ASIC Clouds: Specializing the Datacenter
|
|
- Ira Garrett
- 6 years ago
- Views:
Transcription
1 ASIC Clouds: Specializing the Datacenter Ikuo Magaki, Moein Khazraee, Luis Vega Gutierrez, and Michael Bedford Taylor UC San Diego and Toshiba Presented By: Vandit Agarwal
2 Motivation GPU and FPGA based clouds already successful Even ASIC Clouds have been successfully used Take this idea ahead to form ASIC based clouds for other applications Purpose built Datacenter Large arrays of ASIC accelerators Optimize Total Cost of Ownership (TCO) For increasingly common high-volume chronic computations Downside: High Non Recurring Engineering (NRE) Inflexibility
3 Introduction Two visible trends: Heavy work done on cloud; interactive moved to client Rise of dark silicon - specialization and near threshold computation Conjunction of these two designs proved viable On a single machine level, ASICs can offer at least an order improvement - explore and propose ASIC cloud Identify key issues by studying Bitcoin ASIC Cloud
4 Objective In a Nutshell Two key metrics drive the development: H/w cost per performance = $ per op/s Energy per operation = W per op/s Working with a joint knowledge/control over datacenter and h/ w design Select single TCO-optimal point amongst many Paretooptimal points
5 Specialization Hierarchy Off-PCB Interface On-PCB Network On-ASIC Interconnection Network ASIC Design: achieves reduction in silicon area and energy consumption ASIC Server: organization of ASIC, heat sinks, selective components, custom voltages ASIC Datacenter: optimize rack and datacenter level thermal distribution, costs such as provisioning cost, availability, taxes etc. **To meet the requirements at datacenter level, modifications trickle down in the hierarchy
6 ASIC Cloud Architecture Off-PCB Interface On-PCB Network On-ASIC Interconnection Network Trying to create a generic skeleton for ASIC Cloud Heart of ASIC cloud - Replicated Compute Accelerator (RCA) - multiplied recursively Customization: eg - if RCA requires DRAM, then ASIC contains shared DRAM controllers connected to ASIC-local DRAMs
7 ASIC Server Overview Focussed on 1U 19-inch Rackmount servers Forced air-cooling system Air intake from front, removal from back Air at 30 o C
8 ASIC Server Evaluation Flow Given an implementation and architecture for target RCA: VLSI tools used to map it to target process Analysis tools provide info on: Area Performance Power density Tune the following to find lowest TCO: No. of RCAs/Chip No. of chips/pcb Organization of chips on PCB Power delivery mechanism Cooling mechanism Choice of voltage
9 Thermally-Aware ASIC Server Design ASICs and DC/DC convertors - major sources of heat Heat Sinks: Heat spreader glued to the heat source (die) using Thermal Interface Material (TIM) Spreader has fins - air blowed through them Increasing spreader size improves cooling Increasing the die size improves cooling - overcomes TIM resistance Developed a model: Input: fan curve, ASIC count/row Output: Optimal heat sink parameters
10 Arranging ASICs on PCB
11 More Chips vs Fewer Chips How large (in mm 2 ) should each chip be? Determines how many RCAs will be on each chip Many small ASICs easier to cool than few large ASICs Increasing silicon area -> heat dissipation capacity increases (TIM) Large total die area in a row is effective Increasing no. of chips increases the packaging cost but not by much
12 Power Density and Server Cost Given same RCA, increasing Watts, increases performance Moving right (high power density), very little total silicon per lane (due to temperature constraints) and must be divided into many smaller chips Cooling and packaging cost Moving left (low power density), more silicon per lane and fewer chips Silicon area cost
13 Bitcoin Semi-anonymously and securely transfer money Blockchain - globally replicated public ledger of transactions A distributed consensus algorithm called Byzantine Fault Tolerance determines whose transactions are added to the blockchain Mining: Machines request work from a pool server Hash - brute force attempt at partial inversion of cryptographically hard hash function Hashrate - rate of hash - typically Giga hashes per second (GH/s) On success, other machines verify. Accept and append the block
14 What Led to Bitcoin ASIC Cloud? People are incentivized to mine: More number of machine = more secure system Blockchain reward (25 BTC = ~USD 11k in 2016) 144 blocks daily x 25 BTC per block = ~USD 1.5M daily Rising TCO justifies the increased investment in NRE and other development cost Leads to more specialization
15 Bitcoin ASIC Trend Difficulty
16 Implementation 0.66 mm 2 silicon in UMC 28-nm process. Power density: 2W/mm 2 Extremely high power density
17 Results More silicon -> optimal voltages decreases -> server efficiency increases Initially, costs reduce (right to left) but then silicon costs start building up
18 Voltage Stacking DC/DC power is significant Chips serially chained so that their supplies sum to 12V Lead to significant savings in TCO optimal case
19 Litecoin ASIC Cloud
20 Video Transcoding ASIC Cloud **Pareto points are glitchy because of variations in constants and polynomial order for server components as they vary with voltages
21 CNN ASIC Cloud
22 When is ASIC Cloud Feasible
23 Discussion This is one of the earlier attempts to create a general framework/skeleton for an ASIC cloud. How feasible do you think this technology is and how widely and how soon can we potentially adopt it for a large variety of applications? The authors recommend that open sourcing various tools by the cloud providers and silicon foundries would potentially lead to lower TCO. Is this a good solution? Why or why not? What do you think is more optimal? Investing heavily in (high NRE) in more advanced nodes (eg 16nm) or using/modifying older nodes (eg 65nm) in an ASIC?
