44mm 24mm LQFP-20mm 750 Plastic 32mm PBGA-23mm 250 Plastic 36mm TBD 250 Plastic 40mm TBD 200 Plastic 13"x56mm-CTR-PL 13" 56mm 40mm PBGA-35mm 250 Plastic 44mm QFP-32mm 250 Plastic 13"x72mm-CTR-PL 13" 72mm 24mm TBD 300 Plastic Notes Taped to EIA 481 standards. Reels come standard with Heat Seal Coer Tape. PSA aailable upon request (pressure sensitie adhesie) g peel back pressure for 8mm carrier tapes g peel back pressure for 12 56mm carrier tapes g peel back pressure for 72mm carrier tapes. Additional pocket types aailable upon request. Additional widths and pitches may be aailable, call for details. Plastic carrier tape is standard. Paper carrier tape is special order. Part Description System Reel Size and 7"x8mm-CTR PA Tape Width CarrierTape Reel n Tape Type: PA = Paper, PL = Plastic Label Tape Type Top Coer Tape Sprocket Hole Caity Carrier Tape 74 Practical Components, Inc. klaphen@practicalcomponents.com

75 Tape and Reel Specifications Part Description Tape Width Tape Pitch Reel Size Qty Per Reel Tape Type 01005SMR-PA 8mm 2mm 7" 20,000 Paper 0201SMR-PA 8mm 2mm 7" 10,000 Paper 0402SMR-PA 8mm 2mm 7" 10,000 Paper 0603SMR-PA 8mm 4mm 7" 5,000 Paper 0805SMR-PA 8mm 4mm 7" 5,000 Paper 1206SMR-PA 8mm 4mm 7" 5,000 Paper 1210SMR-PA 8mm 4mm 7" 5,000 Paper 0201SMC-PA 8mm 2mm 7" 15,000 Paper 0402SMC-PA 8mm 2mm 7" 10,000 Paper 0603SMC-PA 8mm 4mm 7" 4,000 Paper 0805SMC-PA 8mm 4mm 7" 4,000 Paper 1206SMC-PA 8mm 4mm 7" 4,000 Paper 0805SMC-PL 8mm 4mm 7" 4,000 Plastic 1206SMC-PL 8mm 4mm 7" 3,000 Plastic 1210SMC-PL 8mm 4mm 7" 3,000 Plastic 1812SMC-PL 12mm 8mm 7" 1,000 Plastic 1825SMC-PL 12mm 8mm 7" 1,000 Plastic 3mm-SME-PL 12mm 8mm 13" 2,000 Plastic 4mm-SME-PL 12mm 8mm 13" 2000 Plastic 5mm-SME-PL 12mm 12mm 13" 1,000 Plastic 6.3mm-SME-PL 16mm 12mm 13" 1,000 Plastic 8mm-SME-PL 16mm 12mm 13" 1,000 Plastic 10mm-SME-PL 24mm 16mm 13" 500 Plastic 18MM-SME-PL 44mm 32mm 13" 125 Plastic 3216SMTA-PL 8mm 4mm 7" 2,000 Plastic 3528SMTA-PL 8mm 4mm 7" 2,000 Plastic 6032SMTA-PL 12mm 8mm 7" 500 Plastic 7343SMTA-PL 12mm 8mm 7" 500 Plastic SC90-TR (supermini) 8mm 4mm 7" 3,000 Plastic SOT323-TR 8mm 4mm 7" 3,000 Plastic SOT353-TR 8mm 4mm 7" 3,000 Plastic SOT363-TR 8mm 4mm 7" 3,000 Plastic SOT23-TR 8mm 4mm 7" 3,000 Plastic SOT25-TR 8mm 4mm 7" 3,000 Plastic SOT26-TR 8mm 4mm 7" 3,000 Plastic SOT143-TR 8mm 4mm 7" 3,000 Plastic SOT89-TR 12mm 8mm 7" 1,000 Plastic SOT223-TR 12mm 8mm 7" 1,000 Plastic DPAK-TR 16mm 8mm 13" 2,500 Plastic D2PAK-TR 24mm 12mm 13" 800/1,000 Plastic SO8GTR-3.8mm 12mm 8mm 13" 2,500 Plastic SO14GTR-3.8mm 16mm 8mm 13" 2,500 Plastic SO16GTR-3.8mm 16mm 8mm 13" 2,500 Plastic SO16GTR-7.6mm 16mm 12mm 13" 1,000 Plastic SO20GTR-7.6mm 24mm 12mm 13" 1,000 Plastic SO28GTR-7.6mm 24mm 12mm 13" 1,000 Plastic SO28JTR-7.6mm 24mm 12mm 13" 1,000 Plastic SSOP8TR-5.3mm 12mm 8mm 13" 2,500 Plastic SSOP14TR-5.3mm 16mm 12mm 13" 1,000 Plastic SSOP16TR-5.3mm 16mm 12mm 13" 1,000 Plastic SSOP20TR-5.3mm 16mm 12mm 13" 1,000 Plastic SSOP24TR-5.3mm 16mm 12mm 13" 1,000 Plastic SSOP28TR-5.3mm 16/24mm 12mm 13" 1,000 Plastic SSOP48TR-7.6mm 32mm 12/16mm 13" 1,000 Plastic SSOP56TR-7.6mm 32mm 12/16mm 13" 500 Plastic TSSOP8TR-3.0mm 12mm 8mm 13" 2,500 Plastic TSSOP8TR-4.4mm 12/16mm 8mm 13" 1,000/2,500 Plastic TSSOP10TR-3.0mm 12mm 8mm 13" 2,500 Plastic TSSOP14TR-4.4mm 12/16mm 8mm 13" 1,000/2,500 Plastic TSSOP16TR-4.4mm 12/16mm 8mm 13" 1,000/2,500 Plastic TSSOP20TR-4.4mm 16mm 8/12mm 13" 1,000/2,500 Plastic TSSOP24TR-4.4mm 16mm 8/12mm 13" 1,000/2,500 Plastic Part Description Tape Width Tape Pitch Reel Size Qty Per Reel Tape Type TSSOP28TR-4.4mm 16mm 8/12mm 13" 1,000 Plastic TSSOP28TR-6.1mm 24mm 12mm 13" 1,000 Plastic TSSOP32TR-6.1mm 24mm 12mm 13" 1,000 Plastic TSSOP38TR-4.4mm 16mm 8/12mm 13" 1,000 Plastic TSSOP38TR-6.1mm 24mm 12mm 13" 1,000 Plastic TSSOP44TR-4.4mm 24mm 12mm 13" 1,000 Plastic TSSOP48TR-4.4mm 16mm 8mm 13" 1,000 Plastic TSSOP48TR-6.1mm 24mm 12mm 13" 1,000 Plastic TSSOP56TR-4.4mm 24mm 12mm 13" 1,000 Plastic TSSOP56TR-6.1mm 24mm 12mm 13" 1,000 Plastic T1-TSOP28-8.1x11.8mm-.55mm 24mm 12mm 13" 1,000 Plastic T1-TSOP28/32-8x18.4mm-.5mm 32mm 12/16mm 13" 1,000 Plastic T1-TSOP32-8x18.4mm-.5mm 32mm 12/16mm 13" 1,000 Plastic T1-TSOP40-10x18.4mm-.5mm 32mm 16mm 13" 1,000 Plastic T1-TSOP48-12x18.4mm-5mm 32mm 16mm 13" 1,000 Plastic T11-TSOP20/26-7.6x17.4mm-1.27mm 24mm 12mm 13" 1,000 Plastic T11-TSOP24/ x18.41mm mm 16mm 13" 1,000 Plastic T11-TSOP x20.95mm-1.27mm 32mm 16mm 13" 1,000 Plastic T11-TSOP40/ x18.42mm-.8mm 32mm 16mm 13" 1,000 Plastic T11-TSOP x18.42mm-.8mm 32mm 16mm 13" 1,000 Plastic T11-TSOP44/ x20.95mm-.8mm 32mm 16mm 13" 1,000 Plastic T11-TSOP x20.95mm-.8mm 32mm 16mm 13" 1,000 Plastic T11-TSOP x22.22mm-.8mm 44mm 16mm 13" 1,000 Plastic T11-TSOP x22.22mm-.5mm 44mm 16mm 13" 1,000 Plastic T11-TSOP X22.22mm-.65mm 44mm 16mm 13" 1,000 Plastic PLCC20TR 16mm 12mm 13" 1,000 Plastic PLCC28TR 24mm 16mm 13" 750 Plastic PLCC32TR 24mm 16mm 13" 750 Plastic PLCC44TR 32mm 24mm 13" 450 Plastic PLCC52TR 32mm 24mm 13" 450 Plastic PLCC68TR 44mm 32mm 13" 230/250 Plastic PLCC84TR 44mm 36mm 13" 250 Plastic QFP-10mm sq. 24mm 24mm 13" 500 Plastic QFP-14mm sq. 32mm 24mm 13" 350 Plastic QFP-14x20mm 44mm 32mm 13" 500 Plastic QFP-28mm sq. 44mm 40mm 13" 200 Plastic QFP-32mm sq. 56mm 44mm 13" 200 Plastic LQFP/TQFP- 5mm sq. 16mm 12mm 13" 1,000 Plastic LQFP/TQFP- 7mm sq. 16mm 12mm 13" 1,000 Plastic LQFP/TQFP- 10mm sq. 24mm 16/24mm 13" 1,000 Plastic LQFP/TQFP- 12mm sq. 24mm 20/24mm 13" 1,000 Plastic LQFP/TQFP- 14mm sq. 32mm 24mm 13" 750 Plastic LQFP/TQFP- 14x20mm 44mm 32mm 13" 500 Plastic LQFP/TQFP- 20mm sq. 44mm 24mm 13" 500 Plastic LQFP/TQFP- 24mm sq. 44mm 32mm 13" 500 Plastic PBGA-13mm sq. 24mm 24mm 13" 500 Plastic PBGA-15mm sq. 24mm 24mm 13" 500 Plastic PBGA-17mm sq. 24mm 24mm 13" 500 Plastic PBGA-23mm sq. 44mm 32mm 13" 250 Plastic PBGA-27mm sq. 44mm 32mm 13" 250 Plastic PBGA-35mm sq. 56mm 40mm 13" 250 Plastic CTBGA/CABGA-5mm sq. 12mm 8mm 13" 1,000 Plastic CTBGA/CABGA-6mm sq. 16mm 8mm 13" 1,000 Plastic CTBGA/CABGA-7mm sq. 16mm 12mm 13" 1,000 Plastic CTBGA/CABGA-8mm sq. 16mm 12mm 13" 1,000 Plastic CTBGA/CABGA-9mm sq. 16mm 12mm 13" 1,000 Plastic CTBGA/CABGA-10mm sq. 24mm 12mm 13" 1,000 Plastic CTBGA/CABGA-11mm sq. 24mm 16mm 13" 1,000 Plastic CTBGA/CABGA-12mm sq. 24mm 16mm 13" 1,000 Plastic CTBGA/CABGA-14mm sq. 24mm 24mm 13" 500 Plastic CTBGA/CABGA-17mm sq. 24mm 24mm 13" 500 Plastic Practical Components, Inc. 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76 Custom PC Practice Boards and Kits Design Custom PC Practice Boards Or Complete Kits To Meet Your Specific Requirements. Practical Components will help you design custom practice PC boards or complete kits. Use the building blocks below to create your board and start saing time and money using dummy parts and a PCB practice kit. Please contact your serice representatie for more information. Practical PC boards are non solder mask defined. Software and Data Files Included With All Kits! Board Material FR4 (140 Tg) Polyimide FR5 BT IS Tg Board Size/Thickness 4" x 5.5" (standard) 2.5" x 2.5" 3" x 3" 8" x 5.5".062" thick (2 layers) Other Fiducials/Tooling Holes Fiducials are used to orient the position of each indiidual component to populate the board Tooling holes are.125" diameter Doughnut (local and global) LPI/Solder Mask LPI is a photo liquid imageable solder mask that will not interfere with solder paste screen printing Stencil Metal mask stencil is used for solder printing, which is aailable for custom or Practical board. Stencils manufactured by Soldermask, Inc. Gerber Data Software data used to create a metal mask stencil for solder paste application X, Y and Theta Data Software used to calibrate pick and place machines for placement of components to PCB Surface Pad Finishes HASL Pb Free HASL IMSN (Immersion Tin) IMAG (Immersion Siler) ENIG (Immersion Gold oer Electroless Nickel) OSP (ENTEK CU-106A HT) Deliery Standard deliery is estimated 6 to 8 weeks Expedited deliery is aailable Capacitor QFP Transistor TSOP SOIC BGA PLCC Tantalum Parts for PC Board Resistor LQFP CABGA SBGA TQFP MLF TSSOP SSOP CTBGA CVBGA Dual Row MLF tscsp PoP Other Final Product PCB Practice Kit 76 Practical Components, Inc. klaphen@practicalcomponents.com

77 CircuitCAM Software Rapidly prepare off-line machine programs and color-coded assembly documentation from CAD or Gerber data. Practical Components goal is to proide alue to our customers by saing time when setting up board test runs. Our partnership with Aegis Industrial Software proides our customers digitized data files for use with Practical s complete line of PCB test boards. Using Aegis CircuitCAM software, customers sae an enormous amount of time when setting up both manual stations and automated equipment. Customer support for installation and use of CircuitCAM and CheckPoint is proided directly by Aegis. Please call your Practical sales representatie to request additional information. Software and Data Files Included With All Kits! BOM Machine Programs CAD/GERBER Visual Aids/Instructions Virtual Factory Modeling Create a graphical routing of your plant s assets and the processes performed at each step. Each point in this routing is associated to a user-defined documentation layout (template) and to a machine programming interface gateway. Model your entire discrete assembly process flow, from prep, assembly, inspection, test, and final assembly; out through packout and shipping. Total and Simplified CAD Support Import board location data from CAD, Gerber, scanned boards, and from select machine sources. Import for any CAD type takes a single click. Knowledge of CAD formats is not required. Visual Documentation Expedite documentation deelopment for both circuit board and mechanical assemblies with drawing templates, automatic color coding, cropping, annotation, OLE, clipboard, and multimedia. CircuitCAM is the fastest tool to proide operators with the documents they need to do their jobs effectiely. Machine Programming CircuitCAM supports irtually all process, assembly, and inspection systems. Through an industry leading network of oer 25 machine OEM partnerships, AEGIS offers comprehensie and user-friendly off-line programming for all types of SMT and through-hole insertion equipment. All Practical Components kits come with: CircuitCAM is an integral component to Aegis Fusion system, a scalable suite of NPI and MES Solutions. Other integrated manufacturing tools include: n CheckPoint BOM Importing and Reision Control n Web-based Paperless Documentation n Web-based Work In Process (WIP) Tracking n Web-based Quality Data Collection and Analysis n Web-based Line Monitoring and Superisory Dashboard n Web-based Materials Setup Verification and Control n Aegis DataMiner Ad hoc data analysis, charting & reporting n Demonstration ersions of CircuitCAM and Checkpoint n Ready-to-run CircuitCAM Project Files (CPFs) n BOM, Gerber, GenCAD, and XY Centroid Files n Assembly Documentation Samples and Templates n Installation Instructions and User Manuals For assistance with the installation and use of CircuitCAM and Checkpoint, please contact an Aegis sales representatie at: Aegis Industrial Software sales@aiscorp.com (215) (phone) (215) (fax) Practical Components, Inc. Tel: Fax:

