Agenda. Smart-card market at a glance Smart card technology roadmap Future needs. Examples. Conclusion

Transcription

1 Agenda Smart-card market at a glance Smart card technology roadmap Future needs New application context Silicon Module Packaging System level environment Examples Multimedia SIM cards New generation of ID products Conclusion Contactless solutions 2

2 Telecoms: The first large smart card application Public Telephony was the first large smart card application First public telephony card issued in France (Télécarte) in 1984 A simple memory card with pre-paid credits Over 12 billion public telephony cards rolled out Mobile Telecom is today s largest smart card application: SIM Introduced in 1992 with GSM Establishes a secure link between the mobile operator and their customer Now used in 3G phones for multiple applications including mobile TV About 1.5 billion SIM cards are deployed each year Contactless solutions 3

3 Banks: Smart cards secure financial transactions Chip cards for banking means secure transactions Clients have a card and know a secret code Code is protected inside the microprocessor The banking world requires the highest security certifications Chip cards for banking: introduced in France in 1992 (CB) and in Germany in 1997 (Geldkarte epurse) Fraud cut by 90% in the 3 years following introduction Evolution: cryptology technology as well as services EMV migration: 100 countries have already partially or fully migrated Supported by Visa and MasterCard Great Britain, France, Mexico, Brazil, Malaysia have already migrated : countries include Turkey, China and Canada Contactless payment is becoming a reality for small transactions 10 million cards already issued in the USA and Japan Contactless solutions 4

4 Identity: Widely-used since 2002 epassport: countries already ICAO standard finalized since VWP countries and more adopting the epassport Biometrics planned for Europe in 2009 National ID cards and drivers licenses: driven by legislation and standards More than 15 countries have adopted an electronic ID card Including Belgium, Italy, Finland, Sweden, Saudi Arabia, Oman and China Standardization initiatives Europe (ECC), Persian Gulf countries Legislation (Europe, USA, Japan etc.) and standards (ISO) for drivers licenses Health care system cards: a proven model France, Germany, Austria, China, Slovenia etc. New projects: Algeria, Mexico (Mu) Secure Identity Documents Deployment WorldWide (Mu) Travel ID Healthcare Source: Gemalto marketing, August 06 Contactless solutions 5

5 Smart Card Hardware: More Moore and more than Moore * Ethernet Enabled Mode ** Near Field Communication Smart Card chip size 25 Sq Millimeters Introduction of Technology 2010 #100 MHz Multimode,I/O 512 MB-1GB Stacked memory Micro-batteries, sensors, networked peripherals 2008 #100 MH z Multimode I/O 256 MB Stacked memory NFC/UWB- wireless I/f 2006 # MHz 32 bit+ USB 2.0 +EEM* +NFC** 4 MB-128MB SC- SMMC interface RSA 2048 in 10 ms MHz 32 bit/nfc** 512KB-1 MB FLASH in single IC RSA 2048 in 50 ms MHz -32 bit µc-usb KB EEPROM RSA 2048 in 300 ms MHz-8/16 bit µc-with Contact-less options 8-32 KB EEPROM RSA 2048 in 500 ms MHz-8 bit 1-8 Kbytes EEPROM RSA 1024 in 500 ms Contactless solutions 6

6 Smart card: Software innovation, past and future Introduction of Technology 2010 Spontaneous networking 2008 MPEGx Direct streaming, Direct IPV6 addressing 2007 DRM /CAS/ for Mobile Broadcast (DVB-H) 2006 Advanced multi-modal modal biometry 2005 Web-service card, ID federation 2004 Real Time, multi-thread thread OS 2003 XML/TCP-IP on Card 2002 On-Card RMI, single-mode biometry Ambient Intelligence Interactive video E-Government Multimedia Processing 2000 WAP/Internet Microbrowsing (SIM Alliance) 1999 Java Card combined with OTA download 1998 Java Card +GSM Subscriber Identity Module (SIM) Mobile Internet Contactless solutions 7

