Trends and Challenges for Data Centers inemi Roadmap

Transcription

1 Trends and Challenges for Data Centers inemi Roadmap

2 Trends and Challenges Context what's happening in the market and in the industry Changes new technology developments Challenges what is needed for the future Collaboration Reduces risk and accelerate transformation 2

3 What is inemi? International Electronics Manufacturing Initiative (inemi) is an industry-led consortium of over 90 global manufacturers, suppliers, industry associations, government agencies and universities. A Non Profit Fully Funded by Member Dues; All Funding is Returned to the Members in High Value Programs and Services; In Operation Since Forecast and Accelerate improvements in the Electronics Manufacturing Industry for a Sustainable Future 3

4 inemi Industry Value Roadmap Technical plan Research Collaborative Projects Forums & Workshops Anticipate technology requirements Identify gaps Focus R&D priorities Eliminate gaps Deliver learning & critical data Leverage efforts & resources of participants Share solutions & best practices Prioritize key challenges Network with customers & suppliers

5 Identify Business Opportunities via Roadmaps inemi roadmaps the future technology requirements of the global electronics industry, identifies and prioritizes technology and infrastructure gaps. Statics of 2015 Roadmap > 500 participants > 280 companies/organizations > 20 countries >7 man years of resources 19 Technology Working Groups (TWGs) 6 Product Emulator Groups (PEGs) Nearly 2000 pages of information Roadmaps the needs for

6 inemi Scope Build to Components Materials Transformation Order Collaborative Lifecycle Design Materials Equipment Software Solutions Solutions Supply Chain Management Information Technology Logistics Communications Business Practices Marketing Design Manufacturing Order Fulfillment Customer 6

7 Context

8 It is all about Data! 8 The number of connected devices has increased dramatically leading to a concept commonly called the IoT (Internet of Things)..

9 What Type of Data? The amount of data with the fast growing elements that are unstructured with the demand for analytics and fast movement of data is also accelerating. 9

10 Expected Internet Traffic by 2016 (Source: Cisco VNI) Exabytes run-rate of global data traffic 130x the amount of data generated in 2000 Mobile internet traffic CAGR 78% from 2011 to % of mobile/wireless data will be offloaded to WiFi Generating the mobile data traffic: Asia/Pacific 40%, Western Europe 22.56%, North America 18.18%, ROW 19.26% Smartphones 48.3%, laptops/notebooks 24.2%, tablets 10% 60% of mobile users (~3B people) will generate >1GB of mobile data traffic/month, compared to just 0.5% of the mobile users today. Cloud-based and Machine-to-Machine mobile traffic By Application: Mobile video 70.5% Web/data 20.0% Machine-to-Machine 4.7% Mobile File Sharing, Mobile Gaming, Mobile VOIP 4.8%

11 Data Center Markets Data centers are the infrastructure for the Cloud Growth - $7B in 2015 to $22B in 2025 Proliferation of datacenters across the world Growth of non traditional players Increasing awareness of Data Security demands Data bandwidth is demanding faster interconnect speeds Power demand is creating challenges Rate of innovation is high, helped by open source concepts of hardware and software 11

12 Portable, patient side, diagnostic and monitoring More Data Sources with more complex requirements Retinal Brain Cochlear Cardiac Urinary Gastric Vagus Nerve & Spinal Implant Large systems for Therapy, Diagnostics, Storage and Communications Smart, Connected Medical Microelectronics Miniaturized Connected Delivering therapy

13 Changes

14 What's been happening? Deployment of Datacenters across the world Both technical and geo political reasons Leverage use of renewable energy Growth in datacenter management 2013 Regional Revenue (M$) Americas Asia-Pacific EMEA Japan Total High-End Systems 35,317 65,801 35,888 25,274 Data Centers 2,960 1,990 2,

15 What's been happening? Pure horse power is no longer the No.1 driver within the server industry. Power has moved to the forefront of demands. In the growing world of data centers and cloud build-out, servers must be efficient, use less power, and take up less space, all while meeting the specific workloads that the IoT requires. Now systems availability required 100% of time achieved through redundancy and more monitoring Growth of density optimized servers or micro-servers IHS projects that the micro-server will be nearly 20% of the total server market by

