Differential Return Loss for Annex 120d Addressing to Comments i-34, i-74, i-75

Size: px
Start display at page:

Download "Differential Return Loss for Annex 120d Addressing to Comments i-34, i-74, i-75"

Transcription

1 Differential Return Loss for Annex 120d Addressing to Comments i-34, i-74, i-75 Richard Mellitz, Samtec Adee Ran, Intel March 2017 IEEE802.3 Plenary, Vancouver, BC, Canada 1 IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force

2 Differential Return Loss and Package Options OPTION A: Go back to clause 93 and Annex 83d OPTION B: Do nothing keep what is in D3.0 OPTION C: Keep packages in D3.0 and lower return loss by 3.5 db to match packages OPTION D: Use lower return loss in OPTION C and specify a new 12 and 30 mm packages which matches RL even more closely 2 IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force

3 Background: Return loss in Annex 83D 3 IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force

4 Return loss for Annex 83d is specified by Equation IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force

5 COM parameters for 83D are the same as CL93 Device package model uses characteristic impedance Z c of 78.2 Ohms (does not appear in the table) 5 IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force

6 Option A: Go Back to Clause 93 and Annex 83d COM package return loss compared to RL limit Little Gap RL limit and package models are close ~1 db gap at some frequencies 6 IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force

7 COM parameters for 120d packages are different from CL93 Device package model uses characteristic impedance Z c of 85 Ohms and pulled into table 7 IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force

8 Annex 120D Return Loss is Specified in Equation 93-3 Just like the background slides 8 IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force

9 OPTION B: do nothing and keep what is in D3.0 COM package return loss compared to RL limit Big Gap RL limit and package models are now further apart gap is generally larger (mainly at low frequencies) 9 IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force

10 Review of COM Packages in D3.0 Table (not aligned with Clause 137 P802.3cd Draft 1.2) 10 IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force

11 OPTION C: keep packages in D3.0 and lower return loss by 3.5 db to match package IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force

12 OPTION C D3.0 packages and lower RL to match package COM package return loss compared to RL limit 12mm/30mm Inconstant gap, but very small in places Move RL limit closer to the package model, keeping a similar shape 12 IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force

13 Option D: Pedantic COM package parameters for Option C Return Loss Device package model Single-ended device capacitance Test 1 Single-ended device capacitance Test 2 Transmission line length, Test 1 Transmission line length, Test 2 Single-ended package capacitance at package-toboard interface Package transmission line characteristic impedance Test 1 Package transmission line characteristic impedance Test 2 Cd Cd Zp Zp Cp Zc Zc nf nf mm mm nf Ω Ω Single-ended termination resistance Test 1 Single-ended termination resistance Test 2 Rd Rd Ω Ω 13 IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force

14 Option D: Pedantic COM associated voltage amplitude parameters for Option C Return Loss Transmitter differential peak output voltage Victim Test 1 Far-end aggressor Test 1 Near-end aggressor Test 1 Victim Test 2 Far-end aggressor Test 2 Near-end aggressor Test 2 A v A fe A ne A v A fe A ne V V V V V V 14 IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force

15 Option D: Pedantic COM parameters for 120d package COM package return loss compared to RL limit More pedantic choice of COM package parameters 15 IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force

16 Summary of choices Choose OPTION A Go back to clause 93 and Annex 83d Wait for measurement product data Choose OPTION B Do nothing. Keep what is in D3.0 Wait to align with clause 137 Choose OPTION C Keep packages in D3.0 and lower return loss by 3.5 db to match package Aligns with requirements from prior COM analyses Choose OPTION D Use lower return loss in OPTION C and specify a new 12 and 30 mm package which matches RL more closely. Lower impact of package proliferations on COM Expected slightly lower COM than for Option B and option C. 16 IEEE P802.3bs 200 Gb/s and 400 Gb/s Ethernet Task Force

ERL for Parameter Update

ERL for Parameter Update ERL for Parameter Update Richard Mellitz, Samtec 02-21-2018 IEEE 802.3 New Ethernet Applications Ad Hoc 1 ToC Review SNR ISI Clause 136 host transmitter and receiver DOE experiment SNR ISI comparison ERL

More information

IEEE P802.3cg 10BASE-T1S Increased Transmit Voltage

IEEE P802.3cg 10BASE-T1S Increased Transmit Voltage IEEE P802.3cg 10BASE-T1S Increased Transmit Voltage David D. Brandt, Rockwell Automation IEEE P802.3cg 10 Mb/s Single Twisted Pair Ethernet Task Force March 2018 Plenary, Rosemont, Illinois, USA Page 1

More information

Adding a Simple Package Model to the Channel Response

Adding a Simple Package Model to the Channel Response Adding a Simple Package Model to the Channel Response Richard Mellitz, Intel Corporation Liav Ben Artsi, Marvell Technology Group Adam Healey, LSI Corporation Charles Moore, Avago Technologies 1 IEEE 802.3bj

More information

Chip To Module Twin Axial Cable Channels For 400 Gb/s: Re-examining the Insertion Loss Equation

Chip To Module Twin Axial Cable Channels For 400 Gb/s: Re-examining the Insertion Loss Equation Chip To Module Twin Axial Cable Channels For 400 Gb/s: Re-examining the Insertion Loss Equation Richard Mellitz, Samtec, April 24, 2017 Contributors: Scott McMorrow & Keith Guetig, Samtec IEEE P802.3bs

More information

Updated 802.3cb Backplane Channel Analysis and PHY proposals

Updated 802.3cb Backplane Channel Analysis and PHY proposals Updated 802.3cb Backplane Channel Analysis and PHY proposals Peter Wu, Jin Zhang, Marvell Semiconductor IEEE 802.3cb March 2016 Plenary Meeting, Macau 1 Supporters Anthony Calbone, Seagate Technology Richard