78 Kit Identifier Component Part Numbers / Kit Numbers Kit Part Description Component Part Description PC000 PC003 PC007 PC008 PC009 PC011 SABER PC012 PC013 PC014 PC015 PC016-J-STD-E PC020 PC031 WTK-1 PC049 PC052 PC200-12mm PC200-14mm PC250-14mm-TMV-DT PC200-15mm-TC PC200-15mm-DT PC300-FQ216-DT PC300-FQ173-TC PC2009 SIR 01005SMR-PA SMR-PA 0201SMR-PA SMC-PA 0402SMR-PA SMC-PA 0603SMR-PA SMC-PA 0805SMR-PA-0 1/2-W-AR-3.5x9.5mm-TR 1/4-W-AR-2.3x6.5mm-TR 1206SMC-PA 1206SMR-Melf 1206SMR-PA SMR-PA SMTA-PL 68LCC A-CABGA36-.8mm-6mm-DC A-CVBGA97-.4mm-5mm-DC A-CABGA mm-DC A-CVBGA360-.4mm-10mm-DC A-CVBGA432-.4mm-13mm-DC A-DualRowMLF156-12mm-.5mm-DC A-CTBGA84-.5mm-7mm-DC A-CTBGA228-.5mm-12mm-DC A-MLF8-3mm-.65mm-DC A-MLF16-5mm-.8mm-DC A-MLF20-5mm-.65mm-DC A-MLF28-7mm-.8mm-DC A-MLF32-7mm-.65mm-DC A-MLF44-7mm-.5mm-DC A-MLF48-7mm-.5mm-DC A-MLF68-10mm-.5mm-DC A-PBGA mm-35mm-DC A-PBGA mm-15mm-DC A-PBGA mm-15mm-DC A-PBGA mm-17mm-DC A-PBGA mm-15mmDC A-PBGA mm-17mm-DC A-PBGA mm-17mm-non DC A-PBGA mm-23mm-DC A-PBGA mm-23mm-DC A-PBGA mm-23mm-DC A-PBGA mm-23mm-DC A-PBGA mm-17mm-DC A-PBGA mm-27mm-DC A-PBGA mm-27mm-DC A-PBGA mm-23mm-DC A-PBGA mm-27mm-DC 78 Practical Components, Inc. klaphen@practicalcomponents.com

79 Kit Identifier Component Part Numbers / Kit Numbers Kit Part Description Component Part Description PC000 PC003 PC007 PC008 PC009 PC011 SABER PC012 PC013 PC014 PC015 PC016-J-STD-E PC020 PC031 WTK-1 PC049 PC052 PC200-12mm PC200-14mm PC250-14mm-TMV-DT PC200-15mm-TC PC200-15mm-DT PC300-FQ216-DT PC300-FQ173-TC PC2009 SIR A-PBGA mm-31mm-DC A-PBGA mm-27mm-DC A-PBGA mm-23mm-DC A-PBGA mm-31mm-DC A-PBGA mm-35mm-DC A-PBGA mm-27mm-DC A-PBGA mm-35mm-DC A-PBGA mm-27mm-DC A-PBGA mm-27mm-DC A-PBGA mm-35mm-DC A-PBGA mm-27mm-DC A-PBGA mm-35mm-DC A-PoP mm-12mm-DC-LF A-PoP mm-14mm-DC-LF A-PoP mm-15mm-DC-LF A-PSfBGA mm-DC-LF A-PSfBGA mm-DC-LF A-PSfBGA mm-DC-LF A-TMVPoP200-.5mm-14mm-DC-LF A-TMVPSfBGA620-.4mm-14mm-DC-LF A-T1-TSOP32-8x20mm-.5mm A-TSSOP20T-4.4mm A-(V)FQFP176(128/48)-14mm-.4-DC-Sn A-(V)FQFP216(100/116)-14mm-.5-DC-Sn Axial Electrolytic, 5x11 BQFP mm-.636mm CKO5 Conn-SMT Conn-TH-Horizontal Conn-TH-Vertical DIP14 DIP16 DIP20-DC DO35 DPAK(TO252) LQFP80-10mm-.4mm LQFP100-14mm-.5mm-2.0mm LQFP120-14mm-.4mm-2.0 LQFP160-24mm LQFP176-24mm-.5mm-2.0mm LQFP44-10mm-.8mm-2.0 LQFP64-7mm-.4mm-2.0 LQFP144-20mm-.5mm-2.0 Mono Capacitor -.200" lead space PB08-200x200 Flip Chip PBGA mm-23mm-DC PLCC20 PLCC28 PLCC44 Practical Components, Inc. Tel: Fax:

80 Kit Identifier Component Part Numbers / Kit Numbers Kit Part Description Component Part Description PC000 PC003 PC007 PC008 PC009 PC011 SABER PC012 PC013 PC014 PC015 PC016-J-STD-E PC020 PC031 WTK-1 PC049 PC052 PC200-12mm PC200-14mm PC250-14mm-TMV-DT PC200-15mm-TC PC200-15mm-DT PC300-FQ216-DT PC300-FQ173-TC PC2009 SIR PLCC68 PLCC68-DC QFP100-14x20mm-.65mm-3.2mm QFP100-14x20mm-.65mm-3.9mm-DC QFP160-28mm-.65mm QFP208-28mm-.5mm-2.6mm QFP208-28mm-.5mm-2.6mm-DC QFP256-28mm-.4mm-2.6mm-DC QFP64-14mm-.8mm-3.9mm QFP44-10mm-.8mm-3.2mm QFP44-10mm-.8mm-3.9mm QFP48-12mm-.8mm-3.3mm QFP52-10mm-.65mm-3.9mm SO8-3.8mm SO14-3.8mm SO16-3.8mm SO16-5.6mm SO16-7.6mm-DC SO18G-7.6mm SO20-7.6mm SO44G-13.3mm SOD80 SOT143-TR SOT23-TR Spacer, CKO5 SSOP14T-5.3mm SSOP16-3.8mm SSOP20T-5.3mm-DC SSOP20T-5.3mm SSOP28T-5.3mm SSOP8T-5.3mm Sticky Tape (double sided) T05 T11-TSOP X22.22mm-.8mm T11-TSOP X18.42mm-.8mm Terminal Holder Board, TB1 Terminal, Bifurcated Terminal, Gold Cup Terminal, Hook Terminal, Pierced Terminal, Turret TO18 TO5/18 Spacer TQFP80-12mm-.5mm Wire, 20 guage Wire, 22 guage Wire, 26 guage 80 Practical Components, Inc. klaphen@practicalcomponents.com

81 Single Pack Hand Solder Kits The kits listed below are for Hand Assembly. Each kit is prepackaged as an indiidual kit. Each component is bagged and labeled for identification. The test board is also indiidually bagged. Both kit and test board are put in a cardboard box that identifies the kit contents. Kits can be customized to meet specific needs. Please call regarding aailability of Lead-Free single pack soldering kits. Reference List for Single Pack Kits Part Number Tin-Lead / Lead-Free Kit Part Description Description IPC Reference Page Number / PC003 Hand Solder Kit, 2.5" square / PC007T-0-01 MLF Hand Assembly Kit / PC007B-0-01 SMT Hand Assembly Kit (T/LQFP, TSOP, BGA, DualRowMLF) / PC007K-0-01 MLF / Fine Pitch SMT (top and bottom) / PC009 Mixed Technology Kit / PC Fine Pitch BGA Kit (0.4, 0.5, 1.0mm) / PC Global BGA Test Kit (1.0mm and 1.27mm pitch) / PC012T-0-01 Global BGA Test Kit (topside only, 1.0mm pitch) / PC012B-0-01 Global BGA Test Kit (bottomside only, 1.27mm pitch) / PC013-K Through Hole Kit (with wires and terminals) / PC013-BTK Through-Hole Kit (no wires or terminals) / PC013-RWTK-1 Recertification Kit (with wires and terminals) / PC013-RK Recertification Kit (no wires or terminals) / PC STD Rework Kit (unassembled) 7711/ / PC RWK Rework Kit (assembled) 7711/ / PC016-J-STD Mixed Tech Kit J-Std-001 Re E / WTK-1 Wires and Terminals (with or without holder) 91 Software and Data Files Included With All Kits! Pb Looking for Lead-Free? This symbol indicates that lead-free parts are aailable! Practical Components, Inc. Tel: Fax:

82 IPC/WHMA-A620 Wire Harness Kit Compliant Wire Harness Kit NEW! The New A620 kit from Practical Components is designed to help companies meet industry standards for cable and wire harness assembly criteria. The A620 kit enables hands on training in the following areas of wire harness assembly. Wire preparation, soldering to terminals, ultrasonic welding, splicing connectors, molding, marking coax/twinac cables with terminations. The A620 kit comes with the recommended materials and tools required to become proficient with the IPC/WHMA-A-620 standard. Each kit is indiidually packaged with all items labeled. Please call for additional information regarding this kit. 82 Practical Components, Inc.

83 Conformal Coating Process Flow Chart Dummy Components And PCB Test Boards For Cleanliness And Conformal Coating Process Testing Practical Components proides products and serices for the testing and ealuation of Conformal Coating materials on assembled PCB test boards. Conformal coating has proided many benefits to high and reliability industries as well as commercial off the shelf products being used in extreme enironments. Changes in technology hae caused conformal coating to become more prealent in different industries like telecommunications, automotie, and other hand held deices. All these products hae befitted from the use of coatings for enironmental protection and product enhancements. Capacitor QFP Transistor TSOP SOIC BGA PLCC Tantalum Parts for PC Board Resistor LQFP CABGA SBGA TQFP MLF TSSOP SSOP CTBGA CVBGA Dual Row MLF tscsp PoP Other Board Material FR4 (140 Tg) Polyimide Fr5 BT IS Tg Board Size/Thickness 4" x 5.5" (standard) 2.5" x 2.5" 3" x 3" 8" x 5.5".062" thick (2 layers) Other Gerber Data Software data used to create a metal mask stencil for solder paste application X, Y and Theta Data Software used to calibrate pick and place machines for placement of components to PCB Surface Pad Finishes HASL Pb Free HASL IMSN (Immersion Tin) IMAG (Immersion Siler) ENIG (Immersion Gold oer Electroless Nickel) OSP (ENTEK CU-106A HT) Customer Option 1 Ship Unassembled parts and boards. Customer Option 2 Manage Component and board assembly. Deliery Standard deliery is estimated 6 to 8 weeks Expedited deliery is aailable Practical Components products can be effectie in the following areas: n Is conformal coating necessary? n Clean or no clean n SIR testing n Coating process options n Coating reliability n Coating material ealuation n Correct design for costing application n Masking options n Inspection and quality control of coating n Repair and rework of PCB assemblies The products and serices proided by Practical Components in support of the ealuation items listed aboe are: n Dummy Components including IC, Passies, transistors, connections or special items as requested n Test PCB dummy boards, made to any size, thickness, material, or special requirements as requested n Assembly of dummy components to the test PCB boards n Design of the PCB board to customer s exact specifications n Management of the procurement process and supply chain All Practical Components supplies products are fully guaranteed. Our products are made to the exact equialent of lie components, without the internal lie die or electrically functioning board. This significantly lowers the cost of the components and test boards. Practical Components can be one stop shop from board design and layout to completed assemblies read for coating. You can be focused on the coating not the logistical chain of acquiring testing assemblies. Practical Components, Inc. Tel: Fax:

84 Test Boards for Cleanliness and Conformal Coating Practical Components offers the following PCB Test boards for printed wiring assemblies materials for process qualification ealuations. Practical Components Test Coupon Board Aailability Cu HASL ImAg ENIG PCB052 CRET board X X X PCB-B-24 Standard Test Board X X X PCB-B-25A Standard Test Board X X X PCB-B-36 Standard Test Assembly X X X PCB-SIR Test Board X X X X PCB-Saber Ealuation Test Board X X X X PCB015 Rework Test Board X X X PCB052 CRET Board H H The Practical Components B-52 CRET (Cleanliness & Residue Ealuation Test) board is designed to help determine the ionic cleanliness of a customers manufacturing process. The test board follows guidelines associated with the IPC-B-52 Test Vehicle. There are seeral different ways to measure residues and their effects on electrical performances, the two most common in the industry are ionic cleanliness testing, for determination of ionic residues, and surface insulation resistance (SIR) testing, for the ealuation of electrochemical failures in humid enironments. Of the arious methods for determination of ionic residues, the method of choice is ion chromatography, which determines both the type of ionic residue and the amount of the residue. The IPC method for ion chromatography is IPC-TM-650, method For SIR testing, the most modern test method, inoling frequent of continuous monitoring, is IPC-TM-650, method Consequently, a test ehicle was needed which could be used for both ion chromatography and surface insulation resistance testing, but which was more representatie of mainstream manufacturing materials and process. 84 Practical Components, Inc. klaphen@practicalcomponents.com