16 What's been happening? Thermal solutions that add to the platform power are not attractive Thermal Management Advent of new cooling techniques Chip Board Rank System level HPC data center, based in NREL s Energy Systems Integration Facility (ESIF), (PUE) rating of 1.06 or better. Need collaboration/co design between the building designers, system integrator and OEMs to optimize the thermal solution for the entire installation 16 Hewlett-Packard Development Company

17 What's been happening? Modularization Higher density at chip level Trend of move to specialty cores to do certain tasks Integration of more on-chip cooling Adoption of new packaging technologies Through Silicon Via (TSV) System in Package (PoP) 17

18 Potential Solution: 2.5D/3D Photonic Co-integrated SiP TSV memory stack, direct bonding interconnect, Large on-package memory cache Multiple voltage regulators to match power delivery to each component to the work in process Electronics, Photonics and Plasmonics on an SOI Substrate Photonic engine DRAM Flash memory DRAM Flash memory DRAM Flash memory DRAM Flash memory Memory controller DRAM CMOS logic DRAM Memory controller Silicon Substrate with TSV interconnects and Si Waveguides Power Controller Photonic/electronic Circuit Board PCB with electronic and photonic signals with embedded components

19 Optical Data Communications Optical methods require up to 75% less power and the cables are typically 75% smaller than copper cable with the same data capacity. 19

20 Challenges

21 Paradigm Shifts Cloud connected digital devices have the potential to enable major disruptions across the industry: Major transition in business models New Power Distribution Systems for Data Centers Huge data centers operating more like utilities (selling data services) Local compute and storage growth may slow (as data moves to the cloud) Rent vs. buy for software (monthly usage fee model) Rapid evolution and new challenges in energy consuming products such as SSL, Automotive and more Sensors everywhere MEMS and wireless traffic! More Moore (scaling of pitch) has reached its forecast limit and must transition to heterogeneous integration - More Than Moore Need for continuous introduction of complex multifunctional products to address converging markets favors modular components or SiP (2- D & 3-D): 21

22 Challenges Managing data as cost effectively as possible in as sustainable manner as possible Bandwidth Power Thermal Environmental Many of these will be addressed by improving performance of system components such as high speed chips, optical packaging & interconnect, optical backplanes and high performance PCBs 22

23 Chip Level Solutions Continue Moore s Law Scaling Reduce leakage currents Transistors are less than 10% of IC power today and going down Reduce on-chip Interconnect power by: Improved conductor conductivity Decrease capacitance Reduce interconnect length Reduce operating frequency Reduce operating voltage Voltage regulator per core Reduce high speed electrical signal length Move photons closer to the transistors 23

24 Board Level Solutions Increased density on the PCBs Ultra Loss Loss Materials Smoother copper traces Embedded Optical traces Optical Connectors 24

25 Collaboration

26 Strategic Concerns Restructuring from vertically integrated OEMs to multifirm supply chains Resulted in a disparity in R&D Needs vs. available resources Arrival of New players Critical needs for R&D Middle part of the Supply Chain is least capable of providing resources Industry collaboration Gain traction at University R&D centers, Industry consortia, ad-hoc cross-company R&D teams The mechanisms for cooperation throughout the supply chain must be strengthened. 26 Cooperation among OEMs, ODMs, EMS firms and component suppliers is needed to focus on the right technology and to find a way to deploy it in a timely manner

27 Consumer Segment had been driving Technology Changes Smart phones dominated unit volume growth for portable products, and the overall market volume growth has been driving other areas: Increased focus on shrinking form factor and low power High level of integration (SoC, SiP) 3D packaging and Embedded Die market leaders Significant focus on sustainability, eco-design and recycling The MEMS/sensor technology for unleashing entertainment, medical, and security as well as perceptual computing Convergence of Entertainment, Computing, Communication drives integration 27 The world of OS and applications and middleware challenges, will drive major shifts and consolidations to enable seamless computing and interoperability The pace of product enhancements is growing rapidly.

28 Other important areas for collaboration Data Security Counterfeit Products Rare Earth and Conflict Materials Carbon foot printing 28

29 Invitation to get involved in the future Benefits of Roadmapping: Assessment of where the whole ecosystem is at Identification of where we/industry want to be Comparison of various technology paths Clarification on what is needed to get there Visibility to what is happening the sooner the better Communication to the industry and along the supply chain is enhanced Define where collaboration and/or innovation is necessary 29

30 North America: Bill Bader Europe: Steve Payne Asia Pacific: Haley Fu