More information

IEEE Gb/s, 100 Gb/s, and 200 Gb/s Ethernet Task Force

IEEE Gb/s, 100 Gb/s, and 200 Gb/s Ethernet Task Force 1 IEEE 802.3 50 Gb/s, 100 Gb/s, and 200 Gb/s Ethernet Task Force Vittal Balasubramanian, Dell Yasuo Hidaka, Fujitsu Upen Reddy Kareti, Cisco Erdem Matoglu, Amphenol-TCS Jim Nadolny, Samtec Rick Rabinovich,

More information

Q Pairs QTE/QSE-DP Final Inch Designs In PCI Express Applications 16 mm Stack Height

Q Pairs QTE/QSE-DP Final Inch Designs In PCI Express Applications 16 mm Stack Height Application Note Q Pairs QTE/QSE-DP Final Inch Designs In PCI Express Applications 16 mm Stack Height Copyrights and Trademarks Copyright 2004 Samtec, Inc. Developed in conjunction with Teraspeed Consulting

More information

CHAPTER 2 NEAR-END CROSSTALK AND FAR-END CROSSTALK

CHAPTER 2 NEAR-END CROSSTALK AND FAR-END CROSSTALK 24 CHAPTER 2 NEAR-END CROSSTALK AND FAR-END CROSSTALK 2.1 INTRODUCTION The high speed digital signal propagates along the transmission lines in the form of transverse electromagnetic (TEM) waves at very

More information

Reference Architecture Proposals and Channel Data

Reference Architecture Proposals and Channel Data Reference Architecture Proposals and Channel Data Richard Mellitz, Samtec Howard Heck. Intel Contribution Acknowledgment: Oluwafemi Akinwale and Subas Bastola, Intel IEEE802.3 Plenary July 2018, San Diego,

More information

Specifying Crosstalk. Adam Healey Agere Systems May 4, 2005

Specifying Crosstalk. Adam Healey Agere Systems May 4, 2005 Specifying Crosstalk Adam Healey Agere Systems May 4, 2005 Proposal Use the power-sum crosstalk (MDNEXT and MDFEXT) limits proposed by D Ambrosia et al. [1] as the normative specification for crosstalk.

More information

RiseUp RU8-DP-DV Series 19mm Stack Height Final Inch Designs in PCI Express Applications. Revision Date: March 18, 2005

RiseUp RU8-DP-DV Series 19mm Stack Height Final Inch Designs in PCI Express Applications. Revision Date: March 18, 2005 RiseUp RU8-DP-DV Series 19mm Stack Height Final Inch Designs in PCI Express Applications Revision Date: March 18, 2005 Copyrights and Trademarks Copyright 2005 Samtec, Inc. Developed in conjunction with

More information

Comparison Between Equalization, COM Package Models, and COM For 100G Base KR Channels

Comparison Between Equalization, COM Package Models, and COM For 100G Base KR Channels Comparison Between Equalization, COM Package Models, and COM For 100G Base KR Channels Richard Mellitz, Samtec September 018 1 Table of Contents Experiment using seven 100G-Base-KR channel models For three

More information

Q2 QMS/QFS 16mm Stack Height Final Inch Designs In PCI Express Applications Generation Gbps. Revision Date: February 13, 2009

Q2 QMS/QFS 16mm Stack Height Final Inch Designs In PCI Express Applications Generation Gbps. Revision Date: February 13, 2009 Q2 QMS/QFS 16mm Stack Height Final Inch Designs In PCI Express Applications Generation 2 5.0 Gbps Revision Date: February 13, 2009 Copyrights and Trademarks Copyright 2009 Samtec, Inc. Developed in conjunction

More information

Issue with 50G PAM4 C2M Specification

Issue with 50G PAM4 C2M Specification Issue with 50G PAM4 C2M Specification Ali Ghiasi Ghiasi Quantum LLC IEEE 802.3bs Electrical Adhoc Meeting Jan 23rd, 2017 Contributor/Supporter q Rich Mellitz Samtec q Yasuo Hidaka Fujitsu A. Ghiasi IEEE

More information

COM 2.40 with 100GEL Configurations Suggestions

COM 2.40 with 100GEL Configurations Suggestions COM 2.40 with 100GEL Configurations Suggestions Richard Mellitz, Samtec July 25, 2018, Ad Hoc IEEE 802.3 100 Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 1 COM 2.40 Adds long FFE capability

More information

High Speed Characterization Report. DVI-29-x-x-x-xx Mated With DVI Cable

High Speed Characterization Report. DVI-29-x-x-x-xx Mated With DVI Cable High Speed Characterization Report DVI-29-x-x-x-xx Mated With DVI Cable REVISION DATE: 07-18-2004 TABLE OF CONTENTS Introduction... 1 Product Description... 1 Overview... 2 Results Summary... 3 Time Domain

More information

ec ec IEEE motions Closing IEEE 802 EC Friday 10 th November 2017 IEEE Closing EC Items November 2017 Plenary Page 1

ec ec IEEE motions Closing IEEE 802 EC Friday 10 th November 2017 IEEE Closing EC Items November 2017 Plenary Page 1 IEEE 802.3 motions Closing IEEE 802 EC Friday 10 th November 2017 IEEE 802.3 Closing EC Items November 2017 Plenary Page 1 ME X.XXX: IEEE P802.3cd 50 Gb/s, 100 Gb/s, and 200 Gb/s Ethernet to Sponsor ballot

More information

GT Micro D High Speed Characterization Report For Differential Data Applications. Micro-D High Speed Characterization Report

GT Micro D High Speed Characterization Report For Differential Data Applications. Micro-D High Speed Characterization Report GT-14-19 Micro D For Differential Data Applications GMR7580-9S1BXX PCB Mount MWDM2L-9P-XXX-XX Cable Mount Revision History Rev Date Approved Description A 4/10/2014 C. Parsons/D. Armani Initial Release

More information

Copyright 2011 by Dr. Andrew David Norte. All Rights Reserved.

