Services provide by UST CO.,LTD

Transcription

1 Universal Semiconductor Technology Services provide by UST CO.,LTD UST Co.,Ltd will put customer' need before us and promise that all UST staffs will do their best for maximization of satisfaction

2 Yatap Subway Station Head Office & R&D Center Techno Park D-908, Yatap-Dong 151, Bundang-Gu, Seongnam-City, Gyeonggi-Do, KOREA ( ) TEL : FAX : admin@semi-ust.com Clean Room & Facility 150-1, Seongju-ri, Wongog-myeon, Anseong, Gyeonggi-do, KOREA ( ) sales@semi-ust.com

3 Head Office & R&D Center Techno Park D-908, Yatap-Dong 151, Bundang-Gu, Seongnam-City,Gyeonggi-Do, KOREA ( ) Clean Room & Facility Inside C&G Hitech, 150-1, Seongju-ri, Wongog-myeon, Anseong-City, Gyeonggi-do, KOREA ( )

4 CEO Accounting Team Sales Team Engineering Team Equipment Machine Dept. TRACK Dept. CMP Dept. R&D Dept.

5 We ve got your solution Semiconductor Equipment tool UST Inc Supplies FAB, SUB/FAB of semiconductor equipment and specialize refurbishment.

6 TEL MARK-7,8 and ACT-8,12 Modification, Up-grade and Overhaul System Configuration Free Change, Modification and Up-grade Open Cassette Type to SMIF Type Modification and Size Conversion

7 TEL MARK-II, V, VZ, 7, 8 Machine s Inch Conversion (2,4,5,6,8 inch) 6inch and 8inch Multi Flow Cassette Unit and Robot Modification Mapping Sensor Block Modification Main Robot Arm Modification COAT Unit and Cup Modification DEV Unit and Cup Modification WDS/Plate Modification

8 TEL ACT-8,12 Machine s Inch Conversion (6,8 inch) 6inch and 8inch Multi Flow Cassette Unit and Robot Modification Mapping Sensor Block Modification Main Robot Arm Modification COAT Unit and Cup Modification DEV Unit and Cup Modification WDS/Plate Modification

9 2 nd Source Parts and Unit of TEL MARK-II,V,VZ,7,8 and ACT-8,12 Fast delivery and Low-cost but same condition with OEM Parts Cassette Stage Assembly manufacture C/A Arm, Main Arm (Ceramic, Vacuum Arm, Aluminum and Anodizing Type) manufacture Plate (LHP, HHP, CPL, HCP, ADH, HEL and CP Power Supply) manufacture Fan Filter Unit A,B Type (Included HEPA Filter) Oven Central Stack manufacture of TEL ACT8, 12

10 2 nd Source Parts and Unit of TEL MARK-II,V,VZ,7,8 and ACT-8,12 L/E Tank (45cc, 100cc, 150cc, 200cc, etc) manufacture TEL MARK and ACT SMIF Type Unit manufacture of Same condition with OEM COAT Nozzle Assembly (EBR, Back Side Rinse and Photo Resist Nozzle Tip) manufacture DEV Nozzle Assembly (H, SH, Spray and Stream type) manufacture Plasma to TFT LCD modification and Upgrade for TEL MARK by Low -cost

11 TEL Clean Track Mark and ACT-8,12 Hot and Cooling Plate Hot / Cooling Plate Production CPL, HCP, ADH, LHP, HHP Assembly Production Hot Plate Modification (LHP HHP, CPL HCP) Thermo Controller Production Same Condition with OEM Thermo Controller and Circulator of SMC 200mm / 300mm s Repair Service

12 Auto Chemical Supply System modification and upgrade CSS or Manual Supply or Both supply modification Buffer Tank Auto Exchange Type System modification Solvent/Develop/HMDS Chemical Supply System manufacture and modification Resist Cabinet Photo Resist Auto-Exchange manufacture and modification Auto Drain Controller and Tray manufacture and modification

13 TEL/DNS/SEMES Spin Scrubber Refurbishment and Overhaul 6inch and 8inch Multi Flow Cassette Unit and Robot Modification Mapping Sensor Block Modification Main Robot Arm Modification Consumable Parts Solution 2nd Source Parts Controller and OS upgrade (Window XP Version) Provide Labor and Service

