SP pF SOT23-6L 4 Channels Diode Array

Transcription

1 SP319.3pF SOT23-6L 4 Channels Diode Array RoHS Pb GREEN Description SP312-3UTG Pinout *Pins 6, 7, 9, 1 are not internally connected but should be connected to the trace SP312-4UTG (AEC-Q11 Qualified) The SP319 integrates 4 channels of ultra low capacitance asymmetrical protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust components can safely absorb repetitive ESD strikes above the maximum contact level specified in the IEC international standard (±8kV contact discharge) without performance degradation. The extremely low off-state capacitance also makes it ideal for protecting high speed signal lines such as USB3.,HDMI, USB2., and esata. Features 8 14 SP312-3UTG SP312-6UTG (AEC-Q11 Qualified) 2 *Pins 1, 2, 3, 4, 5, 6, 7 are not internally connected 3 but should PIN 5be connected to the opposite pin 4 with the PCB trace SP312-6UTG PIN PIN 9 SP312-4HTG(AEC-Q11 Qualified) ESD, IEC , +22kV/-1kV contact, +22kV/-1kV air EFT, IEC , 4A (t P =5/5ns) Lightning, 2.5A (8/2 as defined in IEC nd edition) Low capacitance 3GHz (TYP) per I/O Low leakage current of 1nA (TYP) at 5V AEC-Q11 qualified Moisture Sensitivity Level (MSL-1) Halogen free, lead free and RoHS compliant PIN 2 PIN 5 SP312-4UTG Functional Block Diagram GND (PIN 2) PIN 3 PIN 6 SP312-4HTG Applications LCD/PDP TVs External Storages DVD/Blu-ray Players Desktops MP3/PMP Set Top Boxes Smartphones Ultrabooks/Notebooks Digital Cameras GND (PIN 3, 8) GND (PIN 2) Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.

2 Absolute Maximum Ratings Symbol Parameter Value Units I PP Peak Current (t p =8/2μs) 2.5 A T OP Operating Temperature -4 to 125 C T STOR Storage Temperature -55 to 15 C CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T OP =25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage V RWM I R 1µA 5. V Breakdown Voltage V BR V R =5V, Any I/O to GND.1.5 µa Reverse Voltage Drop V R I R =1mA 8.2 V I Clamp Voltage 1 PP =1A, t p =8/2µs, Fwd 1.5 V V C I PP =2A, t p =8/2µs, Fwd 11.5 V Dynamic Resistance 2 R DYN TLP, t P =1ns, I/O to GND.64 Ω IEC (Contact) +22/-1 kv ESD Withstand Voltage 1 V ESD IEC (Air) +22/-1 kv Diode Capacitance C I/O-GND Reverse Bias=V, f=3 GHz.3 C I/O-I/O.18 pf Note: 1. Parameter is guaranteed by design and/or component characterization. 2.Transmission Line Pulse (TLP) with 1ns width, 2ns rise time, and average window t1=7ns to t2= 9ns SP312 Positive Transmission Line Pulsing(TLP) Plot Positive Transmission Line Pulsing(TLP) Plot TLP Current (A) TLP Current (A) TLP Voltage (V) TLP Voltage (V)

3 Low Capacitance ESD Protection - SP312 SP319 Series Clamping Voltage vs. I PP for 8/2 μs waveshape 8/2 μs Pulse Waveform 14 11% Clamp Voltage (V C ) Percent of I PP 1% 9% 8% 7% 6% 5% 4% 3% 2% Peak Pulse Current-I PP (A) 1% % Time (μs) IEC kv Contact ESD Clamping Voltage IEC kv Contact ESD Clamping Voltage

4 Temperature Soldering Parameters Reflow Condition Pre Heat - Temperature Min (T s(min) ) 15 C - Temperature Max (T s(max) ) 2 C Pb Free assembly T P Ramp-up t P Critical Zone TL to TP - Time (min to max) (t s ) 6 18 secs Average ramp up rate (Liquidus) Temp (T L ) to peak 3 C/second max T L T S(max) Preheat t L Ramp-down T S(max) to T L - Ramp-up Rate 3 C/second max - Temperature (T L ) (Liquidus) 217 C Reflow - Temperature (t L ) 6 15 seconds Peak Temperature (T P ) 26 +/-5 C T S(min) 25 t S time to peak temperature Time Time within 5 C of actual peak Temperature (t p ) 2 4 seconds Ramp-down Rate 6 C/second max Product Characteristics Time 25 C to peak Temperature (T P ) 8 minutes Max. Do not exceed 26 C Lead Plating Lead Material Matte tin Copper Alloy Ordering Information Part Number Package Marking Min. Order Qty. SP319-4HTG SOT23-6 ACVD 3 Lead Coplanarity Substrate material Body Material.4 inches (.12mm) Silicon Molded Compound UL Recognized compound meeting Flammability flammability rating V-. Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. Part Marking System Part Numbering System ACVD AC : Part code V : Assembly code D : Date code TVS Diode Arrays (SPA Diodes) Series Number of Channels SP H T G G= Green T= Tape & Reel Package H= SOT23-6L

5 θ Package Dimensions SOT23-6L D E1 E A A2 A1 Symbol Millimeters Min Nom Max Pin1 e e1 Top View b x 6 Bottom View A A A b L Detail A Side View B B L2 (gauge plane) L Detail A c1 b1 b Section B-B c b c c D E E e BSC e1 1.9 BSC L L2.6 REF.25 BSC.33 θ Recommended soldering pad layout (unit :mm) Embossed Carrier Tape & Reel Specification SOT23-6L 8mm TAPE AND REEL ACCESS HOLE 14.4mm 1.5mm DIA. HOLE 4.mm 2.mm 1.75mm 13mm 8mm C L 18mm 6mm 4.mm GENERAL INFORMATION SOT-23 (8mm POCKET PITCH) 1. 3 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. 8.4mm USER DIRECTION OF FEED Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at COVER TAPE