Copyright 2011 by Dr. Andrew David Norte. All Rights Reserved. Near-End Crosstalk Considerations For Coupled Microstriplines David Norte, PhD www.the-signal-and-power-integrity-institute.com Thornton, Colorado, 80234, USA Abstract This paper addresses the impact of

More information

Updated 50G PAM4 C2M Simulations

Updated 50G PAM4 C2M Simulations Updated 50G PAM4 C2M Simulations Ali Ghiasi Ghiasi Quantum LLC IEEE 802.3bs Electrical Adhoc Meeting Feb 20th, 2017 Contributor/Supporter q Rich Mellitz Samtec q Yasuo Hidaka Fujitsu A. Ghiasi IEEE 802.3

More information

100BASE-T1 EMC Test Specification for ESD suppression devices

100BASE-T1 EMC Test Specification for ESD suppression devices IEEE 100BASE-T1 EMC Test Specification for ESD suppression devices Version 1.0 Author & Company Dr. Bernd Körber, FTZ Zwickau Title 100BASE-T1 EMC Test Specification for ESD suppression devices Version

More information

IEEE Liaison report (Oct ) T v000 Tom Palkert, Macom

IEEE Liaison report (Oct ) T v000 Tom Palkert, Macom IEEE 802.3 Liaison report (Oct 5 2017) T11-2017-00328-v000 Tom Palkert, Macom IEEE 802.3 Base Standards in Force The current version in force is IEEE Std 802.3-2015. Subsequent approved amendments include:

More information

Physical Aspects of Packages for 100GEL & PKG ad-hoc Physical Aspects Summary

Physical Aspects of Packages for 100GEL & PKG ad-hoc Physical Aspects Summary Physical Aspects of Packages for 100GEL & PKG ad-hoc Physical Aspects Summary Liav Ben Artsi, Marvell Israel Ltd. September 2018 Suggested PKG Model Cases Length Ball Side Discontinuity Xtalk (Suggest

More information

University of New Hampshire InterOperability Laboratory Ethernet Consortium

University of New Hampshire InterOperability Laboratory Ethernet Consortium University of New Hampshire InterOperability Laboratory Ethernet Consortium As of January 3 rd, 1997 the Ethernet Consortium Clause # 28 Auto Negotiation State Machine Base Page Exchange Conformance Test

More information

Using ADS to Post Process Simulated and Measured Models. Presented by Leon Wu March 19, 2012

Using ADS to Post Process Simulated and Measured Models. Presented by Leon Wu March 19, 2012 Using ADS to Post Process Simulated and Measured Models Presented by Leon Wu March 19, 2012 Presentation Outline Connector Models From Simulation Connector Models From Measurement The Post processing,

More information

802.3bj FEC Overview and Status AMP_Valid and PCS_Lane TBDs DRAFT IEEE P802.3bs 400 Gb/s Ethernet Task Force Mark Gustlin - Xilinx

802.3bj FEC Overview and Status AMP_Valid and PCS_Lane TBDs DRAFT IEEE P802.3bs 400 Gb/s Ethernet Task Force Mark Gustlin - Xilinx 802.3bj FEC Overview and Status AMP_Valid and PCS_Lane TBDs DRAFT IEEE P802.3bs 400 Gb/s Ethernet Task Force Mark Gustlin - Xilinx Introduction There are several TBDs around the amp_valid and pcs_lane

More information

University of New Hampshire InterOperability Laboratory Ethernet Consortium

University of New Hampshire InterOperability Laboratory Ethernet Consortium University of New Hampshire InterOperability Laboratory Ethernet Consortium As of June 30 th, 1997 the Ethernet Consortium Clause # 28 Auto Negotiation State Machine Base Page Exchange Conformance Test

More information

Feedback from JasPar to the IEEE 802.3bp Task Force regarding Draft 2.0

Feedback from JasPar to the IEEE 802.3bp Task Force regarding Draft 2.0 Feedback from JasPar to the IEEE 802.3bp Task Force regarding Draft 2.0 Japan Automotive Software Platform and Architecture IEEE 802.3bp Interim Meeting September 2015 Andrew Klaus Japan Automotive Software

More information

Sequence Estimators with Block Termination in the presence of ISI

Sequence Estimators with Block Termination in the presence of ISI Hardware implementation i of Sequence Estimators with Block Termination in the presence of ISI Presentation to IEEE 802.3bj Arash Farhood Cortina Systems Joel Goergen Cisco Elizabeth Kochuparambil - Cisco

More information

Proposal for SAS 2.x Specification to Enable Support for Active Cables

Proposal for SAS 2.x Specification to Enable Support for Active Cables 08-052r2 Proposal for SAS 2.x Specification to Enable Support for Active Cables Gourgen Oganessyan QUELLAN March 7, 2008 Introduction Inclusion of active cable interconnect option into the SAS specification

More information

Feasibility of 30 db Channel at 50 Gb/s

Feasibility of 30 db Channel at 50 Gb/s Feasibility of 30 db Channel at 50 Gb/s Ali Ghiasi Ghiasi Quantum LLC 50 GbE & NGOATH Plenary Mee>ng March 16, 2016 List of supporters q Upen Reddy Kare> Cisco q Vipul BhaN Inphi q James Fife - etoups

More information

Application Note. PCIE-RA Series Final Inch Designs in PCI Express Applications Generation GT/s

Application Note. PCIE-RA Series Final Inch Designs in PCI Express Applications Generation GT/s PCIE-RA Series Final Inch Designs in PCI Express Applications Generation 3-8.0 GT/s Copyrights and Trademarks Copyright 2012, Inc. COPYRIGHTS, TRADEMARKS, and PATENTS Final Inch is a trademark of, Inc.

