Reference Architecture Proposals and Channel Data

Size: px
Start display at page:

Download "Reference Architecture Proposals and Channel Data"

Transcription

1 Reference Architecture Proposals and Channel Data Richard Mellitz, Samtec Howard Heck. Intel Contribution Acknowledgment: Oluwafemi Akinwale and Subas Bastola, Intel IEEE802.3 Plenary July 2018, San Diego, Ca IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 1

2 Outline 4 COM architectures Data for each architecture vs a collection of channels Next steps IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 2

3 4 Signal Architecture Approaches 1. Zero Forced DFE 2. Quantized Forced DFE 3. One DFE tap and a number of (Rx)FFE taps 4. One DFE tap and a number of (Rx)FFE taps with gain at cursor IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 3

4 COM is based on the pulse response (Annex 93A) Thru (ISI) channel response is h (0) (t) i.e. the pulse response The following uses pulse response plots to describe COM equalization IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 4

5 Zero Forced (ZF) DFE All legal Tx FFE and CTF (continuous time function) settings are considered Called a full grid search Caveat: Very often CTF settings dominate over the Tx FFE post cursor. Exception: Samples corresponding to DFE cursor of is h (0) (t) greater than certain values (b max ) are converted in to ISI noise Example where 1 st DFE tap reach limit creating ISI noise Pulse response IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 5

6 Quantized DFE Same as Zero force except: Samples corresponding to a DFE cursor h (0) (t n ) greater than the DFE quantization step size are also converted into ISI noise Pulse response IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 6

7 One DFE tap + (Rx)FFE Same full grid as for zero forced DFE except 1 tap of DFE w/ an Rx FFE of a specified number and resolution of pre-cursors and post-cursors are determined from a vector forced optimization. The cursor for the vector forcing is h (0) (t s ) where t s is the sample point and The first post cursor is set the maximum allowed setting (b max ) C=((HH'*HH)^-1*HH')'*FV ; C are the Rx FFE taps HH is derived from h (0) (t) FV is the forcing vector, FV = [... 0, 0, As, bmax(1)*as, 0, 0, 0, 0...] FOM is computed from each CTF and Tx FFE setting with h fferx (f) is computed from the C found as in eq 93A-32 FFE(3,32) used here for now 3 precursors and 32 post cursors IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 7

8 One DFE tap + (Rx) FFE w/ Cursor Gain Same as one DFE tap and a number of Rx FFE taps (pre and post cursor) except: The cursor for the vector forcing (h (0) (t s ) where t s is the sample point) has some gain C=((HH'*HH)^-1*HH')'*FV ; C are the Rx FFE taps HH is derived from h (0) (t) FV is the forcing vector, FV = [... 0, 0, As*10 gain 20, b max (1)*As, 0, 0, 0, 0...] 3 db gain seems to work best IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 8

9 Table 93A-1 parameters I/O control Table 93A 3 parameters Parameter Setting Units Information DIAGNOSTICS 1 logical Parameter Setting Units f_b GBd DISPLAY_WINDOW 1 logical package_tl_gamma0_a1_a2 [ e e-4] f_min 0.05 GHz CSV_REPORT 1 logical package_tl_tau 6.141E-03 ns/mm Delta_f 0.01 GHz RESULT_DIR.\results\100G_Study_Grou p_{date}\ package_z_c 90 Ohm (tdr sel) C_d [1.3e-4 1.3e-4] nf [TX RX] SAVE_FIGURES 0 logical z_p select [ 2 ] [test cases to run] Port Order [ ] Table parameters z_p (TX) [12 30] mm [test cases] RUNTAG KR_Study_Group Parameter Setting z_p (NEXT) [12 30] mm [test cases] Receiver testing board_tl_gamma0_a1_a2 [ e e-4] z_p (FEXT) [12 30] mm [test cases] RX_CALIBRATION 0 logical board_tl_tau 6.191E-03 ns/mm z_p (RX) [12 30] mm [test cases] Sigma BBN step 5.00E-03 V board_z_c 110 Ohm C_p [1.1e-4 1.1e-4] nf [TX RX] IDEAL_TX_TERM 0 logical z_bp (TX) 151 mm R_0 50 Ohm T_r 6.16E-03 ns z_bp (NEXT) 72 mm R_d [ 50 50] Ohm [TX RX] or selected FORCE_TR 1 logical z_bp (FEXT) 72 mm f_r 0.75 *fb z_bp (RX) 151 mm c(0) 0.6 min Non standard control options c(-1) [-0.28:0.025:0] [min:step:max] COM_CONTRIBUTION 0 logical c(-2) [0:0.05:0.1] [min:step:max] TDR 1 logical c(-3) [-0.1:0.025:0] [min:step:max] ERL 1 logical c(-4) 0 [min:step:max] ERL_ONLY 0 logical c(1) [-0.05:.025:0] [min:step:max] TR_TDR ns g_dc [-20:1:10] db [min:step:max] N 1000 f_z GHz TDR_Butterworth 1 logical f_p GHz beta_x 1.70E+09 f_p GHz rho_x 0.18 A_v 0.41 V tdr selected fixture delay time 0 A_fe 0.41 V tdr selected Rx FFE A_ne 0.6 V tdr selected ffe_pre_tap_len 0 UI L 4 ffe_post_tap_len 0 UI M 32 ffe_tap_step_size 0.01 N_b 32 UI ffe_main_cursor_min 0.7 N_b_step 0 normailized ffe_pre_tap1_max 0.3 b_max(1) 0.7 ffe_post_tap1_max 0.3 b_max(2..n_b) 0.2 ffe_tapn_max 0.1 sigma_rj 0.01 UI A_DD 0.02 UI eta_0 8.20E-09 V^2/GHz SNR_TX 32.5 db tdr selected R_LM 0.95 DER_0 1.00E-04 Operational control COM Pass threshold 3 db Include PCB 0 Value 0, 1, 2 g_dc_hp [-6:1:0] [min:step:max] f_hp_pz GHz COM config sheet for ZF or Q DFE Set to zero N_b 32 UI N_b_step normailized Q DFE For reference IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 9