85 Test Boards for Cleanliness and Conformal Coating PCB-B-24 PCB-B-24 Standard Test Board The PCB-B-24 standard test board is compliant with the IPC Phase 3 cleaning and cleanliness test program. It was designed to be a ehicle for examining the interactions between laminate, surface metalizations, and fluxes. It is the primary qualification ehicle for ANSI J-STD-004, which is the IPC specification on fluxes. The four comb patterns are identical and hae 16 mil lines and 20 mil space. These alues were chosen both for ease of stencil printing solder paste, and the board can be wae soldered with minimal chance of solder bridging. The PCB-B-24 test board is an excellent ehicle for narrowing down fluxes or solder material, or testing material interaction. PCB-B-25A PCB-B-25A Standard Test Board The PCB-B-25A test board meets the current guidelines for solder Masks (IPC-SM-804C) and conformal coatings (IPC-CC-830A). The board is normally 0.062" FR-4. The board is simple print-and-etch. The surface is bare copper for materials qualification, but could be any Surface finish required. The PCB-B-25A is used to ealuate interactions between solder masks, solder paste, and fluxes. PCB-B-36 Standard Test Assembly PCB-B-36 The PCB-B-36 standard test board was designed for the IPC cleaning cleanliness test program, Phase 1. It was designed for examining the ability of a cleaning solent to remoe flux residues, and to examine the effects of entrapped residues under low standoff components. The PCB-B-36 test board can be used as a process qualification ehicle for the J-STD-001. This board has 10 SIR test patterns. Two patterns #2 and #4 are mounting pads in quadrants C and D. The pad spacing is 25 mils for patterns #2 and #4. The contact fingers of the board are normally gold plated for compatibility with edge card connectors. The remaining metallization is normally bare copper, or any surface finish. In most cases, four leadless ceramic chip carriers (LCCs) are mounted on the board, one in each quadrant. This test ehicle is designed to test combinations of conformal coatings, fluxes, solder paste and their interactions with each other. Testing cleaning residue under low stand off components is a benefit of the PCB-B-36 test board. Practical Components, Inc. Tel: Fax:

86 Test Boards for Cleanliness and Conformal Coating Practical Components SIR Test Board The Practical Components SIR board is a double sided board to characterize fluxes by determining the degradation of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. The board contains pads for LCC68 and A-PBGA mm-17mm components. Boards and kits are aailable in Tin-Lead or Lead-Free. Practical Components Saber Board The SABER ealuation board can be used to ealuate pick and place equipment, reflow process, component, cleanliness and solder paste screening. The SABER board also has honeycomb patterns for SIR testing. Board finishes include ImAg, ENIG and Pb-Free HASL. Standard board material is IS-410. Practical Components PC015 Assembled Test Board Aailable Pre-Assembled, this board is the ideal ehicle for Off the shelf Conformal Coating testing. Pre-Populated with a ariety of component types, from LQFPs and CABGAs, DIPs down to 0603 chips this board offers a real-world conformal coating testing surface and gies standardized and repeatable results. The PC015 is aailable in Tin-Lead or Lead-Free ersions. The PC015 and components can also be deliered unassembled or partially assembled, example: only the surface mount components mounted on the board. Practical Components also specializes in designing PCB test boards made to size, thickness, material or specified requirements as requested. Practical can also manage the procurement process and supply chain, including assembly and application of materials. Practicals PC015 Rework Kit conforms to IPC 7711/7721 standards or reworking. 86 Practical Components, Inc. klaphen@practicalcomponents.com

87 REVISED [Re. A] SIR Test Board and Kit The Practical SIR board is double sided board to characterize fluxes by determining the degradation of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. This test is carried out at height humidity and heat conditions. The board contains pads for LCC68 and A-PBGA mm-17mm components. Kit is aailable Tin-Lead or Lead-Free (see note.) SIR Test Board Standard finish is ImAg. IS-410 board material. Order Number: PCB-SIR (Board Only) Notes Gerber and X, Y Theta data included at no charge. PBGA is aailable Lead-Free with SAC305 or SAC405 solder ball alloy s. LCC is only aailable with Au castellations which is standard. SIR Kits Part Description Quantity Per 1 Kit Quantity Per 5 Kits Quantity Per 10 Kits 68LCC-1.27mm-24.1mm A-PBGA mm-17mm-DC Kit Order Number: (Tin-Lead) SIR-0-01 SIR-0-05 SIR-0-10 Kit Order Number:(Lead-Free) SIR-0-01-LF SIR-0-05-LF SIR-0-10-LF Practical Components, Inc. Tel: Fax:

88 B-52 CRET Cleanliness & Residue Ealuation Test Kits The New Practical Components B-52 CRET (Cleanliness & Residue Ealuation Test) Kit is designed to help determine the ionic cleanliness of a customers manufacturing process. The test boards and components follow guidelines associated with the IPC-B-52 Test Vehicle. There are seeral different ways to measure residues and their effects on electrical performances, the two most common in the industry are ionic cleanliness testing, for determination of ionic residues, and surface insulation resistance (SIR) testing, for the ealuation of electrochemical failures in humid enironments. Of the arious methods for determination of ionic residues, the method of choice is ion chromatography, which determines both the type of ionic residue and the amount of the residue. The IPC method for ion chromatography is IPC-TM-650, method For SIR testing, the most modern test method, inoling frequent of continuous monitoring, is IPC-TM-650, method Consequently, a test ehicle was needed which could be used for both ion chromatography and surface insulation resistance testing, but which was more representatie of mainstream manufacturing materials and processes. The IPC B 52 Test Vehicle was the result. The Practical B-52 CRET test ehicle is diided into four primary segments: 1. The main SIR test board 2. The Ion Chromatography (IC) test coupon 3. The solder mask adhesion coupons 4. The SIR mini-coupons Additional technical information specifications and guidelines can be found on the Practical Components web site at Practical Components proides the test ehicles, components, Gerber files, and Aegis Circuit Cam files. If the goal of testing is to do an engineering ealuation of the manufacturing process, then stock IPC-B-52 boards can be used, but should be as representatie as possible. If the goal of the testing is process qualification, per J-STD-001 or IEC , then the test ehicles should be procured from the customers existing PCB endor using the same material set as for manufactured hardware. Customers should note that Practical will offer both Tin-Lead and Lead Free ersions of the PCB052 B-52 CRET Kit. B-52 CRET Kit Figure ID Location Part Description Quantity Per Board 3 U1, U9 A-CABGA mm-17mm-ISO 2 6 U2, U8 A-QFP160-28mm-.65mm-ISO 2 7 U3, U10 A-TQFP80-12mm-.5mm-ISO 2 9 U4-U7 A-SO16GT-3.8mm-ISO 4 2 C1-C8, C64-C SMC-0.01UF 20 8 C9-C SMC-0.01UF 15 5 C24-C38, C76-C SMC-0.1UF C39-C SMC-10UF 25 1 J2 Conn-TH-Hor-4x24-AMP 1 11 J1, J3 Conn-TH-Ver-4x24-AMP 2 4 P1 Conn-SMT-2x16-Molex 1 Note Lead-Free Part Number List Part Number Part Description A-CABGA mm-17mm-ISO-SAC A-QFP160-28mm-.65mm-2.6mm-ISO-SN A-TQFP80-12mm-.5mm-2.0mm-ISO-Sn A-SO16GT-3.8mm-ISO-Sn SMC-0.01UF-Sn SMC-0.01UF-Sn SMC-0.1UF-Sn SMC-10UF-Sn Conn-TH-Hor-4x24-AMP Conn-TH-Ver-4x24-AMP Conn-SMT-2x16-Molex n Connector J2 has oerhang tabs which interfere with the manufacturing rails. In its place, a third ertical connector (J1, J3) can be used. Tin-Lead Part Number List Part Number Part Description A-CABGA mm-17mm-ISO A-QFP160-28mm-.65mm-2.6mm-ISO A-TQFP80-12mm-.5mm-2.0mm-ISO A-SO16GT-3.8mm-ISO SMC-0.01UF SMC-0.01UF SMC-0.1UF SMC-10UF Conn-TH-Hor-4x24-AMP Conn-TH-Ver-4x24-AMP Conn-SMT-2x16-Molex Board Order Number: PCB Practical Components, Inc. klaphen@practicalcomponents.com

89 B-52 CRET Cleanliness & Residue Ealuation Test Kits H H Standard board finish is Immersion Siler, ENIG and HASL. S-410 board material. Board size: 3.950" x 10.04". Practical Components, Inc. Tel: Fax:

90 SMTA Saber Ealuation Board and Kit Tin-Lead or Lead-Free Aailable! The SMTA Saber Ealuation Kit. Practical Components is licensed by SMTA to distribute the Saber Ealuation PC Board. The Saber Board includes land patterns for a wide ariety of JEDEC and EIAJ components. The Saber Board is used to ealuate: P&P equipment Reflow process Component placement accuracy Cleanliness Speed and accuracy of component placement Solder paste screening Notes Gerber Data and X, Y Theta Data are aailable if required at no charge. Digitized files proided by Aegis Software included at no charge. Lead-free parts are aailable. Order Number: PCB-SABER (Board Only) REVISED [Re. E] SMTA Saber Ealuation PC Board Standard board finish is Immersion SilerIS-410 board material. Other board finishes aailable are: ENIG and Pb Free HASL Aailable as a Single Pack Kit SMTA Saber Board Kits Top/bottom iew (double-sided) Board size: 3.875" x 5.375" Part Description Quantity Per 1 Kit Quantity Per 24 Kit Quantity Per 48 Kits Quantity Per 96 Kits PCB-Saber (see chart for aail. finishes) SMR-Sn 57 1,368 2,736 2, SMR-Sn ,440 2, SMR-Sn 34 1,000 1,632 4, SMR-Sn 31 1,000 1,488 3, SMR-Sn ,008 2, SMR-Sn , SMR-Sn ,000 SOT23-Sn 24 1,000 1,152 3,000 A-CABGA208-.8mm-15mm-DC DPAK(TO252)-Sn SO16GT-3.8mm-Sn SO20GT-7.6mm-Sn A-MLF100-12mm-.4mm-DC-Sn PLCC68-Sn T1-TSOP32-8x18.4mm-.5mm-Sn (V)FQFP216(100/116)-14mm-.5mm-DC-Sn QFP208-28mm-.5mm-2.6mm-Sn QFP x20mm-.65mm-3.9-DC-Sn Kit Order Number: (Tin-Lead) SMTA-Saber-1 SMTA-Saber-24 SMTA-Saber-48 SMTA-Saber-96 Kit Order Number: (Lead-Free) SMTA-Saber-1-LF SMTA-Saber-24-LF SMTA-Saber-48-LF SMTA-Saber-96-LF 90 Practical Components, Inc. klaphen@practicalcomponents.com

91 Terminal and Wire Kit The WTK-1 Kit includes eerything needed to train and practice your wire soldering skills. This kit contains three different gauges of wire and fie styles of terminals representatie of what is aailable in the marketplace. Our kit also comes standard with a Terminal Holder. This reusable tool safely holds terminals during wiring and soldering operations. Terminals will fit snug in holes of the TH1 when the holder is new. The holes are intentionally slightly undersized to all for expansion with use. Each kit comes indiidually packaged with all components bagged and tagged for easy identification. Perfect for classroom settings..078 Dia. Hole.112 Dia..187 Dia..112 Dia..145 Dia Aailable as a WTK-1 Kit Part Description Quantity Order Per Kit Number TB01 Terminal Holder Turret Terminal Bifurcated Terminal Hook Terminal Pierced Terminal Cup Terminal Gauge Wire 3' Gauge Wire 3' Gauge Wire 3' Note Kit is aailable without terminal holder. Single Pack Kit TB-01 Terminal Holder Dia Dia Dia. Hole Bifurcated Terminal Pierced Terminal Measurements are in inches Dia Dia. Hole.072 Dia..060 Dia. Knurl Square TurretTerminal.587 R Hook Terminal.020 Gold Cup Terminal Ref Practical Components, Inc. Tel: Fax:

92 Lead-Free Zero-Ohm SMD Resistor Kit The PCB000 test board has land patterns for 01005, 0201, 0402, and 0603 Zero Ohm Lead-Free SMD Resistors. Each component pad is connected in series (daisy-chained) to the next pad. When zero ohm alue resistors are placed on the pad, the result is a line of continuity. This test board can be used for placement accuracy ealuation with any type of component REVISED [Re. B] PCB000 Zero-Ohm Test Board matching the physical size of the pads. Each component type has 2,000 pads, except for pad size which has 165 pads for Pick-n-Placement purposes only with four different pad spacing. There are also 48 pads for to test for continuity. SMD Resistors with Zero-Ohm alue, and SMD Capacitors can be used on this test board. Customers can mix and match components and quantities to create a custom kit. Please contact your Practical Components sales representatie for details. Notes * 01005SMR-PA-0-Sn part is not included in kit. Can be added to kit build upon request for additional price. Gerber and X, Y Theta data included at no charge. Digitized files proided by Aegis Software included at no charge. PC000 SMD Lead-Free Zero-Ohm Resistor Kits P/N PCB000 2ØØØ PRACTICAL COMPONENTS, INC. Board size: 8" x 5.5",.062" thick. IS-410 board material. Standard finish is Immersion Siler. Board finishes aailable are ENIG and Pb-free HASL. Part Description Quantity Per 5 Kits Quantity Per 10 Kits Quantity Per 15 Kits Quantity Per 20 Kits Quantity Per 25 Kits Quantity Per 50 Kits *01005SMR-PA-0-Sn 1,000 2,000 3,000 3,500 4,300 8, SMR-PA-0-Sn 10,000 20,000 30,000 40,000 50, , SMR-PA-0-Sn 10,000 20,000 30,000 40,000 50, , SMR-PA-0-Sn 10,000 20,000 30,000 40,000 50, ,000 PCB000-Zero Ohm Board Kit Order Number (Lead-Free): PC LF PC LF PC LF PC LF PC LF PC LF Order numbers for indiidual items Part Description Order Numbers 01005SMR-PA-0-Sn SMR-PA-0-Sn SMR-PA-0-Sn SMR-PA-0-Sn PCB000-Zero Ohm Test Board TBD (customer to specify finish) 92 Practical Components, Inc. klaphen@practicalcomponents.com