More information

Modeling of Connector to PCB Interfaces. CST User Group Meeting, September 14, 2007 Thomas Gneiting, AdMOS GmbH

Modeling of Connector to PCB Interfaces. CST User Group Meeting, September 14, 2007 Thomas Gneiting, AdMOS GmbH Modeling of Connector to PCB Interfaces CST User Group Meeting, September 14, 2007 Thomas Gneiting, AdMOS GmbH thomas.gneiting@admos.de Table of Content Introduction Parametric CST model of connector to

More information

SEAM-RA/SEAF-RA Series Final Inch Designs in PCI Express Applications Generation GT/s

SEAM-RA/SEAF-RA Series Final Inch Designs in PCI Express Applications Generation GT/s SEAM-RA/SEAF-RA Series Final Inch Designs in PCI Express Applications Generation 3-8.0 GT/s Copyrights and Trademarks Copyright 2011 Samtec, Inc. Developed in conjunction with Teraspeed Consulting Group

More information

Application Note. PCIE-EM Series Final Inch Designs in PCI Express Applications Generation GT/s

Application Note. PCIE-EM Series Final Inch Designs in PCI Express Applications Generation GT/s PCIE-EM Series Final Inch Designs in PCI Express Applications Generation 3-8.0 GT/s Copyrights and Trademarks Copyright 2015, Inc. COPYRIGHTS, TRADEMARKS, and PATENTS Final Inch is a trademark of, Inc.

More information

NGAuto Channel Modeling and Analysis

NGAuto Channel Modeling and Analysis NGAuto Channel Modeling and Analysis Eric DiBiaso (TE Connectivity), Bert Bergner (TE Connectivity), Chris Mandel (TE Connectivity) Supporters: IEEE 802.3ch Multi-Gig Automotive Ethernet PHY Task Force

More information

FDTD-Based Statistical Analysis of Crosstalk on Planar Data buses

FDTD-Based Statistical Analysis of Crosstalk on Planar Data buses FDTD-Based Statistical Analysis of Crosstalk on Planar Data buses Loubna Tani, Nabih El ouazzani Faculty of Sciences and Technology Fez Signals, Systems and Components laboratory EMC unit Fez Morocco Corresponding

More information

XPort Direct+ NC Addendum

XPort Direct+ NC Addendum XPort Direct+ NC Addendum Part No. 900-535 Rev. A February 2008 Contents Overview 3 PCB Interface Signals 3 Connecting XPort Direct+ NC to an Ethernet Port 4 Selecting LAN Magnetics 4 Common-Mode Choke

More information

Multidrop Ethernet for In-cabinet Applications

Multidrop Ethernet for In-cabinet Applications Multidrop Ethernet for In-cabinet Applications David D. Brandt Rockwell Automation IEEE P802.3cg 10 Mb/s Single Twisted Pair Ethernet Task Force Mar. 2017 Plenary Meeting, Vancouver, BC Canada Page 1 Purpose

More information

Acu-Trac Ultrasonic Level Sensors

Acu-Trac Ultrasonic Level Sensors General SSI s Acu-Trac ultrasonic level sensors broadcast and receive commands over a standard TIA/EIA RS- 485 serial data bus enabling the sensors to communicate and share data with other modules located

More information

CW211 Specification High-Speed USB2.0(480Mbps)DPDT Switch

CW211 Specification High-Speed USB2.0(480Mbps)DPDT Switch CW211 Specification High-Speed USB2.0(480Mbps)DPDT Switch Chipwiser Technology Co.Ltd Copyright@2009,Chipwiser Technology Co.Ltd All right reserved Chipwiser Technology 1/9 GENERAL DESCRIPTION CW211 is

More information

QPairs QTE/QSE-DP Multi-connector Stack Designs In PCI Express Applications 16 mm Connector Stack Height REVISION DATE: OCTOBER 13, 2004

QPairs QTE/QSE-DP Multi-connector Stack Designs In PCI Express Applications 16 mm Connector Stack Height REVISION DATE: OCTOBER 13, 2004 Application Note QPairs QTE/QSE-DP Multi-connector Stack Designs In PCI Express Applications 16 mm Connector Stack Height REVISION DATE: OCTOBER 13, 2004 Copyrights and Trademarks Copyright 2004 Samtec,

More information

COM 2.51 with rxffe updates

COM 2.51 with rxffe updates COM 2.51 with rxffe updates Richard Mellitz, Samtec Oct. 3, 2018 1 Table of Contents Zero forcing DFE - review Experimental Features Modification in diagram Vector forcing DFE/RxFFE Algorithm to compute

More information

Latency and FEC options for 25G Ethernet

Latency and FEC options for 25G Ethernet Latency and FEC options for 25G Ethernet Adee Ran Intel Corp. August 2014 August 12, 2014 IEEE 802.3 25 Gb/s Ethernet Study Group 1 Goals Explore FEC encoding/decoding options Discuss FEC gain/latency

More information

IEEE P802.3bs D Gb/s & 400 Gb/s Ethernet 4th Sponsor recirculation ballot comments

IEEE P802.3bs D Gb/s & 400 Gb/s Ethernet 4th Sponsor recirculation ballot comments l 0 S 0 P L Berger, atherine # r04-1 l 120D S 120D.3.1.1 P 352 L 13 # r04-10 omment Type G omment Status A This draft meets all editorial requirements. AEPT. omment Type T omment Status A The value of

More information

PCIEC PCI Express Jumper High Speed Designs in PCI Express Applications Generation GT/s