24 Bitcoin ASIC Cloud Design Repeatedly execute a Bitcoin hash operation Input: 512 bit block Mutate the block and perform SHA256 on it Fed into another round of SHA256 Leading zero count performed and matched with the target 64 rounds in each SHA
25
26
27
Security Analysis of Bitcoin. Dibyojyoti Mukherjee Jaswant Katragadda Yashwant Gazula
Security Analysis of Bitcoin Dibyojyoti Mukherjee Jaswant Katragadda Yashwant Gazula Security Analysis of Bitcoin Introduction How Bitcoin works? Similar peer-to-peer systems Vulnerabilities and solutions
More informationProblem: Equivocation!
Bitcoin: 10,000 foot view Bitcoin and the Blockchain New bitcoins are created every ~10 min, owned by miner (more on this later) Thereafter, just keep record of transfers e.g., Alice pays Bob 1 BTC COS
More informationECE 486/586. Computer Architecture. Lecture # 2
ECE 486/586 Computer Architecture Lecture # 2 Spring 2015 Portland State University Recap of Last Lecture Old view of computer architecture: Instruction Set Architecture (ISA) design Real computer architecture:
More informationBitcoin. CS6450: Distributed Systems Lecture 20 Ryan Stutsman
Bitcoin CS6450: Distributed Systems Lecture 20 Ryan Stutsman Material taken/derived from Princeton COS-418 materials created by Michael Freedman and Kyle Jamieson at Princeton University. Licensed for
More informationBlockchain. CS 240: Computing Systems and Concurrency Lecture 20. Marco Canini
Blockchain CS 240: Computing Systems and Concurrency Lecture 20 Marco Canini Credits: Michael Freedman and Kyle Jamieson developed much of the original material. Bitcoin: 10,000 foot view New bitcoins
More informationProof-of-Work & Bitcoin
CS 220: Introduction to Parallel Computing Proof-of-Work & Bitcoin Lecture 19 Bitcoin: Mining for Heat https://qz.com/1117836/bitcoin-mining-heatshomes-for-free-in-siberia/ 4/25/18 CS 220: Parallel Computing
More informationBitcoin Mining. A high-level technical introduction. Konstantinos Karasavvas
Bitcoin Mining A high-level technical introduction Konstantinos Karasavvas Outline PoW / Hashcash Transaction propagation Block mining Block propagation Mining Profitability Proof of Work From wikipedia:
More informationQSFP-DD: Enabling 15 Watt Cooling Solutions
QSFP-DD MSA QSFP-DD: Enabling 15 Watt Cooling Solutions White Paper Mark Nowell: Cisco Attila Aranyosi, Vu Le, Jeffery J. Maki: Juniper Networks Scott Sommers, Tom Palkert, Weiming Chen: Molex 3/12/2018
More informationThermal Design and Management of Servers
White Paper Thermal Design and Management of Servers Thermal Design and Management of Servers P.1 Overview With the exponential growth of knowledge development, data needs to be stored, processed and secured
More informationBitcoin (Part I) Ken Calvert Keeping Current Seminar 22 January Keeping Current 1
Bitcoin (Part I) Ken Calvert Keeping Current Seminar 22 January 2014 2014.01.22 Keeping Current 1 Questions What problem is Bitcoin solving? Where did it come from? How does the system work? What makes
More informationBREAKING THE MEMORY WALL
BREAKING THE MEMORY WALL CS433 Fall 2015 Dimitrios Skarlatos OUTLINE Introduction Current Trends in Computer Architecture 3D Die Stacking The memory Wall Conclusion INTRODUCTION Ideal Scaling of power
More informationSmalltalk 3/30/15. The Mathematics of Bitcoin Brian Heinold
Smalltalk 3/30/15 The Mathematics of Bitcoin Brian Heinold What is Bitcoin? Created by Satoshi Nakamoto in 2008 What is Bitcoin? Created by Satoshi Nakamoto in 2008 Digital currency (though not the first)
More informationBitcoin (and why it uses SO much energy)
Bitcoin (and why it uses SO much energy) David Malone Hamilton Institute / Dept Maths&Stats Maynooth University. 2018-11-08 Bitcoin Background Bitcoin is a cryptocurrency that started around 2008 2009.
