SP5001 Series 4 Channel Common Mode Filter with ESD Protection

Transcription

1 Low Capacitance ESD Protection - SP51 Series SP51 Series 4 Channel Common Mode Filter with ESD Protection RoHS Pb GREEN Description The SP51 Series is a highly integrated Common Mode Filter (CMF) providing both ESD protection and EMI common mode noise filtering for systems using high speed differential serial interfaces, such as MIPI D-PHY or HDMI. The SP51 Series can protect and filter two differential line pairs in a small RoHS-compliant TDFN-1 package, with cost and space savings over discrete solutions. SP51 Pinout Features In Out 1+ In 1- GND 3 9 Out 1-8 GND In Out + In Out - Note :This drawing is not to scale. Large differential bandwidth >.5 GHz High Common Mode Stop Band Attenuation: > 5 db at 7 MHz > 3 db at 8 MHz ±15kV ESD protection per channel (IEC Level 4, contact discharge) TDFN-1.5mm.mm.75mm package with.5mm lead pitch RoHS-compliant, Leadfree packaging AEC-Q11 qualified Functional Block Diagram Applications Pin1 Pin External (Connector) Pin4 Pin1 Pin9 Internal (ASIC) Pin7 HDMI/DVI Display in Mobile Phones MIPI D-PHY (CSI-, DSI, etc) in Mobile Phones and Digital Still Cameras Pin5 Pin6 Pin3 Pin8

2 Low Capacitance ESD Protection - SP51 Series Absolute Maximum Ratings Symbol Parameter Value Units I DC DC Current Per Line 1 ma P DC DC Package Power Rating.5 W T OP Operating Temperature -4 to 15 C T STOR Storage Temperature 5 to 15 C Thermal Information Parameter Rating Units Storage Temperature Range 5 to 15 C Maximum Junction Temperature 15 C Maximum Lead Temperature (Soldering -4s) 6 C CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (T OP =5ºC) Parameter Symbol Test Conditions Min Typ Max Units Channel Resistance R CH Pins 1 1, 9, 4 7 and Ω Total Channel Capacitance C TOTAL V I/O = 1.65V DC Reverse Bias; f=1mhz, 3mV AC pf Reverse Standoff Voltage V RWM 5. V Breakdown Voltage V BR I T =1mA V Forward Voltage at I F V F I F =1mA V Reverse Leakage Current I LEAK V I/O =3.3V.1.1 µa Dynamic Resistance 3 R DYN Negative (tp=8/µs).7 Positive (tp=8/µs) 1.3 TLP, tp=1ns, I/O to GND.36 ESD Withstand Voltage 1 V ESD IEC61-4- (Contact Discharge) ±15 kv IEC61-4- (Air Discharge) ±3 kv Differential Mode Cutoff Frequency F 3dB Z SOURCE =5 Ω, Z LOAD 5 Ω.5 GHz Common Mode Stop Band Attenuation F α f=8mhz 3 db Notes: 1 ESD zapping at I/O pins (1,,4,5) with respect to GND. Guaranteed by design. 3 Transmission Line Pulse (TLP) with 1ns width and ps rise time. Ω

3 Low Capacitance ESD Protection - SP51 Series Differential Mode Attenuation SDD1 vs. Frequency (Zdiff = 1Ω) Common Mode Attenuation SCC1 vs. Frequency (Zcomm= 5Ω) -1 Insertion Loss(dB) SP Differential Return Loss SDD11 vs. Frequency (Zdiff = 1Ω) -1 Differential Return Loss SDD vs. Frequency (Zdiff = 1Ω) Transmission Line Pulsing (TLP) Plot TLP Current (A) TLP Voltage (V)

4 Temperature TVS Diode Arrays (SPA Diodes) Low Capacitance ESD Protection - SP51 Series Product Characteristics Soldering Parameters Lead Plating Lead Material Lead Coplanarity Substrate material Body Material T P T L T S(max) Pre-Plated Frame Copper Alloy.4 inches (.1mm) Silicon Molded Epoxy Flammability UL 94 V- Notes : 1. All dimensions are in millimeters. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI Preheat Ramp-up t P t L Critical Zone TL to TP Ramp-down Reflow Condition Pre Heat Pb Free assembly - Temperature Min (T s(min) ) 15 C - Temperature Max (T s(max) ) C - Time (min to max) (t s ) 6 18 secs Average ramp up rate (Liquidus) Temp (T L ) to peak 3 C/second max T S(max) to T L - Ramp-up Rate 3 C/second max - Temperature (T L ) (Liquidus) 17 C Reflow - Temperature (t L ) 6 15 seconds Peak Temperature (T P ) 6 +/ C Time within 5 C of actual peak Temperature (t p ) 4 seconds Ramp-down Rate 6 C/second max Time 5 C to peak Temperature (T P ) 8 minutes Max. Do not exceed 6 C T S(min) t S 5 time to peak temperature Time Part Numbering System Part Marking System TVS Diode Arrays (SPA Diodes) Series SP 51 Number of Channels 4 = 4 Channel TDFN-1 4T T G 3 *** G= Green T= Tape & Reel Package TDFN-1 (.5x.mm) Product Series 3 = SP51 Date Code (Year / Week) Ordering Information Part Number Package Size Marking Min. Order Qty. SP51-4TTG TDFN-1.5x.mm 3**** 3

5 Low Capacitance ESD Protection - SP51 Series Package Dimensions TDFN-1 X PIN 1 MARKING X.1 C.1 C.5 C D TOP VIEW DETAIL B.5 C A3 SIDE VIEW A1 A B E A C L1 EXPOSED Cu L DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS MOLD CMPD DETAIL B ALTERNATE CONSTRUCTIONS A1 L A3 TDFN-1 JEDEC MO-9 Millimeters Inches Min Max Min Max A A A3. REF.8 REF b D.5 BSC.98 BSC E. BSC.79 BSC e.5 BSC. BSC L L SP51 DETAIL A 1 5 8X 1.7 8X.3 PACKAGE OUTLINE.1 MIN 8X L e 6 9X b.45.5 PITCH BOTTOM VIEW.1 M C A B.5 M C Recommended Soldering Footprint Tape & Reel Specification TDFN-1 T Top Cover Tape 5 Max K W P A B P P 扑 Device Orientation in Tape E F 1. ±.5 Pin1 Location Dimensions Symbol Millimetres E 1.75+/-.1 F 3.5 +/-.5 P 4. +/-.1 P 4. +/-.1 P. +/-.5 W /-.1 A.19 +/-.5 B.77 +/-.5 K 1.5 +/-.5 T.5+/-.