SP4050 Series. TVS Diode Arrays (SPA Diodes) Lightning Surge Protection - SP4050 Series. RoHS Pb GREEN. Description

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1 SP4050 Series RoHS Pb GRN Description The SP4050 integrates low capacitance diodes with an additional zener diode to protect each I/O pin against SD and high surge events. This robust component can safely absorb up to 20A per IC nd edition(t p =8/20µs) without performance degradation and a minimum ±30kV SD per IC International Standard. Their low loading capacitance also makes them ideal for protecting high speed signal pins. Pinout Features I/O 1 I/O 2 I/O 3 I/O 4 NC TDFN-14 MSOP10 I/O 8 I/O 7 µdfn-12 SD, IC , ±30kV contact, ±30kV air FT, IC , 40A (5/50ns) Lightning, IC nd edition,20a (t p =8/20µs) Low capacitance of 4.4pF (TYP) per I/O Low leakage current of 0.5µA (MAX) at 2.5V Moisture Sensitivity Level(MSL -1) Halogen free, lead free and RoHS compliant I/O 1 I/O 2 I/O 3 I/O 4 I/O 12 I/O 11 I/O 10 I/O 9 I/O 8 I/O 7 I/O 1 I/O 2 I/O 3 I/O 4 I/O 12 I/O 11 I/O 10 I/O 9 I/O 8 I/O 7 Applications LCD/PDP TVs Desktops Game Consoles Set Top Boxes Notebooks Note: Pinout diagrams above shown as component footprint on circuit board. Functional Block Diagram Application xample I/O 2 I/O 4 I/O 8 or 12 LVDS Interface LVDS Controller CLK+ CLK- Outside World A0+ A0- A1+ A1- I/O 1 I/O 3 A2+ A2- Shield Signal Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. SP ATG Shield

2 Absolute Maximum Ratings Parameter Value Units I PP Peak Current (t p =8/20μs) 20.0 A P PK Peak Pulse Power (t p =8/20µs) 300 W T OP Operating Temperature -40 to 125 ºC T STOR Storage Temperature -55 to 150 C CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. lectrical Characteristics (T OP =25ºC) Parameter Test Conditions Min Typ Max Units Reverse Standoff Voltage V RWM 2.5 V Snap Back Voltage V SB I SB =50mA 2.0 V Reverse Leakage Current I LAK V R =2.5V, I/O to 0.5 µa Clamp Voltage 1 V C I PP =10A, t p =8/20µs, Fwd 8.9 V I =1A, t PP =8/20µs, Fwd p 4.5 V I PP =20A, t p =8/20µs, Fwd 13.2 V SD Withstand Voltage 1 V SD IC (Contact) ±30 kv IC (Air) ±30 kv Diode Capacitance 1 C I/O- Reverse Bias=0V 4.4 pf Diode Capacitance 1 C I/O-I/O Reverse Bias=0V 2.2 pf Note: 1. Parameter is guaranteed by design and/or component characterization. 8/20μs Pulse Waveform Clamping Voltage vs. I PP 110% 100% 90% Percent of I PP 80% 70% 60% 50% 40% 30% Clamp Voltage (V C ) % % 0% Time (μs) Peak Pulse Current-I PP (A)

3 Temperature TVS Diode Arrays (SPA Diodes) Capacitance vs. Bias Insertion Loss (S21) I/O to Capacitance (pf) Attenuation (db) DC Bias (V) Frequency (MHz) Soldering Parameters Reflow Condition Pre Heat Pb Free assembly - Temperature Min (T s(min) ) 150 C - Temperature Max (T s(max) ) 200 C - Time (min to max) (t s ) secs Average ramp up rate (Liquidus) Temp (T L ) to peak 3 C/second max T S(max) to T L - Ramp-up Rate 3 C/second max - Temperature (T L ) (Liquidus) 217 C Reflow - Temperature (t L ) seconds Peak Temperature (T P ) /-5 C Time within 5 C of actual peak Temperature (t p ) seconds Ramp-down Rate 6 C/second max Time 25 C to peak Temperature (T P ) 8 minutes Max. Do not exceed 260 C T P T L T S(max) T S(min) 25 t S Preheat Ramp-up time to peak temperature Ordering Information t P t L Ramp-down Time Critical Zone TL to TP Part Number Package Marking Min. Order Qty. SP ATG MSOP10 P* SP TTG TDFN-14 P* SP UTG μdfn-12 P* Part Marking System P*8 P*12 Part Numbering System TVS Diode Arrays (SPA Diodes) Series Number of Channels SP xx x T G G= Green T= Tape & Reel Package A = MSOP10 T = TDFN-14 U = µdfn-12 MSOP10 TDFN-14 and µdfn-12 Note:*Assembly Site

4 Package Dimensions - MSOP10 10 D 2.00 [0.0787] 0.50 [0.0197] Package MSOP10 Pins A 5.28 [0.2079] 3.20 [0.1260] Solder Pad Layout 1.04 [0.0409] 4.24 [0.1669] 0.32 [0.0126] C DIM A A B c D e 0.50 BSC BSC L B e A1 L Package Dimensions - TDFN-14 D TDFN-14 A3 K e D2 b A L A1 2 A A A RF RF b D D e 0.50 BSC 0.02 BSC K L Package Dimensions - μdfn-12 A2 L1 D b (x12) D2 e2 e e1 e2 L2 L A1 b1 (4x) A μdfn-12 A A A RF RF b b D D e 0.50 BSC BSC e BSC BSC e BSC BSC L L L

5 mbossed Carrier Tape & Reel Specification - MSOP10 Pin 1 Location User Feeding Direction A B D D Min Min F P P / / W P K t / / mm TAP AND RL mbossed Carrier Tape & Reel Specification TDFN-14 and μdfn-12 P2 P1 D0 P F W T Ø 0.60 ± º MAX 10º MAX A0 K0 B0 User Feeding Direction A B D F K P P P T W Pin 1 Location 8mm TAP AND RL

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