inemi Roadmap Packaging and Component Substrates TWG

Transcription

1 inemi Roadmap Packaging and Component Substrates TWG TWG Leaders: W. R. Bottoms William Chen Presented by M. Tsuriya

2 Agenda Situation Everywhere in Electronics Evolution & Blooming Drivers Changing inemi Roadmap 21 TWGs, Outline, Cross TWG Activities Rapid Change in Requirement Material Single Chip Package WLP Complexity 2.5D/3D Integration Embedded Packages Future Co-Integrated SiP Conclusion Schedule 2

3 Everywhere in Electronics 3 Source: Yole at inemi Package workshop 2014

4 Evolution & Blooming Flowers 4 Source: Yole at inemi Package workshop 2014

5 Drivers Changing.. This requires change in packages Requirement High Band Density Low Latency Expanded Data Processing Expanded data Storage Major Gaps Power (particularly Package Related) Thermal Management Cost Heterogeneous Integration Physical Density of Bandwidth Latency 5

6 6 Power Reduction

7 7 Thermal Management

8 Chapter Outline Executive Summary Introduction Situation Analysis - bench mark state of the art Packaging and Substrate Markets Roadmap of Quantified Key Attribute Needs Single Chip Packaging Component Substrates Wafer Level Packaging 3D integration MEMS Packaging Automotive Electronics SiP Packaging Gaps and Showstoppers Recommendations for Potential Alternative Technologies Critical Research Needs Contributors 9

9 Cross TWG Activity Technology Working Group / PEG Semiconductor Technology x x Final Assembly x Interconnect PCB (Organic) x x Modeling, Simulation & Design Tools x Optoelectronics x x Packaging & Component Substrates x RF Components & Subsystems x x Test, Inspection and Measurement x x Thermal Management x x Board Assembly x x Passive Components x x Interconnect Substrates (Ceramic) x Electronic Connectors x x MEMS/Sensors x Photovoltaics x Power Conversion Electronics x x Office / Consumer x x Portable / Wireless x x Automotive x x High-End Systems x x Medical x x Aerospace/Defense x x 10

10 11 All Materials will Change

11 Single-Chip Package Technology Year of Production Cost per Pin Minimum for Contract Assembly (Cents/Pin) Low-end, Low-cost package Mobile Device Package Memory Cost-performance High-performance Harsh Performance: chip-to-chip Low-end, Low-cost package(mhz) Mobile Device Package(MHz) Memory(MHz) Cost-performance (Gb/s) High-performance (Gb/s) Harsh Performance: Pkg-to-Board Manufacturable solutions exist, and are being optimized Manufacturable solutions are known Interim solutions are known Manufacturable solutions are NOT known Low-end, Low-cost package(mhz) Mobile Device Package(MHz) Memory(MHz) Cost-performance (Gb/s) High-performance (Gb/s)

12 The Rapid Change in Requirement is Driving a Revolution in Packaging New Material New Package Architecture 2.5D Packages Wafer Level Packages System Integration in a Package (SiP) New Manufacturing Process Cu Pillar No Underfills Panel Level Processing 13

13 New Materials Will Be Required Many are in use today Many are in development Cu interconnect Ultra Low k dielectrics High k dielectrics Organic semiconductors Green Materials Pb free Halogen free Nanotubes Nano Wires Macromolecules Nano Particles Composite materials But improvements are needed 14

14 15 WLP Complexity is Rising

15 16 2.5D/ 3D Integration

16 Future Co-Integrated SiP TSV memory stack, direct bonding interconnect, serdes in controller Electronics, Photonics and Plasmonics on an SOI Substrate Photonic engine Large on-package memory cache with serdes in controller DRAM DRAM DRAM DRAM Memory controller CMOS logic Flash memory Flash memory Flash memory Flash memory DRAM DRAM Memory controller Multiple voltage regulators to match power delivery to each component to the work in process Silicon Substrate with TSV interconnects and Si Waveguides Power Controller Photonic/electronic Circuit Board 17 PCB with electronic and photonic signals with embedded components

17 New Package Architectures Gaps & Challenges Gap 3D TSV Integration Cost Test Strategy Thermal Management Signal and Power Integrity Handing Thin Die/Wafer Bonding System in Package Change Needed Close the gap between Chip and Substrate Wiring Packaging for Higher Current Density Flexible System Packaging 3D Packaging Low Cost Package Manufacturing Processes for Complex wafer Level Packages Photonic to the Package Heterogeneous Integration Noise/Cross Talk Thermal Management Wafer Level Packaging Rapidly Increasing Complexity in WLP Contact Pitch 2013 Edition 2015 Edition Wafer2Wafer Bonding 18

18 Conclusion System Integration at the package level is the only path to meet the cost and Performance Requirement over the next ten years. The definition of research needs for new materials, new architectures and new manufacturing equipment and process is essential to ensure that solutions are ready before Gaps become Showstoppers. inemi roadmap is focused on meeting that needs. 19

19 2015 Roadmap Schedule 3Q2013: Recruit Product Sector Champions, teams and refine data charts/begin 2015 Roadmap Newsletter & send 2013 PEG chapters 3/4Q13: Product Sector Champions Develop Emulators September 16, 2013 Teleconference with P.E. Group Chairs September 27, 2013 Web based meeting TWG/PEG Chairs (key attributes) October 16, 2013 SMTAI Presentation on 2015 Plans October 17, Roadmap PEG Kick-off with PEG/TWG/TC at SMTAI 2013 Roadmap chapter, format, Exec. Summary ed to each TWG chair (Word) 1/3/2014 Organizing Teleconference with TWG Chairs 1/10/2014: Feb 19, PEG Workshop/TWG Kick-off Agilent Technologies, Santa Rosa, CA Product Sector Tables Complete PEG Chapter rough drafts written Cross cut issues are initially addressed May 13, 2014 Telecon With TWG Chairs, Preliminary PEG Chapters Due May 27, 2014 N.A. RM WS - Open Roadmap TWG Presentations in Orlando, FL (ECTC) June 11, 2014 European Roadmap Workshop/Webinar 9:00 AM EDT June 18, 2014 Asian Roadmap Workshop/Webinar 8:00 PM EDT July 14, 2014 TWG Drafts Due for TC Review August 20,21, 2014 TC Face-to-Face Review with TWG Chairs at IBM, RTP, N.C. September 22, 2014 Final Chapters of Roadmap Due October 2, 2014 TC Briefing/SMTA at SMTAI (Rosemont, Illinois) October 31, 2014 Edit, Prepare Appendix A-D, Executive Summary November 20, 2014 Go To Press December TBD, 2014 Ship to Members April TBD, 2015 Offer to Industry April TBD, 2015 Global industry roadmap presentations via webinars 20 20

20 Bill Bader Grace O Malley gomalley@inemi.org