PCIEC PCI Express Jumper High Speed Designs in PCI Express Applications Generation GT/s PCIEC PCI Express Jumper High Speed Designs in PCI Express Applications Generation 3-8.0 GT/s Mated with PCIE-RA Series PCB Connectors Copyrights and Trademarks Copyright 2015, Inc. COPYRIGHTS, TRADEMARKS,

More information

Product Specification DataSheet

Product Specification DataSheet Product Specification DataSheet SFP-10G-ER RoHS Compliant 10Gb/s SFP+ 1550nm 40km Optical Transceiver PRODUCT FEATURES Hot pluggable 10Gb/s serial optical interface Up to 40km on 9/125um SMF Compliant

More information

Prolabs SFP-1G-T. Datasheet: Transceivers. SFP-1G-T Copper Transceiver. Ordering Information. Introduction. Key Features. Applications 1 / 7

Prolabs SFP-1G-T. Datasheet: Transceivers. SFP-1G-T Copper Transceiver. Ordering Information. Introduction. Key Features. Applications 1 / 7 Prolabs SFP-1G-T SFP-1G-T Copper Transceiver Key Features Up to 1.25 GBd bi-directional data links Compliant with IEEE 802.3z, IEEE 802.3u, IEEE 802.3ab Compliant with SFP MSA Hot-pluggable SFP footprint

More information

10 Mb/s Single Twisted Pair Ethernet Noise Measurements Steffen Graber Pepperl+Fuchs

10 Mb/s Single Twisted Pair Ethernet Noise Measurements Steffen Graber Pepperl+Fuchs 10 Mb/s Single Twisted Pair Ethernet Noise Measurements Steffen Graber Pepperl+Fuchs IEEE P802.3cg 10 Mb/s Single Twisted Pair Ethernet Task Force 4/24/2017 1 Content Impulsive Noise Measurement Setup

More information

Operation Manual for VXC4000 VXC4000 V

Operation Manual for VXC4000 VXC4000 V Variable Crosstalk Coupler VXC4000 Operation Manual for VXC4000 K VXC4000 V Rev 1.0 August 2015 Introduction... 2 Safety Instruction... 2 1. General... 4 Features... 4 2. Connectors & Switches... 5 2 1

More information

10. Interconnects in CMOS Technology

10. Interconnects in CMOS Technology 10. Interconnects in CMOS Technology 1 10. Interconnects in CMOS Technology Jacob Abraham Department of Electrical and Computer Engineering The University of Texas at Austin VLSI Design Fall 2017 October

More information

Compliance test method and detailed spec for - USB2.0. Tektronix Korea YJ.PARK

Compliance test method and detailed spec for - USB2.0. Tektronix Korea YJ.PARK Compliance test method and detailed spec for - USB2.0 Tektronix Korea YJ.PARK 1 Agenda Introduction to USB2.0 Architecture Overview Frame Work and Data Transfer USB2.0 Spec. and Compliance testing Tektronix

More information

EZL-200F Application Notes (003) Serial Interface (RS232/RS422/RS485)

EZL-200F Application Notes (003) Serial Interface (RS232/RS422/RS485) Application Notes (003) Serial Interface (RS232/RS422/RS485) Version 2.0 Sollae Systems Co., Ltd. 1. Overview supports three serial interfaces: RS232, RS422, and RS485. You can select the interface you

More information

XSFP-T-RJ Base-T Copper SFP Transceiver

XSFP-T-RJ Base-T Copper SFP Transceiver Product Overview The electrical Small Form Factor Pluggable (SFP) transceiver module is specifically designed for the high performance integrated full duplex data link at 1.25Gbps over four pair Category

More information

Common Mode Noise Filter. LCFE Series. Description. Features. Applications. 1210mm Size. Source Meter. LCR Meter (3GHz) Source Meter.

Common Mode Noise Filter. LCFE Series. Description. Features. Applications. 1210mm Size. Source Meter. LCR Meter (3GHz) Source Meter. Description This specification covers the engineering requirements for both Common Mode Noise Filter (CMF) and ESD Protection, especially high speed differential serial interfaces, such as USB 3., USB

More information

NBASE-T and IEEE802.3bz Ethernet Testing 7 MARCH 2016

NBASE-T and IEEE802.3bz Ethernet Testing 7 MARCH 2016 NBASE-T and IEEE802.3bz Ethernet Testing Agenda Market Drivers for 2.5G/5G Ethernet Data Rates 2.5G/5G Ethernet Transmitter Test Challenges and Solutions Testing Approach for 2.5G/5G Data Rates Information/Resources

More information

INPAQ Global RF/Component Solutions

INPAQ Global RF/Component Solutions HCE 1012 GH 900 BP Specification Product Name Series Part No Chip Common Mode Filter plus ESD Function HCE Series HCE 1012 GH 900 BP Size EIAJ 1012 HCE1012G SERIES (Chip Common Mode Filter plus ESD function)

More information

Board Design Guidelines for PCI Express Architecture

Board Design Guidelines for PCI Express Architecture Board Design Guidelines for PCI Express Architecture Cliff Lee Staff Engineer Intel Corporation Member, PCI Express Electrical and Card WGs The facts, techniques and applications presented by the following

More information

General Purpose, Low Noise NPN Silicon Bipolar Transistor. Technical Data AT AT-41533

General Purpose, Low Noise NPN Silicon Bipolar Transistor. Technical Data AT AT-41533 General Purpose, Low Noise NPN Silicon Bipolar Transistor Technical Data AT-411 AT-433 Features General Purpose NPN Bipolar Transistor 9 MHz Performance: AT-411: 1 db NF,. db G A AT-433: 1 db NF, 14. db