10 Table 93A-1 parameters I/O control Table 93A 3 parameters Parameter Setting Units Information DIAGNOSTICS 1 logical Parameter Setting Units f_b GBd DISPLAY_WINDOW 1 logical package_tl_gamma0_a1_a2 [ e e-4] f_min 0.05 GHz CSV_REPORT 1 logical package_tl_tau 6.141E-03 ns/mm Delta_f 0.01 GHz RESULT_DIR.\results\100G_Study_Group _{date}\ package_z_c 90 Ohm (tdr sel) C_d [1.3e-4 1.3e-4] nf [TX RX] SAVE_FIGURES 0 logical z_p select [ 2 ] [test cases to run] Port Order [ ] Table parameters z_p (TX) [12 30] mm [test cases] RUNTAG CK_100GEL Parameter Setting z_p (NEXT) [12 30] mm [test cases] Receiver testing board_tl_gamma0_a1_a2 [ e e-4] z_p (FEXT) [12 30] mm [test cases] RX_CALIBRATION 0 logical board_tl_tau 6.191E-03 ns/mm z_p (RX) [12 30] mm [test cases] Sigma BBN step 5.00E-03 V board_z_c 110 Ohm C_p [1.1e-4 1.1e-4] nf [TX RX] IDEAL_TX_TERM 0 logical z_bp (TX) 151 mm R_0 50 Ohm T_r 6.16E-03 ns z_bp (NEXT) 72 mm R_d [ 50 50] Ohm [TX RX] or selected FORCE_TR 1 logical z_bp (FEXT) 72 mm f_r 0.75 *fb z_bp (RX) 151 mm c(0) 0.6 min Non standard control options c(-1) [-0.28:0.025:0] [min:step:max] COM_CONTRIBUTION 0 logical c(-2) [0:0.05:0.1] [min:step:max] TDR 1 logical c(-3) 0 [min:step:max] ERL 1 logical c(-4) 0 [min:step:max] ERL_ONLY 0 logical c(1) [-0.05:.025:0] [min:step:max] TR_TDR ns g_dc [-20:1:10] db [min:step:max] N 1000 f_z GHz TDR_Butterworth 1 logical f_p GHz beta_x 1.70E+09 f_p GHz rho_x 0.18 A_v 0.41 V tdr selected fixture delay time 0 A_fe 0.41 V tdr selected A_ne 0.6 V tdr selected Rx FFE L 4 ffe_pre_tap_len 3 UI M 32 ffe_post_tap_len 32 UI N_b 1 UI ffe_tap_step_size 0.01 b_max(1) 0.7 ffe_main_cursor_min 0.7 b_max(2..n_b) 0.2 ffe_pre_tap1_max 0.3 sigma_rj 0.01 UI ffe_post_tap1_max 0.3 A_DD 0.02 UI ffe_tapn_max 0.1 eta_0 8.20E-09 V^2/GHz crusor_gain 0:1:4 db SNR_TX 32.5 db tdr selected R_LM 0.95 DER_0 1.00E-04 Operational control COM Pass threshold 3 db Include PCB 0 Value 0, 1, 2 g_dc_hp [-6:1:0] [min:step:max] f_hp_pz GHz Set to zero for no gain COM config sheet for FFE and w/wo gain For reference IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 10

11 Reference: ZF DFE Channels: Cabled backplane (2) Cabled fabric switch (12) Used channels with COM 2.3dB Analysis used 32 taps total (DFE+FFE or DFE-only) Is the ZF DFE too optimistic Does the implication of the ZF DFE require too much power IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 11

12 Data Summary Quantized DFE seems like just derating COM of the ZF DFE FFE with gain seems to get closer to ZF DFE for high loss IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 12

13 COM Correlations to DFE-based COM Stat Uncertainty More variability for the FFE based COM X and Y axis are db of COM IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 13

14 Summary & Next Steps Reference EQ architecture choices impact on COM results More variability in results with DFE+FFE-based reference EQ Is a quantized DFE good enough? It seems like it is the same as raising the COM threshold Follow-on work Assess the sensitivity to # of taps in the Rx Equalizer Look at algorithm to better optimize gain in FFE; goal being to reduce uncertainty in results Follow-work for channels: Address PCB manufacturing to further reduce the channel ISI. IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 14

15 Backup IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 15

16 COM vs Channel IL ZF DFE Quantized ZF DFE DFE+FFE DFE+FFE w/ Gain IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 16

17 Consolidated Data IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 17

18 Consolidated Data #2 IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 18

19 Quantized DFE Delta calculated relative to ZF-DFE. IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 19

20 DFE + FFE IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 20

21 DFE + FFE w/ 3dB Cursor Gain IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 21

22 Correlation to COM with DFE DFE Quantized DFE FFE w/ gain IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 22

COM 2.40 with 100GEL Configurations Suggestions

COM 2.40 with 100GEL Configurations Suggestions COM 2.40 with 100GEL Configurations Suggestions Richard Mellitz, Samtec July 25, 2018, Ad Hoc IEEE 802.3 100 Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Task Force 1 COM 2.40 Adds long FFE capability

More information

Comparison Between Equalization, COM Package Models, and COM For 100G Base KR Channels

Comparison Between Equalization, COM Package Models, and COM For 100G Base KR Channels Comparison Between Equalization, COM Package Models, and COM For 100G Base KR Channels Richard Mellitz, Samtec September 018 1 Table of Contents Experiment using seven 100G-Base-KR channel models For three

More information

Issue with 50G PAM4 C2M Specification

Issue with 50G PAM4 C2M Specification Issue with 50G PAM4 C2M Specification Ali Ghiasi Ghiasi Quantum LLC IEEE 802.3bs Electrical Adhoc Meeting Jan 23rd, 2017 Contributor/Supporter q Rich Mellitz Samtec q Yasuo Hidaka Fujitsu A. Ghiasi IEEE

More information

Updated 802.3cb Backplane Channel Analysis and PHY proposals

Updated 802.3cb Backplane Channel Analysis and PHY proposals Updated 802.3cb Backplane Channel Analysis and PHY proposals Peter Wu, Jin Zhang, Marvell Semiconductor IEEE 802.3cb March 2016 Plenary Meeting, Macau 1 Supporters Anthony Calbone, Seagate Technology Richard

