Trickle Up: Photonics and the Future of Computing Justin Rattner Chief Technology Officer Intel Corporation

Transcription

1 Trickle Up: Photonics and the Future of Computing Justin Rattner Chief Technology Officer Intel Corporation * Other names, logos and brands may be claimed as the property of others. Copyright 2009, Intel Corporation.

2 Is This the Future of Si Photonics?

3 Or, is this?

4 Si Photonics Must Serve the High Volume Market

5 Display Bandwidths Above 10 Gbps Above 20 Gbps in 2H 2009

6 Solid State Drives (SSDs) Above 250 MBps SSD RAID Arrays >1.0 Gigabyte per second

7 Servers with 10s of GBs of Memory For Virtualization and In-Memory Databases IWILL Server Motherboards with 16 DIMM Slots

8 Coming Soon: USB Gbps one-way over just 2M of cable but very inexpensive

9 Getting USB 3.0 to Deliver 5Gbps While Preserving Backward Compatibility Current USB1/2 connectors and cables fail between 1.0 and 2.0 GHz New USB3 connector adds four new high-bandwidth wires for 4.8 Gbps one-way Major cliffs at 1-2GHz

10 R [W in -1 ] Subtle Electrical Signaling Challenges Copper Roughness Skin effect concentrates current on the inner edge, roughness increases resistance vs. theory High Current Density Regions Typical conductor x-section. Epoxy AC Common Mode Noise Irregularities in the glass weave cause differential pairs to propagate signals at different velocities, closing eyes. Glass FR4 Glass Weave Copper Resistance R 1.5 f Typical PCB 0.7 Theory R 1.8 f f [GHz] Differential 10 Gb/s ACCM No ACCM time [ps] V diff [mv]

11 USB3 Cable Gets Thicker and Shorter USB1/2 0.5Gbps USB3 5.0Gbps 4-5mm Bend Radii ~10x of OD > 8mm Bend Radii << USB 1/2 ~$1.75/link 5.0Gbps

12 The Stage is Set for a Low Cost, High Volume, Optical I/O Solution Can You Say $1 per Port?

13 Introducing Light Peak An complete optical I/O solution Start at ~10Gbps, scale up to ~100Gbps Single, compatible, optical architecture Unified Connector (Display, LAN, USB) A generalized transport scheme Carry whatever protocols needed i.e. PCIe, DisplayPort, HDMI, USB, etc Every plug provides same capability Based on simple app agnostic protocol

14 Implementing Light Peak First Generation: Discrete Device Solution Optical Modules Light Peak Router DisplayPort PCIe Ethernet Gen 1 Optical Module 4 Fibers 2-Link 2 Link Optical Optical IC IC VCSELs/PINs

15 Light Peak Demonstration at IDF Devices Up to 100m Computer 10Gbps Beyond HD Display SSD RAID Array 8 Gbps ~2 Gbps 10Gbps 10Gbps 10Gbps Light Peak Router DisplayPort PCIe Ethernet Simultaneous traffic on one 10Gbps Light Peak link: 8Gbps video stream to beyond-hd display (DisplayPort) 2Gbps bi-directional transfer to SSD RAID array (PCIe)

16 Integration: The key to lower cost & higher speeds

17 Intel s Silicon Photonics Research Innovating with low-cost silicon to create new optical devices 1 st Continuous Wave Silicon Raman Laser (Feb 05) Hybrid Silicon Laser (Sept. 06) 40 Gb/s PIN Photodetectors (Aug. 07) Silicon Modulators 1GHz ( Feb 04) 10 Gb/s (Apr 05) 40 Gb/s (July 07) 8-channel integrated 200Gb/s (May 08) Avalanche photodetectors with 340 GHz Gain*BW

18 End of 2009 Research Goal Integrated Silicon Photonics Optical Link 10G PRBS Generator 10G PRBS Generator 10G PRBS Generator 10G PRBS Generator. 4 x 10 G Driver SiP Tx 4x InP lasers 4 x10g Si Mod. Mux 4 x 10G Photo Detectors. 4 x 10 G TIA Demux 10G Error Detector CLK Tx Test board Rx Test board 4x10 Gb/s Goal: Demonstrate all key components to realize a low-cost, integrated, 4x10Gbps SiP optical link

19 Power Efficiency (mw/gb/s) Challenges for Silicon Photonics Power Efficiency Packaging nm 90nm 160nm 250nm 130nm 90nm 130nm 180nm 130nm 130nm 180nm 130nm 90nm Intel s latest electrical results m Electrical links continue to improve performance/watt*: FIBERS Power issues for optical links - E-O-E conversion efficiency - Laser impedance, driver proximity Package topside Connection? PROCESSOR Monolithic Integration? ORGANIC PACKAGE SOCKET FR4 MOTHERBOARD Board connection? Connector cost Assembly cost Testing cost Reliability Package compatibility

20 The opportunity is there The technology looks good in the lab Now is the time to take Silicon Photonics into low-cost, high volume production

21 Q&A