More information

SFP-GIG-T-LEG. 1.25Gbps SFP Copper Transceiver

SFP-GIG-T-LEG. 1.25Gbps SFP Copper Transceiver Part# 39665 SFP-GIG-T-LEG ALCATEL-LUCENT COMPATIBLE 1000BASE-TX SFP COPPER 100M REACH RJ-45 SFP-GIG-T-LEG 1.25Gbps SFP Copper Transceiver Features Up to 1.25Gb/s bi-directional data links Hot-pluggable

More information

RoHS compliant RJ45 gigabit Ethernet Small Form Pluggable (SFP), 3.3V 1000BASE Ethernet. Performance

RoHS compliant RJ45 gigabit Ethernet Small Form Pluggable (SFP), 3.3V 1000BASE Ethernet. Performance Features Compliant with IEEE 802.3z Gigabit Ethernet Standard Compliant with SFP MSA specifications. Supports auto-negotiation 10/100/1000BASE-T operation in host system with SGMII interface. Supports

More information

Category 8 paves the way for IEEE 40GBASE-T. David Hughes RCDD/DCDC/NTS Senior Technical Manager MEA CommScope

Category 8 paves the way for IEEE 40GBASE-T. David Hughes RCDD/DCDC/NTS Senior Technical Manager MEA CommScope Category 8 paves the way for IEEE 40GBASE-T David Hughes RCDD/DCDC/NTS Senior Technical Manager MEA CommScope Agenda Market need for 40 G over balanced twisted pair cabling Standards ISO/IEC 11801-99-1

More information

BT6201 FOUR-CHANNEL 30GB/S BERT (V.2.5)

BT6201 FOUR-CHANNEL 30GB/S BERT (V.2.5) BT6201 FOUR-CHANNEL 30GB/S BERT (V.2.5) The STELIGENT BT6201 is a high performance, easy to use, 4 Lanes, cost-effective, 4 x 30 Gb/s Bit Error-Rate Tester (BERT) for current 100 G TOSA/ROSA components

More information

USING THE VENABLE RLC WINDOWS SOFTWARE VERSION 4.5

USING THE VENABLE RLC WINDOWS SOFTWARE VERSION 4.5 USING THE VENABLE RLC WINDOWS SOFTWARE VERSION 4.5 FOR MODELS 350/3120/3215/3225/3235 AND Series 43xx/51xx/63xx/74xx/88xx/350c System Venable Instruments 8656 SH 71 West, Bldg. E Cuesta Center Austin,

More information

Circuit Model for Interconnect Crosstalk Noise Estimation in High Speed Integrated Circuits

Circuit Model for Interconnect Crosstalk Noise Estimation in High Speed Integrated Circuits Advance in Electronic and Electric Engineering. ISSN 2231-1297, Volume 3, Number 8 (2013), pp. 907-912 Research India Publications http://www.ripublication.com/aeee.htm Circuit Model for Interconnect Crosstalk

More information

AT-41511, AT General Purpose, Low Noise NPN Silicon Bipolar Transistors. Data Sheet. Description. Features. Pin Connections and Package Marking

AT-41511, AT General Purpose, Low Noise NPN Silicon Bipolar Transistors. Data Sheet. Description. Features. Pin Connections and Package Marking AT-4111, AT-4133 General Purpose, Low Noise NPN Silicon Bipolar Transistors Data Sheet Description Avago s AT-4111 and AT-4133 are general purpose NPN bipolar transistors that offer excellent high frequency

More information

DesignCon 2005 Track 5: Chip and Board Interconnect Design (5-TA2)

DesignCon 2005 Track 5: Chip and Board Interconnect Design (5-TA2) DesignCon 2005 Track 5: Chip and Board Interconnect Design (5-TA2) Connector-Less Probing: Electrical and Mechanical Advantages Authors/Presenters: Brock LaMeres, Agilent Technologies Brent Holcombe, Agilent

More information

Application Note AN105 A1. PCB Design and Layout Considerations for Adesto Memory Devices. March 8, 2018

Application Note AN105 A1. PCB Design and Layout Considerations for Adesto Memory Devices. March 8, 2018 Application Note AN105 A1 PCB Design and Layout Considerations for Adesto Memory Devices March 8, 2018 Adesto Technologies 2018 3600 Peterson Way Santa Clara CA. 95054 Phone 408 400 0578 www.adestotech.com

More information

XFP Bi-Directional 10G 80km Tx1490/Rx1550nm & Tx1550/Rx1490nm SLXFB-XXXX-80

XFP Bi-Directional 10G 80km Tx1490/Rx1550nm & Tx1550/Rx1490nm SLXFB-XXXX-80 XFP Bi-Directional 10G 80km Tx1490/Rx1550nm & Tx1550/Rx1490nm SLXFB-XXXX-80 Description Sourcelight SLXFB-XXXX-80 is XFP BIDI 80KM transceivers are designed for 10G Ethernet 10G BASE-LR/LW per 802.3ae

More information

AVLC 0201 series Ultra Compact Size Multilayer Chip Varistor

AVLC 0201 series Ultra Compact Size Multilayer Chip Varistor AVLC 0201 series Ultra Compact Size Overview ESD Varistor is a component which acts as a nonconductor on the circuit in normal circum-stances. When over-voltage is loaded, it becomes a conductor which

More information

LED operation guidelines for LZ LED products

LED operation guidelines for LZ LED products operation guidelines for LZ products A. Introduction The new LedEngin LZ products are extremely energy efficient with a low forward voltage for a given driving current. However, when switching power supplies

More information

IEEE RTPGE. Optimisation of physical layer components for RTPGE. Thomas Müller, Gunnar Armbrecht, Stephan Kunz (Rosenberger)

IEEE RTPGE. Optimisation of physical layer components for RTPGE. Thomas Müller, Gunnar Armbrecht, Stephan Kunz (Rosenberger) Optimisation of physical layer components for RTPGE Thomas Müller, Gunnar Armbrecht, Stephan Kunz (Rosenberger) Supporters: Mehmet Tazebay (Broadcom) Thomas Suermann (NXP) Rosenberger Hochfrequenztechnik