More informationConsensus & Blockchain
Consensus & Blockchain S P Suresh Chennai Mathematical Institute Formal Methods Update Meeting IIT Mandi July 17, 2017 The Bitcoin revolution is upon us What is Bitcoin? Bitcoin: an exciting new currency
More informationPower Density. Digital Control. Improvements and. Techniques Enabling. Power Management Capabilities. Technical Paper 004
Digital Control Techniques Enabling Power Density Improvements and Power Management Capabilities Technical Paper 004 First presented at PCIM China 2007 Digital control can be used as an enabling technology
More informationPart 1 of 3 -Understand the hardware components of computer systems
Part 1 of 3 -Understand the hardware components of computer systems The main circuit board, the motherboard provides the base to which a number of other hardware devices are connected. Devices that connect
More informationP2P BitCoin: Technical details
ELT-53206 Peer-to-Peer Networks P2P BitCoin: Technical details Mathieu Devos Tampere University of Technology Department of Electronics & Communications Engineering mathieu.devos@tut.fi TG406 2 Outline
More informationWhat is Proof of Work?
What is Proof of Work? Educational Series September 18, 2018 Overview There are many protocols that regulate how nodes on a blockchain achieve consensus, and currently the most popular is proof-of-work.
More informationThermal Management of Mobile Electronics: A Case Study in Densification. Hongyu Ran, Ilyas Mohammed, Laura Mirkarimi. Tessera
Thermal Management of Mobile Electronics: A Case Study in Densification Hongyu Ran, Ilyas Mohammed, Laura Mirkarimi Tessera MEPTEC Thermal Symposium: The Heat is On February 2007 Outline Trends in mobile
More informationPower Considerations in High Performance FPGAs. Abu Eghan, Principal Engineer Xilinx Inc.
Power Considerations in High Performance FPGAs Abu Eghan, Principal Engineer Xilinx Inc. Agenda Introduction Trends and opportunities The programmable factor 4 focus areas for power consideration Silicon
More informationBitcoin and Blockchain
Bitcoin and Blockchain COS 418: Distributed Systems Lecture 18 Zhenyu Song [Credit: Selected content adapted from Michael Freedman. Slides refined by Chris Hodsdon and Theano Stavrinos] Why Bitcoin? All
More informationVblock Infrastructure Packages: Accelerating Deployment of the Private Cloud
Vblock Infrastructure Packages: Accelerating Deployment of the Private Cloud Roberto Missana - Channel Product Sales Specialist Data Center, Cisco 1 IT is undergoing a transformation Enterprise IT solutions
More informationData Center Trends: How the Customer Drives Industry Advances and Design Development
Bablu Kazi, PE MORRISON HERSHFIELD MISSION CRITICAL Data Center Trends: How the Customer Drives Industry Advances and Design Development What does the Customer Need? Scalability P U E Latest Technology
More informationSurveying the Physical Landscape
Surveying the Physical Landscape UL and the UL logo are trademarks of UL LLC 2017 What do we mean by physical security? Some might think about this Or this Or For this presentation, we mean protection
More informationAutomated Transient Thermal Analysis
Automated Transient Thermal Analysis with ANSYS Icepak and Simplorer Using EKM Eric Lin Lalit Chaudhari Shantanu Bhide Vamsi Krishna Yaddanapudi 1 Overview Power Map Introduction Need for Chip-co Design
More informationThermal Considerations in Package Stacking and Advanced Module Technology
Thermal Considerations in Package Stacking and Advanced Module Technology Ulrich Hansen, Director of Marketing, Staktek February 16, 2006 Continued drive to increase sub-system density, functionality and
More informationAdvanced Thermal Solution Dynamic Heat Conduction System (DHCS) Introduction