93 AIM Print Test Board and Kit PCB2009 AIM Print Test Board Board material is IS-410. Standard finish: ImAg. Board size: 8.5" x 6". The AIM print test board was designed to include many printing challenges which are commonly encountered on manufacturers assemblies. BGA pads hae circular and square pad design to test paste release. AIM has included the standard IPC slump test pattern in order to further challenge the properties of any product tested thereon. This print pattern is more real life and more accurate to predict slump since indiidual pads are used instead of one pad that is common in the thermometer method. There is a number on the board indicating the distances between pads so a hard number can be used for paste ealuations. Common pad sizes were incorporated into the layout including 1206, 0805 and 0603 rectangular pads for discrete components. These pads hae arying distance between them so the user can determine solder beading of paste. Four 250 x 250mil pads are aailable to be utilized with arious aperture styles in order to allow for wetting tests. There are also seeral fine pitch QFP pads designed to check for the propensity of any gien product to cause bridging and to confirm the existence of torn prints, peaking (dog ears), or bridging. Notes Digitized gerber files proided by Aegis Software included at no charge. Kit aailable with Tin/Lead and Pb-free components. Software and Data Files Included With All Kits! Part Description PC2009 AIM Test Kit Practical Components, Inc. Tel: Fax: Quantity Per 25 Kits A-T/LQFP144-20mm-.5mm A-PBGA mm-35mm-DC 25 A-SSOP14T-5.3mm 50 A-PLCC20T 50 A-PBGA mm-17mm-DC 25 A-CABGA mm-15mm-DC 25 A-QFP44-10mm-.8mm-3.2mm 25 A-QFP64-14mm-.8mm-3.2mm 25 A-LQFP176-24mm-.5mm-2.0mm 25 A-PLCC68T 25 A-QFP240-32mm-.5mm-2.6mm 20 A-SSOP28T-5.3mm 75 A-SSOP20T-5.3mm SMR SMR SMR SMR SMR SMR 1425 PDIP A-MLF48-7mm-.5mm-DC 100 A-MLF32-7mm-.65mm-DC 100 A-MLF16-5mm-.8mm-DC 100 A-DualRowMLF156-12mm-.5mm-DC 25 A-CVBGA97-.4mm-5mm-DC 25 A-CVBGA360-.4mm-10mm-DC 25 A-(V)FQFP216(100/116-14mm-.5mm-DC 50 A-(V)FQFP176(128/48)-14mm-.4mm-DC 50 PCB Kit Order Number: PC

94 Solder Practice Board and Kit Tin-Lead and Lead-Free Kits are aailable The PC003 hand solder practice kit is a low cost, effectie kit for training and testing employees. This double-sided board has pads for 13 different components: One through-hole Dip14 and twele surface-mount components. Each item is indiidually bagged and tagged for easy identification. Kits consist of PLCCs, SOICs, TSSOPs, SOTs, Passies, and QFPs with 0.5mm and 0.65mm pitch. This low cost kit is ideal for classroom training and practice. IPC-A-610 Re D compliant. Kit is aailable with Tin-Lead or Lead-Free components. PCB003 Solder Practice Board Top View Board size: 2.5" x 2.5" IPC Compliant Single Pack Kit PC003 Solder Practice Board Kit (Tin-Lead and Lead-Free components aailable) Part Description Quantity Per Kit PCB003 Board (customer to specify finish) 1 QFP208-28mm-.5mm-2.6mm 1 QFP44-10mm-.8mm-3.2mm 1 QFP100-14x20mm-.65mm-3.2mm 1 PLCC44 1 SO8GT-3.8mm 1 SO20GT-7.6mm 1 SOT23 3 SOT143 2 TSSOP20-4.4mm SMR SMR SMR 6 DIP14T 1 Kit Order Number: (Tin-Lead) PC003 Kit Order Number: (Lead-Free) PC003-LF Note Gerber Data and X, Y Theta Data are aailable at no charge. Lead-Free parts are aailable with Sn finish. Standard finish is ImAg finish, IS-410 board material. Other board finishes aailable are: HASL, ENIG, and Pb free ImAg. Software and Data Files Included With All Kits! Bottom View Order Number: PCB003 Re B (Board Only) 94 Practical Components, Inc. klaphen@practicalcomponents.com

95 BGA Variable Pitch and Array Board Mix and match components to configure your custom kit. Practical Components is now offering a one-of-a-kind BGA Variable Pitch and Array PC Board. Each board contains matrices for the most popular ball pitches found on BGAs and CSPs. The use of full matrices allows maximum flexibility for placing parts with full, staggered, or perimeter configurations. Each board has a mixture of een and odd matrices to enable placement, using automatic equipment, of the highest ball counts aailable. PCB005 Variable Pitch and Array Board KLAPHEN@PRACTICALCOMPONENTS.COM PHONE: FAX: PHONE: FAX: Standard finish is Immersion Siler. Top View Bottom View Order Number: PCB005 (Board Only) Notes Kits can be configured to the customer s requirements. Gerber Data and X, Y Theta Data are aailable if required at no charge. Digitized files proided by Aegis Software included at no charge. Pad dimensions: 1.0mm pitch = 24 mil pad diameter 1.27mm pitch = mil pad diameter 1.5mm = mil pad diameter 0.5mm = 11 mil pad diameter 0.8mm = mil pad diameter 0.75mm = 18 mil pad diameter Aailable as a Single Pack Kit Please call your Practical Components sales representatie to identify components aailable for the PCB005 Test Board. Practical Components, Inc. Tel: Fax:

96 MLF Test Board and Kits REVISED [Re. A] Lead-Free and Tin-Lead Kits Aailable! This new PCB007 MicroLeadFrame (MLF ) Test Board is two test boards in one. The top side of the board consists of daisy-chained MLF pads. Amkor s new MLF packages are a near CSP plastic encapsulated package with a copper leadframe substrate. MLF packages hae perimeter pads on the bottom of the package. Thermal enhancement is proided by Amkor s ExposedPad technology. The test board front side has land patterns for MLF package sizes in arying I/O counts. Lead pitches of these include 0.5mm, 0.65mm and 0.8mm. The MLF side of the PCB007 board is designed to help customers become more familiar with the placement and process characteristics of MLF packages. The wide assortment of pad sizes and pitches proide a PCB007 MLF Test Board comprehensie oeriew of MLF packages. Daisy-chain patterns on the PCB007 board complement the patterns on the components, allowing continuity to be tested (except for TSOP s and T/LQFP120). The bottom side of the PCB007 Test Board proides a ariety of SMD component types. The bottom of the board has T/LQFP component with 0.4mm pitch, pads for the PBGA256 component with a 1.00mm pitch and two TSOP Type II components with 0.8mm pitch. Board also has new DualRowMLF156 component with 0.5mm pitch. Standard board finish for the PCB007 is Immersion Siler. Other finishes are aailable upon request. Standard board thickness is 0.062". Customers always hae the option of mixing and matching components to suit their requirements. Aailable as a Single Pack Kit Standard finish is Immersion Siler IS-410 board material. Other board finishes aailable are: ENIG and Pb free HASL. Top iew Board size: 8" x 5.5" Software and Data Files Included With All Kits! Bottom iew 96 Practical Components, Inc. klaphen@practicalcomponents.com

97 MLF Test Board and Kits PC007 MLF Kits (Lead-Free Option Aailable) Part Description Quantity Per 1 Kit Quantity Per 5 Kits Quantity Per 10 Kits Quantity Per 20 Kits Quantity Per 50 Kits Kit Order Number (Top and Bottom): PC007K-0-01 PC007K-0-05 PC007K-0-10 PC007K-0-20 PC007K-0-50 A-MLF8-3mm-.65mm-DC A-MLF16-5mm-.8mm-DC ,200 A-MLF20-5mm-.65mm-DC ,200 A-MLF28-7mm-.8mm-DC ,600 A-MLF32-7mm-.65mm-DC A-MLF44-7mm-.5mm-DC ,000 A-MLF68-10mm-.5mm-DC ,400 A-T/LQFP120-14mm-.4mm A-DualRowMLF156-12mm-.5mm-DC PBGA mm-17mm-DC T11-TSOP x18.42mm-.8mm T11-TSOP x22.22mm-.8mm PCB007 Test Board Part Description Quantity Per 1 Kit Quantity Per 5 Kits Quantity Per 10 Kits Quantity Per 20 Kits Quantity Per 50 Kits Kit Order Number (Bottom Only): PC007B-0-01 PC007B-0-05 PC007B-0-10 PC007B-0-20 PC007B-0-50 A-T/LQFP120-14mm-.4mm A-DualRowMLF156-12mm-.5mm-DC PBGA mm-17mm-DC T11-TSOP x18.42mm-.8mm T11-TSOP X22.22mm-.8mm PCB007 Test Board Part Description Quantity Per 1 Kit Quantity Per 5 Kits Quantity Per 10 Kits Quantity Per 20 Kits Quantity Per 50 Kits Kit Order Number (Top Only): PC007T-0-01 PC007T-0-05 PC007T-0-10 PC007T-0-20 PC007T-0-50 A-MLF8-3mm-.65mm-DC A-MLF16-5mm-.8mm-DC ,200 A-MLF20-5mm-.65mm-DC ,200 A-MLF28-7mm-.8mm-DC ,600 A-MLF32-7mm-.65mm-DC A-MLF44-7mm-.5mm-DC ,000 A-MLF68-10mm-.5mm-DC ,400 PCB007 Test Board Notes Kit quantities are subject to change. Mix and match components and quantities to create a custom kit. Please contact your sales representatie for details. Components supplied in kits (except for TSOP s and T/LQFP120) hae pairs of leads shorted together in a daisy-chain pattern that result in a line of continuity when combined with the shorted pairs of pads on the board. Continuity test pads on the board allow the end user to erify electrical connections at solder joints and to identify electrical opens. Gerber and X, Y Theta data included at no charge. Digitized files proided by Aegis Software included at no charge. PBGA is aailable with SAC305 or SAC405 Lead-Free solder ball alloy s. Aailable as a Single Pack Kit Lead-Free Part Description List Part Description A-MLF8-3mm-.65mm-DC-Sn A-MLF16-5mm-.8mm-DC-Sn A-MLF20-5mm-.65mm-DC-Sn A-MLF28-7mm-.8mm-DC-Sn A-MLF32-7mm-.65mm-DC-Sn A-MLF44-7mm-.5mm-DC-Sn A-MLF68-10mm-.5mm-DC-Sn A-DualRowMLF156-12mm-.5mm-DC-Sn A-T/LQFP120-14mm-.4mm-2.0-Sn PBGA mm-17mm-DC-SAC305 T11-TSOP x18.42mm-.8mm-Sn T11-TSOP x22.22mm-.8mm-Sn PCB007 Test Board (customer to specify board finish) Practical Components, Inc. Tel: Fax:

98 Solder Practice Board and Kits A uniersal PCB to meet all your needs. Rework practice, solder training and ealuation, and for testing and calibration of pick-and-place machines. REVISED Order Number: PCB008 Re H (Board Only) PCB008 Solder Practice Board [Re. H] Lead-Free Option Aailable! Software and Data Files Included With All Kits! Standard finish is Immersion Siler. IS-410 board material. Other board finishes aailable are: ENIG, OSP-HT, and Pb-free HASL. Top iew Board size: 5.5" x 8". Bottom iew Board size: 5.5" x 8". 98 Practical Components, Inc. klaphen@practicalcomponents.com

99 Solder Practice Board and Kits Choose from the kits below or create your own custom configuration. Lead-Free Components List (included in a complete kit) Part Description Quantity Per Board MLF68-10mm-.5mm-DC-Sn 2 PBGA mm-17mm-DC-LF 2 CVBGA97-.4mm-5mm-DC-LF 2 PBGA mm-35mm-DC-LF 2 QFP44-10mm-.8mm-3.9mm-Sn 2 QFP100-14x20mm-.65mm-3.9mm-DC-Sn 2 QFP208-28mm-.5mm-2.6mm-DC-Sn 2 QFP256-28mm-.4mm-2.6mm-DC-Sn 2 LQFP100-14mm-.5mm-2.0mm-Sn 1 PLCC20-Sn 2 PLCC44-Sn 2 PLCC68-Sn 2 SO8-3.8mm-Sn 4 SO14-3.8mm-Sn 4 SO20-7.6mm-Sn 4 SSOP20-5.3mm SMR-Sn 200 SOT23-TR-Sn 4 SOT143-TR-Sn SMR-Sn SMR-Sn SMR-Sn SMR-Sn SMR-Sn 32 PCB008 Board (customer to specify finish) 1 Part Description Tin-Lead Components List (included in a complete kit) Quantity Per Board MLF68-10mm-.5mm-DC 2 PBGA mm-17mm-DC 2 CVBGA97.4mm-5mm-DC 2 PBGA mm-35mm-DC 2 QFP44-10mm-.8mm-3.9mm 2 QFP100-14x20mm-.65mm-3.9mm-DC 2 QFP208-28mm-.5mm-2.6mm-DC 2 QFP256-28mm-.4mm-2.6mm-DC 2 LQFP100-14mm-.5mm-2.0mm 1 PLCC20 2 PLCC44 2 PLCC68 2 SO8-3.8mm 4 SO14-3.8mm 4 SO20-7.6mm 4 SSOP20-5.3mm SMR 200 SOT23-TR 4 SOT143-TR SMR SMR SMR SMR SMR 32 PCB008 Board-HASL finish 1 Component Quantities In Each Kit Kit Order Description Quantity of Parts Per Kit Boards PBGA169 PBGA225 PBGA352 QFP mm QFP208-.5mm QFP256-.4mm PC008-BGA PC008-BGA PC008-BGA PC008-BGA PC008-BGA PC008-QFP PC008-QFP PC008-QFP PC008-QFP PC008-QFP PC008-BGA/QFP PC008-BGA/QFP Kit Order Numbers Kit Order Description (complete kit top and bottom) Kit Order Description (top side of kit only) PC008K-1 PC008-TOP-1 PC008K-6 PC008-TOP-6 PC008K-12 PC008-TOP-12 PC008K-24 PC008-TOP-24 PC008K-48 PC008-TOP-48 Notes Gerber Data and X, Y Theta Data are aailable if required at no charge. Digitized files proided by Aegis Software included at no charge. Kit is aailable with Lead-Free components (for Tin-Lead and Lead-Free kits). Substitutions may occur depending on aailability of lead-free finishes and alloys. PBGAs are aailable with SAC305 or SAC405 Lead-Free alloys. CVBGA is aailable with SAC105, SAC305 or SAC405 Lead-Free alloys. Add LF to end of Kit Order Number when ordering Lead-Free kits. Practical Components, Inc. Tel: Fax:

100 Mixed Technology Board and Kit The PC009 Mixed Technology kit has surface mount components and through-hole components. This kit s primary use is for hand soldering but is also aailable as machine run upon special request. Tin-Lead and Lead-Free components aailable. Through-hole components are placed in close proximity to surface mount components to represent real soldering situations. Components are indiidually bagged and identified for component recognition. Order numbers for indiidual items Part Description A-PBGA mm-27mm-DC-SAC405 or SAC305 ** A-CABGA36-.8mm-6mm-DC-SAC405 or SAC305 or SAC105 ** QFP208-28mm-.5mm-2.6mm-DC-Sn SOT23-TR-Sn PLCC44-Sn PLCC68-Sn SOD80-TR-Sn SO16GT-3.8mm-Sn 6032SMTA-TR-Sn 0805SMR-TR-Sn 1206SMR-TR-Sn 0603SMR-TR-Sn QFP44-10mm-.8mm-3.2-Sn DIP16T-Sn 1/4 Watt Axial Resistor-Sn 1/2 Watt Axial Resistor-Sn CK05-LF T05-Sn 5 x 11 Axial Electrolytic-LF DO35-LF PC009 Mixed Technology Kits (Tin-Lead and Lead-Free parts) Hand Assembly Machine Run Part Description Quantity Per 1 Kit Quantity Per 5 Kits Quantity Per 10 Kits Quantity Per 20 Kits Quantity Per 50 Kit PCB009 Mixed Technology Board SMD Components A-PBGA mm-27mm-DC ** A-CABGA36-.8mm-6mm-DC ** QFP208-28mm-.5mm-2.6mm-DC SOT23-TR PLCC PLCC SOD80-TR SO16GT-3.8mm SMTA-TR SMR-TR , SMR-TR , SMR-TR ,000 QFP44-10mm-.8mm Through-Hole Components DIP16T /4 Watt Axial Resistor /2 Watt Axial Resistor CK T x 11 Axial Electrolytic DO34 or DO Kit Order Number: (Tin-Lead) PC PC PC PC PC Kit Order Number: (Lead-Free) PC LF PC LF PC LF PC LF PC LF Tin-Lead and Lead-Free Kits Aailable PCB009 Mixed Technology Board Board size: 4" x 5.5". Standard finish is Immersion Siler. Other board finishes aailable are: ENIG and HASL. IS-410 board material. Notes Aailable as a Single Pack Kit Kit aailable with Tin-Lead or Lead-Free parts. **BGA/CABGA Packages are not included in kit. Either BGA or CABGA can be added to kit upon request. Mix and match components and quantities to create a custom kit. Gerber Data and X, Y Theta Data are aailable at no charge. Not all parts are aailable lead-free. 100 Practical Components, Inc. klaphen@practicalcomponents.com

101 Tin-Lead and Lead-Free Aailable REVISED [Re. E] BGA Fine Pitch Board and Kit The PC011 BGA Kit contains Amkor daisy-chained fine pitch BGAs. The daisy-chain PCB011 test board contains patterns for the 0.4mm pitch, 0.5mm pitch and 1.0mm pitch CSP/BGA components. Amkor BGA type components on the board are the CTBGAs, CVBGAs and PBGAs. The PCB011 BGA Fine Pitch Board PCB011 test board is double sided. This test board is designed to help the end user become familiar with smaller BGA body sizes and pitches. Components come in standard JEDEC trays. Kit component quantities are for one side of the board only. Standard finish is Immersion Siler or ENIG finish. IS-410 board material. Notes Gerber and X, Y Theta data included at no charge. Digitized files proided by Aegis Software included at no charge. PBGAs are aailable with SAC305 or SAC405 solder ball alloys. CVBGA and CTBGA are aailable with SAC305, SAC405 or SAC105 solder ball alloys. Aailable as a Single Pack Kit PC011 BGA Kits Board size: 8" x 5.5" Part Description Quantity Per 1 kit Quantity Per 5 kits Quantity Per 10 kits Quantity Per 15 kits Quantity Per 20 kits A-CTBGA84-.5mm-7mm-DC-SAC A-CTBGA228-.5mm-12mm-DC-SAC A-CVBGA360-.4mm-10mm-DC-SAC A-CVBGA432-.4mm-13mm-DC-SAC A-CABGA mm-15mm-DC-SAC A-PBGA mm-27mm-DC-SAC PCB011-Amkor BGA Test Board Kit Order Number: (Tin-Lead) PC PC PC PC PC Kit Order Number: (Lead-Free) PC LF PC LF PC LF PC LF PC LF Part Description Order numbers for indiidual items Order Number A-CTBGA84-.5mm-7mm-DC-SAC A-CTBGA228-.5mm-12mm-DC-SAC A-CVBGA360-.4mm-10mm-DC-SAC A-CVBGA432-.4mm-13mm-DC-SAC A-CABGA mm-15mm-DC-SAC A-PBGA mm-27mm-DC-SAC PCB011-Amkor BGA Test Board Practical Components, Inc. Tel: Fax:

102 BGA Global Daisy-Chain Test Kit Tin-Lead and Lead-Free Aailable! PCB012 BGA Global Daisy-Chain Test Board Standard finish is Immersion Siler. IS-410 board material. Other board finishes aailable are: ENIG, and Pb Free HASL Top iew Board size: 8" x 5.5" Bottom iew 102 Practical Components, Inc. klaphen@practicalcomponents.com

103 BGA Global Daisy-Chain Test Kit Tin-Lead and Lead-Free Aailable! The New PCB012 Global Daisy-Chain test board has 25 different BGA land patterns. Board pads accommodate BGA components ranging from 15mm square to 35mm square. The PCB012 test board has 1.00mm and 1.27mm pitch pads. BGA components placed on this test board range from 156 to 1,156 balls. Daisy-chain patterns on the PCB012 board compliment the patterns on the components, allowing continuity to be tested. Each pad on the board has multiple daisy-chain patterns. These multiple daisy-chained pads allow different ball-count PBGA components to be placed on the same pad. Each pattern has test points to check for continuity. There are ball-count to test-point legends on the board. Standard finish for the PCB012 board is Alpha Leel Siler flash. Other finishes are aailable upon request. Standard board thickness is 0.062". The board is double sided with different pad sizes on the top and bottom. Customers can mix and match components to suit their requirements. Part Number Part Description A-PBGA mm-17mm-DC A-PBGA mm-17mm-DC-LF A-PBGA mm-17mm-DC A-PBGA mm-17mm-DC-LF A-PBGA mm-23mm-DC A-PBGA mm-23mm-DC-LF A-PBGA mm-23mm-DC A-PBGA mm-23mm-DC-LF A-PBGA mm-27mm-DC A-PBGA mm-27mm-DC-LF A-PBGA mm-27mm-DC A-PBGA mm-27mm-DC-LF A-PBGA mm-35mm-DC A-PBGA mm-35-DC-LF A-PBGA mm-35mm-DC A-PBGA mm-35mm-DC-LF-305 PC012 BGA Global Daisy-Chain Test Kit 1.0mm Pitch Top Side 5 Pads Per Board 4 Pads Per Board 2 Pads Per Board 2 Pads Per Board Quantity Per 1 Kit Quantity Per 5 Kit Quantity Per 10 Kit Quantity Per 20 Kit mm Pitch Bottom Side Part Number Part Description Quantity Per 1 Kit Quantity Per 5 Kit Quantity Per 10 Kit Quantity Per 20 Kit A-PBGA mm-23mm-DC A-PBGA mm-23mm-DC-LF Pads Per Board A-PBGA mm-27mm-DC A-PBGA mm-27mm-DC-LF A-PBGA mm-27mm-DC 3 Pads Per A-PBGA mm-27mm-DC-LF-305 Board A-PBGA mm-27mm-DC A-PBGA mm-27mm-DC-LF A-PBGA mm-31mm-DC A-PBGA mm-31mm-DC-LF Pads Per A-PBGA mm-31mm-DC Board A-PBGA mm-31mm-DC-LF A-PBGA mm-35mm-DC A-PBGA mm-35mm-DC-LF Pads Per Board Notes Kit quantities are subject to change. Mix and match components and quantities to create a custom kit. Please contact your sales representatie for details. Board is double sided (top side for 1.0mm pitch packages / bottom side for 1.27mm pitch package) Gerber and X, Y Theta data included at no charge. Digitized files proided by Aegis Software included at no charge. n Kit also aailable as SAC405 but SAC305 is the preferred Alloy. Aailable as a Single Pack Kit Description Part Number Top PC012T Top Lead Free PC012T-0-01-LF 19462N Bottom PC012B Bottom Lead Free PC012B-0-01-LF Complete PC012K Complete Lead Free PC012K-0-01-LF Practical Components, Inc. Tel: Fax:

104 Through-Hole Solder Training Kits PC013 Kits Choose from four kits! The PC013 hand solder practice kit is an effectie way to ealuate or train employees and students. This ersatile board comes with a ariety of through-hole components and each kit is coneniently boxed and the components are indiidually bagged and labeled for easy PCB013 Board identification. It is aailable in seeral different options to meet each company s requirements. Kits come standard with an SO16 resistor network, but can be upgraded to a Flat Pack 16. This kit is ideal for classroom settings. Kit is aailable with Tin-Lead and Lead-Free parts. Aailable as a Single Pack Kit Basic Through-Hole Kit Part Description Quantity Per Kit PCB013 (customer to specify finish) 2 DO35 10 AE-5x12 4 CK05 20 CK05 Spacer 20 1/2-W-AR 18 1/4-W-AR 20 DIP16 6 TO5 10 TO18 4 TO5/18 Spacer 14 SO16GT-5.6mm 4 Order Number: (Lead-Free) PC013-BTK -LF Order Number:(Tin-Lead) PC013-BTK Complete Though-Hole Kit Part Description Quantity Per Kit PCB013 2 Turret Terminal 15 Bifurcated Terminal 15 Hook Terminal 15 Pierced Terminal 15 Cup Terminal 15 DO35 10 AE-5x12 4 CK05 20 CK05 Spacer 20 1/4-W-AR 20 1/2-W-AR 18 DIP16 6 TO5 10 TO18 4 TO5/18 Spacer 14 SO16GT-5.6mm 4 20 Gauge Wire 3' 22 Gauge Wire 3' 26 Gauge Wire 3' Kit Order Number: (Tin-Lead) PC013-K Kit Order Number: (Lead-Free) PC013-K-LF Board size: 3" x 4", IS-410 board material. Other board finishes aailable are: ENIG and HASL. Recertification Kit With Wires And Terminals Part Description Quantity Per Kit PCB013 1 Turret Terminal 5 Bifurcated Terminal 5 Hook Terminal 5 Pierced Terminal 5 Cup Terminal 5 DO35 2 AE-5x12 1 CK05 6 CK05 Spacer 6 1/4-W-AR 5 1/2-W-AR 3 DIP16 2 TO5 2 TO18 2 TO5/18 Spacer 4 SO16GT-5.6mm 1 20 Gauge Wire 5' 26 Gauge Wire 5' Order Number: (Tin-Lead) PC013-RWTK-1 Order Number: (Lead-Free) PC013-RWTK-1-LF Recertification Kit Part Description Quantity Per Kit PCB013 1 DO35 2 AE-5x12 1 CK05 6 CK05 Spacer 6 1/4-W-AR 5 1/2-W-AR 3 DIP16 2 TO5 2 TO18 2 TO5/18 Spacer 4 SO16GT-5.6mm 1 Order Number: (Tin-Lead) PC013-RK Order Number: (Lead-Free) PC013-RK-LF Note SO16GT-5.6mm is not aailable Lead-Free. 104 Practical Components, Inc. klaphen@practicalcomponents.com

105 IPC 9850 Attribute Defect Rate Kit IPC 9850 Kit Attribute Defect Rate Kit checks out pick and place machines. IPC-9850 includes test methods for determining arious SMT placement equipment attributes, including repeatability, accuracy and attribute defects. Each of these tests requires specific material and this new test board and kit from Practical Components proides the solution for conducting the attribute rate defect testing. The applicable section from IPC-9850 is 4.1, where attribute defects are defined as components placed upside down, tombstoned, on side, missing or extra part, damaged lead(s), damaged part(s), completely off land, or wrong polarity. Testing requires the placement of 88,000 components on 20 boards to attain reasonably accurate test results. Practical Components 9850 Kit will proide you with enough components and boards to meet this guideline. While IPC-9850 requires the placement of components on sticky tape (included), these boards can also be printed with solder paste and reflowed. PCB014 Board IPC Compliant Each board contains the lands (multiple orientations) for 4,400 components (440 SOT23s, 440 SO8s, SMCs, SMRs, SMCs and SMRs). Test material is aailable from Practical as single boards or complete kits with all the necessary dummy components. On request, this board comes with demonstration ersions of CircuitCAM and CheckPoint manufacturing software, ready-to-run CircuitCAM Project Files (CPFs) and Gerber and X, Y Theta data at no extra charge. Notes Gerber Data and X, Y Theta Data are aailable, if required, at no charge. Digitized files proided by Aegis Software included at no charge. PC014 Kit (IPC 9850) Part Description Quantity Per 5 Kits Quantity Per 10 Kits Quantity Per 20 Kits SOT23-TR 3,000 6,000 12,000 SO8GTR-3.8mm 2,500 5,000 10, SMC-PA 10,000 10,000 20, SMR-PA 10,000 10,000 20, SMC-PA 8,000 12,000 20, SMR-PA 5,000 10,000 20,000 Sticky Tape 1 Roll 2 Rolls 3 Rolls PCB Kit Order Number: PC PC PC Board size: 11" x 11",.062" thick. High Temp 170Tg board material. Standard board finish is HASL. Practical Components, Inc. Tel: Fax:

