The Advanced Cantilever Probe Card with High Bandwidth (>3GHz) and Experimental Result

Transcription

1 Morgan Ku, Phil Hsieh, Jason Ho, Sobers Chang, Seenew Lai, Dick Ho MJC Probe Inc. The Advanced Cantilever Probe Card with High Bandwidth (>3GHz) and Experimental Result June 8-11, San Diego, CA USA

2 Outline Introduction & Background Objectives & Goal Modeling & Analysis Experiment, Validation & Customer Verification Summary & Conclusion Follow-On Work IEEE SW Test Workshop 2

3 Introduction & Background High Speed Market (LCD, Memory, Logic ) 6,000 5,000 4,000 3,000 2,000 1,000 LCD Driver IC Market Trend Units: [Units M] Source: isuppli Source: (2007/Q1); MPI coordination IEK/ITRI (2007/05) High Resolution Fast Response High Speed Testing FPC-less High Color Reproduction IEEE SW Test Workshop 3

4 Introduction & Background High Frequency Market [Units k] 7,000,000 6,000,000 5,000,000 4,000,000 3,000,000 2,000,000 1,000, Source: KGD Packaging & Test Workshop 2007 ~ Teradyne Wireless Devices Cellular Handsets Cordless Phone WLAN Bluetooth GPS UWB WiMax DVB-H & T-DMB Zigbee IEEE SW Test Workshop 4

5 Introduction & Background Customer / Market Requirement Smile Curve Cost ($), Delivery (Time) Quality (Performance), Service IEEE SW Test Workshop 5

6 Objectives & Goal Objectives Reduce the total cost for high speed device testing High performance (>3GHz, >1Gbps) Low total cost (CP/FT test cost ) Short delivery time (< 2 weeks) Fine pitch (< 35 um) Strategy How?? Improve the Signal Integrity issue of the normal cantilever probe card. IEEE SW Test Workshop 6

7 Modeling & Analysis Modeling The EM model of the probe card EM model(probe), Circuit model(probe Card) IEEE SW Test Workshop 7

8 Modeling & Analysis Modeling Inductance of the cantilever probe IEEE SW Test Workshop 8

9 Modeling & Analysis Modeling The impedance compensated cantilever probe (R+) MPI Patent Pending IEEE SW Test Workshop 9

10 Modeling & Analysis Modeling Inductance comparison IEEE SW Test Workshop 10

11 Modeling & Analysis Improve the R+ probe s impedance matching with DOE method ( EM Simulation result ) IEEE SW Test Workshop 11

12 ANOVA Modeling & Analysis IEEE SW Test Workshop 12

13 S/N Chart Modeling & Analysis IEEE SW Test Workshop 13

14 Modeling & Analysis Modeling The impedance compensated cantilever probe (R+ probe) MPI Patent Pending IEEE SW Test Workshop 14

15 Modeling & Analysis Analysis Frequency Domain response S21,S11 (R+ probe vs. normal probe ) MPI Patent Pending IEEE SW Test Workshop 15

16 Modeling & Analysis Analysis Time Domain response Impedance (R+ probe vs. normal probe ) IEEE SW Test Workshop 16

17 Modeling & Analysis Analysis Time Domain response Rising time 20~80% (R+ probe vs. normal probe ) IEEE SW Test Workshop 17

18 Modeling & Analysis Analysis Time Domain response Rising time 10~90% (R+ probe vs. normal probe ) IEEE SW Test Workshop 18

19 Experiment & Validation Experiment structure Calibration (SOLT+Port extension, TRL) Frequency Domain Time Domain Probe (wafer side) Probe under test Probe (tester side) IEEE SW Test Workshop 19