7 Future needs: density - security New application context Enhanced functionality, multi-application Silicon environment New SOC structures Microelectronics New module and variants SIP Packaging technologies Die to wafer stacking New form factors System level aspects Security of the finished good Against destructive and non-destructive attacks Contactless solutions 8

8 New application context Enhanced functionality, multi-applications Enable more functions in always reducing volumes Increase the secure storage capacity Increase communication speed between the «card» and remote servers or data-bases Increase the security of accesses to servers and processed on-card assets Offer a better flexibility at communication protocol levels (ISO, USB, NFC,..) Re-enforce the physical security, reliability and life-time of smartplatforms requested by key market applications (Mobile Communications, E-ID programmes, Pay-TV,..) Contactless solutions 9

9 Silicon environment Continuous increasing of clock frequencies ( 32 bit CPU) Optimal dimensioning of the silicon platform along 4 major axes: CPU, Storage, I/O, Bandwidth Power consumption management From large to very large secure data storage From several 100 KB to MB/GB EEPROM => Flash => PCM and/or MRAM Complex hardwired functions (dedicated coprocessors, state machines, anti-tampering sensors preventing fault insertion) Up to 50 sensors on most complex processors available today Optimal management of computational power, peak and average power consumption, management of lower noise immunity Not only a functional but also a severe security challenge Decoupling and filtering necessary Critical for all contact-less applications P-Flash MRAM Heterogeneous integration High-density logic, RF blocks, analog sensors, large embedded SRAM and NVM, asynchronous logic, on-chip remote peripheral controllers, Smart cards chips are becoming more and more complex SOCs Asynchronous Contactless solutions 10

10 Packaging issues New form factors and technologies New 3FF for SIM cards (new standard for Mobile SIM cards) New technologies for E-Id: (passports, visas) Die stacking (CPU et large storage memories: > 1 GB) Passive components (capacities, SMT, energy sources) Ultra-short embedded die to die interconnect (with enforced security) Monitoring of embedded power consumption Passport Low number of external I/Os (8 contacts ISO) Floppy substrates (PCBs, RF antenna connection, plastic screens, OLEDs) Very thin module thicknesses (a few 10µ for laminating) Contactless solutions 11

11 New constraints: system level integration Global approach needed at «packaging» and manufacturing levels Smart card becoming a computer?..with new management approach for the associated security risks Design methodology New security challenges Contactless solutions 12

12 New security challenges on smart cards Prevention against invasive attacks Active layer protection by robust die sealing and attachment Inter-die link protection for multi-die structures (through suitable place and route) Embedding of energy micro-sources (micro-batteries ) enabling a nondestructive control of module and event dating Prevention against non-invasive attacks Perturbation of consumption current analysis (SPA, DPA) through the simultaneous operations of the stacked dies Electromagnetic emission control Counter-measures against fault-injection attacks (3D active topologies, ad-hoc surface processing. ) Prevention against combined attacks Simultaneous perturbations of both IC and modules Contactless solutions 13

13 Example: Gemalto Multimedia SIM platform (1) HW platform Powerful USIM processor (32 bits) Large embedded Flash (# 1MB) + external memory (128 MB) Multiple I/Os managed simultaneously: ISO, USB, NFC SW platform New OS SW generation based on secure µ-kernel Full 2G/3G support Multithread, Multitask USIM operating system Interface and Packaging Legacy support (ISO) Very thin packaging Reliable Standardization ETSI, 3GPP reference standards Contactless solutions 14

14 Gemalto Multimedia SIM platform (1) Interface aspects of the SIM/Handset chipset: simultaneous ISO, USB, NFC handling RF CIRCUIT ISO TS E-USIM VCC GND VCC GND CLK RST IO Digital BaseBand NFC integrated over a Single Wire Protocol (SWP) RST CL USB D+/Dtrough 2 unused contacts CLK IO D+ D- SERVICE Bus Application Processor USB IC Full Speed D- D+ Contactless solutions 15

15 Gemalto Multimedia SIM platform (2) Packaging aspects for the CPU + external Flash Side to side structure (From MEDEA+ Onom@Topic project) Aluminium wedge bonding 16 wires Capacitor Stacked structure (From PIDEA+ Sm@rtPack project) Gold Ball bonding, 18 wires to bond Capacitor Contactless solutions 16

