IC Obsolescence Solutions

Transcription

1 Company Overview March 12, 2015 Tuesday, October 03, 2017

2 IC FOOTPRINT CONVERSION ADAPTERS REPLACE OBSOLETE ICs WITHOUT RE-SPINNING YOUR PCB An IC Adapter is a small PCB designed that: Has a circuit and components to emulate the original IC Has interconnect/io that matches the original IC Is designed to be assembled to your existing PCB using standard SMT assembly process Also Known As: Interposers Footprint conversion adapters Modules Daughter card Mezzanine card

3 WARNING: OBSOLESCENCE CAN HAPPEN AT ANY TIME WHY RESPIN WHEN YOU CAN ADAPT! Utilize latest generation silicon in your system Purchase product you need, when you need it Quick turn development / minimize legacy engineering Qualify by similarity form, fit & function

4 WARNING: OBSOLESCENCE CAN HAPPEN AT ANY TIME WHY RESPIN WHEN YOU CAN ADAPT! Outdated IC Package Bare PCB in Tact Updated IC Package Matched to Footprint System Updated with Latest IC Technology

5 WHY USE AN IC ADAPTER? Production-Worthy Solution for IC Obsolescence or Shortages: Without the cost or effort of redesigning a motherboard Without expensive last-time buy purchases Without risky gray-market purchases With minimal product requalification and test requirements (component change vs. new board design) ie. Quicker Time to Market Unit Cost Reduction: New device with adapter is often less expensive than existing device Fan-Out: Adapters can fan-out fine pitch components to a larger pitch to avoid increasing motherboard layer count and eliminating microvias and blind/buried vias TSOP to SOJ BGA Fan-Out Adapter Multi IC to QFP

6 ISI CAN ADAPT TO ANY FOOTPRINT ISI adapters can be made to replace any standard IC package CDIP PDIP SIP QFN LQFP PQFP CQFP TQFP SDIP TSOP PLCC HSOP HTSSOP QFP SQFP CSP/WLP SOIC PGA HBGA BGA DIP SOC VSO PMFP SSOP SOJ

7 BGA ADAPTERS

8 LEADFRAME ADAPTERS

9 PGA/DIP/SIP ADAPTERS

10 FOOTPRINT CONVERSION ADAPTERS OVERVIEW OF ADAPTER DESIGN PROCESS 1. Customer provides project information Mechanical drawings of ICs and target footprint Net list or schematic Routing requirements; matched/maximum signal lengths, differential pair, controlled impedance, ground planes, etc. X, Y, Z dimensional requirements Any specific reliability requirements Quantities required for prototypes and production 2. ISI provides quotation for NRE, prototypes and production 3. Customer orders NRE & prototypes 4. ISI designs module/adapter and submits design to customer for approval 5. Customer approves design 6. ISI builds prototypes 7. Customer verifies function and in some cases reliability of module/adapter solution, places order for production requirements 8. ISI builds turn-key solution to production schedule

11 FOOTPRINT CONVERSION ADAPTERS ADAPTER DESIGN EXAMPLES In many cases, more than one component is necessary to replace the original IC. For example, many adapters require bypass capacitors and/or voltage regulators. ISI has come up with many innovative solutions to allow multiple components to fit into the available x,y and z space. Example A: The new device(s) will fit into the same area as the original chip. Adapter has new device(s) on top side, and I/O to the motherboard on the bottom side Example B: The new device and components will not fit into the same area as the original chip. I/O to the motherboard is lengthened to allow placement of devices on both sides of the adapter. Example C: Adapter must extend above surrounding components to accommodate all components. I/O to the motherboard is lengthened and components can be placed on both sides

12 INTERPOSER DESIGN PROCESS Interposer is designed to fit in available space: Max Bottom Side Height: Keep Out Area Min Air Gap: *Height: Max Height: (*Except Where Specified) Max Overall Height: Max Top Side Height: Interposer PCB Max PCB Thickness: Board Separation Height: Motherboard PGA Pins & Socket used to add z-height

13 INTERPOSER MANUFACTURING PROCESS Interposer assembly is typically done in multi-up panels DIP PGA SOIC / SOJ 3 x 5 Interposer Panel When possible, we pre-manufacture the connector and use it as a sub-component. Carriers are plastic (injection molded) or laminate (multi-head high speed drillers/routers) Pins are parallel loaded and pressed for coplanarity. Leads are formed for QFP / SOIC style packages QFP / PLCC MicroPGA

14 INTERPOSER MANUFACTURING PROCESS Step 1: SMT Bottom Side Populate interconnect Individual QFP FlexFrame Screen Solder MPM - SPM Placement Fuji CP-732 & QP-351 Reflow Heller 1800, 1809 Step 2: SMT Top Side Populate QFPs

15 INTERPOSER MANUFACTURING PROCESS Step 3: Singulate with Router Inspection Visual to IPC A-610 Class III Mechanical / Dimensional to Drawing (including leads) X-Ray of hidden solder joints (as required) Inspection templates (as required) Nikon Nexiv Automated Optical/Laser CMMs for lead flatness, coplanarity & true position as required Testing (as required) Functional Boundary Scan / JTAG DC Parametric Test patterns Packaging / Labeling JEDEC Tray Tape & Reel Custom (MacGyver)

16 WHY CHOOSE ISI FOR IC ADAPTERS? ISI is quickly approaching 30 years experience and currently designs and manufactures more than 100 new designs each year ISI has our own high volume manufacturing facility allowing us to be cost competitive for high volume applications ISI has developed and manufactures our own unique interconnect to accommodate any IC footprint (FlexFrame, BGA, PGA, etc.) ISI Adapters are designed for to be used in high-volume automated SMT manufacturing lines using standard SMT processes ISI Adapters have been tested and qualified for use in the most demanding applications, including military and commercial aircraft, automotive, ruggedized embedded computing systems

17 THANK YOU! Contact ISI to engage on your next project: Address: Phone: Website: 741 Flynn Road / Camarillo, California (805) Dave Gagnon Western USA Office: Cell: (714) (714) dave.gagnon@molex.com» Bob Garon Midwest USA Cell: (630) bob.garon@molex.com» Brian Witzen Eastern USA Cell: (919) brian.witzen@molex.com