Accelerating the Mass Transition of 100 GbE in the Data Center. Siddharth Sheth, Vice President of Marketing, High-Speed Connectivity
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1 Accelerating the Mass Transition of 100 GbE in the Data Center Siddharth Sheth, Vice President of Marketing, High-Speed Connectivity
2 Inphi: Solving Bandwidth Bottlenecks High-speed analog semiconductor for data center and next gen cloud infrastructure Fabless business model Founded November 2000 and IPO November 2010 NYSE: IPHI International presence Design centers : Santa Clara, UK, West Lake Village, Taiwan Field Offices : Japan, China, Korea, Taiwan, East Coast 171 employees worldwide: 119 engineers and system designers 17 product lines; 170+ products based on III-V and CMOS Over 160 customers worldwide More than 80% of all internet traffic goes through Inphi products (1) Note (1) Source: Based on Inphi share for 10G port type shipments for 2010 per Ovum, and Inphi management estimates for 40G and 100G 2
3 Megatrend 1: Exploding IP Traffic Any Device, Any Content, Anywhere Drives Need for Network Infrastructure Upgrade (PB per Month) 70,000 52,500 35,000 17, Source: Cisco Visual Networking Index PB: Petabyte 3
4 Megatrend 2: Bandwidth Enabling Cloud Computing DRAM DRAM DRAM DRAM CPU DRAM Cloud Hardware and Software Layer DRAM DRAM Data Center DRAM Core Network IPTV Mobile Internet Video Conference Broadband Aggregation Network 4
5 100G PHY Adoption 100G Deployments Started Next Gen 100G Deployments Core Routers Datacenter Switches Blade Servers iphy Early Adoption iphy Mainstream Adoption Foundation : 25Gbps CMOS Platform (Low Power PLLs, SerDes, Equalizers, CDRs) (Signal Integrity, Manufacturability) 3-vector strategy targeting end-to-end 100G PHY solutions Lower power 100GE CMOS PHYs and lower power optics will enable next gen 100GbE datacenter deployments 100G CMOS PHY technology can be re-used in Infiniband (EDR) and Fibre-Channel (32G) datacenter applications 5
6 Need for Speed in Data Centers : Simplification 10GbE Pipes 100GbE Pipes Source: IEEE 802.3ba_Yahoo presentation_2007 6
7 Need for Speed in Data Centers: Data Center Fabric 100GbE 100GbE Juniper QFabric Brocade VCS 100GbE 100GbE Cisco Unified Fabric HP FlexFabric 7
8 10G equivalent SFP+ 4-5 W 10G equivalent XFP W 8-12 W Here Today (10G equivalent X2/XENPAK) 8
9 Next Gen 100G Systems : Higher Silicon Content Current CFP Solution Inphi-based Next Gen 100G Solution CFP2, CFP4 100G System 1 Terabit System >10X Bandwidth System ASICs 100 Gbps capacity 10G CFP Module 100G SerDes CFP Module 100G SerDes System ASICs 1 Tbps capacity nx10g nx28g CFP Module System 10G Interface Driver TIA Tx CDR Rx CDR System 28G Interface Next Gen Module with >10x Density Content $ Power Process $X 20W SiGe >$10X <10W CMOS SiGe PHY technology is in the CFP module today Next gen CFP will contain CMOS PHYs CFP2, CFP4 based systems with CMOS 100G PHYs on line card 9
10 Low Power CMOS SerDes: Key Enabler for 100GbE CMOS : Lower Power, Integration, Ease-of-Manufacturability CMOS benefits from Moore s law scaling Higher integration, lower cost, and lower power than SiGe CMOS is slower than SiGe Detailed channel model definitions and channel link simulations Key innovations in architecture and design needed to achieve performance margins 1) GB package 2) Receiver input termination 3) EQ/CDR AMI model 1) CDR package 2) TX output termination 3) TX EQ AMI model TIA ODeMux 1:4 CR loop PI Channel layout on the line Card Quattro2 connector Channel layout in the module CR loop PI PI CR loop 1) GB package Line Card routing 2) TX output including striplines termination and vias 3) TX EQ AMI model Module routing including microstrip/stripline, via, AC coupling cap 1) CDR package 2) Receiver input termination 3) EQ/CDR AMI model 10
11 First Generation 100G PHY 20W CFP Module Shipping now in CFPs 10:4 Gearbox IC SiGe Technology 2-chip solution Two suppliers (Finisar and SemTech) Power : 8-12W Source for Feature Set Terminology: Jeff Maki, Juniper Networks 11
12 Second Generation 100G PHY CMOS <12 W CFP Module CMOS CMOS <7W CFP2 Module Production shipments in :4 Gearbox IC and CDR CMOS Technology Single chip Gearbox IC solution Multiple Tier-1 merchant IC suppliers Power : <3.5W Source for Feature Set Terminology: Jeff Maki, Juniper Networks 12
13 Third Generation 100G PHY CMOS Production shipments start in 2013/2014 for CFPs, CFP2s, CFP4s and host cards) 10:4 Gearbox + MLG (OIF standard will be adopted in 2012) CMOS Technology CMOS Multiple Tier1 merchant IC Suppliers <2.5W CMOS Source for Feature Set Terminology: Jeff Maki, Juniper Networks 13
14 Tri-rate PHYs Required for Next Gen Data Centers Data Center Ethernet Switch Market was ~6.0B USD in 2010 Overall data center switch market expected to grow at 8-12% CAGR 10GbE Expected to be the Fastest Grower Near Term, Followed by 40GbE 100GE expected to ramp in the 2014 timeframe Next Gen PHYs Need a Tri-rate Speed Strategy Support 10G SerDes and 25G SerDes Tri-rate PHY (10/40/100G) required to capture data center growth Next Gen Optics MSAs QSFP+ allows 10G / 40G support CFP2 allows 100G support Will there be an MSA supporting 10/40/100G? QSFP2 (100G QSFP+) Source : Crehan Research 14
15 Conclusion 100GbE deployment in data centers is the next step of adoption Industry roadmap for data center-friendly100gbe optical MSA CFP2, CFP4, 100G QSFP+ CMOS Tri-rate PHYs coming next for data center deployments 10 / 40 / 100G Ethernet support in a single PHY Low power, Low latency, Integration and Ease-of- Manufacturability Key technology elements from optics and IC component suppliers will enable wider deployment of 100GbE 15
16 Thank You Siddharth Sheth, Vice President of Marketing, High-Speed Connectivity
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