16 Gemalto Multimedia SIM platform: Industrialized concepts (1) Contactless solutions 17

17 Gemalto Multimedia SIM platform: Industrialized concepts (2) Microcontroller mounted Face To Face with the Memory. Any attempt to deconstruct the system will cause it to be broken and the data lost Track and interconnection pad metallization Micro-inserts growth Wafer thinning Compatibility with legacy manufacturing (module mounting) Top die ( 3,000X2,950) 75µm SLE66 AL BCB Glue Al/CU CU/AL Oxide 180µm Contactless solutions Silicon wafer 200mm

18 Examples: security in E-Identity A large number of non-secure ID documents Fake passports: a serious threat Equipment now available for producing fake ID papers With an increase in numbers of ID documents, it s harder to pick out the fakes Contactless solutions 19

19 Security threats Methods of fraud 1. Counterfeiting (copy/make the card body/booklet) Possibly using stolen/salvaged document components 2. Falsifying (Forgery) a real document (change personalization) Changing or adding information Or a look a like / Impostor 3. Creating a true false document (do personalization) Using original stolen material; e.g. blank passports 4. Obtaining a true document by applying for it with false documents Contactless solutions 20

20 Physical and Visual security on the card body is useful and important SECRET Visual security can be visible (open) or hidden (covert) 4 levels of verification Level 1: to the naked eye Level 2: with simple equipment: Magnifying glass, UV lamp etc. Level 3: with special equipment Level 4: secret / in laboratory A secure document is one that is designed with a consistent set of security features Important to have strong overt level 1 or level 2 security features Two highly-secure and proven materials are available Polycarbonate (PC) is very secure as it is non-delaminable and can be personalized by laser PET-PVC offers very high security with a color photo Visual security is varied Impression: guilloche Inks DOVIDs CLI (Changeable Laser Image) Contactless solutions 21

21 Example: Passport booklet A booklet with security printed visa pages Passport holder s personal information printed on the data page Microprocessor + Inlay sealed in the e-cover or in e- Datapage Laser secured en-graveable data page: all personalized data inside the data page where they can not be altered Visual and electrical information bound together Durability: Durability radically exceeds the latest ICAO & ISO specifications < 10 times ISO requirements Security: The hinge fully integrated to the data page. Removing the hinge from the data page is impossible without leaving clearly traceable marks Pure polycarbonate, no other materials involved REQUIREMENT FOR THE HIGHEST SECURITY Fluorescent printing as an option Metal foil printing as an option L l d Contactless solutions 22

22 Example: Gemalto laser secured cards PolyCarbonate (PC) card body for the highest security Secure material with the strongest set of security features Multiple Polycarbonate sheets, sheets fused together (no glue) to form a solid card that cannot be delaminated to change data Inner sheets carry security printing and devices, embedded within the solid card Unique security features are enabled by polycarbonate s optical characteristics, e.g. CLI/MLI Secure laser engraving personalization Laser engraving embedded within the PC body - can not be scratched away or altered Laser-specific personalization security features The most durable card material DOVID Front printing CLI Laser engraving Tactile effect Carbon PC sheets for laser engraving Back printing clear Contactless solutions 23

23 Secure Documents: Highest security products! PKI Chip enabling electronic identity 100% polycarbonate card or data page EAC CC certified etravel OS Secure laser engraving Positive and negative embossing CLI/MLI Options - Taggants - Laser sealer - Transparent window - Color Picture on PC Contactless solutions 24

24 Conclusions Market dynamics for smart card systems requires a permanent revisiting of functionality and security Changes required concern not only the classical silicon environment but also the complete packaging and system integration chains Mobile Multimedia is a very strong driver for multi-chip integration New E-ID product are pushing for new system level packaging options with very strong integration between microelectronics and complete physical security There will be many challenges behind us! Contactless solutions 25

25 Thank you! Jean-Pierre Tual Director, Industrial Relations jean-pierre.tual@gemalto.com