SP pF 30kV Bidirectional Discrete TVS

Transcription

1 SP pF 30kV Bidirectional Discrete TVS RoHS Pb GREEN Description The SP1326 back-to-back diodes are fabricated in a proprietary silicon avalanche technology. These diodes provide a high ESD (electrostatic discharge protection level for electronic equipment. The SP1326 TVS can safely absorb repetitive ESD strikes at ±30kV (contact discharge, IEC without performance degradation. Additionally, each diode can safely dissipate 4A of 8/20µs surge current (IEC nd edition with very low clamping voltages. Pinout and Functional Block Diagram 1 Features ESD, IEC , ±30kV contact, ±30kV air EFT, IEC , 40A (5/50ns Lightning, 4A (8/20µs as defined in IEC nd edition Low leakage current of 0.02μA (TYP at 5V Space efficient Halogen free, Lead free and RoHS compliant Moisture Sensitivity Level (MSL -1 2 Applications Mobile phones Smart phones Smart watches Tablets Portable navigation components Portable medical components Application Example Keypads I/O Controller P1 P2 Outside World P3 P4 IC Case GND SP1326 (x4 SP1026 (x4 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.

2 Absolute Maximum Ratings Symbol Parameter Value Units I PP Peak Pulse Current (t p =8/20μs 4 A T OP Operating Temperature -40 to 125 C T STOR Storage Temperature -55 to 150 C CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T OP =25ºC Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V RWM 6.0 V Breakdown Voltage V BR I R =1mA 7.8 V Leakage Current I LEAK V R =5V μa I Clamp Voltage 1 pp =1A, t p =8/20µs 12.0 V V C I pp =4A, t p =8/20µs 15.5 V Dynamic Resistance 2 R DYN TLP, t P =100ns, I/O to GND 0.35 Ω IEC (Contact Discharge ±30 kv ESD Withstand Voltage 1 V ESD IEC (Air Discharge ±30 kv Reverse Bias=0V 15 pf Diode Capacitance 1 C D Reverse Bias=2.5V 12 pf Note: 1 Parameter is guaranteed by design and/or component characterization. 2.Transmission Line Pulse (TLP with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns Capacitance vs. Reverse Bias 8/20μs Pulse Waveform Capacitance (pf Percent of I PP 110% 100% 90% 80% 70% 60% 50% 40% 30% 20% Bias Voltage (V 10% 0% Time (μs

3 Temperature TVS Diode Arrays (SPA Diodes Clamping voltage vs. I PP for 8/20μS waveshape 18 Positive Transmission Line Pulsing (TLP Plot 30 Clamp Voltage (V C Peak Pulse Current-I PP (A TLP Current (A TLP Voltage (V IEC kv Contact ESD Clamping Voltage Soldering Parameters Reflow Condition Pb Free assembly - Temperature Min (T s(min 150 C Pre Heat - Temperature Max (T s(max 200 C - Time (min to max (t s secs Average ramp up rate (Liquidus Temp (T L to peak 3 C/second max T S(max to T L - Ramp-up Rate 3 C/second max Reflow - Temperature (T L (Liquidus 217 C - Temperature (t L seconds Peak Temperature (T P /-5 C Time within 5 C of actual peak Temperature (t p seconds Ramp-down Rate 6 C/second max T P T L T S(max T S(min 25 t S Preheat Ramp-up time to peak temperature t P t L Ramp-down Time Critical Zone TL to TP Time 25 C to peak Temperature (T P 8 minutes Max.

4 Part Numbering System TVS Diode Arrays (SPA Diodes Series Ordering Information SP L T G Number of Channels T= Tape & Reel Package G= Green SOD-523 Part Number Package Marking Min. Order Qty. SP LTG SOD-523 I I 5000 Product Characteristics Lead Plating Lead Material Lead Coplanarity Substrate material Body Material Flammability Matte Tin Copper Alloy inches(0.102mm Silicon Molded Compound UL Recognized compound meeting flammability rating V-0. Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI Part Marking System Package Dimensions SOD-523 E2 E D c Symbol Millimeters Inches Min Max Min Max b A A E1 Top View b c D θ E A1 A E E REF REF θ Side View L Side View L θ 7 O REF 7 O REF 0.60mm 0.70mm 1.42mm Recommended Soldering pad layout

5 General Purpose ESD Protection - SP1026 SP1326 Embossed Carrier Tape & Reel Specification SOD-523 Symbol Millimetres Inches Min Max Min Max A B D D E F P P P K T W mm TAPE AND REEL Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at