The interconnect becomes an increasingly critical system component > Fatter compute nodes > Increasing disparity between local and remote
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1 Multiterabit Switch Fabrics Enabled by Proximity Communication Hans Eberle, Alex Chow, Bill Coates, Jack Cunningham, Robert Drost, Jo Ebergen, Scott Fairbanks, Jon Gainsley, Nils Gura, Ron Ho, David Hopkins, Ashok Krishnamoorthy, Jon Lexau, Wladek Olesinski, Tarik Ono, Justin Schauer Sun Microsystems Laboratories Future Interconnect Needs The interconnect becomes an increasingly critical system component > Fatter compute nodes > Increasing disparity between local and remote communication Data center trends > Server consolidation > Network consolidation > Virtualization > Clustering > Horizontal scale beyond the chassis Sun Microsystems, Inc 2
2 Proximity Communication () Chips overlap face-to-face 5-20mm Chip 1 Chip 2 Chip m Transmit Receive Tx Micropads Y Vernier X Vernier Rx Pads Receive Transmit Capacitively couple over micron distances 0-20 m Utilize on-chip electronic alignment Sun Microsystems, Inc 3 Removing the Chip IO Bottleneck Huge Bandwidth Gain 10 Tbps per mm 2 Comparison of Scale Proximity Communication I/O lanes per mm Proximity I/O Area Ball Bonding Year 15_m 120_m Area Ball Bonding Sun Microsystems, Inc 4
3 Proximity Communication Advantages Increases bandwidth/area Avoids off-chip wires Obviates ESD protection Shrinks transceiver circuits Lowers power consumption Makes multi-chip modules reworkable Enables smaller chips Sun Microsystems, Inc 5 Opportunity Proximity Communication allows for building switch fabrics that scale to thousands of ports and multiple Tbps throughput using a flat single-stage network rather than a hierarchical multistage network Switch bisection bandwidth Chip 1 Chip 2 Chip 3 Sun Microsystems, Inc 6
4 Blocking Multi-stage Switch S 1,1 12x12 S 1,2 12x12 S 2,1 S 3,1 12x12 S 3,2 12x switches 3 stages 576 internal links S 1,24 12x12 S 2,12 S 3,24 12x (Folded network combines S 1 and S 3 ) Sun Microsystems, Inc 7 Non-blocking Multi-stage Switch S 1,1 12x24 S 1,2 12x24 S 2,1 S 2,2 S 3,1 24x12 S 3,2 24x switches 3 stages 1,152 internal links S 1,24 12x24 S 2,24 S 3,24 24x n m Expansion: m 2n -1 Sun Microsystems, Inc 8
5 Proximity Communication Switch S 1,1 S 1, switches 1 stage links S 1, Sun Microsystems, Inc 9 Vector Multi-Chip Module Link (Bridge Chip) Switch Element (Island Chip) Off-Module IO (Wire Bonds) Sun Microsystems, Inc 10
6 Port-Sliced Crossbar Switch Input Ports Output ports Sun Microsystems, Inc 11 Single-Stage Switch Advantages Low deterministic latency Simple global scheduling > No internal blocking > No out-of-sequence delivery > Service guarantees possible Lower cost > Fewer switch elements > Less internal wiring Less power Higher reliability Sun Microsystems, Inc 12
7 Switch Prototype Characteristics System characteristics > 4 x 10GE ports > Layer2 switching > Based on ATCA standard > Off-the-shelf line cards > Proprietary switch blade Switch fabric > "Vector switch" with 4 Island chips + 2 Bridge chips (3 links) > Off-chip connections through wire bonds Sun Microsystems, Inc 13 Switch Prototype Switch Motherboard Line Card Switch Daughtercard Sun Microsystems, Inc 14
8 Switch Prototype Organization Line Card 1 Line Card 2 Line Card 3 Line Card 4 Monitor Packet Generator Packet Checker Switch Monitor Flow Ctrl Encoder Decoder Switch Fabric (4 x 4 Crossbar) Sun Microsystems, Inc 15 Bridge and Island Chips 16 x 1 Gpbs DDR Bridge 1 Bridge 2 Island 1 Island 2 Island 3 Island 4 3 x 16 x 1 Gpbs DDR Rx Rx Rx DES DES DES 250 MHz DES Tx Tx Tx 3 x 16 x 1 Gpbs DDR SER Sun Microsystems, Inc 16 x 1 Gpbs DDR 16
9 Bridge and Island Chips 118 mm 229 mm Bridge 70 mm 103 mm Island Tx Array Rx Array Bridge Power Off-Chip IO Switch Logic Alignment Measurement Alignment Marker Bridge Power Process Technology: 6-Layer Aluminum TSMC 018 m CMOS Sun Microsystems, Inc 17 Vector Switch Prototype Sun Microsystems, Inc 18
10 Scaling Up Switch Fabric Element Switch Fabric Element Switch Switch Fabric Fabric Element Element Switch Switch Fabric Fabric Element Element Switch Switch Fabric Fabric Element Element Switch Switch Fabric Fabric Element Element Switch Fabric Element Switch Fabric Element Switch Fabric Element Switch Fabric Element Switch Fabric Element Switch Fabric Element 256 Ports 25 Tbps 1,024 Ports 10 Tbps 4,096 Ports 40 Tbps Sun Microsystems, Inc 19 Scalable Switch Architecture "Output Buffered Switch with Input Groups > Reduces memory requirements from O(n 2 ) to O(n # Island Chips) > To be presented at Globecom 2007 "Parallel Wrapped Wave Front Arbiter" > Increases throughput of n x n Wrapped Wave Front Arbiter by a factor of n > Presented at HPSR 2007 Sun Microsystems, Inc 20
11 Output Buffered Switch with Input Groups Arbiter Arbiter Arbiter Sun Microsystems, Inc 21 Applications Data center backbone Blade system interconnect ATCA chassis aggregation Cluster interconnect System interconnect Sun Microsystems, Inc 22
12 Summary Proximity Communication allows for building a flat single-stage switch fabric that scales to thousands of ports and multiple Tbps throughput > Low latency > High efficiency > Service guarantees > Low power > High physical density Sun Microsystems, Inc 23 Hans Eberle hanseberle@suncom
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