More information

IEEE Gb/s, 100 Gb/s, and 200 Gb/s Ethernet Task Force

IEEE Gb/s, 100 Gb/s, and 200 Gb/s Ethernet Task Force 1 IEEE 802.3 50 Gb/s, 100 Gb/s, and 200 Gb/s Ethernet Task Force Vittal Balasubramanian, Dell Yasuo Hidaka, Fujitsu Upen Reddy Kareti, Cisco Erdem Matoglu, Amphenol-TCS Jim Nadolny, Samtec Rick Rabinovich,

More information

COM 2.51 with rxffe updates

COM 2.51 with rxffe updates COM 2.51 with rxffe updates Richard Mellitz, Samtec Oct. 3, 2018 1 Table of Contents Zero forcing DFE - review Experimental Features Modification in diagram Vector forcing DFE/RxFFE Algorithm to compute

More information

ERL for Parameter Update

ERL for Parameter Update ERL for Parameter Update Richard Mellitz, Samtec 02-21-2018 IEEE 802.3 New Ethernet Applications Ad Hoc 1 ToC Review SNR ISI Clause 136 host transmitter and receiver DOE experiment SNR ISI comparison ERL

More information

Feasibility of 30 db Channel at 50 Gb/s

Feasibility of 30 db Channel at 50 Gb/s Feasibility of 30 db Channel at 50 Gb/s Ali Ghiasi Ghiasi Quantum LLC 50 GbE & NGOATH Plenary Mee>ng March 16, 2016 List of supporters q Upen Reddy Kare> Cisco q Vipul BhaN Inphi q James Fife - etoups

More information

Differential Return Loss for Annex 120d Addressing to Comments i-34, i-74, i-75

Differential Return Loss for Annex 120d Addressing to Comments i-34, i-74, i-75 Differential Return Loss for Annex 120d Addressing to Comments i-34, i-74, i-75 Richard Mellitz, Samtec Adee Ran, Intel March 2017 IEEE802.3 Plenary, Vancouver, BC, Canada 1 IEEE P802.3bs 200 Gb/s and

More information

Updated 50G PAM4 C2M Simulations

Updated 50G PAM4 C2M Simulations Updated 50G PAM4 C2M Simulations Ali Ghiasi Ghiasi Quantum LLC IEEE 802.3bs Electrical Adhoc Meeting Feb 20th, 2017 Contributor/Supporter q Rich Mellitz Samtec q Yasuo Hidaka Fujitsu A. Ghiasi IEEE 802.3

More information

COM Analysis on Backplane and Cu DAC Channels

COM Analysis on Backplane and Cu DAC Channels COM Analysis on Backplane and Cu DAC Channels Ali Ghiasi Ghiasi Quantum LLC IEEE 802.3cd Task Force Mee@ng Whistler May 25, 2016 Overview q Follow on the Macau presenta@on q Inves@ga@ng COM analysis on

More information

Chip To Module Twin Axial Cable Channels For 400 Gb/s: Re-examining the Insertion Loss Equation

Chip To Module Twin Axial Cable Channels For 400 Gb/s: Re-examining the Insertion Loss Equation Chip To Module Twin Axial Cable Channels For 400 Gb/s: Re-examining the Insertion Loss Equation Richard Mellitz, Samtec, April 24, 2017 Contributors: Scott McMorrow & Keith Guetig, Samtec IEEE P802.3bs

More information

10GBASE-KR for 40G Backplane

10GBASE-KR for 40G Backplane 1GBASE-KR for 4G Backplane Nov 7 Technology Hiroshi Takatori Hiroshi.Takatori@.us 1 Outline This contribution discusses, - Performance based on 1GBASE-KR Std - Theoretical Limit (Saltz SNR) and Time Domain

More information

100GEL C2M Channel Analysis Update

100GEL C2M Channel Analysis Update 100GEL C2M Channel Analysis Update Jane Lim, Cisco Pirooz Tooyserkani, Cisco Upen Reddy Kareti, Cisco Joel Goergen, Cisco Marco Mazzini, Cisco 9/5/2018 IEEE P802.3ck 100Gb/s, 200Gb/s, and 400Gb/s Electrical

More information

Transmitter testing for MMF PMDs

Transmitter testing for MMF PMDs Transmitter testing for MMF PMDs IEEE P802.3cd, San Diego, July 2016 Jonathan Ingham Foxconn Interconnect Technology Supporters Will Bliss (Broadcom) Ali Ghiasi (Ghiasi Quantum) Vasu Parthasarathy (Broadcom)

More information

Simulation Results for 10 Gb/s Duobinary Signaling

Simulation Results for 10 Gb/s Duobinary Signaling Simulation Results for 10 Gb/s Duobinary Signaling Populating the Signaling Ad Hoc Spreadsheet IEEE 802.ap Task Force Atlanta March 15-17, 2005 802.AP Backplane Ethernet Contributors Vitesse Majid Barazande-Pour

More information

SPICE Model Validation Report

SPICE Model Validation Report EQCD (DV to DV) Cable Assembly Mated with: QTE-xxx-01-x-D-A QSE-xxx-01-x-D-A Description: Cable Assembly, High Data Rate, 0.8mm Pitch Samtec, Inc. 2005 All Rights Reserved TABLE OF CONTENTS INTRODUCTION...

More information

Sequence Estimators with Block Termination in the presence of ISI

Sequence Estimators with Block Termination in the presence of ISI Hardware implementation i of Sequence Estimators with Block Termination in the presence of ISI Presentation to IEEE 802.3bj Arash Farhood Cortina Systems Joel Goergen Cisco Elizabeth Kochuparambil - Cisco

More information

400G PAM4 The Wave of the Future. Michael G. Furlong - Senior Director, Product Marketing

400G PAM4 The Wave of the Future. Michael G. Furlong - Senior Director, Product Marketing 400G The Wave of the Future Michael G. Furlong - Senior Director, Product Marketing mfurlong@inphi.com ECOC 2017 100G is Ramping in the Cloud 100G Now Shipping (~2H2016) Numerous Market Reports Millions

More information

Raj Kumar Nagpal, R&D Manager Synopsys. Enabling Higher Data Rates and Variety of Channels with MIPI D-PHY

Raj Kumar Nagpal, R&D Manager Synopsys. Enabling Higher Data Rates and Variety of Channels with MIPI D-PHY Raj Kumar Nagpal, R&D Manager Enabling Higher Data Rates and Variety of Channels with MIPI D-PHY Agenda Design motivation MIPI D-PHY evolution Summary of MIPI D-PHY specification MIPI channel evolution