More information

Channel Based Methods for Signal Integrity Evaluation COMPAL ELECTRONICS, INC. Taipei Server Business Aug 13, 2013

Channel Based Methods for Signal Integrity Evaluation COMPAL ELECTRONICS, INC. Taipei Server Business Aug 13, 2013 Channel Based Methods for Signal Integrity Evaluation COMPAL ELECTRONICS, INC. Taipei Server Business Aug 13, 2013 Agenda Evolution of Signal Integrity Evaluation Review of Industrial Specification Foundation

More information

Agilent L4433A Dual/Quad 4x8 Reed Matrix

Agilent L4433A Dual/Quad 4x8 Reed Matrix Agilent L4433A Dual/Quad 4x8 Reed Matrix Data Sheet LXI compliance includes built-in Ethernet connectivity Fully-featured graphical Web interface Dual 4x8, 8x8, or 4x16 2-wire configurations 64 2-wire

More information

CDMSP M Surface Mount TVS Diode Array

CDMSP M Surface Mount TVS Diode Array *RoHS COMPLIANT Features RoHS compliant* Protects four I/O lines Ultra-low capacitance ~.55 pf ESD protection > kv Surge protection Applications High Definition Multimedia Interface (HDMI) Digital Visual

More information

Produto: 10Gbps XFP Transceiver, Single Mode, 40km Reach Modelo: V7-XFP-ER31 Documentação: Técnica/Datasheet. Features

Produto: 10Gbps XFP Transceiver, Single Mode, 40km Reach Modelo: V7-XFP-ER31 Documentação: Técnica/Datasheet. Features Produto: 10Gbps XFP Transceiver, Single Mode, 40km Reach Modelo: V7-XFP-ER31 Documentação: Técnica/Datasheet Features Supports 8.0Gb/s to 11.1Gb/s bit rates Hot-pluggable XFP footprint, Built-in digital

More information

Ethernet OptoLock EDL300T

Ethernet OptoLock EDL300T Ethernet OptoLock EDL300T DATA SHEET 650 nm 100 Mbps Ethernet Fiber Optic Transceiver with Termination for Bare POF Seamless Digital to Light/ Light to Digital Conversion FEATURES Simple low-cost termination

More information

Per Hop Worst Case Class A Latency

Per Hop Worst Case Class A Latency Per Hop Worst Case Class A Latency Christian Boiger christian.boiger@fh-deggendorf.de IEEE 802 Plenary Meeting March 2011 Singapore 1 Latency Calculations - The latency calculations in this presentation

More information

Contents. 0 Introduction. 1 Scope. Page 1

Contents. 0 Introduction. 1 Scope. Page 1 STANDARDISERINGEN I SVERIGE SWEDISH STANDARDS INSTITUTION SWEDISH STANDARD SS 63 63 24 Handläggande organ/standardizing body Fastställd/Approved Utgåva/Edition Sida/Page ITS Information Technology Standardization

More information

Path forward for 100G SMF objectives in 802.3cd

Path forward for 100G SMF objectives in 802.3cd Path forward for 100G SMF objectives in 802.3cd Gary Nicholl - Cisco Matt Brown - APM Chris Cole - Finisar Dave Lewis - Lumentum Hai-Feng Liu - Intel Jeff Maki - Juniper Peter Stassar - Huawei Kohichi

More information

Fast-20 SCSI Parallel Interface. TO: Membership of X3T10 X3T10/94-061r4

Fast-20 SCSI Parallel Interface. TO: Membership of X3T10 X3T10/94-061r4 TO: Membership of X3T10 FROM: SUBJECT: L. Lamers / J. Lohmeyer Fast-20 SCSI proposal for working draft DATE: May 9, 1994 This revision (4) incorporates the changes suggested by the May 5, 1994 Fast-20

More information

Characterize and Debug Crosstalk Issues with Keysight Crosstalk Analysis App

Characterize and Debug Crosstalk Issues with Keysight Crosstalk Analysis App Chong Min-Jie Characterize and Debug Crosstalk Issues with Crosstalk Analysis App Page Characterize and Debug Crosstalk Issues with Crosstalk Analysis App Min-Jie Chong HPS Product Manager & Planner Oscilloscope

More information

DATASHEET 0201 / 0402 / AVL / AVLC Series

DATASHEET 0201 / 0402 / AVL / AVLC Series Document Datasheet Type Multilayer Chip Varistor Application ESD protection Part No. AVL/ AVLC series Revision 0 DATASHEET 0201 / 0402 / 0603 AVL / AVLC Series Applications Mobile Phone & PDA Cellular

More information

Solving MIPI D-PHY Receiver Test Challenges

Solving MIPI D-PHY Receiver Test Challenges Stefan Walther and Yu Hu Verigy stefan.walther@verigy.com yu.hu@verigy.com Abstract MIPI stands for the Mobile Industry Processor Interface, which provides a flexible, low-cost, high-speed interface solution

More information

ISOLATED RS-232 TO RS-422/485 CONVERTER

ISOLATED RS-232 TO RS-422/485 CONVERTER QUICK START GUIDE ICD400A ISOLATED RS-232 TO RS-422/485 CONVERTER 24/7 TECHNICAL SUPPORT AT 877.877.2269 OR VISIT BLACKBOX.COM STEP 1 - Specifications Complies with FCC Class B and CE requirements. Withstands

More information

Isolated, Voltage or Current Input 7B41 FEATURES APPLICATIONS PRODUCT OVERVIEW FUNCTIONAL BLOCK DIAGRAM