106 Rework Kits REVISED PC015 Rework Kit Conforms to IPC 7711/7721 Standards for reworking. PCB015 Board [Re. B] The PC015 Kit is ideal for rework training or ealuating current rework procedures. This kit contains 2 fully populated boards and replacement components to enable remoing and replacing ½ of the components. Reworked solder joints can then be isually compared to original solder joints (on components not reworked) on the same board. Kit includes 2 boards which allows one to be used practice and one to be used ealuation. This kit conforms to the IPC 7711 and 7721 standards for rework- Kit is aailable with Lead-Free and Tin/Lead components! ing. It contains a wide range of components from Through-Hole to Chip Scale. Each kit is coneniently boxed with the replacement components indiidually bagged and labeled for easy identification. Forget looking for scrap boards for training purposes. Tin-Lead and Lead-Free components aailable. This kit is perfect for classroom settings and can also be ordered unassembled as a standard hand solder. IPC Compliant Aailable as a Single Pack Kit Part Description PC015 Rework Kit Assembled Quantity Per Kit PCB015-Assembled 2 LQFP100-14mm-.5mm LQFP44-10mm-.8mm PLCC28T 4 SOT SMC SMC SMR 6 SOD80 6 SO14GT-3.8mm 4 1/4-W-AR 6 **CK05 w/standoff 6 DIP14 3 TO5 w/standoff 3 TO18 w/standoff 6 *MLF16-5mm-.8mm 2 *A-CABGA36-.8mm-6mm-DC 2 Kit Order Number: (Tin-Lead) PC Kit Order Number:(Lead-Free) PC LF Notes n *MLF16/CABGA36 Packages are not included in kit. Either package can be added upon request. n **CK05 may be substituted with Radial Mono. Part Description Contains boards populated with components. Standard board finish is HASL or Immersion Siler. IS- 410 board material Board size: 3.5" x 5.5" PC015 For Hand Assembly Kit Quantity Per Kit PCB015-Standard 1 LQFP100-14mm-.5mm LQFP44-10mm-.8mm PLCC28 4 SOT SMC SMC SMR 6 SOD80 6 SO14GT-3.8mm 4 1/4-W-AR 6 **CK05 6 CK05 Spacer 6 DIP14 3 TO5 3 TO18 6 TO5/18 Spacer 9 *MLF16-5mm-.8mm-DC 2 *A-CABGA36-.8mm-6mm-DC 2 Kit Order Number: (Tin-Lead) PC Std Kit Order Number:(Lead-Free) PC Std-LF 106 Practical Components, Inc. klaphen@practicalcomponents.com

107 NEW! IPC Compliant Hand Soldering Kit Tin-Lead and Lead-Free Kits Aailable PCB-J-STD Board Soldering Kit Conforms to J-STD-001E Specifications PCB-J-Std Board The PC016 Mixed Technology Kit is an effectie and economical way to train and ealuate students and employees. This kit contains a ariety of standard Surface Mount and Through-Hole components with traces to simulate real world situations. Each kit comes indiidually boxed with all components bagged and labeled for easy identification. Conforms to IPC J-STD-001E standard for soldering. In stock and ready to ship, this kit is perfect for classroom settings. Aailable as a Single Pack Kit IPC Compliant Board size: 3" x 4",.062 thick, IS-410 board material. HASL and Immersion Siler finish is aailable. Part Description PC016-J-STD-E Hand Soldering Kit Quantity Per Kit PCB /4-W-AR 4 TO5 4 TO5 Spacer 4 DO35 4 CK05 *see note 4 CK05 Spacer 4 DIP SMR SMR SMC 4 SOD80 4 SO14GT-3.8mm 2 QFP100-14x20mm-.65mm PLCC20 2 Turret Terminals 4 Bifurcated Terminals 4 Pierced Terminals 4 Hook Terminals 4 Gold Cup Terminals 4 20 Gauge Wire 3' 22 Gauge Wire 3' 26 Gauge Wire 3' Kit Order Number: (Tin-Lead) PC016-J-STD-E Kit Order Number: (Lead-Free) PC016-J-STD-E-LF Note n *CK05 may be substituted with Radial Mono. PC016-J-STD-E Lead-Free Hand Soldering Kit Part Description Quantity Per Kit PCB /4-W-AR-Sn 4 TO5-Sn 4 TO5 Spacer 4 DO35-LF 4 CK05-LF *see note 4 CK05 Spacer 4 DIP16-Sn SMR-Sn SMR-Sn SMC-Sn 4 SOD80-Sn 4 SO14-3.8mm-Sn 2 QFP100-14x20mm-.65mm-3.2mm-Sn 2 PLCC20-Sn 2 Turret Terminals 4 Bifurcated Terminals 4 Pierced Terminal 4 Hook Terminals 4 Gold Cup Terminals 4 20 Gauge Wire 3' 22 Gauge Wire 3' 26 Gauge Wire 3' Kit Order Number: PC016-J-STD-E-LF J-STD-001E is world-recognized as the sole industry-consensus standard coering soldering materials and processes. This reision now includes support for lead free manufacturing, in addition to easier to understand criteria for materials, methods and erification for producing quality soldered interconnections and assemblies. The requirements for all three classes of construction are included. Full color illustrations are proided for clarity. This standard fully complements IPC-A-610E. 60 pages Released February Practical Components, Inc. Tel: Fax:

108 Lead-Free Process Capability Validation Kit Cookson Electronics Lead-Free Process Capability Validation Program Practical Components and Cookson Electronics are teaming up to offer a new Lead-Free Process Capability Validation Program. This program consists of lead-free components and test boards from Practical Components, with Cookson Electronics analytical ealuation and process capability alidation serices to the IPC and J-STD requirements. The CE Analytics Test Kit consists of: PCB test boards with IS-410 laminate, arious lead-free compatible pad finishes (ENTEK PLUS CU- 106A-HT and Alpha-LEVEL Immersion Siler), industry standard lead-free components, ALPHA OM-338 (M13) lead-free solder paste and ALPHA Telecore + cored wire, and process application guidelines. The CE Analytics laboratory serices include: 1. Lead-Free Process Capability Validation, comprised of: Macro and microscopic inspection and analysis of processed assemblies compared to IPC and J-STD requirements. Validation Report with recommendations for process optimization, if applicable CE Analytics Lead-Free Process Capability Validation Certificate. 2. Voiding Analysis 3. Macroscopic Examination of Processed Assemblies (non-destructie) 4. Microscopic Examination of Solder Connection Integrity. Draw on CE Analytics expertise to alidate your lead-free process capabilities. You can reduce the cost, time, and worry associated with conerting to lead-free by using the new CE Analytics Lead-Free Process Capability Validation. It is an easy three-step procedure: 1. Order the CE Analytics Lead-Free Test Kit, which includes boards, materials and components to set up and run a lead-free SMT, Thru-Hole, Mixed Technology or Rework process. 2. Order a serice package from CE Analytics and send in your processed boards. In return, you will receie a detailed laboratory analysis, report, recommendations for optimization if applicable, and a Lead-Free Process Capability Validation Certificate. 3. Run your lead-free process with confidence. For More Information For more information concerning price, deliery and how to order the new CE Analytics Lead-Free Process Capability Validation go to or contact Cookson Electronics at To contact your Practical Components sales representatie about the CE Analytics Lead-Free Test Kit call or check our web site Definition of Cookson Electronic Materials Included IS-410 is a CAF resistant, lead-free assembly compatible laminate and prepreg system that is ideal for high-density designs requiring multiple soldering steps. IS-410 materials contain a unique resin technology that offers exceptional IST thermal performance and reliability. Alpha-LEVEL is an immersion siler finish applied to circuit board solder pads that deelops a dense uniform siler deposit and proides excellent Pb free soldering, reliability, and contact resistance. ALPHA OM-338 (M13) is a broad latitude lead-free solder paste proiding the lowest cost of ownership proen through a wide print process window performance, ultra-fine pitch printing capability (0.25mm circles and 0.4 mm pitch components) and excellent oiding resistance exceeding IPC7095 Class III standards. ALPHA Telecore Plus is a low residue core solder wire designed for no-clean soldering applications that must meet all appropriate Bellcore specifications. The unique blend of rosin and proprietary actiators proides rapid wetting while leaing minimal, optically clear, completely inert residue. Electroless Nickel/ Immersion Gold (ENIG) is a leading immersion finish deliering excellent coerage, uniformity and mechanical strength for good solderability. Low temperature operation allows for good solder mask compatibility. The finish has a long shelf-life and can withstand multiple thermal cycles. ALPHA CUT Laser Cut Stencils are designed and manufactured to proide the ultimate stencil printing performance for most surface mount requirements, particularly when used in conjunction with ALPHA Solder Pastes or ALPHA Surface Mount Adhesies. The stencils are manufactured using a CAD/CAM drien high precision XY-laser cutting process. Order Numbers Stencils are sold separately as follows: For PCB030 board design: Order Number: (29" x 29" size, 5mil thick) Order Number: (20" x 20" size, 5mil thick) n For PCB031 modified board design: Order Number: (29" x 29" size, 5mil thick) Order Number: (20" x 20" size, 5mil thick) Software and Data Files Included With All Kits! 108 Practical Components, Inc. klaphen@practicalcomponents.com

109 Lead-Free Process Capability Validation Kit Board Design Reised To Include Through-hole Components. PCB031 Cookson Lead-Free Validation Board PCB031 PC Board Chart PCB Board (optional customer to choose board finish) PCB031-ENTEK (CU-106A-HT) PCB031-AlphaLeel (Immersion Siler) PCB031-ENIG (Electroless Nickel/Immersion Gold) Notes PC031 Cookson Lead-Free Capability Validation Kit Part Description Quantity Per 24 Kits PCB SMR-Sn 1, SMR-Sn 1, SMR-Sn 1, SMR-Sn 1, SMR-Sn 1, SMR-Sn 500 SOT23-Sn " Radial Mono Cap 120 SO16GT-3.8mm-Sn 72 SO20GT-7.6mm-Sn 24 PDIP16T-Sn 72 1/4-W-AR-Sn 240 TO-5-Sn 96 QFP256-28mm-.4mm-Sn 24 QFP100-14x20mm-.65mm-Sn 24 A-PBGA mm-17mm-SAC A-PBGA mm-23mm-SAC A-LQFP80-10mm-.4mm-Sn 24 A-LQFP100-14mm-.5mm-Sn 24 SOD80-Sn 250 A-CABGA36-6mm-.8mm-SAC A-MLF48-7mm-.5mm-Sn 43 Kit Order Number: PC * See PC board chart aboe to specify board finish. Gerber Data and X,Y Theta Data are aailable if required at no charge. Digitized files proided by Aegis Software. All parts included in kit are lead-free. Laminate board material is IS layer (.062" thickness). Finishes aailable: ENTEK CU 106A-HT, Alpha Leel Immersion Siler and ENIG (Electroless Nickel oer Gold). Board size: 3.875" x 5.375". Order Number: PCB031 (board only customer to specify board finish upon order. See PC board chart.) Notice: A limited number of PC030 SMT kits and boards are aailable. Please call for aailability. Practical Components, Inc. Tel: Fax:

110 Traceability & Control Validation Kit Practical Components and Aegis Industrial Software, the leader in Manufacturing Information Management Systems, hae partnered together to offer a traceability and control kit designed to alidate your entire manufacturing process and proide the potential for rich product and process traceability detail. Traceability and process control are no longer requirements resered for manufacturers in regulatory or specific market segments. Today, all manufacturers who aspire to achiee or to maintain a world class status must delier some degree of traceability. Until now, there has not existed a common language regarding the nature of traceability or its leels. Nor was there a means to benchmark such capability or to communicate its nature to customers or regulatory agencies in a common manner. The new Traceability & Control Validation Kit proides the physical materials and the procedural guide to determine your factories traceability and control capability, and then rate the results in a formalized matrix. These ratings can be used to demonstrate your capabilities, communicate to customers or auditors, or to proide a start point on a path to improe your capabilities and track progress along the way. Benchmark Your Traceability and Control Rate your traceability and control far beyond simple component traceability. Using the procedural guide and materials proided in this kit, a manufacturer can test and alidate two key elements of traceability; control mechanisms to assure process execution is proper een under high-change conditions, and the resultant reporting scope and depth their traceability systems will delier. This dual approach of alidating process control and isibility yields a comprehensie assessment of your capabilities. Communicate Your Capability Manufacturers all oer the world hae been searching for a way to coney to their customers or auditors their traceability capability. In the past, it has been impossible without a common rating system or een a generalized agreement on the maximum range of what traceability entails. One party may beliee traceability is simple lot traceability of components while another may include all quality, test, packaging and machine data feeds from the entire process. The purpose of this kit is to produce a common rating on the scale from simple traceability to the ery adanced. The scale can then be used to communicate your capabilities in a uniform manner to those who require this information. Improe What You Measure The rating scale will also help manufacturers who are continuously looking for ways to improe their factory operations. Through uniformed measurements, a roadmap can be deeloped to improe your plant to een greater leels of traceability. By measuring your abilities today, this kit can help create a defined path to the future. Technical Basis As the only solution proider of information systems deliering such scope of control and traceability, Aegis has the unique technical experience to delier such a kit in conjunction with Practical Components. Aegis methods of rating traceability hae been concurrently deeloped with, and adopted by, many of the leading manufacturers in the industry. Now your enterprise can benefit from oer 6 years of definition and usage in factories all oer the world to rate your systems and processes against this scale. Use this Kit s Materials and Procedural Guide to Determine Your Traceability and Control Capability in the Following Categories: Traceability Validation Production and Release Authentication History Process Documentation History Consumable Lots Used at Eery Process Step Tooling ID s Used at Eery Process Step Component Lot Traceability From Automated Mounters Component Lot Traceability From Hand Insertion PCB Panel and Image Record Integrity Route History and Cycle Rate Operator ID at Eery Process Step Process and Product Content Deiation Notices Pin, Component and Product Quality Indictment/Diag./Repair Test and Measurement Records Parametric Data Records Machine Eents and Alarms Box-Build Genealogy Packaging and Shipment Genealogy Process Control Supporting Proper Traceability Assured Identifier Acquisition on Coneyorized Line PCB Panel to Image Mapping Control Assured Documentation and Version Dispatch to Station Consumable Validation Line Control Tooling Validation and Line Control Feeder/Component Validation and Line Control Route Sequence Enforcement Packout Control 110 Practical Components, Inc. klaphen@practicalcomponents.com