More information

Adding a Simple Package Model to the Channel Response

Adding a Simple Package Model to the Channel Response Adding a Simple Package Model to the Channel Response Richard Mellitz, Intel Corporation Liav Ben Artsi, Marvell Technology Group Adam Healey, LSI Corporation Charles Moore, Avago Technologies 1 IEEE 802.3bj

More information

Feasibility of 40/100G Heterogeneous System based on Channel Data

Feasibility of 40/100G Heterogeneous System based on Channel Data Feasibility of 40/100G Heterogeneous System based on Channel Data Jan 2008 Technology Hiroshi Takatori Hiroshi.Takatori@.us 1 Outline Generalized methodology for feasibility analysis of heterogeneous (electro-optical)

More information

Channels for Consideration by the Signaling Ad Hoc

Channels for Consideration by the Signaling Ad Hoc Channels for Consideration by the Signaling Ad Hoc John D Ambrosia Tyco Electronics Adam Healey, Agere Systems IEEE P802.3ap Signaling Ad Hoc September 17, 2004 Two-Connector Topology N2 H B September,

More information

Physical Aspects of Packages for 100GEL & PKG ad-hoc Physical Aspects Summary

Physical Aspects of Packages for 100GEL & PKG ad-hoc Physical Aspects Summary Physical Aspects of Packages for 100GEL & PKG ad-hoc Physical Aspects Summary Liav Ben Artsi, Marvell Israel Ltd. September 2018 Suggested PKG Model Cases Length Ball Side Discontinuity Xtalk (Suggest

More information

An Overview of High-Speed Serial Bus Simulation Technologies

An Overview of High-Speed Serial Bus Simulation Technologies An Overview of High-Speed Serial Bus Simulation Technologies Asian IBIS Summit, Beijing, China September 11, 27.25.2.15.1.5 -.5 -.1 Arpad Muranyi arpad_muranyi@mentor.com Vladimir Dmitriev-Zdorov -.15

More information

Gain and Equalization Adaptation to Optimize the Vertical Eye Opening in a Wireline Receiver. D. Dunwell and A. Chan Carusone University of Toronto

Gain and Equalization Adaptation to Optimize the Vertical Eye Opening in a Wireline Receiver. D. Dunwell and A. Chan Carusone University of Toronto Gain and Equalization Adaptation to Optimize the Vertical Eye Opening in a Wireline Receiver D. Dunwell and A. Chan Carusone University of Toronto Analog Front End Adaptation Analog Front-End (AFE) Digital

More information

Keysight MOI for USB Type-C Cable Assemblies Compliance Tests Using Keysight M937XA Multiport PXIe VNA

Keysight MOI for USB Type-C Cable Assemblies Compliance Tests Using Keysight M937XA Multiport PXIe VNA Revision 1.01 Feb-24, 2017 Universal Serial Bus Type-C TM Specification Revision 1.1 Keysight Method of Implementation (MOI) for USB Type-C TM Cables Assemblies Compliance Tests Using Keysight For Type-C

More information

SPISim StatEye/AMI User s Guide

SPISim StatEye/AMI User s Guide SPISim StatEye/AMI User s Guide Latest Version: V20180315 SPISim LLC Vancouver, WA 98683, USA Tel. +1-408-905-6692 http://www.spisim.com This user s guide describes the SPISim s StatEye channel analysis

More information

Performance Evaluation of Transcoding and FEC Schemes for 100 Gb/s Backplane and Copper Cable

Performance Evaluation of Transcoding and FEC Schemes for 100 Gb/s Backplane and Copper Cable Performance Evaluation of Transcoding and FEC Schemes for 100 Gb/s Backplane and Copper Cable IEEE 802.3bj Task Force Atlanta, November 8-10, 2011 Roy Cideciyan - Outline Error models at RS decoder input

More information

802.3cb PMD and Channel. Anthony Calbone 3/14/2016

802.3cb PMD and Channel. Anthony Calbone 3/14/2016 802.3cb PMD and Channel Anthony Calbone 3/14/2016 Overview The presentation introduces a single link segment for each 2.5 Gb/s and 5 Gb/s for 802.3cb This link segment is described for two different reference

More information

PCI Express Electrical Basics

PCI Express Electrical Basics PCI Express Electrical Basics Dean Gonzales Advanced Micro Devices Copyright 2015, PCI-SIG, All Rights Reserved 1 Topics PCI Express Overview Enhancements for 8GT/s Target Channels for the Specification

More information

Using ADS to Post Process Simulated and Measured Models. Presented by Leon Wu March 19, 2012

Using ADS to Post Process Simulated and Measured Models. Presented by Leon Wu March 19, 2012 Using ADS to Post Process Simulated and Measured Models Presented by Leon Wu March 19, 2012 Presentation Outline Connector Models From Simulation Connector Models From Measurement The Post processing,

More information

Modeling MultiGigabit FPGA Channels with Agilent ADS 2008

Modeling MultiGigabit FPGA Channels with Agilent ADS 2008 Modeling MultiGigabit FPGA Channels with Agilent ADS 2008 Andy Turudic Sr. Manager, High-End FPGAs Altera aturudic@altera.com Amolak Badesha Field Applications Engineer - Agilent 2008 Altera Corporation

More information

ADS USB 3.1 Compliance Test Bench

ADS USB 3.1 Compliance Test Bench ADS 2016.01 USB 3.1 Compliance Test Bench Notices Keysight Technologies, Inc. 1983-2016 1400 Fountaingrove Pkwy., Santa Rosa, CA 95403-1738, United States All rights reserved. No part of this documentation

More information

Proposal for modeling advanced SERDES

Proposal for modeling advanced SERDES Proposal for modeling advanced SERDES IBM, Cadence June 2006 1 CADENCE DESIGN SYSTEMS, INC. Presenters, Contributors Presenters / Contributors 1. Joe Abler IBM Systems & Technology Group High Speed Serial

More information

Application Note. PCIE-RA Series Final Inch Designs in PCI Express Applications Generation GT/s

Application Note. PCIE-RA Series Final Inch Designs in PCI Express Applications Generation GT/s PCIE-RA Series Final Inch Designs in PCI Express Applications Generation 3-8.0 GT/s Copyrights and Trademarks Copyright 2012, Inc. COPYRIGHTS, TRADEMARKS, and PATENTS Final Inch is a trademark of, Inc.

