2018 Project Focus of IPSR. Dr. Robert C. Pfahl Director of Roadmapping March 12, 2018 OFC

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1 2018 Project Focus of IPSR Dr. Robert C. Pfahl Director of Roadmapping March 12, 2018 OFC

2 Sponsors & Participants Sponsor Lead Participants 1

3 Goals and Objectives of IPSR Goals Create A Self-Sustaining Roadmapping Consortium Impact the Nation by Establishing the path to Volume Integrated Photonics Manufacturing Objectives Build an Integrated Silicon Photonics Manufacturing Community Phase 1 ( ): Produced a Prioritized Manufacturing Systems Roadmap for Photonic. This Phase of the roadmap was funded by NIST AMTech Stage 1: Initial Roadmap Development of technology needs Stage 2: Emulator Development to Quantify volume-cost objectives Stage 3: Creation of the R&D Technical Plan Phase 2 ( ): Provide R&D Project recommendations to AIM Photonics and other specialized R&D consortia 2

4 17 Countries Roadmap Participation as of November Individuals 308 Organizations 2016 & 2017 Roadmaps available at 3

5 2018 Goals Post updated IPSR 2017 containing two new chapters Publish comprehensive IPSR 2018 Complete Phase 1 Board Level Optical Interconnect Project with AIM-based prototypes Document and Implement a technical planning process to develop additional AIG projects that address strategic gaps that AIM members see as critical Launch application interest groups (AIGs) to execute these critical projects 4

6 Steps in IPSR Roadmapping Process 1. Scope and Analyze the Situation 1. Market (Applications) 2. Technology 2. Identify the Needs and Grand Challenges 1. Design Tools 2. Training of Designers 3. Manufacturing Technologies 4. Materials 5. Component Technology 6. Standards Development 7. Intellectual Property Protection 8. Security and Information Management 3. Identify Paradigm Shifts and Strategic Concerns 4. Develop Strategic Recommendations for all Stakeholders 1. Design Tools 2. Manufacturing Technology 3. Materials Development 4. Supply Chain Development through Industry Standards 5. Provide these recommendations to AIM Photonics and other organizations to aid in focusing and prioritizing their Technical Plans for Research and Development 5

7 The Technology Needs Differ by Market Segment Data Center Product Data center servers require heterogeneous integration of memory, logic, power controllers and photonics in 3D-SiP package architecture to meet applications requirements in a controlled environment. The solution selected must provide for packaging of replacements for existing top of rack components. These solutions must include SiP based traffic analysis supporting data path switching decisions, selecting between photonic and electronic data paths and between packet switching and circuit switching. 6 Photonics for the Internet of Things The internet of things (IoT) will require a package for heterogeneous integration of sensors, RF components, memory and photonics in 3D-SiP architectures. The package must enable a general purpose SiP IoT hub packaging for environments that may not be well controlled. This capability will include energy scavenging to power the IoT hub in many cases and redundancy to ensure long term service free reliability. Product Emulators are Used To Drive Technology Requirements

8 Benefits of Roadmapping Anticipate technology trends and paradigm shifts Collaborate with key players, industry experts, suppliers and customers, globally in all major markets Obtain access to learning and knowledge experts Develop consensus for next steps 7

9 2018 IPSR Roadmap-TWGs and PEGs TWGs 1. Monolithic Integration 2. Packaging of Integrated Silicon Photonics 3. Connectors 4. Substrates 5. Assembly 6. Test 7. Electronic- Photonic Design Automation 8. Photonic Sensors Data Center Product Emulator Groups Cost Automotive Internet of Things Sensors RF Photonics 8

10 IPSR Leadership David Armstrong Chair, Test TWG Advantest 9

11 1 0 Additional IPSR Leadership Ajey Jacob, Co-Chair Monolithic Integration TWG, Global Foundries Brett Attaway, Electronic-Photonic Design Automation TWG, Bridg Terry Smith, Interconnect TWG, 3M Tom Marrapode, On Board Photonics Project Chair, Molex

12 Strategic Recommendations from the IPSR Roadmap

13 1 2 Strategic Recommendations Focus Projects on Addressing the Grand Challenges Reduction in Power per function Reduction in Cost Decrease Latency Increased physical bandwidth density Address challenges that the supply chain will not achieve in time to address the quantified industrial needs in the IPSR Roadmap Design Tools Manufacturing Technology Materials Development Supply Chain Consolidation through Industry Standards

14 Technical Plan for Board-Level Optical Interconnect The following 3 Phase Technical Plan was the result of looking for low-hanging fruit at the 2016 IPSR Spring Meeting. The discussions started with the Interconnection TWG lead by John MacWilliams A small group met weekly to develop a Statement of Work (SOW) for an industry led project. As discussions have progressed, more short terms needs have been identified that must be addressed if single mode expanded beam connectors are to be implemented in high volume. High volume is necessary to achieve cost objectives. 13

15 For additional information: Bob Pfahl