SP8008 Series Diode Array

Transcription

1 SP88 Series Diode Array RoHS Pb GRN Description The SP88 integrates eight channels of ultra low capacitance common mode protection for electronic equipment exposed to electrostatic discharges (SD. This robust component can effectively protect against SD events exceeding the IC contact SD level of ±8 kv without any performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as V-by-One, mbedded DisplayPort, HDMI 1. through 2.1 and USB 2./3./3.1. Pinout Functional Block Diagram Features SD, IC , +3kV/-23kV contact, +3kV/-23kV air FT, IC , 4A (t P =5/5ns Lightning, IC nd edition, 4A (t P =8/2μs Low capacitance 3GHz (TYP per I/O Applications LCD/PDP TVs LCD/LD Monitors Notebook Computers Ultrabooks Automotive Displays Low leakage current of.5μa (MAX at 5V Small form factor μdfn packages (JDC MO- 229 saves board space and supports straightthrough routing of the data lines. Halogen free, Lead free and RoHS compliant Flat Panel Displays Digital Signage HD Cameras/Projectors USB and HDMI interfaces Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.

2 Absolute Maximum Ratings Symbol Parameter Value Units Peak Current (t p =8/2μs 4. A T OP Operating Temperature -4 to 125 C T STOR Storage Temperature -55 to 15 C CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. lectrical Characteristics (T OP =25ºC Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V RWM 5 V Reverse Breakdown Voltage V BR I R =1mA 6 V Reverse Leakage Current I LAK V R =5V, I/O to GND.5 µa =1A, t P =8/2µA, Fwd 9.39 V Clamp Voltage 1 V C =2A, t P =8/2µA, Fwd 1.38 V =4A, t P =8/2µA, Fwd V Dynamic Resistance 1 R DYN TLP, t P =1ns, I/O to GND.4 Ω IC (Contact +3 / -23 kv SD Withstand Voltage 1 V SD IC (Air +3 / -23 kv Diode Capacitance 1 C I/O-GND Reverse Bias=V, f=3 GHz.3 pf Note: 1 Parameter is guaranteed by design and/or component characterization. 8/2μS Pulse Waveform Clamping Voltage vs. 11% 1% 9% 8% Percent of 7% 6% 5% 4% 3% Clamp Voltage (V C % 2. 1% % Time (μs Peak Pulse Current- (A Positive Transmission Line Pulsing (TLP Plot NegativeTransmission Line Pulsing (TLP Plot TLP Current (A TLP Voltage (V TLP Current (A TLP Voltage (V

3 Temperature TVS Diode Arrays (SPA Diodes IC kv Contact SD Clamping Voltage IC kv Contact SD Clamping Voltage ye diagram 5Gbps, 2.5 GHz w/sp88-8utg Insertion Loss Diagram -5. S21 Insertion Loss (db Frequency (Hz Soldering Parameters Reflow Condition - Temperature Min (T s(min 15 C Pb Free assembly T P Ramp-up t P Critical Zone TL to TP Pre Heat - Temperature Max (T s(max 2 C - Time (min to max (t s 6 18 secs Average ramp up rate (Liquidus Temp (T L to peak T S(max to T L - Ramp-up Rate 3 C/second max 3 C/second max T L T S(max T S(min t S Preheat t L Ramp-down Reflow - Temperature (T L (Liquidus 217 C - Temperature (t L 6 15 seconds 25 time to peak temperature Time Peak Temperature (T P 26 +/-5 C Time within 5 C of actual peak Temperature (t p 2 4 seconds Ramp-down Rate 6 C/second max Time 25 C to peak Temperature (T P 8 minutes Max. Do not exceed 26 C

4 Part Numbering System Part Marking System SP 88 8 U T G TVS Diode Arrays G= Green (SPA Diodes T= Tape & Reel Series Number of Channels Package U=μDFN-14 (5.5x1.5mm Ordering Information Part Number Package Marking Min. Order Qty. SP88-8UTG µdfn-14 SP Package Dimensions D D µdfn-14(5.5x1.5x.5mm JDC MO-229 Pin1 Millimeters Inches Symbol Top View Min Nom Max Min Nom Max c Pin1 2 L Package Outline.62mm (3X Top View Side View eb NdB D2 b ea NdA Bottom View.56mm (3X 14 A1 A 1 h.43mm (6X 1.8mm c A A b c.1 Side.15 View D D NdB NdA 5. eb BSC.197 BSC ea.5 BSC.2 BSC eb 1.5 BSC.59 BSC 2 NdB 3. BSC.118 BSC L D b ea L.2.3 NdA h.5 Bottom.1 View Package Outline.56mm (3X.62mm (3X A1 A h.26mm (14X e=.5mm Recommended soldering pad layout.5mm (14X.43mm (6X 1.8mm.26mm (14X e=.5mm Recommended soldering pad layout.5mm (14X

5 Low Capacitance SD Protection - SP312 SP88 Series mbossed Carrier Tape & Reel Specification µdfn-14 P1 P2 P D User Feeding Direction Symbol Millimeters A /-.1 B /-.1 D /- W F Pin 1 Location D1 Ø 1. min /-.1 F 5.5 +/-.5 D1 A T K.7 +/-.1 P 2. +/-.5 P1 4. +/-.1 K B P2 4. +/-.1 T.3 +/-.5 W / Littelfuse, Inc. SP312 Series