SP5001 Series 4 Channel TVS Common Mode Filter

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Cuthbert Parsons
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Low Capacitance ESD Protection - SP51 Series SP51 Series 4 Channel TVS Common Mode Filter RoHS Pb GREEN Description The SP51 Series is a highly integrated Common Mode Filter (CMF providing both ESD

1 Low Capacitance ESD Protection - SP51 Series SP51 Series 4 Channel TVS Common Mode Filter RoHS Pb GREEN Description The SP51 Series is a highly integrated Common Mode Filter (CMF providing both ESD protection and EMI common mode noise filtering for systems using high speed differential serial interfaces, such as MIPI D-PHY or HDMI. The SP51 Series can protect and filter two differential line pairs in a small RoHS-compliant TDFN-1 package, with cost and space savings over discrete solutions. SP51 Pinout Features In Out 1+ In 1- GND 3 9 Out 1-8 GND In Out + In Out - Note :This drawing is not to scale. Large differential bandwidth >.5 GHz High Common Mode Stop Band Attenuation: > 5 db at 7 MHz > 3 db at 8 MHz ±15kV ESD protection per channel (IEC Level 4, contact discharge and ±3kV air discharge TDFN-1.5mm.mm.75mm package with.5mm lead pitch RoHS-compliant, Leadfree packaging AEC-Q11 qualified Moisture Sensitivity Level (MSL-1 Functional Block Diagram Applications Pin1 Pin External (Connector Pin4 Pin1 Pin9 Internal (ASIC Pin7 HDMI/DVI Display in Mobile Phones MIPI D-PHY (CSI-, DSI, etc in Mobile Phones and Digital Still Cameras Pin5 Pin6 Pin3 Pin8

2 Low Capacitance ESD Protection - SP51 Series Absolute Maximum Ratings Symbol Parameter Value Units I DC DC Current Per Line 1 ma P DC DC Package Power Rating.5 W T OP Operating Temperature -4 to 15 C T STOR Storage Temperature 5 to 15 C CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T OP =5ºC Parameter Symbol Test Conditions Min Typ Max Units Channel Resistance R CH Pins 1 1, 9, 4 7 and Ω Total Channel Capacitance C TOTAL V I/O = 1.65V DC Reverse Bias; f=1mhz, 3mV AC pf Reverse Standoff Voltage V RWM 5. V Breakdown Voltage V BR I T =1mA V Forward Voltage at I F V F I F =1mA V Reverse Leakage Current I LEAK V I/O =3.3V.1.1 µa Dynamic Resistance 3 R DYN Negative (tp=8/µs.7 Positive (tp=8/µs 1.3 TLP, tp=1ns, I/O to GND.36 ESD Withstand Voltage 1 V ESD IEC (Contact Discharge ±15 kv IEC (Air Discharge ±3 kv Differential Mode Cutoff Frequency F 3dB Z SOURCE =5 Ω, Z LOAD 5 Ω.5 GHz Common Mode Stop Band Attenuation F α f=8mhz 3 db Notes: 1 ESD zapping at I/O pins (1,,4,5 with respect to GND. Guaranteed by design. 3 Transmission Line Pulse (TLP with 1ns width and ps rise time. Ω

3 Low Capacitance ESD Protection - SP51 Series Differential Mode Attenuation SDD1 vs. Frequency (Zdiff = 1Ω Common Mode Attenuation SCC1 vs. Frequency (Zcomm= 5Ω -1 Insertion Loss(dB SP Differential Return Loss SDD11 vs. Frequency (Zdiff = 1Ω -1 Differential Return Loss SDD vs. Frequency (Zdiff = 1Ω Transmission Line Pulsing (TLP Plot TLP Current (A TLP Voltage (V

4 Temperature TVS Diode Arrays (SPA Diodes Low Capacitance ESD Protection - SP51 Series T P T L T S(max T S(min 5 t S Preheat Ramp-up time to peak temperature t P t L Time Critical Zone TL to TP Ramp-down Soldering Parameters Reflow Condition Pre Heat Pb Free assembly - Temperature Min (T s(min 15 C - Temperature Max (T s(max C - Time (min to max (t s 6 18 secs Average ramp up rate (Liquidus Temp (T L to peak T S(max to T L - Ramp-up Rate 3 C/second max 3 C/second max Reflow - Temperature (T L (Liquidus 17 C - Temperature (t L 6 15 seconds Peak Temperature (T P 6 +/ C Time within 5 C of actual peak Temperature (t p 4 seconds Ramp-down Rate 6 C/second max Time 5 C to peak Temperature (T P 8 minutes Max. Do not exceed 6 C Part Numbering System Part Marking System TVS Diode Arrays (SPA Diodes Series SP 51 Number of Channels 4 = 4 Channel TDFN-1 4T T G 3 *** G= Green T= Tape & Reel Package TDFN-1 (.5x.mm Product Series 3 = SP51 Date Code (Year / Week Ordering Information Part Number Package Size Marking Min. Order Qty. SP51-4TTG TDFN-1.5x.mm 3**** 3

5 Low Capacitance ESD Protection - SP51 Series Package Dimensions TDFN-1 X PIN 1 MARKING X.1 C.1 C.5 C D TOP VIEW DETAIL B.5 C A3 SIDE VIEW A1 A B E A C L1 EXPOSED Cu L DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS MOLD CMPD DETAIL B ALTERNATE CONSTRUCTIONS A1 L A3 TDFN-1 JEDEC MO-9 Millimeters Inches Min Max Min Max A A A3. REF.8 REF b D.5 BSC.98 BSC E. BSC.79 BSC e.5 BSC. BSC L L SP51 DETAIL A 1 5 8X 1.7 8X.3 PACKAGE OUTLINE.1 MIN 8X L e 6 9X b.45.5 PITCH BOTTOM VIEW.1 M C A B.5 M C Recommended Soldering Footprint Tape & Reel Specification TDFN-1 T Top Cover Tape 5 Max K W P A B P P 扑 Device Orientation in Tape E F 1. ±.5 Pin1 Location Dimensions Symbol Millimetres E 1.75+/-.1 F 3.5 +/-.5 P 4. +/-.1 P 4. +/-.1 P. +/-.5 W /-.1 A.19 +/-.5 B.77 +/-.5 K 1.5 +/-.5 T.5+/-. Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at

SP5001 Series 4 Channel Common Mode Filter with ESD Protection

SP5001 Series 4 Channel Common Mode Filter with ESD Protection Low Capacitance ESD Protection - SP51 Series SP51 Series 4 Channel Common Mode Filter with ESD Protection RoHS Pb GREEN Description The SP51 Series is a highly integrated Common Mode Filter (CMF) providing