August 31, 2015 Version 1. 0 Advanced Thermal Solution Dynamic Heat Conduction System (DHCS) Introduction Author: Irene.Wu E-mail: Irene.Wu@advantech.com.tw August 31, 2015 Version 1. 0 Table of Contents
More information2005 IBM Power and Cooling Technology Symposium. Advancements in Power Interconnect. Presenter: Don Wood Date: September 21, 2005
2005 IBM Power and Cooling Technology Symposium Advancements in Power Interconnect Presenter: Don Wood Date: September 21, 2005 Overview This presentation examines the following power interconnect trends
More informationIBM Integrated Server Farm (ISF)
IBM Integrated Server Farm (ISF) TSS HW Services 05/04/2005 Data Centre Trends The density of computing power in a data centre environment has steadily increased in recent years. This trend is driven by
More informationTransistors and Wires
Computer Architecture A Quantitative Approach, Fifth Edition Chapter 1 Fundamentals of Quantitative Design and Analysis Part II These slides are based on the slides provided by the publisher. The slides
More informationBest Engineering Practice to Extend the Free Air-Cooling Limit in Tablet Hand Held Devices AMD TFE 2011
Best Engineering Practice to Extend the Free Air-Cooling Limit in Tablet Hand Held Devices AMD TFE 2011 Gamal Refai-Ahmed, Ph.D, AMD Fellow Guy Wagner, Director - Electronic Cooling Solutions William Maltz,
More informationPowerPlay Early Power Estimator User Guide for Cyclone III FPGAs
PowerPlay Early Power Estimator User Guide for Cyclone III FPGAs 101 Innovation Drive San Jose, CA 95134 www.altera.com Software Version: QII v9.0 SP2 Document Version: 2.0 Document Date: June 2009 UG-01013-2.0
More informationBlockchain Beyond Bitcoin. Mark O Connell
Mark O Connell mark@mkoconnell.com SNIA Legal Notice The material contained in this tutorial is copyrighted by the SNIA unless otherwise noted. Member companies and individual members may use this material
More information3331 Quantifying the value proposition of blade systems
3331 Quantifying the value proposition of blade systems Anthony Dina Business Development, ISS Blades HP Houston, TX anthony.dina@hp.com 2004 Hewlett-Packard Development Company, L.P. The information contained
More informationBrief Background in Fiber Optics
The Future of Photonics in Upcoming Processors ECE 4750 Fall 08 Brief Background in Fiber Optics Light can travel down an optical fiber if it is completely confined Determined by Snells Law Various modes
More informationLecture 8: Virtual Memory. Today: DRAM innovations, virtual memory (Sections )
Lecture 8: Virtual Memory Today: DRAM innovations, virtual memory (Sections 5.3-5.4) 1 DRAM Technology Trends Improvements in technology (smaller devices) DRAM capacities double every two years, but latency
More informationThe Effect of Temperature on Amdahl Law in 3D Multicore Era
The Effect of Temperature on Amdahl Law in 3D Multicore Era L Yavits, A Morad, R Ginosar Abstract This work studies the influence of temperature on performance and scalability of 3D Chip Multiprocessors
More informationFPGA Power Management and Modeling Techniques
FPGA Power Management and Modeling Techniques WP-01044-2.0 White Paper This white paper discusses the major challenges associated with accurately predicting power consumption in FPGAs, namely, obtaining
More informationSophon SC1 White Paper
Sophon SC1 White Paper V10 Copyright 2017 BITMAIN TECHNOLOGIES LIMITED All rights reserved Version Update Content Release Date V10-2017/10/25 Copyright 2017 BITMAIN TECHNOLOGIES LIMITED All rights reserved
More informationChapter 5: ASICs Vs. PLDs
Chapter 5: ASICs Vs. PLDs 5.1 Introduction A general definition of the term Application Specific Integrated Circuit (ASIC) is virtually every type of chip that is designed to perform a dedicated task.