More information

BER- and COM-Way of Channel- Compliance Evaluation: What are the Sources of Differences?

BER- and COM-Way of Channel- Compliance Evaluation: What are the Sources of Differences? DesignCon 016 BER- and COM-Way of Channel- Compliance Evaluation: What are the Sources of Differences? Vladimir Dmitriev-Zdorov, Mentor Graphics vladimir_dmitriev-zdorov@mentor.com, 70-494-1196 Cristian

More information

Application Note. PCIE-EM Series Final Inch Designs in PCI Express Applications Generation GT/s

Application Note. PCIE-EM Series Final Inch Designs in PCI Express Applications Generation GT/s PCIE-EM Series Final Inch Designs in PCI Express Applications Generation 3-8.0 GT/s Copyrights and Trademarks Copyright 2015, Inc. COPYRIGHTS, TRADEMARKS, and PATENTS Final Inch is a trademark of, Inc.

More information

Towards Package Baseline Proposal for 802.3ck

Towards Package Baseline Proposal for 802.3ck Towards Package Baseline Proposal for 802.3ck Liav Ben Artsi, Marvell Israel Ltd. November 2018 Executive Summary An Optimized initial PKG model was supplied during the September interim The supplied package

More information

IEEE 802.3ap Codes Comparison for 10G Backplane System

IEEE 802.3ap Codes Comparison for 10G Backplane System IEEE 802.3ap Codes Comparison for 10G Backplane System March, 2005 Boris Fakterman, Intel boris.fakterman@intel.com Presentation goal The goal of this presentation is to compare Forward Error Correction

More information

100G Signaling Options over Backplane Classes

100G Signaling Options over Backplane Classes 100G Signaling Options over Backplane Classes IEEE P802.3bj January 2012 Newport Beach FutureWei Hiroshi Takatori Hiroshi.Takatori@huawei.com Contributors and Supporters Albert Vareljian Sanjay Kasturia,

More information

PCI Express Gen 4 & Gen 5 Card Edge Connectors

PCI Express Gen 4 & Gen 5 Card Edge Connectors PCI Express Gen 4 & Gen 5 Card Edge Connectors Product Presentation Amphenol Information Communications ava and Commercial Products Agenda 1. Value Proposition 2. Product Overview 3. Signal Integrity Performance

More information

PCIEC PCI Express Jumper High Speed Designs in PCI Express Applications Generation GT/s

PCIEC PCI Express Jumper High Speed Designs in PCI Express Applications Generation GT/s PCIEC PCI Express Jumper High Speed Designs in PCI Express Applications Generation 3-8.0 GT/s Mated with PCIE-RA Series PCB Connectors Copyrights and Trademarks Copyright 2015, Inc. COPYRIGHTS, TRADEMARKS,

More information

IEEE 802.3ap Backplane Ethernet Overview

IEEE 802.3ap Backplane Ethernet Overview IEEE 802.3ap Backplane Ethernet Overview T10 SAS Adhoc Meeting Houston May 25 26, 2005 Ali Ghiasi aghiasi@broadcom.com 1 History of Backplane Ethernet Ethernet previously did not standardize backplane

More information

ECEN720: High-Speed Links Circuits and Systems Spring 2017

ECEN720: High-Speed Links Circuits and Systems Spring 2017 ECEN720: High-Speed Links Circuits and Systems Spring 2017 Lecture 1: Introduction Sam Palermo Analog & Mixed-Signal Center Texas A&M University Class Topics System and design issues relevant to high-speed

More information

The Future of Electrical I/O for Microprocessors. Frank O Mahony Intel Labs, Hillsboro, OR USA

The Future of Electrical I/O for Microprocessors. Frank O Mahony Intel Labs, Hillsboro, OR USA The Future of Electrical I/O for Microprocessors Frank O Mahony frank.omahony@intel.com Intel Labs, Hillsboro, OR USA 1 Outline 1TByte/s I/O: motivation and challenges Circuit Directions Channel Directions

More information

Aggregation of Crosstalk in Backplanes

Aggregation of Crosstalk in Backplanes DesignCon 2008 Aggregation of Crosstalk in Backplanes Atul Gupta, InspireSys Corporation Email: atul.krishna.gupta@hotmail.com Henry Wong, Gennum Corporation Email: hwong@gennum.com Abstract As the serial

More information

100Gb/s Backplane/PCB Ethernet Two Channel Model and Two PHY Proposal

100Gb/s Backplane/PCB Ethernet Two Channel Model and Two PHY Proposal 100Gb/s Backplane/PCB Ethernet Two Channel Model and Two PHY Proposal IEEE P802.3bj 100Gb/s Backplane and Copper Cable Task Force Newport Beach Rich Mellitz, Intel Corporation Kent Lusted, Intel Corporation

More information

March 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive

March 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive March 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive 2018 BiTS Workshop Image: pilgrims49 / istock COPYRIGHT NOTICE The presentation(s)/poster(s) in this publication comprise the Proceedings

More information

Agilent Technologies Advanced Signal Integrity

Agilent Technologies Advanced Signal Integrity Agilent Technologies Advanced Signal Integrity Measurements for Next Generation High Speed Serial Standards Last Update 2012/04/24 (YS) Appendix VNA or TDR Scope? ENA Option TDR Overview USB 3.0 Cable/Connector

More information

Type-C Technologies and Solutions

Type-C Technologies and Solutions Type-C Technologies and Solutions 2016.12.20 Gary Hsiao Project Manager Gary_Hsiao@keysight.com Agenda Type-C Overview Type-C PD Solutions USB 3.1 Simulation Solutions USB 3.1 TX/RX Solutions USB 3.1 Cable/Connector

More information

SEAM-RA/SEAF-RA Series Final Inch Designs in PCI Express Applications Generation GT/s

SEAM-RA/SEAF-RA Series Final Inch Designs in PCI Express Applications Generation GT/s SEAM-RA/SEAF-RA Series Final Inch Designs in PCI Express Applications Generation 3-8.0 GT/s Copyrights and Trademarks Copyright 2011 Samtec, Inc. Developed in conjunction with Teraspeed Consulting Group

