Tender No Technical Specification for Digital Image Correlation (DIC) System. Commodity Description

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Ella Ramsey
5 years ago
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1 Tender No Technical Specification for Digital Image Correlation (DIC) System Commodity Description We intend to purchase Digital Image Correlation (DIC) System for research, laboratory and industrial applications. Quotations are invited from the eligible bidders for providing the mentioned products as per detailed technical specifications provided in technical requirements section. The proposed system should be equivalent with or better than each of the specifications listed in the technical requirement section. Please follow the instructions carefully and comply your bid accordingly. If any of the instructions are not followed or violated, a submitted bid will be subjected to disqualify. The vendor to provide the following in the quote 1. The quotations must be submitted in two separate envelopes namely Technical quote and price quote and these two parts of the quote are to be clearly marked on the envelopes. The technical quote should provide the detailed technical specifications and photographs of the proposed machine. The additional accessories offered by the manufacturer can also be included. The technical quote should contain only technical specifications without any prices. The price quote should contain the technical specifications as well as prices in details. 2. Submit detail technical specifications of Digital Image Correlation (DIC) System. The technical quote should contain a detailed specification vise Technical Compliance statement, authenticated with signature and seal of the prospective supplier. The bid should be stating whether the proposed machine satisfies or doesn t satisfy with the specified requirements. If the value offered by proposed machine doesn t satisfy the asked specification or any ambiguity left in the specification, the bid will be subjected to disqualify. 3. The prospective supplier should be either original manufacturer or authorized dealer of the original manufacturer of the proposed machine. In case of authorized dealer, the technical quote should contain a valid original certificate provided by the original manufacturer on the name of IIT Bombay. 4. Attractive discount for an educational institution should be offered.

2 5. The prospective supplier is expected to have supplied the below mentioned Digital Image Correlation (DIC) System to at least 2-5 government institutes or national laboratories such as IITs, IISc, NITs, NML, DMRL, NAL etc. Provide the details of 5 users in India for getting first hand feedback about the product. 6. The software should be compatible with the latest versions of windows operating system. Up-gradation of software free for 5 years, if required. 7. Support of hardware and spares for 10 years and more after the End of life of the model. 8. Guarantee and warranty of the product to 3 year warranty. 9. Quotes to be submitted by the vendor s principal in foreign currency. 10. The price quote should include the cost of annual maintenance contract (AMC) for the period of 3 years. 11. If the machine failed to meet the specified requirements, the vendor will be held liable to take the machine back at their own cost. IIT Bombay will not be responsible for any damage to the machine until it is handed over to the user. 12. The firm should have adequate number (at least 10) of such systems currently in operation for more than 5 years. Manufacturer should furnish the details addresses of such establishments where they have supplied similar equipment and running successful for more than 5 years. 13. The firm should be equipped with well-trained engineers to offer post warranty maintenance and service support. Number of service engineers employed in this region by manufacturer should be mentioned. 14. Nearest service center to Mumbai is to be mentioned Technical Specifications: A. Feature High Resolution 3D DIC System for Static Strain measurement, Dynamic and Fatigue Measurements, and Full Field Frequency Analysis Provision for remodeling using user defined coordinate system. In-plane displacements X and Y Directions. Out of plane displacements - Z Direction Strains, Vector Directions, Principal Strains Direction Full Field Accelerations (X,Y and Z Direction) Dynamic measurement with Full Field Frequency Analysis, FFT Analysis

3 The vendor should provide all technical drawings, data and catalogs for reviewing the bid proposal. If there is no published brochure and detail of drawings which describes the above system, it will be recognized by purchaser that the vendor is not qualified. B. Specification I. Software requirements for displacement and strain measurement a) Image Acquisition Software Images should be captured in the following formats: Manual: Press of keyboard or mouse click. Time Capture: User can define the time interval for a limited or unlimited period of time. The user should have the ability to stop and subsequently restart the image acquisition without any loss of stored data. Flexible Capture for Fatigue Measurements: Capture first set of images in a certain time period and subsequent set of images in different time periods. Hardware trigger: Using TTL (Transistor logic) or input signal from an external sensor or manual or time. The software should clearly show if the images have over exposure. The software should clearly show if the calibration carried out is correct and should indicate if the sources of errors for calibration. System should be capable of acquiring load cell and thermocouple data up to 8 channels and display selected channels without disturbing the acquired data Image Acquisition Software for High Speed Cameras. The Image Acquisition Software must support High speed Cameras. The Image Acquisition Software must indicate if the image is under exposed / over exposed and is ideal for DIC Measurements. Capability to capture 1 fps. Interface with the DAQ to capture analog signals. b) 2D and 3D Digital Image Correlation Software Software with the following features: Resolution of Strain Measurement 25 to 50 or better. Vendor should provide exhaustive document to support his claim. Strain Computation Algorithms:- Lagrange, Hencky, Euler-Almansi, Log Euler-Almansi, Engineering, Biot, etc. Indication, if the correlation carried out is correct and if not, indicate sources of errors.