Isolated, Voltage or Current Input 7B41 FEATURES APPLICATIONS PRODUCT OVERVIEW FUNCTIONAL BLOCK DIAGRAM Isolated, Voltage or Current Input 7B41 FEATURES Interfaces, amplifies and filters unipolar and bipolar voltage inputs. Module provides a precision output of either +1 V to +5 V or 0 V to +10 V. All 7B41

More information

DM9051NP Layout Guide

DM9051NP Layout Guide NP Version: 1.1 Technical Reference Manual Davicom Semiconductor, Inc Version: NP-LG-V11 1 1. Placement, Signal and Trace Routing Place the 10/100M magnetic as close as possible to the (no more than 20mm)

More information

InfiniBand FDR 56-Gbps QSFP+ Active Optical Cable PN: WST-QS56-AOC-Cxx

InfiniBand FDR 56-Gbps QSFP+ Active Optical Cable PN: WST-QS56-AOC-Cxx Data Sheet PN: General Description WaveSplitter s Quad Small Form-Factor Pluggable Plus (QSFP+) active optical cables (AOC) are highperformance active optical cable with bi-directional signal transmission

More information

COM Analysis on Backplane and Cu DAC Channels

COM Analysis on Backplane and Cu DAC Channels COM Analysis on Backplane and Cu DAC Channels Ali Ghiasi Ghiasi Quantum LLC IEEE 802.3cd Task Force Mee@ng Whistler May 25, 2016 Overview q Follow on the Macau presenta@on q Inves@ga@ng COM analysis on

More information

8. Selectable I/O Standards in Arria GX Devices

8. Selectable I/O Standards in Arria GX Devices 8. Selectable I/O Standards in Arria GX Devices AGX52008-1.2 Introduction This chapter provides guidelines for using industry I/O standards in Arria GX devices, including: I/O features I/O standards External

More information

ISO/IEC 11801: (E)

ISO/IEC 11801: (E) ISO/IEC 11801:2002-09 (E) Information technology_- Generic cabling for customer premises CONTENTS FOREWORD...10 INTRODUCTION...11 1 Scope...13 2 Normative references...13 3 Definitions, abbreviations and

More information

Produto: 1.25Gbps SFP Optical Transceiver, 550m Reach, with DDM Modelo: V7-SFP-0301D Documentação: Técnica/Datasheet

Produto: 1.25Gbps SFP Optical Transceiver, 550m Reach, with DDM Modelo: V7-SFP-0301D Documentação: Técnica/Datasheet Produto: 1.25Gbps SFP Optical Transceiver, 550m Reach, with DDM Modelo: V7-SFP-0301D Documentação: Técnica/Datasheet Features Data-rate of 1.25Gbps operation 850nm VCSEL laser and PIN photodetector Compliant

More information

ASNT1016-PQA 16:1 MUX-CMU

ASNT1016-PQA 16:1 MUX-CMU 16:1 MUX-CMU 16 to 1 multiplexer (MUX) with integrated CMU (clock multiplication unit). PLL-based architecture featuring both counter and forward clocking modes. Supports multiple data rates in the 9.8-12.5Gb/s

More information

Channels for Consideration by the Signaling Ad Hoc

Channels for Consideration by the Signaling Ad Hoc Channels for Consideration by the Signaling Ad Hoc John D Ambrosia Tyco Electronics Adam Healey, Agere Systems IEEE P802.3ap Signaling Ad Hoc September 17, 2004 Two-Connector Topology N2 H B September,

More information

Alternative B Type Mid-Span Power Sourcing Equipment. User s Guide

Alternative B Type Mid-Span Power Sourcing Equipment. User s Guide Alternative B Type Mid-Span Power Sourcing Equipment User s Guide REGULATORY STATEMENTS FCC Certifications This equipment has been tested and found to comply with the limits for a Class B digital device,

More information

AN10035_1 Comparing energy efficiency of USB at full-speed and high-speed rates

AN10035_1 Comparing energy efficiency of USB at full-speed and high-speed rates Comparing energy efficiency of USB at full-speed and high-speed rates October 2003 White Paper Rev. 1.0 Revision History: Version Date Description Author 1.0 October 2003 First version. CHEN Chee Kiong,

More information

TF90LVDS047-6CG. Quad LVDS Line Driver with Flow-Through Pinout. Description. Features. Applications. Function Diagram. Ordering Information

TF90LVDS047-6CG. Quad LVDS Line Driver with Flow-Through Pinout. Description. Features. Applications. Function Diagram. Ordering Information Features Companion driver to Quad Extended Common Mode LVDS Receiver TF0LVDS048 DC to 400 Mbps / 200 MHz low noise, low skew, low power operation t 350 ps (max) channel-to-channel skew t 250 ps (max) pulse

More information

AOZ8809ADI. Ultra-Low Capacitance TVS Diode. Features. General Description. Applications. Typical Applications

AOZ8809ADI. Ultra-Low Capacitance TVS Diode. Features. General Description. Applications. Typical Applications Ultra-Low Capacitance TVS Diode General Description The AOZ889ADI is a transient voltage suppressor array designed to protect high speed data lines such as HDMI 1.4/2., USB 3./3.1, MDDI, SATA, and Gigabit

More information

HSP series portfolio overview. High-speed port ESD protection

HSP series portfolio overview. High-speed port ESD protection HSP series portfolio overview High-speed port ESD protection Is this presentation suited for you? 2 Where do you stand with high-speed port protection? Beginner? I am not familiar with this subject. I

More information

Crosstalk Analysis of ATC2 and impurity measurements

Crosstalk Analysis of ATC2 and impurity measurements Crosstalk Analysis of ATC2 and impurity measurements Institute for nuclear physics University of Cologne March 29 B. Birkenbach, B. Bruyneel, J. Eberth, H.Hess, D. Lersch, G. Pascovici, P. Reiter, A. Wiens,

More information