More informationDigital Design Methodology (Revisited) Design Methodology: Big Picture
Digital Design Methodology (Revisited) Design Methodology Design Specification Verification Synthesis Technology Options Full Custom VLSI Standard Cell ASIC FPGA CS 150 Fall 2005 - Lec #25 Design Methodology
More informationSmartPool: practical decentralized pool mining. Loi Luu, Yaron Velner, Jason Teutsch, and Prateek Saxena August 18, 2017
SmartPool: practical decentralized pool mining Loi Luu, Yaron Velner, Jason Teutsch, and Prateek Saxena August 18, 2017 Mining pools Miners role in cryptocurrencies Definition: A cryptocurrency is a decentralized
More informationThermal Analysis on Face-to-Face(F2F)-bonded 3D ICs
1/16 Thermal Analysis on Face-to-Face(F2F)-bonded 3D ICs Kyungwook Chang, Sung-Kyu Lim School of Electrical and Computer Engineering Georgia Institute of Technology Introduction Challenges in 2D Device
More informationICS 421 & ICS 690. Bitcoin & Blockchain. Assoc. Prof. Lipyeow Lim Information & Computer Sciences Department University of Hawai`i at Mānoa
ICS 421 & ICS 690 Bitcoin & Blockchain Assoc. Prof. Lipyeow Lim Information & Computer Sciences Department University of Hawai`i at Mānoa Accepted by: Overstock.com Expedia.com Newegg.com Tigerdirect.com
More informationBITMAIN. S2 Server Manual
BITMAIN S2 Server Manual Page 2 of 10 Contents 1 Overview... 3 2 Connect to Server... 4 3 Pool Setting... 5 4 Server Status... 6 5 System Configuration and status... 7 5.1 System Upgrading... 7 5.2 Password
More informationDigital Design Methodology
Digital Design Methodology Prof. Soo-Ik Chae Digital System Designs and Practices Using Verilog HDL and FPGAs @ 2008, John Wiley 1-1 Digital Design Methodology (Added) Design Methodology Design Specification
More informationIntelligent Power Allocation for Consumer & Embedded Thermal Control
Intelligent Power Allocation for Consumer & Embedded Thermal Control Ian Rickards ARM Ltd, Cambridge UK ELC San Diego 5-April-2016 Existing Linux Thermal Framework Trip1 Trip0 Thermal trip mechanism using
More informationProposers Day Workshop
Proposers Day Workshop Monday, January 23, 2017 @srcjump, #JUMPpdw Advanced Devices, Packaging, and Materials Horizontal Research Center Aaron Oki NG Fellow Northrop Grumman Center Motivation Active and
More informationData Centers. The Environment. December The State of Global Environmental Sustainability in Data Center Design
Data Centers & The Environment The State of Global Environmental Sustainability in Data Center Design December 2018 Today s Data Centers Data centers have a huge impact on the world we live in. Today they
More informationCS 4770: Cryptography. CS 6750: Cryptography and Communication Security. Alina Oprea Associate Professor, CCIS Northeastern University
CS 4770: Cryptography CS 6750: Cryptography and Communication Security Alina Oprea Associate Professor, CCIS Northeastern University March 30 2017 Outline Digital currencies Advantages over paper cash
More informationEmulex LPe16000B Gen 5 Fibre Channel HBA Feature Comparison
Demartek Emulex LPe16000B Gen 5 Fibre Channel HBA Feature Comparison Evaluation report prepared under contract with Emulex Executive Summary Explosive growth in the complexity and amount of data of today
More informationAlgorand: Scaling Byzantine Agreements for Cryptocurrencies
Algorand: Scaling Byzantine Agreements for Cryptocurrencies Yossi Gilad, Rotem Hemo, Silvio Micali, Georgios Vlachos, Nickolai Zeldovich Presented by: Preet Patel and Umang Lathia Outline Overview of Distributed
More informationFrequently Asked Questions. s620 SATA SSD Enterprise-Class Solid-State Device
Frequently Asked Questions s620 SATA SSD Enterprise-Class Solid-State Device Frequently Asked Questions Q: What about advanced data protection? A: In mission-critical enterprise and datacenter applications,
More informationFlexible & Scalable 48V Solutions Powering Tomorrow s Data Centers. Sean Gold Maxim Integrated 3/9/2017
Flexible & Scalable 48V Solutions Powering Tomorrow s Data Centers Sean Gold Maxim Integrated 3/9/2017 Rack Architectures are Changing from 12V to 48V Why a New Rack Power Architecture is Needed Data Centers
More informationA Lightweight Blockchain Consensus Protocol
A Lightweight Blockchain Consensus Protocol Keir Finlow-Bates keir@chainfrog.com Abstract A lightweight yet deterministic and objective consensus protocol would allow blockchain systems to be maintained
More informationCONSENSUS PROTOCOLS & BLOCKCHAINS. Techruption Lecture March 16 th, 2017 Maarten Everts (TNO & University of Twente)
CONSENSUS PROTOCOLS & BLOCKCHAINS Techruption Lecture March 16 th, 2017 Maarten Everts (TNO & University of Twente) 2 Consensus protocols & blockchain 3 Consensus protocols & blockchain 4 Consensus protocols
More informationTHERMAL GRADIENT AND IR DROP AWARE DESIGN FLOW FOR ANALOG-INTENSIVE ASICS
THERMAL GRADIENT AND IR DROP AWARE DESIGN FLOW FOR ANALOG-INTENSIVE ASICS Pacific MicroCHIP Corp. AIMS-CAT November, 2009 OUTLINE Motivation Thermal Gradient Impact Simulation Methodology Results Accurate
More informationPower dissipation! The VLSI Interconnect Challenge. Interconnect is the crux of the problem. Interconnect is the crux of the problem.
