Semiconductor Equipment

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1 Semiconductor Equipment Dept Semiconductor Equipment Mipox Corporation Wafer edge polisher Mipox Edge Polisher has over 140 introduction results to Semiconductor market. G8 用 :2 Bevel shape of any kind of wafers can be controlled. Tape back up feature can process variable diameter wafer bevel grinding Edge layer removal can be achieved. Easy to select polishing edge surface quality by the only change polishing film grain size. Environmentally friendly non-chemical process. UTK Systems Lapping & Polishing Machine High Wafer Precision Track cleaning シリーズ brush, Lapping & Polishing Machine UTK Double sided Lapping & Polishing machines are specially designed for extremely thin wafer. UTK provides total solution as manufacture of Wafer edge brush polishing Machine and brush cleaning machine with its experienced technology as high precision brush manufacture. Ishiihyoki Co.,Ltd. Inkjet Coater Whole coating of Resist and Isolation film Thickness:0.03μm~50μm Realizes high uniformity(±3%~5%) Efficiency in utilizing of material is more than 90%

2 Sonix, Inc USA Wafer bond inspection machine Fully automated nondestructive testing system using ultrasonic scanning. Minimum detect void size : 10μm~ Fully automated handling 200mm and 300mm SECS/GEM compliance The Cross Section Tool allows us to display and measure the depth of a line of TSV s. High throughput can be achieved by using Dual arm robot & scanning. MUSASHI ENGINEERING.INC Dispenser System High speed High accuracy Dispenser System for micro dispensing Standard platform in Local engineering and support for overseas Manual, Semi auto and Full Automatic system Patent on Musashi s own dispenser technology in, USA, Germany and Vision Semicon Co., Ltd. Plasma Cleaning Equipment W/B adhesion improves, Effective in De-Lami control More than 300 sets sold in worldwide High throughput, High quality cleaning Burnt protect mechanism(option)

3 Canon Machinery Inc. Die Bonder System High productivity full automatic die bonder Excellent stability on paste dispensing Shorter distance between preform and bonding to keep paste quality Applicable for large-size frame (up to 100x300mm) Semics Inc. Full Automatic TestProber High performance & low price full automatic prober Wafer size; up to 12 High index time, high load bearing, and high accuracy Many sales records to major testing house and IDM all the world Esmo ag Germany Manipulators esmo manipulators are designed to support and precisely position test heads up to 1300 kg. modular design high safety standards precisely repeatable positioning active cable management motor drive with force-feedback control for safety cut-out

4 Athlete Athlete FA Corporation IC Assembly Equipments High productivity IC packing equipment <Main products> BGA/WLCSP ball mounter Flip Chip Bonder TAB potting system Customized system can be developed by customer s special requirement. Semics Inc. Full Automatic TestProber High performance & low price full automatic prober Wafer size; up to 12 High index time, high load bearing, and high accuracy Many sales records to major testing house and IDM all the world Esmo ag Germany Manipulators esmo manipulators are designed to support and precisely position test heads up to 1300 kg. modular design high safety standards precisely repeatable positioning active cable management motor drive with force-feedback control for safety cut-out

5 EPM Test Incorporated Canada Memory Tester MS5205 General Purpose Memory Test System Target Devise; Flash (NAND, NOR), SRAM, DRAM, non-volatical memory Worldwide sales records for fail analysis/process control Max 16G real-time-bitmap Easy pattern creation by Graphic Sequence Editor: No-C language other; MS4205ex (High speed memory test system)