14 EBARA EPO2226,2228 Modification, Upgrade and Overhaul EPO2226/EPO2228 Trouble Shooting and Labor Service Free conversion between 6inch with 8inch I-Head Repair and Change Provide 2 nd Source Parts -Rotary Joint manufacture and modification -I-Head manufacture and modification -Provide all of Consumable Parts

15 P.C.B (Printed Circuit Board) Art-work and Assembly OEM / ODM R&D Service We can develop and provide all types of PCB from double-layer products to Carbon, MLB-B/D Single/Double-Layer PCB Multi-Layer PCB (4Layer ~ 26Layer) P.C.B Art Work Metal / Flexible PCB Micom Firmware Development Wire Design Build up etc.

16 OEM / ODM R&D Service Product Design and Development Support Development process chart Development Planning and Review - Item Concept arrangement - technology deployment for Item and Review - Making a Development Plan Product Design - Product Features - 3D Rendering or Make a Design Mock-up and Assembly The design and mold development - Product Features - Make a each Standard Plane for Mechanism, Electronic and Circuit - 3D modeling design and 2D drawing - Mold supplier selection and order - Parts assembly, test and review - Written specifications of Product and Parts

17 Wafer Pre-Aligner Wafer alignment system is equipped with X-axis, Y-axis. It performs highly-accurate centering and Flat or Notch find up to 300mm wafers. Compact size Fast alignment High performance accuracy High performance repeatability Easy to use and install Notch, Flat wafer Sapphire, Glass wafer Wafer broken detect Wafer diameter detect Ethernet communication Substrate size Power Description ~ 300mm Wafer DC24V Specification Centering < ±20 μm Position Accuracy Theta < ±0.1 degree Wafer Eccentricity R: ±5mm Processing Time (sec) Alignment Warming up 3.2 ~ 3.7 sec R: ±5mm Detect Line CCD Camera Moving Axis X, Y, Θ Dimension(mm) 213(W) x 248(D) x 301(H) Weight 8kg

18 Lift- Off System and Manual Spin Coater The machine has designed and manufactured a compact and easy-to-use spin-coater. This system consists of wet bath, Lift off and cleaning unit and includes chemical recycle function for saving chemical volume LIFT-OFF System SPECIFICATION Wafer Size: 2 ~ 8 Wafer Chemical Bath - Double Layer Bath - Wafer Jig up-down Unit - Ultra Sonic Spin Units - Chuck: Edge Gripping type - Chemical / DIW Dispensing - Drain System Transfer Robot Chemical recycling Tank - Temperature Control Available Chemical supply System Operation: Touch Screen Auto Loading & Dispensing High Pressure Nozzle

19 Auto Track Spinner System As the system is used in Lithography, the system coats wafers with photo resist and develop patterns on wafer with develop liquid. This system is used in many kinds of special coating process including MEMS process and includes both coating function of top/back side. UMSC-5 possible the EBR (Edge Bead Removal) on Square Glass Auto Supply System can be set by N2 Pressure LED, MEMS, Bumping, GaAs, Glass, Quartz Multi process flow (Supported Cascade Mode ) Various System Configuration The machine already tested High-repeatability and stability at the production wafer FAB U MSC-5 Glass Coater Gl a ss Developer Description UMSC-5 Specification Standard / Option Standard Option Sample Loading 370 x 470 1,000 x 1,000 Operation PLC & Touch Screen PC Dispensing Auto Dispensing Arm Slit Nozzle Volume Control PR Pumping Tool Motor AC Servo Motor / Direct Type AC Servo Motor / Belt Type Spin Step 20 Steps, 20 Recipes Spin RPM ~ 1,500rpm ~ 5,000rpm Spindle Cover Installed EBR ( Edge Bead Removal) Installed

20 Wafer Loading Module (Wafer Sorter) Wafer Loading Module is equipped with X, Y-axis and Theta, Z-axis. It performs fast and precision motion controlling by micro motor. Substrate size Operation Cylinder Type ~ 300mm Wafer PC Base Flipping Type Robot Cylinder Type Flipping Robot Suction Vacuum Vacuum Mapping Sensor Option Attachment Stroke X-Axis: AC Servo Motor Z-Axis: Air Cylinder R-Stroke: 410mm Z-Stroke: 350mm Arm Ceramic Finger Arm Ceramic Finger Arm