More information

High-speed Interconnect Simulation Using Particle Swarm Optimization

High-speed Interconnect Simulation Using Particle Swarm Optimization 1 High-speed Interconnect Simulation Using Particle Swarm Optimization Subas Bastola and Chen-yu Hsu Intel Corporation subas.bastola@intel.com, chen-yu.hsu@intel.com Abstract Particle Swarm Optimization

More information

Agenda TDR Measurements Using Real World Products

Agenda TDR Measurements Using Real World Products Agenda TDR Measurements Using Real World Products The Case for using both TDR and S-parameters Device Package Analysis - Measure Impedance -C-self Characterizing Device Evaluation Test board Measure Differential

More information

Keysight Technologies EZJIT Plus Jitter Analysis Software for Infiniium Oscilloscopes. Data Sheet

Keysight Technologies EZJIT Plus Jitter Analysis Software for Infiniium Oscilloscopes. Data Sheet Keysight Technologies EZJIT Plus Jitter Analysis Software for Infiniium Oscilloscopes Data Sheet 02 Keysight EZJIT Plus Jitter Analysis Software for Infiniium Oscilloscopes - Data Sheet Table of Contents

More information

PI2EQX6874ZFE 4-lane SAS/SATA ReDriver Application Information

PI2EQX6874ZFE 4-lane SAS/SATA ReDriver Application Information Contents General Introduction How to use pin strap and I2C control External Components Requirement Layout Design Guide Power Supply Bypassing Power Supply Sequencing Equalization Setting Output Swing Setting

More information

The Influences of Signal Matching During Multi-site Testing

The Influences of Signal Matching During Multi-site Testing Eddie McClanahan and Al Wegleitner Texas Instruments The Influences of Signal Matching During Multi-site Testing 2007 San Diego, CA USA Agenda Background Problem Statement Objective Methodology Results

More information

IBIS-AMI Modeling and Simulation of 56G PAM4 Link Systems

IBIS-AMI Modeling and Simulation of 56G PAM4 Link Systems IBIS-AMI Modeling and Simulation of 56G PAM4 Link Systems Hongtao Zhang, hongtao@xilinx.com Fangyi Rao, fangyi_rao@keysight.com Xiaoqing Dong, dongxiaoqing82@huawei.com Geoff Zhang, geoffz@xilinx.com Outline

More information

High Speed and High Power Connector Design

High Speed and High Power Connector Design High Speed and High Power Connector Design Taiwan User Conference 2014 Introduction High speed connector: Electrically small Using differential signaling Data rate >100Mbps High power connector: Static

More information

PCI Express 3.0 Characterization, Compliance, and Debug for Signal Integrity Engineers

PCI Express 3.0 Characterization, Compliance, and Debug for Signal Integrity Engineers PCI Express 3.0 Characterization, Compliance, and Debug for Signal Integrity Engineers - Transmitter Testing - Receiver Testing - Link Equalization Testing David Li Product Marketing Manager High Speed

More information

IEEE Liaison report (Oct ) T v000 Tom Palkert, Macom

IEEE Liaison report (Oct ) T v000 Tom Palkert, Macom IEEE 802.3 Liaison report (Oct 5 2017) T11-2017-00328-v000 Tom Palkert, Macom IEEE 802.3 Base Standards in Force The current version in force is IEEE Std 802.3-2015. Subsequent approved amendments include:

More information

PI2EQX6804-ANJE Four-lane SAS/SATA ReDriver Application Information May 13, 2011

PI2EQX6804-ANJE Four-lane SAS/SATA ReDriver Application Information May 13, 2011 Contents General Introduction How to use pin strap and I2C control External Components Requirement Layout Design Guide Power Supply Bypassing Power Supply Sequencing Equalization Setting Output Swing Setting

More information

5 GT/s and 8 GT/s PCIe Compared

5 GT/s and 8 GT/s PCIe Compared 5 GT/s and 8 GT/s PCIe Compared Bent Hessen-Schmidt SyntheSys Research, Inc. Copyright 2008, PCI-SIG, All Rights Reserved 1 Disclaimer The material included in this presentation reflects current thinking

More information

Understanding 3M Ultra Hard Metric (UHM) Connectors

Understanding 3M Ultra Hard Metric (UHM) Connectors 3M Electronic Solutions Division 3MUHMWEBID_100809 Understanding 3M Ultra Hard Metric (UHM) Connectors Enabling performance of next generation 2 mm Hard Metric systems 3M Electronic Solutions Division

More information

Automated AMI Model Generation & Validation

Automated AMI Model Generation & Validation Automated AMI Model Generation & Validation José Luis Pino Amolak Badesha Agilent EEsof EDA Manuel Luschas Antonis Orphanou Halil Civit Asian IBIS Summit, Shenzhen China November 9, 2010 (Presented previously

More information

DisplayPort 1.4 Webinar

DisplayPort 1.4 Webinar DisplayPort 1.4 Webinar Test Challenges and Solution Yogesh Pai Product Manager - Tektronix 1 Agenda DisplayPort Basics Transmitter Testing Challenges DisplayPort Type-C Updates Receiver Testing Q and

More information

ATLAS Release Date: 11 th January : Mitigation of excessive time delay in Tek CH34 Pulser/Sampler seen in Japan

ATLAS Release Date: 11 th January : Mitigation of excessive time delay in Tek CH34 Pulser/Sampler seen in Japan ATLAS 18.05 Release Date: 16 th May 2018 1: Support of 2018 licence PCN and Polarcare added to help about 2: Time delay before acquisition of recorded data option added to confirm probe placement. 3: Delta-L

More information

High Speed Characterization Report. DVI-29-x-x-x-xx Mated With DVI Cable

High Speed Characterization Report. DVI-29-x-x-x-xx Mated With DVI Cable High Speed Characterization Report DVI-29-x-x-x-xx Mated With DVI Cable REVISION DATE: 07-18-2004 TABLE OF CONTENTS Introduction... 1 Product Description... 1 Overview... 2 Results Summary... 3 Time Domain