20 Experiment & Validation Frequency Domain response result S11 - R+ probe vs. normal probe IEEE SW Test Workshop 20

21 Experiment & Validation Frequency Domain response result S21 - R+ probe vs. normal probe IEEE SW Test Workshop 21

22 Experiment & Validation Circuit model vs. experiment result IEEE SW Test Workshop 22

23 Experiment & Validation Time Domain response result Impedance (R+ probe vs. normal probe ) Impedance ~52Ω Impedance ~148Ω IEEE SW Test Workshop 23

24 Experiment & Validation Time Domain response result LCD - mini-lvds (R+ probe vs. normal probe ) Input Data Rate : 500 Mbps Input Voltage: +/- 150 mv IEEE SW Test Workshop 24

25 Experiment & Validation Time Domain response result LCD MDDI (R+ probe vs. normal probe ) Input Data Rate : 500 Mbps Input Voltage: +/- 250 mv IEEE SW Test Workshop 25

26 Experiment & Validation Time Domain response result Memory - DDR-III (R+ probe vs. normal probe ) Input Data Rate : 1.6 Gbps Input Voltage: +/- 1 V IEEE SW Test Workshop 26

27 Experiment & Validation Time Domain response result Logic - SATA-II (R+ probe vs. normal probe ) Input Data Rate : 3.0 Gbps Input Voltage: +/- 250 mv IEEE SW Test Workshop 27

28 Experiment & Validation Time Domain response result Logic - USB 2.0 (R+ probe vs. normal probe ) Input Data Rate : 480 Mbps Input Voltage: +/- 500 mv IEEE SW Test Workshop 28

29 Experiment & Validation Time Domain response result Logic - PCI Express-I (R+ probe vs. normal probe ) PCI E-I (Tx) Input Data Rate : 2.5GMbps Input Voltage: +/- 650 mv IEEE SW Test Workshop 29

30 Experiment & Validation Time Domain response result Logic - HDMI (R+ probe vs. normal probe ) HDMI (Source) Input Data Rate : 2.5 Gbps Input Voltage: +/- 400 mv IEEE SW Test Workshop 30

31 Experiment & Validation Time Domain response result Logic - Display Port (R+ probe vs. normal probe ) Display Port (Sink) Input Data Rate : 2.7 Gbps Input Voltage: +/- 400 mv IEEE SW Test Workshop 31

32 Experiment & Validation Frequency Domain response result R+ probe card (PCB + needle) >3GHz IEEE SW Test Workshop 32

33 Experiment & Validation Time Domain response result R+ probe card (PCB + needle) Mini-LVDS MDDI USB 2.0 PCI E -I HDMI Display Port IEEE SW Test Workshop 33

34 Customer Verification Shmoo comparison Interface: mini-lvds Data Rate: 500 Mbps Application: Large Panel R+ Cantilever Probe Normal Cantilever Probe vs. IEEE SW Test Workshop 34

35 Summary & Conclusion The probe is the main factor to decrease the frequency bandwidth performance of the cantilever probe card. The impedance compensated cantilever probe (R+) has successful been developed and validated the superior SI performance of the probe card. (Patent pending) Hundreds of R+ probe cards have been released to mass production of customer s high speed device testing. IEEE SW Test Workshop 35

36 Application & Specification S21-3dB Bandwidth: > 3GHz Inductance: 7~10 nh Fine pitch: < 35 um Real application of R+ probe cards LCD (mini-lvds, MDDI, ), Memory (DDR-III), Logic (USB2.0, PCI E-I, ) Lead-time < 2 weeks IEEE SW Test Workshop 36

37 Follow-On Work Improving the impedance compensated structure toward to the needle tip. Ongoing work ~ higher speed device testing probe card for RF application devices. IEEE SW Test Workshop 37

38 Acknowledgements Great thanks to MPI (MJC Probe Inc.) teamwork : Tom Peng Judy Chen Tim Hsu Mars Lin Mark Sun Alex Yang Dean Yang Vito Lai Wensen Hung Robert Kao Rex Liao IEEE SW Test Workshop 38

39 Q & A Thank you very much. IEEE SW Test Workshop 39