The VLSI Interconnect Challenge Avinoam Kolodny Electrical Engineering Department Technion Israel Institute of Technology VLSI Challenges System complexity Performance Tolerance to digital noise and faults
More informationECE520 VLSI Design. Lecture 1: Introduction to VLSI Technology. Payman Zarkesh-Ha
ECE520 VLSI Design Lecture 1: Introduction to VLSI Technology Payman Zarkesh-Ha Office: ECE Bldg. 230B Office hours: Wednesday 2:00-3:00PM or by appointment E-mail: pzarkesh@unm.edu Slide: 1 Course Objectives
More informationMSYS 4480 AC Systems Winter 2015
MSYS 4480 AC Systems Winter 2015 Module 12: DATA CENTERS By Satwinder Singh 14/05/2015 1 Data Centers Data Centers are specialized environments that safeguard your company's most valuable equipment and
More informationTest Methods for DC/DC Power Modules
Test Methods for DC/DC Power Modules Design Note 027 Flex Power Modules Precautions Abstract A user may have the desire to verify or characterize the performance of DC/DC power modules outside the system
More informationQualification Strategies of Field Programmable Gate Arrays (FPGAs) for Space Application October 26, 2005
Qualification Strategies of Field Programmable Gate Arrays (FPGAs) for Space Application October 26, 2005 Douglas Sheldon Harald Schone Historical FPGAs have been used in spacecraft for over 10 years.
More informationVersion 0.7. GoldCoin Patch Announcement. What is a 51% attack. The impossible made possible
Version 0.7 www.gldcoin.com www.gldtalk.org October 11 2013 GoldCoin Patch Announcement Welcome to the GoldCoin minor version 7 announcement. We have some fantastic news for you folks today. We have at
More informationSystems and Technology Group. IBM Technology and Solutions Jan Janick IBM Vice President Modular Systems and Storage Development
Systems and Technology Group IBM Technology and Solutions Jan Janick IBM Vice President Modular Systems and Storage Development Power and cooling are complex issues There is no single fix. IBM is working
More informationPhysicals: Scope (Extrapolate) William Tschudi, LBNL
Physicals: Scope (Extrapolate) William Tschudi, LBNL Top Challenges for a Science of Physicals Models, models, models Understanding power dissipation, heat distribution, cooling, interactions Big O for
More informationDarkcoin: Peer to Peer Crypto Currency with Anonymous Blockchain Transactions and an Improved Proof of Work System
Darkcoin: Peer to Peer Crypto Currency with Anonymous Blockchain Transactions and an Improved Proof of Work System Introduction Evan Duffield, Kyle Hagan (evan@darkcoin.io, kyle@darkcoin.io) 18 March 2014
More informationENEE 457: E-Cash and Bitcoin
ENEE 457: E-Cash and Bitcoin Charalampos (Babis) Papamanthou cpap@umd.edu Money today Any problems? Cash is cumbersome and can be forged Credit card transactions require centralized online bank are not
More informationConfiguring DDR Interface IP to Enhance Speed and Minimize Design Footprint
Configuring R Interface IP to Enhance Speed and Minimize esign Footprint Bruce Luo, VP Product Solutions Shanghai Event September 14, 2017 2017 What Limits R Performance? PCB SoC Package PCB traces Rx
More informationCoordinating Liquid and Free Air Cooling with Workload Allocation for Data Center Power Minimization
Coordinating Liquid and Free Air Cooling with Workload Allocation for Data Center Power Minimization Li Li, Wenli Zheng, Xiaodong Wang, and Xiaorui Wang Dept. of Electrical and Computer Engineering The
More informationCooling on Demand - scalable and smart cooling solutions. Marcus Edwards B.Sc.