More information

Release Notes. SnpExpert Release Notes

Release Notes. SnpExpert Release Notes Release Notes SnpExpert 2018.01 Release Notes 1. OVERVIEW Xpeedic SnpExpert provides a quick way to understand the electrical characteristics of the passive interconnectors in a system by not only viewing

More information

Leveraging IBIS Capabilities for Multi-Gigabit Interfaces. Ken Willis - Cadence Design Systems Asian IBIS Summit, Shanghai, PRC November 13, 2017

Leveraging IBIS Capabilities for Multi-Gigabit Interfaces. Ken Willis - Cadence Design Systems Asian IBIS Summit, Shanghai, PRC November 13, 2017 Leveraging IBIS Capabilities for Multi-Gigabit Interfaces Ken Willis - Cadence Design Systems Asian IBIS Summit, Shanghai, PRC November 13, 2017 Overview In writing EDI CON paper Signal Integrity Methodology

More information

PCI Express 3.0 Testing Approaches for PHY and Protocol Layers

PCI Express 3.0 Testing Approaches for PHY and Protocol Layers PCI Express 3.0 Testing Approaches for PHY and Protocol Layers Agenda Introduction to PCI Express 3.0 Trends and Challenges Physical Layer Testing Overview Transmitter Design & Validation Transmitter Compliance

More information

Optical SerDes Test Interface for High-Speed and Parallel Testing

Optical SerDes Test Interface for High-Speed and Parallel Testing June 7-10, 2009 San Diego, CA SerDes Test Interface for High-Speed and Parallel Testing Sanghoon Lee, Ph. D Sejang Oh, Kyeongseon Shin, Wuisoo Lee Memory Division, SAMSUNG ELECTRONICS Why Interface? High

More information

GHz 6-Bit Digital Phase Shifter

GHz 6-Bit Digital Phase Shifter 1.1 1.5 GHz 6-Bit Digital Phase Shifter Features Frequency Range: 1.1 to 1.5 GHz RMS Error ~ 1.6 deg. 5 db Insertion Loss TTL Control Inputs.5-um InGaAs phemt Technology 28 Lead 7. x 7. x.8 mm 3 QFN Package

More information

Revisi&ng MCBHCB Requirements in Support of 50G/lane PAM4

Revisi&ng MCBHCB Requirements in Support of 50G/lane PAM4 Revisi&ng MCBHCB Requirements in Support of 50G/lane PAM4 Ali Ghiasi Ghiasi Quantum LLC IEEE 802.3cd Task Force Mee@ng San Diego July 26, 2016 Background q Comment 128 was submiked on P802.3bs dram 1.4

More information

Damage Boundary Software

Damage Boundary Software 1 Damage Boundary Software I. General Operation Manual. The Damage Boundary Optional software program is intended to aid in the process of determining the fragility of a product using the ASTM D- 3332

More information

Demonstration of Technical & Economic Feasibility. Brian Seemann Xilinx

Demonstration of Technical & Economic Feasibility. Brian Seemann Xilinx Demonstration of Technical & Economic Feasibility Results are presented which demonstrate the technical and economic feasibility of backplane signaling at 5+ and 1+ Gigabits/second Brian Seemann Xilinx

More information

HMC7545AxLP Gbps 4-Channel Asynchronous Signal Conditioner Evaluation Board (EVB) User Guide

HMC7545AxLP Gbps 4-Channel Asynchronous Signal Conditioner Evaluation Board (EVB) User Guide HMC7545AxLP47 14.2 Gbps 4-Channel Asynchronous Signal Conditioner Evaluation Board (EVB) User Guide User Guide Part # ECN# CP140238 Hittite Microwave Corporation 2 Elizabeth Dr Chelmsford, MA 01824 United

More information

AN 608: HST Jitter and BER Estimator Tool for Stratix IV GX and GT Devices

AN 608: HST Jitter and BER Estimator Tool for Stratix IV GX and GT Devices AN 608: HST Jitter and BER Estimator Tool or Stratix IV GX and GT Devices July 2010 AN-608-1.0 The high-speed communication link design toolkit (HST) jitter and bit error rate (BER) estimator tool is a

More information

RClamp0502B. Ultra-Low Capacitance TVS for ESD and CDE Protection. PROTECTION PRODUCTS - RailClamp Description. Features. Mechanical Characteristics

RClamp0502B. Ultra-Low Capacitance TVS for ESD and CDE Protection. PROTECTION PRODUCTS - RailClamp Description. Features. Mechanical Characteristics - RailClamp Description RailClamps are ultra low capacitance TS arrays designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are

More information

GT Micro D High Speed Characterization Report For Differential Data Applications. Micro-D High Speed Characterization Report

GT Micro D High Speed Characterization Report For Differential Data Applications. Micro-D High Speed Characterization Report GT-14-19 Micro D For Differential Data Applications GMR7580-9S1BXX PCB Mount MWDM2L-9P-XXX-XX Cable Mount Revision History Rev Date Approved Description A 4/10/2014 C. Parsons/D. Armani Initial Release

More information

IBIS-AMI Model Simulations Over Six EDA Platforms

IBIS-AMI Model Simulations Over Six EDA Platforms IBIS-AMI Model Simulations Over Six EDA Platforms Romi Mayder, romi.mayder@xilinx.com Ivan Madrigal, ivan.madrigal@xilinx.com Brandon Jiao, brandon.jiao@xilinx.com Hongtao Zhang, hongtao.zhang@xilinx.com

More information

GL500A Application Manual

GL500A Application Manual GL500A Application Manual Main Functions A Variety of Waveform Displays Y-T, X-Y, and FFT waveforms can be displayed on large, easy-to-read screens. Dual-screen Event and Current Data Replay Current data

More information

N1014A SFF-8431 (SFP+)

N1014A SFF-8431 (SFP+) DATA SHEET N1014A SFF-8431 (SFP+) Compliance and Debug Application for 86100D DCA-X and N109X DCA-M Oscilloscopes Be Confident With Compliant Measurements Easy-to-use oscilloscope application that lets

More information

Latency and FEC options for 25G Ethernet

Latency and FEC options for 25G Ethernet Latency and FEC options for 25G Ethernet Adee Ran Intel Corp. August 2014 August 12, 2014 IEEE 802.3 25 Gb/s Ethernet Study Group 1 Goals Explore FEC encoding/decoding options Discuss FEC gain/latency