111 Traceability & Control Validation Kit PC Traceability & Control Validation Kit Part Description Quantity Per Board Quantity Per Kit (10 Panels) 0603SMR-TR SMR-TR SMR-TR SMTA-TR *A-CABGA36-.8mm-6mm-DC 1 40 *A-PBGA mm-27mm-DC 1 40 PLCC PLCC QFP208-28mm mm-DC 1 40 QFP44-10mm-.8mm SO16GT-3.8mm SOD80-TR SOT23-TR /2 Watt Axial Resistor /4 Watt Axial Resistor x 11 Axial Electrolytic 2 80 CK DIP16T DO TO PCB009-Aegis-ImAg 4-up array 40 boards Kit Order Number: PC MES-ImAg *Customer to choose between CABGA36 s. PBGA256 upon order. Board material is IS-410 with ImAg finish. An identification label containing barcode details are found on each reel, tray, and tube, proiding knowledge of incoming material Part Description relationships. The label includes an AGI (Aegis Global Identifier) that seres as a unique identifier for each material instance. Below is an example: PC Traceability & Control Validation Kit The PCB009 board is presented in a rotated 4-up panel to address the challenges of multi-up assemblies for surface mount and through-hole insertion processes. Both the panel and each image is directly laser marked* with a barcode for serial identification. Barcode labels are also included with the kit. Use of this panel proides for: n Establishing Panel ID-to-Image ID relationships n Proofing WIP tracking and Route Enforcement n Proofing Graphic Defect Collection and Repair n Verifying Circuit Image Ordering Across Machines n Verifying Placement Accuracy on Rotated Images Note: A sample iserer database that contains a fully defined PC009 assembly example is aailable to existing Aegis customers with FUSION systems. Global Technology Award Aegis receied the Global Technology Award, sponsored by Global SMT & Technology. The kit also includes the following items to support the control and alidation processes: n Guide for performing alidation steps n Adhesie labels for each board and panel n Label files for use with Dymo Label Writer printers n Sample ECN/Deiation notices in PDF format for alidating change notification processes n Additional material labels with AGI numbers for affixing to tooling, consumables and other materials that require alidation in order to build product *Laser marking serices proided by Coneyor Technologies Incorporated (CTI). CTI Systems is a leading manufacturer of SMT connecting coneyors and peripherals, including label and laser marking solutions. Tel: (919) Practical Components, Inc. Tel: Fax:

112 SMT/PTH Mixed Technology Pb-Free Kit Indium Corporation SMT/PTH Mixed Technology Pb-Free Kit Practical Components and Indium Corporation are introducing a new Lead-Free SMT/Through-hole Mixed Technology test board and kit. The PCB049 Board can be used to ealuate the following conditions: Solder paste wetting and spread. Solder paste slump performance. Solder perform Pin-in-Paste performance. Wae flux hole fill performance. P&P equipment and placement accuracy. Reflow process capabilities. Effectieness of cleaning processes. Surface Insulation resistance (SIR). Surface finish interaction factors. Pb-Free Underfill performance. PCB049 Board PC049 Indium Lead-Free Kit Part Description Quantity Per 24 Kits Order Number A-PBGA mm-17mm-DC-LF LQFP64-7mm-.4mm-2.0-DC-Dc A-QFP208-28mm-.5mm-2.6-DC-Sn A-QFP100-14x20mm DC-Sn A-SSOP20T-5.3mm-DC-Sn A-SO16GT-7.6mm-DC-Sn A-PLCC68T-DC-Sn SMR-PA-0-Sn 1, SMR-PA-0-Sn 3, SMR-PA-0-Sn 3, SMR-PA-0-Sn 2, A-PDIP20T-7.6mm-DC-Sn A-DIP16T-7.6mm-Sn SMR-PA-0-Sn 1, /4W-AR-Sn TO5-Sn Kit Order Number: PC LF Board size: 8" x 12", FR4 170Tg board material. Standard board finish is ImAg. For details on ealuation techniques and material performance requirements, contact Chris Anglin of Indium Corporation at INDIUM or Test-Kit@Indium.com. For complete information this kit or other Lead-Free solutions please contact your Practical Components representatie at Software and Data Files Included With All Kits! 112 Practical Components, Inc. klaphen@practicalcomponents.com

113 Practical Components Practical Crossword Puzzle Across 2. Typically offers manufacturing, test and logistics serices 5. Atomic number The distance between the centers of two leads on an IC. Or the distance between the components in a tape carrier. Or the distance between two tape adjacent sprocket holes (4 mm). 10. One Million or 1,000, Internal delamination of a BGA due to moist expansion inside the BGA housing. 16. Micro lead frame 17. A material is injected under the component. Usually used on Flip-Chip applications to improe reliability. 18. F= kx (Q4Qb/d2) where F represents the electrostatic force, k represents a constant of proportionality, Q4 and Qb represent quantities of electrostatic charge, and d represents the distance between the charges. 19. A unit of electromotie force equal to the potential difference between two points for which 1 coulomb of electricity will do 1 joule of work in going from one point to the other. 21. Restriction of the use of certain Hazardous Substances in electrical equipment 25. A hot air knife leels the SnPb solder pad finish. 27. As Ball Grid Array with a thin BT resin epoxy PCB base substrate. 28. An alloy that changes directly from solid to a liquid state at one exact temperature. 30. Chemical symbol for antimony 33. Oxygen absorption on metal surfaces. 34. A small mark on the PCB used to calculate the PCB position relatie to the placement head. The calculations are then used to ensure precise placement of the components. 37. A unit of energy or work equal to the force of 1 newton magnitude when the point at which the force is applied is displaced 1 meter in the direction of the force. 42. A connector contact (usually a flat spring) which is slotted lengthwise to proide addi tional, independently-operating points of contact. 43. Solder paste spreading after printing. Down 1. A die connection method attaching aluminum or gold wires between the pads of a bare IC and the component lead. 3. Thrifty, economical 4. F = m2/gr, where F represents force, m represents the mass of a moing object, represents its elocity, g represents the acceleration due to graity (32.2 ftlsec2 ) and r represents the radius of the orbit of the mass. 6. The mounted PCB is heated in a furnace by a hot atmosphere or IR radiation in specific stages, finally melting the solder paste and thereby forming the solder joints. 7. Has a higher melting point and lower density than platinum 9. Flat plastic matrix component carrier. 12. Inclined for or fitted for actual actiities 13. Abbreiation for zero insertion force connector 14. Glass transition temperature. The temperature at which a material changes from hard to soft state. 15. It is the only metal, except for mercury, caesium, and rubidium, which can be liquid near room temperatures 20. The transfer of an electrical charge between two objects with different electrostatic potential. 22. A moement of electrons, positie ions, negatie ions, or holes; the rate of transfer of electricity from one point to another. 23. The portion of a terminal or a contact that is crimped 24. Beginners all-purpose symbolic instruction code 26. Non-functional component used for placement, hand soldering or rework practice runs. 29. The load connected to the output end of a circuit, deice or transmission line. 31. A part of an electrical or a mechanical system 32. Refers to a specific group of IC packages with leads on all four sides. 35. Refers to a specific group of IC packages with leads on two sides. 36. Fast SMD placement machine primarily placing small chips 38. Inert gas used in the soldering process to aoid oxidation of the components, pads and solder alloy. 39. Garbage in garbage out. 40. Symbol Ta and atomic number #82 Practical Components, Inc. Tel: Fax:

114 CircuitMedic Epoxy Kit This kit contains 10 packages of clear, low iscosity, superior strength epoxy, precisely measured out into two-compartment plastic packages so it s easy to use and there s no measuring. Once cured, this epoxy makes an effectie electrical insulator with good high temperature mechanical and impact resistance properties. The epoxy can be used to fill in holes, gaps, burns or to inject into delaminated locations. The kit also contains mixing sticks, mixing cups and foam swabs Professional Repair Kit The Professional Repair Kit is the most complete and most ersatile circuit board repair kit you ll find anywhere. It s the total package. The kit includes dry film, epoxy-backed circuit frames, and unique replacement circuits that do not use messy liquid epoxy. Includes eyelets and setting tools for plated through hole repair, Circuit Tracks to repair damaged circuits, epoxy and color agents for solder mask or base board repairs, and a comprehensie manual all packaged in a conenient carrying case. If you need to repair damaged circuit boards, the all-in-one Professional Kit is what you need. Kit contains 10 packages of clear, low iscosity, superior strength epoxy, precisely measured out into two-compartment plastic packages so it s easy to use and there s no measuring. Applications n Surface Mount Pad Repair n BGA Pad Repair n Land Repair n Edge Contact Repair n Conductor Repair n Plated Hole Repair n Base Board Repair, Epoxy Method n Base Board Repair, Edge Transplant Method n Coating Replacement n RoHS Compliant n RoHS Compliant n Applications n Base Board Repair, Epoxy Method n Base Board Repair, Edge Transplant Method n Coating Replacement, Solder Mask Practical Part Number: Professional Repair Kit is packaged in an ESD safe carry case Practical Part Number: Practical Components, Inc. klaphen@practicalcomponents.com

115 CircuitMedic Micro Drill System Micro-Drill is a workhorse in a kit. This ersatile powerhouse is ideal for milling, drilling, grinding, cutting and sanding circuit boards. It remoes coating, cuts circuits, cuts leads, drills holes, cuts slots, shapes FR4 and performs many other procedures using arious interchangeable bits. Unlike most hand-held tools, the Micro-Drill has a tiny, high speed DC motor in the hand piece, eliminating bothersome drie cables and giing the technician better control. A separate power supply keeps the hand piece lightweight and reduces fatigue. Power is supplied by a panel switch or foot switch for ease of use. Application n Multipurpose machining, grinding, and cutting for circuit board repair and rework Plated Hole Repair Kit Here are all the tools and materials you ll need to repair damaged plated through holes in circuit boards. The kit includes a ariety of eyelet sizes, carbide ball mills for drilling, and setting tools to form the eyelets conforming to IPC guidelines. Eyelets are made of pure copper electroplated with solder. Eyelet tooling is hardened steel. Application Notes n Plated Hole Repair, No Inner Layer Connection n Plated Hole Repair, Double Wall Method n Plated Hole Repair, Inner Layer Connection n RoHS Compliant Practical Part Number: 19513N The Micro-Drill is ideal for precision circuit board grinding and cutting operations. Practical Part Number: Practical Components, Inc. Tel: Fax:

116 Soldering Aids Tools for the Latest Deelopments in Component and Assembly Technologies 1 MilProbes for Ultra Fine Pitch Rework BGA, Flip Chip, TAB, COB, etc. The RocHard 1 MilProbe is a 0.3" long Micro-tip in a 4 3/8" long hex shape stainless steel handle. The Micro-tip is tapered to a one mil diameter tip for TAB, BGA, and other ultra fine pitch rework. The tip is either straight (SH-341) or 50º angled at 5 mil from the point (SH-316). The different tip geometry allows the tips to reach between all circuit leads and traces under a microscope. Soldering Aid Kits These Beau Tech kits contain the most popular tools. The inyl cases keep the tools clean, handy, and safe from damage. The clear inyl front allows easy selection of the tool to be used. The kits will also keep your bench more organized. Selection of a kit denotes a true crafts person and seeker of alue. Two-Piece Fine Pitch RocHard 10 MilProbe Kit Kit Contents SH-241, 10 MilProbe SH-216, 10 MilProbe Teflon Tip Protectors Vinyl Case Order Number: SH-222 (Minimum Order: 1) Four-Piece TH/SMT RocHard 25 MilProbe Kit I MilProbe (SH-316) cleaning 3 mil pitch TAB substrate. Kit Contents SH-116, 25 MilProbe SH-117, 25 MilProbe SH-123, 25 MilProbe SH-141, 25 MilProbe Vinyl Case Order Number: SH-125 (Minimum Order: 1) Oerall dimensions of the 1 MilProbe, straight and angled ersion. Aailable Models: SH-316 (50º Angled) SH-341 (Straight) SH-322 (Kit including both SH-316 and SH-341) The probe tip is strong and long lasting since it is made of special, proprietary alloy to achiee maximum strength. The hex shape stainless steel handle proides a easy grasp of the tool when operating under a microscope. It also preents the tool from rolling on the work bench. To further increase the comfort of using the tool, a foam sleee that goes onto the handle is aailable as an optional part. The 1 MilProbe comes with a protection cap and a inyl pouch. The cap keeps the tip from damage and keeps the operator from injury. The pouch proides additional protection to the tip and proides a conenient way of storing and carrying the 1 MilProbe. MilProbe Selection Guide A = 1 MilProbes, B = 10 MilProbes, C = 25 MilProbes Pitch Size Application 2-10 mil mil mil mil 30+ mil Through-Hole Testing Solder Joint & A A, B B B, C C C Wire Bonding Strength Straightening Leads & Wires A A, B B B, C C C Six-Piece Standard/Miniature Soldering Aid Kit Kit Contents Standard Aids SH-20A Straight Flat Reamer/ Straight Fork Tip SH-20B Angled Flat Reamer Reamer/Straight Fork Tip SH-20K Stainless Steel Brush/ Beeled Scraper Blade Miniature Aids SH-20C Straight Flat Reamer/ Straight Fork Tip SH-20D Angled Flat Reamer Reamer/Straight Fork Tip SH-20G Stainless Steel Brush/Beeled Scraper Blade Vinyl Case Order Number: SH-120 (Minimum Order: 1) Cleaning Leads & Traces A A B B C C Applying Epoxy A A B B C C The new inspection mirror meets clean room requirements yet is sufficiently economical for non-clean room. 116 Practical Components, Inc. klaphen@practicalcomponents.com

117 Soldering Aids Orange Sticks Double Beeled Ends (7" x 5/32") Beau Tech orange sticks are made of high quality nonresin wood which will not contaminate solder and component leads. Natural wood is among the best material that does not generate static charge, thus is safe to use in any ESD sensitie area. They are effectie, yet inexpensie tools coming in packages of 100. ESD SAFE Package of 100 Applications Use to position and hold Through-Hole and Surface Mount components for soldering and desoldering. Use to bend component leads. Use to guide wire on the board. Use to break solder bridges. Use to probe for loose components. Order Number: SH-83 (Package of 100) Practical Components, Inc. Tel: Fax:

118 Flextac BGA Rework Stencil Kit Flextac BGA Rework Stencil Kit includes 20 different sizes of BGA rework stencils, a spatula handle and three sizes of spatula blades. There are a total of 40 stencils in kit (2 stencils per type). Replacement blades are aailable (see tool kit list for order number). If you e been using metal stencils for BGA rework, we hae some great news for you. Flextac BGA Rework Stencils a creatie new product that is a major improement oer what you may be using now. These flexible solder paste stencils are laser cut from high quality, anti-static polymer film with a residue-free adhesie backing. Because they are self-sticking, no tape or fixturing is needed. The adhesie seals around each BGA pad to preent solder paste from bleeding under the stencil when the paste is applied. Flextac Stencils are easy to use and leae no residue on the board surface. Current BGA rework stencils are fabricated from metal and require fixturing or taping to position them and hold them in place. Metal stencils warp easily, and if the circuit board has undulations in the board surface, the metal stencil will not sit flat. Since there is no gasket-like seal, solder paste can easily bleed under metal stencils when paste is applied with a squeegee. Also solder paste can spill out oer the sides of flat metal stencils contaminating the circuit board surface. Metal stencils require tedious stencil cleaning. To use metal stencils effectiely, a high leel of operator skill is required. To use, the operator folds the pre-scored side tabs and then peels off the coer film from the bottom side of the stencil. The operator holds the side tabs while placing the Flextac Stencil in position. If it is not correctly positioned, it can simply be remoed and repositioned. The side tabs also sere as solder dams preenting oerspill. No external taping or fixturing is used. Next the operator applies a small dab of solder paste and uses a standard squeegee to spread the paste. Since the residue-free adhesie seals around each BGA pad, the operator can make as many passes as necessary with the squeegee to assure proper aperture filling. The Flextac Stencil is then peeled up leaing a perfect deposit of solder on each pad. Although Flextac Stencils are disposable, they can be used seeral times. Application Applying solder paste for BGA rework. Features and Benefits Residue-free adhesie backing seals around BGA pads to preent solder paste bleed. Laser cut ensures precise aperture size. Disposable eliminates tedious stencil cleaning. Flexible conforms to board surface. Fold-up sides for easy placement and solder paste containment. Low cost. Packaged in a handy ESD safe carrying case Kit Part Description Note Description Flextac BGA Rework Stencil Kit Custom pattern stencils are aailable as special order with up to 2,600 holes per stencil. Please call Practical for quotation. 118 Practical Components, Inc. klaphen@practicalcomponents.com

119 Flextac BGA Rework Stencil Kit Flextac BGA Rework Stencil Kits each kit includes 2 stencils per ball count Part Description PBGA Ball Count Body Size Pitch Aperture Size Ball Pattern (matrix) B x 22mm 1.27mm.025" (0.635mm) 7 x 17 Full Array B mm 1.0mm.020" (0.508mm) 14 x 14 Full Array B mm 1.5mm.025" (0.635mm) 15 x 15 Full Array B mm 1.0mm.020" (0.508mm) 16 x 16 Full Array B mm 1.27mm.032" (0.813mm) 16 x 16 Full Array B mm 1.27mm.025" (0.635mm) 20 x 20 P4-Row B mm 1.27mm.025" (0.635mm) 20 x 20 P4-Row + 4x4 center B mm 1.27mm.025" (0.635mm) 20 x 20 P4-Row + 6x6 center B x 25mm 1.27mm.032" (0.813mm) 16 x 19 Full Array B mm 1.0mm.020" (0.508mm) 22 x 22 P4-Row + 6x6 center B mm 1.27mm.025" (0.635mm) 26 x 26 P4-Row B mm 1.27mm.025" (0.635mm) 19 x 19 Full Array B mm 1.27mm.032" (0.813mm) 19 x 19 Full Array B mm 1.27mm.025" (0.635mm) 26 x 26 P4-Row + 6x6 center B mm 1.27mm.025" (0.635mm) 31 x 31 P4-Row B mm 1.0mm.020" (0.508mm) 22 x 22 Full Array B mm 1.27mm.025" (0.635mm) 33 x 33 P5-Row B mm 1.27mm.032" (0.813mm) 25 x 25 Full Array B mm 1.0mm.020" (0.508mm) 26 x 26 Full Array B mm 1.0mm.020" (0.508mm) 26 x 26 Full Array Part Description Hand tools included in kit Description Spatula (1 piece) Squeegee Blade Handle (1 piece) Squeegee Blade 12mm (1 piece) Squeegee Blade 27mm (1 piece) Squeegee Blade 35mm (1 piece) Part Description Description Stencil Thickness in Mils B Pitch Ball Count Body Size Other PBGA stencils aailable (not included in kit) Each item includes set of 10 stencils which depends on part number Part Description PBGA Ball Count Body Size Pitch Aperature Size Ball Pattern (matrix) B mm 1.27mm.025" (0.635mm) 17 x 17 P4-Row B mm 1.27mm.025" (0.635mm) 17 x 17 P5-Row + 3x3 center B mm 1.0mm.020" (0.508mm) 18 x 18 Full Array B mm 1.27mm.025" (0.635mm) 26 x 26 P5-Row B x 32mm 1.27mm.030" (0.762mm) 19 x 25 Full Array B mm 1.27mm.025" (0.635mm) 32 x 32 P5-Row B mm 1.0mm.025" (0.635mm) 24 x 24 Full Array B mm 1.27mm.032" (0.813mm) 25 x 25 Full Array B ,156 35mm 1.0mm.020" (0.508mm) 34 x 34 Full Array Practical Components, Inc. Tel: Fax:

120 Practical BGA Reballing Kit BGA-Holder Stencil Ball Matrix Body Size (mm) Pitch (mm) BGA5 BGA64 8 x 8 5 x BGA81 9 x 9 5 x BGA7 BGA48 8 x 8 7 x BGA8 BGA x 15 8 x BGA x 14 8 x BGA9 BGA81 9 x 9 9 x BGA x 10 9 x BGA10 BGA x x BGA x x BGA x x BGA11 BGA x x BGA12 BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA14 BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA15 BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA16 BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA17 BGA x x BGA x x BGA x x BGA x x BGA x x BGA18 BGA x x BGA x x BGA x x BGA x x BGA19 BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x The Practical BGA Reballing Kit features patented stencils and holder to manually rework BGA components to original condition. Restore costly BGAs to original condition using hot air rework stations or tools. Simply squeegee on flux, pour on solder balls and rework with hot air! Stencils and holders are aailable separately, so you can purchase only the stencils and stencil holders you need. All the standard stencils and holders are aailable as a kit for one of the easiest and least expensie BGA repair solutions. BGA-Holder Stencil Ball Matrix Body Size (mm) Pitch (mm) BGA x x BGA x x BGA21 BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA23 BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA25 BGA x x BGA x x BGA x x BGA x x BGA x x BGA27 BGA x x BGA x x BGA x x BGA x x Practical Components, Inc. klaphen@practicalcomponents.com

121 Practical BGA Reballing Kit BGA-Holder Stencil Ball Matrix Body Size (mm) Pitch (mm) BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA29 BGA x x BGA x x BGA31 BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA33 BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA35 BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA-Holder Stencil Ball Matrix Body Size (mm) Pitch (mm) BGA x x BGA x x BGA x x BGA x x BGA x x BGA37.5 BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA40 BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA42.5 BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA x x BGA13x8 BGA90 6 x 15 8 x BGA13x15 BGA x x Notes Stencils and holders aailable indiidually. Custom stencils and holders are aailable for additional price. Call Practical for quotation. Kit can be special quoted with multiple stencils and holders. Call Practical for quotation. Kit Contents for 150-X BGA Kit Fluxpen Vial of 50,000 Solder Balls.Choice of 20 mil, 25 mil or 30 mil solder spheres. Choice of Sn63/Pb37 or Sn10/Pb90 solder alloy. 1 standard holder (component specific). 1 standard stencil (component specific). Kit Order Number: X BGA Reballing Kit Practical Components, Inc. Tel: Fax:

122 International Distributors Australia / New Zealand OnBoard Solutions Pty Ltd 4 Nymboida Steet Coogee NSW 2034 Sydney, Australia Tel :+61 (0) Fax: +61 (0) Contact : Peter Ruefli info@onboardsolutions.com Brazil New Horizon Comercial Rua James Holand, Barra Funda Sao Paulo, SP Brazil Tel: Fax: Contact: Maria Fernanda esd@newhorizon.com.br China Kasion Automation Limited Website: sales@kasion.com Hong Kong Office Suite 1204, 12/F, Nanyang Plaza, 57 Hung To Road, Kwun Tong, Kowloon, Hong Kong Tel: (852) Fax: (852) Shanghai Office Suite 1301, Xu Hui Commercial Mansion, 168 Yude Road, Shanghai , P.R.C. Tel: (86) or Fax: (86) Shenzhen Office Room 308, Futian Tianan Hi-Tech Venture Park Tower A Tianan Cyber Park, Futian District, Shenzhen , P.R.C. Tel: (86) Fax: (86) SZ Demo Centre Suite 1821, Changping Commercial Blding 99 Honghua Road Futian Free Trade Zone Shenzhen , P.R.C. Tel: (86) Fax: (86) Tianjin Office Suite 8-503, Hong Da Apartment, Hebei Road Tianjin , P.R.C. Tel: (86) Fax: (86) Eastern Europe (Coering countries i.e. Latia, Lithuania, Estonia, Belarus, Czech Republic, Sloakia, Poland and Russia) Production Solutions Sp. z.o.o. ul. Marka Hlaski Jozefow Poland Tel: Fax: Contact: Robert Jaworski czes@psinter.com Website: Finland Prodi Oy Valakkatie Helsinki Finland Tel: Fax: prodi@prodi.fi Contact: Lauri Lehtinen Website: France Teknis France 11, A Des Marronniers BP Le Chesnay Cedex France Tel: Fax: p.guillaume@teknisfrance.com Contact: Philippe Guillaume Website: Germany AAT Aston Konradstrasse Nurnberg Germany Tel: Fax: danagirstl@aston.de Contact: Dana Girstl Website: India Practical Components Mktg. Scs. 51 Bukit Batok Crescent #06-18 Unity Center Singapore Tel: Fax: daidpracomps@singnet.com.sg daid.koh@practicalcomponents.com.sg Contact: Daid Koh Ireland Quiptech International Ltd. Rierside Commercial Estate Galway Ireland Tel: Fax: sales@quiptech.com Contact: Donal Murnane Website: Israel Nortec International 4 Hamelacha St. Industrial Zone Ra Anana Israel Tel: Fax: kobi@nortec.co.il Contact: Kobi Shterenberg Website: Italy Ramos Via Camillo de Nardis Napoli Italy Tel: Fax: mmoscati@iol.it Contact: Michele Moscati Website: Japan Nissho Musen SOTOKANDA Chiyoda Ku, Tokyo Japan Tel: Fax: aoki@nmk.co.jp Contact: Mr. Aoki Website: Korea Sungmoon Semitech Corp. 3F, Fine Venture Bldg., Yatap-dong, Bundang-gu, Seongnam-si, Gyeonggi-do, Korea Tel: Fax: jhlee@smsemitech.com Contact: Jae-Hee (John) Lee Website: Netherlands / Belgium / Luxembourg PrintTec Lingewei LK TIEL The Netherlands Tel: +31 (0) Fax: +31 (0) info@printtec.nl Contact: Robert Joosten Website: Portugal Teknis Portugal Rua Eng. Duarte Pachecco, No66 Appartado Alcobaca Portugal Tel/Fax: Mobile: mc.boukhobza@teknisfrance.com Contact: Marie Christine Boukhobza Website: Russia DiPaul 23, Pr. Popoa Street St. Petersburg, Russia Tel: Fax: Contact: Andrey Lukin olgazotoa@dipaul.ru Contact: Grigory Rubtso - sales lukin@dipaul.ru Website: Singapore / Malaysia / Indonesia Practical Components Mktg. Scs. 51 Bukit Batok Crescent #06-18 Unity Center Singapore Tel: Fax: daidpracomps@singnet.com.sg daid.koh@practicalcomponents.com.sg Contact: Daid Koh Sweden/ Denmark/ Norway DESAB Elektroniksystem AB Haradsagen Huddinge Sweden Tel: Fax: mikael.roots@desab-elektronik.se Contact: Mikael Roots Website: Switzerland Sibalco AG Birmannsgasse 8 CH-4009 Basel Switzerland Tel: Fax: info@sibalco.ch Contact: Noelia Guilherme Tunisia / Algeria / Morocco Teknis Tunisie Aenue Mohamed V Boumhel el Bassatine 2097 Ben Arous Tunisie Tel: / Fax: GSM: contact@teknistunisie.com Contact: Ghazali Zied Website: United Kingdom Intertronics Unit 17, Station Field Industrial Estate Kidlington, Oxon OX5 1JD, England Tel: Fax: enquiries@intertronics.co.uk Contact: JKein Cook Website: Practical Components, Inc. klaphen@practicalcomponents.com

123 contains useful information about PoP and TMV qualification, reliability and other aspects of 3D packages. PoP, TMV Whitepapers n Package-on-Package (PoP) Data Sheet n PSfBGA Dual Sided Test Contactor Data Sheet n Joint Project for Mechanical Qualification of Next Generation High Density Package-on-Package (PoP) with Through Mold Via Technology, Whitepaper n Assembly and Reliability Assessment of Fine Pitch TMV Package on Package (PoP) Components, Whitepaper n Next Generation Package-on-Package (PoP) Platform with Through Mold Via (TMV ), Whitepaper n Application of Through Mold Via (TMV ) as PoP base package, Whitepaper n PoP / CSP Warpage Ealuation and Viscoelastic Modeling, Whitepaper n Surface Mount Assembly and Board Leel Reliability for High Density PoP (Package on Package) Utilizing Through Mold Via Interconnect Technology - Joint Amkor and Sony Ericsson, Whitepaper n Drien by Smartphones, Package-on-Package Adoption and Technology Are Ready to Soar By Lee Smith, Amkor Technology, Inc. This article originally appeared in Chip Scale Reiew Magazine, July 2008 n High Density PoP (Package-on-Package) and Package Stacking Deelopment, Whitepaper n Package-on-Package: The Story Behind This Industry Hit By Lee Smith, Amkor Technology, Inc. This article originally appeared in Semiconductor International Magazine, June, 2007 n Study on the Board Leel Reliability Test of Package on Package (PoP) with 2nd Leel Underfill, Whitepaper n Stacked CSP (SCSP) Data Sheet n 3D Packaging Technology Solution Data Sheet

124 PO Box Noel Street Los Alamitos, CA U.S.A. TEL FAX PRSRT STD U.S. POSTAGE PAID LOS ALAMITOS CA PERMIT NO /07 Copyright 2011 Practical Components, Inc. $5.00