Photonics & 3D, Convergence Towards a New Market Segment Eric Mounier Thibault Buisson IRT Nanoelec, Grenoble, 21 mars 2016

Transcription

1 From Technologies to Market Photonics & 3D, Convergence Towards a New Market Segment Eric Mounier Thibault Buisson IRT Nanoelec, Grenoble, 21 mars

2 CONTENT Silicon Photonics value proposition Why 3D brings value for photonics An industry on the rise 2

3 DATA CENTER TRAFFIC WILL TRIPLE FROM 2014 TO % CAGR Zettabytes per Year (source Cisco Index) Most of the flow will be WITHIN data center: 73% in Source Cisco Index

4 INTERNET CONTENT AND APPLICATION PROVIDERS INVESTMENTS 2014 Investment for Facilities & Equipment In 2014, around $143B was invested worldwide in new data center projects (future technologies, R&D). Content and application providers alone North America $10.9B Europe $12.8B Asian-Pacific $9.7B invest $40B annually to networks, facilities, and equipment. Latin America $4.6B The Middle East and Africa $2.0B 60 new large data centers are expected in Western Europe by /3 of the global investments made in this market. 4

5 WHERE ARE THE TECHNICAL CHALLENGES? For the next generation of data centers three main technical aspects are targeted: Storage capacity Power consumption (always on) Data flow Data Center Equipment manufacturers are continuously working on technical breakthroughs On the storage side, higher density capacity/less latency are sought. Related to power consumption, more efficient systems are needed. For the data flow, faster data transmission and higher bandwidth are required. Storage Capacity Power Consumption Technical Breakthroughs Data Flow IT equipment Power equipment Cooling systems 5

6 WHERE ARE THE TECHNICAL CHALLENGES? Equipment manufacturers are continuously working on technical breakthroughs For the next generation of data centers three main technical aspects are targeted: Storage capacity Power consumption Data flow On the storage side, higher density capacity/less latency are sought. Related to power consumption, more efficient systems are needed. For the data flow, faster data transmission and higher bandwidth are required. Data Center Optical links are a solution at Storage Power Capacity these challenges Consumption while reducing costs! Technical Breakthroughs Data Flow IT equipment Power equipment Cooling systems 6

7 SILICON PHOTONICS Today s status & roadmap Back in 2006, VOA was the first Si photonics products on the market. Today still few Si photonics products are on the market. Roadmap Silicon Photonics on data centers Yole forecasts Si Photonics to start being used in data centers by In the near term (~2020+), Si photonics chips will be deployed in high-speed signal transmission systems, which far exceed the capabilities of copper cabling: HPCs, Data Centres, Medical applications. AOC products available 2014 Silicon Photonics will start being used in data centers Si photonics used for core interconnections within processors As Si photonics evolves and chips become more sophisticated, we expect to see the technology used more in processing tasks such as interconnecting multiple cores within processor chips to boost access to shared cache and busses VOA: the first Si photonics on the market Photons will get closer to the chips! 7

8 MORE TO COME /

9 WE NEED INTEGRATION Small form factor pluggable transceiver is essential part for 100G deployments different flavors for 100G transceivers! Front panel bandwidth is today the most important metrics how many ports can you aggregate? Divided by 2 Divided by 2 Decreasing form factor Increasing front panel density. 32x100 Gbps 3.2Tbps (1.28Tbps for 40G) 9

10 WE NEED INTEGRATION Small form factor pluggable transceiver is essential part for 100G deployments the different flavors for 100G transceivers! Front panel bandwidth is today the most important metrics how many ports can you aggregate? 80% Divided by 2 Compared to IC, fiber pig tailing makes a big difference. Divided by 2 Decreasing form factor Increasing front panel density. 10

11 WE NEED INTEGRATION: 3D IS A SOLUTION 3DICs drivers have not changed Small form factor pluggable over transceiver the years: is essential part for 100G deployments the different flavors for 100G transceivers! Increased performance & functionality Reduce power consumption Reduce form factor Reduce cost Decreasing form factor Increasing front panel density. 11

12 WE NEED INTEGRATION: 3D IS A SOLUTION 3DICs drivers have not changed Small form factor pluggable over transceiver the years: is essential part for 100G deployments the different flavors for 100G transceivers! Increased performance & functionality They correspond to what Si Photonics is looking for: Front panel bandwidth is today the most important metrics how many ports can you aggregate? more bandwidth for HPC & data centres interconnects Reduce power consumption less mw/gbps power consumption Reduce form factor denser integration with 3D stacks (µbumps, 2.5D, TSV) Reduce cost Divided by 2 leverage of CMOS process ($1/Gbps target) Divided by 2 Decreasing form factor Increasing front panel density. 12

13 NOT YET THE IC SUPPLY CHAIN Design Wafer fab Wafer probe (optical & electrical) Assembly Suppliers End-users are driving the R&D for optical data centers. Wafers Chip firms Optical interconnects firms Servers Social network & ebusiness providers Manufacturing equipment Still few IP provider, packaging services providers. Like the IC in the 90s. v Materials & supplies 13

14 STILL FEW PRODUCTS BUT A COMPETITIVE LANDSCAPE Product Manufacturing R&D/ Development Stage Si Photonics Activity Acquired by R&D/MPW Design Fabless Foundries Devices / modules OSATs Systems End-users Business model 14

15 CONCLUSIONS Silicon Photonics is the answer to interconnects bottlenecks in HPC, data centers but is also a promising platform for other applications such as medical, lidar. Packaging is still a major hurdle, 3D developments from the IC world can help. The photonics supply chain is still setting up, for ex. opportunities will arise for OSATs. 15

16 THANK YOU FOR YOUR ATTENTION 16