More information

PCI Express 4.0. Electrical compliance test overview

PCI Express 4.0. Electrical compliance test overview PCI Express 4.0 Electrical compliance test overview Agenda PCI Express 4.0 electrical compliance test overview Required test equipment Test procedures: Q&A Transmitter Electrical testing Transmitter Link

More information

Real-time Vibration Analyzer Software

Real-time Vibration Analyzer Software Real-time Vibration Analyzer Software POWERFUL AND VERSATILE ANALYSIS TOOL The AS-410 Vibration Analyzer software merges the best features of real-time machinery analyzer, dynamic signal analyzer, transient

More information

RiseUp RU8-DP-DV Series 19mm Stack Height Final Inch Designs in PCI Express Applications. Revision Date: March 18, 2005

RiseUp RU8-DP-DV Series 19mm Stack Height Final Inch Designs in PCI Express Applications. Revision Date: March 18, 2005 RiseUp RU8-DP-DV Series 19mm Stack Height Final Inch Designs in PCI Express Applications Revision Date: March 18, 2005 Copyrights and Trademarks Copyright 2005 Samtec, Inc. Developed in conjunction with

More information

Modulation Schemes Link Budget Analysis under BCI Interference for RTPGE

Modulation Schemes Link Budget Analysis under BCI Interference for RTPGE Modulation Schemes Link Budget Analysis under BCI Interference for RTPGE January 2014 IEEE Reduced Twisted Pair Gigabit Ethernet Benson Huang, Albert Kuo Realtek Semiconductor Corp. Outline SNR Calculation

More information

Tektronix Innovation Forum

Tektronix Innovation Forum Tektronix Innovation Forum Enabling Innovation in the Digital Age DisplayPort 1.2 Spec Updates and overview of Physical layer conformance testing Presenter: John Calvin DisplayPort 1.2 Spec Updates Agenda

More information

100Gb/s SMF PMD Alternatives Analysis

100Gb/s SMF PMD Alternatives Analysis 100Gb/s SF D Alternatives Analysis 40Gb/s and 100Gb/s IEEE 80.3 lenary Session San Antonio TX 13-15 November 01 Chris Bergey Luxtera Sudeep Bhoja Inhi Chris Cole Finisar Ali Ghiasi Broadcom Jonathan King

More information

Basic Calculator Functions

Basic Calculator Functions Algebra I Common Graphing Calculator Directions Name Date Throughout our course, we have used the graphing calculator to help us graph functions and perform a variety of calculations. The graphing calculator

More information

Advanced Jitter Analysis with Real-Time Oscilloscopes

Advanced Jitter Analysis with Real-Time Oscilloscopes with Real-Time Oscilloscopes August 10, 2016 Min-Jie Chong Product Manager Agenda Review of Jitter Decomposition Assumptions and Limitations Spectral vs. Tail Fit Method with Crosstalk Removal Tool Scope

More information

Q Pairs QTE/QSE-DP Final Inch Designs In PCI Express Applications 16 mm Stack Height

Q Pairs QTE/QSE-DP Final Inch Designs In PCI Express Applications 16 mm Stack Height Application Note Q Pairs QTE/QSE-DP Final Inch Designs In PCI Express Applications 16 mm Stack Height Copyrights and Trademarks Copyright 2004 Samtec, Inc. Developed in conjunction with Teraspeed Consulting

More information

General Purpose, Low Noise NPN Silicon Bipolar Transistor. Technical Data AT AT-41533

General Purpose, Low Noise NPN Silicon Bipolar Transistor. Technical Data AT AT-41533 General Purpose, Low Noise NPN Silicon Bipolar Transistor Technical Data AT-411 AT-433 Features General Purpose NPN Bipolar Transistor 9 MHz Performance: AT-411: 1 db NF,. db G A AT-433: 1 db NF, 14. db

More information

Agilent. Master your next PCIe test with the Agilent M8020A High-Performance BERT Application Brief

Agilent. Master your next PCIe test with the Agilent M8020A High-Performance BERT Application Brief Agilent Master your next PCIe test with the Agilent M8020A High-Performance BERT Application Brief 1 Table of Contents Contents Disclaimer... 3 1 Introduction... 4 2 PCI Express Specifications... 4 3 PCI

More information

Xiaoqing Zhu, Sangeun Han and Bernd Girod Information Systems Laboratory Department of Electrical Engineering Stanford University

Xiaoqing Zhu, Sangeun Han and Bernd Girod Information Systems Laboratory Department of Electrical Engineering Stanford University Congestion-aware Rate Allocation For Multipath Video Streaming Over Ad Hoc Wireless Networks Xiaoqing Zhu, Sangeun Han and Bernd Girod Information Systems Laboratory Department of Electrical Engineering

More information

Status Update - SDD21 & SDD11/22 Model Development

Status Update - SDD21 & SDD11/22 Model Development Status Update - SDD21 & SDD11/22 Model Development John DAmbrosia, Tyco Electronics Matt Hendrick, Intel January 2005 1 Acknowedgements Rich Mellitz, Intel Steve Krooswyk, Intel Mike Altmann, Intel Yves

More information

DS1624 Digital Thermometer and Memory

DS1624 Digital Thermometer and Memory Digital Thermometer and Memory FEATURES Temperature Measurements Require No External Components Measures Temperatures from -55 C to +125 C in 0.0625 C Increments Temperature is Read as a 12-Bit Value (2-Byte

More information

Analyzing Digital Jitter and its Components

Analyzing Digital Jitter and its Components 2004 High-Speed Digital Design Seminar Presentation 4 Analyzing Digital Jitter and its Components Analyzing Digital Jitter and its Components Copyright 2004 Agilent Technologies, Inc. Agenda Jitter Overview

More information

AT-41511, AT General Purpose, Low Noise NPN Silicon Bipolar Transistors. Data Sheet. Description. Features. Pin Connections and Package Marking

AT-41511, AT General Purpose, Low Noise NPN Silicon Bipolar Transistors. Data Sheet. Description. Features. Pin Connections and Package Marking AT-4111, AT-4133 General Purpose, Low Noise NPN Silicon Bipolar Transistors Data Sheet Description Avago s AT-4111 and AT-4133 are general purpose NPN bipolar transistors that offer excellent high frequency

More information