Cooling on Demand - scalable and smart cooling solutions Marcus Edwards B.Sc. Schroff UK Limited Data Centre cooling what a waste of money! A 1MW data center needs 177,000,000 kwh in its lifetime of 10
More informationThermal Management Challenges in Mobile Integrated Systems
Thermal Management Challenges in Mobile Integrated Systems Ilyas Mohammed March 18, 2013 SEMI-THERM Executive Briefing Thermal Management Market Visions & Strategies, San Jose CA Contents Mobile computing
More informationMikko Ohvo Business Development Manager Nokia
HW Solution for distributed edge data centers Mikko Ohvo Business Development Manager Nokia HW Solution for distributed edge data centers Introduction In this presentation Nokia will share design considerations
More information3D Integration & Packaging Challenges with through-silicon-vias (TSV)
NSF Workshop 2/02/2012 3D Integration & Packaging Challenges with through-silicon-vias (TSV) Dr John U. Knickerbocker IBM - T.J. Watson Research, New York, USA Substrate IBM Research Acknowledgements IBM
More informationVirtualization Strategies on Oracle x86. Hwanki Lee Hardware Solution Specialist, Local Product Server Sales
Virtualization Strategies on Oracle x86 Hwanki Lee Hardware Solution Specialist, Local Product Server Sales Agenda Customer Business Needs Oracle VM for x86/x64 Summary Customer Business Needs Common IT
More informationCandidates Day Modeling the Energy Consumption of. Ryan Cole Liang Cheng. CSE Department Lehigh University
Candidates Day 2016 Modeling the Energy Consumption of Blockchain Consensus Algorithms Daniel Lopresti, Interim Dean P.C. Rossin College of Engineering and Applied Science July 30, April 15,2018 2016 Ryan
More informationOIF CEI-56G Project Activity
OIF CEI-56G Project Activity Progress and Challenges for Next Generation 400G Electrical Links David R Stauffer Kandou Bus, SA OIF Physical & Link Layer Working Group Chair June 12, 2014 Electrical Implementation
More informationTechnology for a Changing World
Technology for a Changing World Cisco Expo 2009 Axel Clauberg Director, Solutions & Architectures, Emerging Markets, Cisco Systems November 10, 2009 1 VISION Changing the way the World Lives, Works, Plays
More informationSystem Packaging Solution for Future High Performance Computing May 31, 2018 Shunichi Kikuchi Fujitsu Limited
System Packaging Solution for Future High Performance Computing May 31, 2018 Shunichi Kikuchi Fujitsu Limited 2018 IEEE 68th Electronic Components and Technology Conference San Diego, California May 29
More informationENERGY EFFICIENCY & THERMAL MANAGEMENT TECHNOLOGY SUMMIT SEPT. 2008
ENERGY EFFICIENCY & THERMAL MANAGEMENT TECHNOLOGY SUMMIT SEPT. 2008 Introduction Several fronts are addressing data center energy efficiency and thermal management Berk-Tek s standards work Efforts in
More informationAnupam Datta CMU. Fall 2015
Anupam Datta CMU Fall 2015 A rational reconstruction of Bitcoin 1. Start with straw man design 2. Identify weaknesses 3. Augment design and iterate Alice: I, Alice, am giving Bob one coin Alice digitally
More informationXylem: Enhancing Vertical Thermal Conduction in 3D Processor-Memory Stacks
Xylem: Enhancing Vertical Thermal Conduction in 3D Processor-Memory Stacks Aditya Agrawal, Josep Torrellas and Sachin Idgunji University of Illinois at Urbana Champaign and Nvidia Corporation http://iacoma.cs.uiuc.edu
More informationPower Optimization in FPGA Designs
Mouzam Khan Altera Corporation mkhan@altera.com ABSTRACT IC designers today are facing continuous challenges in balancing design performance and power consumption. This task is becoming more critical as
More informationDatacenter Efficiency Trends. Cary Roberts Tellme, a Microsoft Subsidiary
Datacenter Efficiency Trends Cary Roberts Tellme, a Microsoft Subsidiary Power Slashing Tools P3 Kill-A-WATT Measures min, max, and instantaneous voltage and current draw Calculates power (watts), kilowatt
More informationECE 172 Digital Systems. Chapter 15 Turbo Boost Technology. Herbert G. Mayer, PSU Status 8/13/2018
ECE 172 Digital Systems Chapter 15 Turbo Boost Technology Herbert G. Mayer, PSU Status 8/13/2018 1 Syllabus l Introduction l Speedup Parameters l Definitions l Turbo Boost l Turbo Boost, Actual Performance
More informationCommunity Driven Innovation and Sustainability. Revolutionary IT Infrastructures
Community Driven Innovation and Sustainability. Revolutionary IT Infrastructures Why we do it? Hyper-scale environments are the breeding grounds for new technologies, business models and ideas. The business
More informationUNIT 4 INTEGRATED CIRCUIT DESIGN METHODOLOGY E5163
UNIT 4 INTEGRATED CIRCUIT DESIGN METHODOLOGY E5163 LEARNING OUTCOMES 4.1 DESIGN METHODOLOGY By the end of this unit, student should be able to: 1. Explain the design methodology for integrated circuit.
