Define material specifications for high power and high density PCB's needed to support under-the-hood automotive applications

Transcription

1 Define material specifications for high power and high density PCB's needed to support under-the-hood automotive applications Call for Project Formation December, 2015 Initiative Leaders: Steve Brown, Alpha (Alent plc) inemi Staff: Steve Payne

2 Agenda Introduction to inemi Project Proposal o Define material specifications for high power and high density PCB's needed to support under-the-hood automotive applications inemi Project Process Timeline 2

3 What is inemi? Mission: Forecast and Accelerate improvements in the Electronics Manufacturing Industry for a Sustainable Future. 5 Key Deliverables: Technology Roadmaps Collaborative Deployment Projects Research Priorities Document Proactive Forums Position Papers International Electronics Manufacturing Initiative (inemi) is an industry-led consortium of 90 plus global manufacturers, suppliers, industry associations, government agencies and universities. A Non Profit Fully Funded by Member Dues; In Operation Since Visit us at

4 4 OEM/ODM/EMS Members

5 5 Association/Consortium, Government, Consultant & University Members

6 Why Collaborative Projects? Reduce cost by leveraging resources o Reduce cost by new technologies o Reduce resource demands and $ investments for each company o Stimulate standards and common specification development o Work on issues facing all your suppliers/customers o Disseminate efficient business practices Reduce risk of technology introduction o Gain knowledge and accelerate deployment of new technologies o Developing industry infrastructure, source of supply o Ensure reliability and technology readiness when required Reduce environmental risks o Ensure sustainable solutions are put in place and in sync with industry 6

7 Profile of Successful inemi Projects Addresses knowledge gap of industry o Common problem solved by working together o Often a pre-cursor to standards development Brings together a segment of supply chain to provide industrywide response Direct alignment with member companies commercial interests. LCA Estimator Tin Whisker Susceptibility Warpage Characterization of Organic Packages Creep Corrosion 7

8 inemi Projects - Quick Facts inemi organizes and facilitates projects Members define and execute projects Projects are aligned with member interest and roadmap identified needs 20+ ongoing projects; 8+ members participating per project Projects typically last months Currently running projects in following areas: Packaging & Component Substrates Test, Inspection & Measurement Environmentally Sustainable Electronics Optoelectronics Board Assembly Interconnect PCB - Organic Connectors MEMS/Sensors Medical Automotive Power conversion

9 Ongoing and in-plan projects Project Name Alternative Materials Assessment Project - Phase 2 Automotive Electronic Material Challenges Characterization of Pb-Free Alloy Alternatives Project - - Addendum to Scope of Work Version 3.2 June 2, 2015 Connector High Speed Signaling Metrology Program: Phase 1 Connector Standard Reliability Test Recommendations Program: Phase 1 DC-DC Conversion Project - Phase 2 Development of Cleanliness Specification for Expanded Beam Final Assembly: Flexible Automation/Line Integration Metals Recycling - Phase 2 QFN Package Board Level Reliability Project Quantifying Recycling and Repair Metrics - Phase 2 Ultra Low Loss Laminate/PCB for High Reliability & Performance Use Environment Classification Initiative inemi PM Mark Schaffer Mark Schaffer David Godlewski David Godlewski David Godlewski Mark Schaffer David Godlewski Mark Schaffer Mark Schaffer Masahiro Tsuriya Mark Schaffer Masahiro Tsuriya Mark Schaffer TIG Chair Name Member - Company Name Initiative - Start Date ECE Cory Robertson HP Other Anitha Sinkfield Delphi Board Assembly Richard Coyle Alcatel-Lucent Board Assembly Zhichao Zhang Intel Board Assembly Anne Ryan Alcatel-Lucent ECE Rick Fishbune IBM Optoelectronics Tatiana Berdinskikh Celestica Final Assembly Subbu Kandasamy ECE Carol Handwerker Purdue Board Assembly Richard Coyle Alcatel-Lucent ECE Lisa Dender IBM Organic PCB Gary Long Intel ECE Alan Lucero Intel

10 Background/Context There appears to be no coherent view of specifications for automotive electronics for high power high density and high reliability. IPC class 3 (IPC-A-610 Class 3) is the highest standard but not written specifically for under the hood applications or (any specific industry) and is therefore not always sufficient or appropriate. Initially a Tier 1 supplier may specify IPC class 3 whereas now they specify IPC class 3 + DIN + wide range of OEM specific standards etc. There is a need to review OEM s specifications and requirements (BMW, VW, HKMC etc.) and undertake a cross comparison. Most standards mandate thermal cycling between -40C to + 125C. This is overkill for some applications (In-Cabin), yet not satisfactory for latest generation underhood applications as OEM s specify additional criteria such as thermal shock and vibration testing and also temperature in excess of +125C (such as +140C); field failures are often caused by extreme conditions. There is also a trend to specify and procure material and components that do not meet any criteria more than is absolutely needed - (good enough scenario). Typical Tier 1 s will be serving multiple OEM s requiring multiple validation cycles whilst trying to simplify the choice or common suite of materials.