4 Indication of the appropriate subset size to be selected. 3D Displacement and Strain measurements. 2D and 3D Plots of the images Co-ordinate transformation Export of plots in ASCII, TIF, JPEG, AVI, clipboard, etc. Profile over a line, point or area measurement. Animation of the result Color coded display of Displacements, Tangential Strains, Principal Strains (combined with direction) Display of statistical data Computation of Principal Strains, Von Mises and Tresca. Computation of FFT: This must be menu driven and through an external software like Matlab. Variables for FFT: Displacement, Strain and accelerations. Full Field Velocities and Accelerations. Creation of a user defined variable based on user defined Linear and polynomial equation. Computation of statistical data: mean, median, min., max., standard deviation etc. Export of plot and data to MATLAB, etc. Import of 3D DIC Data into a project from other project files. Creation of variables based on user defined equations. For Example: Poisson s ratio. The user defined variable must provide a 3D Plot and other computational facilities of the 3D DIC software, Extract of data in a Node for comparison with FEM Data. c) Software Licenses: License 1: One Main license with the PC. License 2: One Post Processing License. Optional: Quote for 2 post processing licenses (preferably web based) d) Speckle Generator Software for generating speckles. e) Grid Generator software for generating custom built grids. Given the wide range of applications in IIT, it is important that the vendor provide a software to generate custom grids in house. The grid generated should be both white on black background and black on white background. Software for generating user defined speckles is needed. The diameter of the speckle to be generated and the coverage should be user defined.

5 II. Hardware Specifications a) Optical Components and Accessories for displacement and strain measurement 1. Camera 1:- 4MP or more, 75 or more fps USB 3.0 / Gig E Cameras. (Static strain measurements, 10Hz or more) 2. Lenses: 17mm (2 nos.) and 35mm (2 nos.) or equivalent 3. Camera 2:- 1.3 MP, 2000 fps, Ethernet Based cameras. (High Speed Camera for dynamic/fatigue measurement upto 300Hz) 4. Lenses: 50mm (2 nos.) and 100mm (2 nos.) or equivalent 5. UV filters for lenses and trigger switch for cameras 6. Illumination: 2 High intensity LED Lamps with illumination control, mounting stands to uniformly illuminate the surface without heating the structure. Video flood controller unit. 7. Mounting unit: Mounting stand Tripod for mounting the cameras. The tripod should have a head that can be rotated in all 3 directions. Mounting Aluminum Channel to mount the cameras or better configuration. 8. Calibration grids: Aluminum Honeycomb Backed Grids or equivalent 4 10 Dots Spacing s 3,4,5,7,10,14,20 and 28mm or better configuration (Grids with Glass or ceramic or steel backing is Not Acceptable). They should be provided with proper carrying case. 9. White Spray Paint Cans: 10 Nos or more. b) Computer and Data Acquisition Module 1. Notebook Computer: Notebook Computer, 2.9. GHz quad i7, 15.3" 1920x1080 LCD, DVD-RW, 16GB RAM, 256 GB SSD, 1TB Hard Disk, 1GB Graphics Card, Windows 7 64 Bit / W8, MS Office, PCI Express Slot, Carry Case and other Standard Features or better configuration Channel USB Data Acquisition Module to capture analog inputs along with the images. The USB Module should be synchronized with the Low Speed and High Speed camera and capable of capturing dynamic signals or better configuration. * Please note that the price quoted for the optional items : 1. CAD Import, Comparison to FEA results 2. Alignment of multiple measurements, Alignment to CAD data

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