More informationElectronics Cooling Using Conduction Convection Radiation from Heat Sinks to Heat Pipes - CFD Consulting Services
Electronics Cooling Using Conduction Convection Radiation from Heat Sinks to Heat Pipes - CFD Consulting Services Predictive Engineering s CFD Consulting Experience Electronics cooling can be as simple
More informationA Green Approach. Thermal
A Green Approach to Thermal Management Thermal Management - AGENDA Definitions & Thermal Facts Density Trends Rack Level Management Passive Solutions Thermal Sources & Green Solutions Data Center Layout
More informationFundamentals of Computer Design
CS359: Computer Architecture Fundamentals of Computer Design Yanyan Shen Department of Computer Science and Engineering 1 Defining Computer Architecture Agenda Introduction Classes of Computers 1.3 Defining
More informationEmerging IC Packaging Platforms for ICT Systems - MEPTEC, IMAPS and SEMI Bay Area Luncheon Presentation
Emerging IC Packaging Platforms for ICT Systems - MEPTEC, IMAPS and SEMI Bay Area Luncheon Presentation Dr. Li Li Distinguished Engineer June 28, 2016 Outline Evolution of Internet The Promise of Internet
More informationMicroprocessor Trends and Implications for the Future
Microprocessor Trends and Implications for the Future John Mellor-Crummey Department of Computer Science Rice University johnmc@rice.edu COMP 522 Lecture 4 1 September 2016 Context Last two classes: from
More informationTIRIAS RESEARCH. Lowering Barriers to Entry for ASICs. Why ASICs? Silicon Business Models
Technology industry Reporting Insights Advisory Services Whitepaper by TIRIAS Research June 20, 2017 There has never been a better time to build your own custom application specific integrated circuit
More informationfor Power Energy and
Engineered for Power Management: Dell PowerEdge Servers Are Designed to Help Save Energy and Reduce Costs ABSTRACT Keeping up with the rising cost of energy is one of the greatest challenges facing IT
More informationDominick Lovicott Enterprise Thermal Engineering. One Dell Way One Dell Way Round Rock, Texas
One Dell Way One Dell Way Round Rock, Texas 78682 www.dell.com DELL ENTERPRISE WHITEPAPER THERMAL DESIGN OF THE DELL POWEREDGE T610, R610, AND R710 SERVERS Dominick Lovicott Enterprise Thermal Engineering
More informationInterested in conducting your own webinar?
Interested in conducting your own webinar? Email webinars@bnpmedia.com July 17, 2012 TCO in the Data Center Audio Abstract Presenter Info Slides Handouts Group Chat Q & A Live Twitter Feed Help Survey
More informationThermal solutions for MMIC line amplifiers in CATV systems
Thermal solutions for MMIC line amplifiers in CATV systems David Cheskis and Charles Armour, ANADIGICS March 2013 Introduction CATV systems require amplifiers with high linearity and high output power
More informationSystem Power Management Power Architecture and Power Monitoring. Ken Boyden International Rectifier September, 2006
System Power Management Power Architecture and Power Monitoring Ken Boyden International Rectifier September, 2006 Heat Densities Future trend Problem Management of cooling simply by monitoring temperature
More informationWarehouse-Scale Computers to Exploit Request-Level and Data-Level Parallelism
Warehouse-Scale Computers to Exploit Request-Level and Data-Level Parallelism The datacenter is the computer Luiz Andre Barroso, Google (2007) Outline Introduction to WSCs Programming Models and Workloads
More informationEnergy efficient mapping of virtual machines
GreenDays@Lille Energy efficient mapping of virtual machines Violaine Villebonnet Thursday 28th November 2013 Supervisor : Georges DA COSTA 2 Current approaches for energy savings in cloud Several actions
More informationFive Emerging DRAM Interfaces You Should Know for Your Next Design
Five Emerging DRAM Interfaces You Should Know for Your Next Design By Gopal Raghavan, Cadence Design Systems Producing DRAM chips in commodity volumes and prices to meet the demands of the mobile market
More information