11 Needs of Industry There is a need to identify common failure mechanisms in automotive electronics and relate how standards can relate to each. To define test procedures for Tier 1 and material manufacturers that will give a high degree of confidence in meeting OEM s requirements Enable Tier 1 and OEM s to be able to more easily compare material datasheets from differing suppliers

12 Scope of Work Scope of Work o o o Define categories for high power / High density (level of miniaturisation); define terminology. Define what are the main attributes of a material that would place it in a specific category; (GM do have a proprietary categorization system). Develop a suite of tests that can meet a consensus of requirements from Tier 1 and OEM s o o o o Material characterization tests to more accurately replicate applications Potentially apply certain existing tests for specific applications into a suite of tests Define various acceptability levels for various categories of electronics Agree performance attributes that need to pass tests for specific applications o Example may be a new solder alloy or component may be validated within a PCBA through a high T & vibration fatigue test a shear test looking for joint failure on a component. Potential Participating Organizations o Car Manufacturers / Automotive electronics Tier 1 & Tier 2 suppliers / electronic material manufacturers / all who have an interest or participate in automotive electronics supply chain

13 IS / IS NOT Analysis This Project IS: This Project IS NOT: Provide initial analysis of what the Project IS and IS NOT Underhood / Harsh Environment Auto Electronics (>100 C Op Temp) Standard Development Review Current Test Standard regimes WRT PCBA Not biased to any supplier Review of OEM specific test standards In-Cabin applications (Infotainment/Instrumentation/Comfort Convenience) Laminate and Assembly Materials-centric Identifying failure mechanisms and performance limitations of current systems. Defining categories for high power and high density underhood Automotive applications Defining and measuring key material properties to meet the application requirements

14 inemi Project Process

15 The Project Process - 5 Steps 1 2 SELECTION DEFINITION Open for Industry input 3 4 PLANNING (The Initiative Phase) inemi Technical Committee (TC) Approval Required for Execution EXECUTION / REVIEW 5 CLOSURE Limited to Committed inemi Members

16 2 Definition Organization Stakeholders Background Objectives Deliverables Benefits Skills required Risks Scope Costs TC APPROVAL TO PROCEED Decision after Review Is it still valid? Is the market forecast valid? Do we have resources? What is current priority? What are the consequences of aborting now?

17 3 Planning TC Time estimates Initial schedule Resource analysis Optimization Risk review Issue resolution Prepare to implement Decision after Review Is the schedule acceptable to participating member companies? Are resources committed? Do we still want to do it? Is current priority correct? APPROVAL TO PROCEED

18 3 Output of Planning Process Project Leadership SOW (Statement of Work) Document Describing the Project PS (Project Statement) Document Defining: What each Firm Will Contribute The rules for the Project Firm Commitment from Management SOW and PS are described at TC APPROVAL TO PROCEED

19 Outline of Statement of Work (SOW) 1. Background to work 2. Scope of project 3. Purpose of project 4. What the project IS/IS NOT 5. Business Impact 6. Previous/current related work 7. Outcome of project 8. Prospective Participants (Generic nonspecific list) 9. Project Schedule with Milestones 10. Resources required from project participants 11. Project monitoring plan 12. General and administrative guidelines

20 Initiative Timeline - Next Meetings o Dec. 7 th : Call for Project Formation o Confirm interest in participation - Response needed by Dec 16th o Hold weekly meetings o 1st meeting kick off and introduction o 2nd meeting Is/Is not analysis, preliminary definition o 3rd-4th meeting project detail (materials; reliability; test method options; test vehicles; etc.) o 5th meeting review the draft SOW, potential resource requirement and high level schedule o 6th meeting - refine the SOW, prepare the PS; o End Jan. 2016: SOW prepared for submission to TC o Feb. 1 st Project call for participation o End Mar Project start date

21 North America: Bill Bader Europe: Steve Payne Asia Pacific: Haley Fu