Moving Forward with the Cross-Market Applications Roadmap. TWG Chairs: Tremont Miao, Analog Alan Benner, IBM

Transcription

1 Moving Forward with the Cross-Market Applications Roadmap TWG Chairs: Tremont Miao, Analog Alan Benner, IBM

2 Working TWG Conclusions 1 The O-E-O interface is the best driver for the CTR. 2 CTR-2 should map 10Gbps to 1Tbps transceivers over time The data rate for a single channel will standardize at 10Gbps (25 Gbps in some cases) due to EMI and density/complexity limits of electronics. Optical interconnects will migrate toward single mode (possibly using WDM) in the long run, but initially we see short-reach multimode being most common. Standard transceiver components are entering the market in the following sequence: telecom/datacom, server clusters, SAN, consumer electronics, mobile appliances. The defining attributes for microphotonics markets will be COST, system density, power consumption, heat management, cable management, EMI shielding.

3 Discussion Questions Given the performance levels being projected in the initial set of quantitative surveys: What characteristics will drive more rapid adoption of active cables in: HPC? -- LAN? -- Video? What major performance characteristics will pose the primary limit on the attractiveness of active cables in: HPC? -- LAN? -- Video?

4 Drivers of Active Cable Adoption HPC Systems LAN Video Characteristic Votes Characteristic Votes Characteristic Votes Performance 6 Cost 6 Ease of Installation 7 Reliability 4 Backward Compatibility 4 Cost 5 Power 3 Footprint 3 Marketing 2 System Cost 2 Marketing 3 1 Design Footprint 2 Ease of Install 2 Footprint 1 System System Backward 1 1 Design Design Compatibility 1 Performance 1 Video Demand 1

5 Backups

6 Results of the HPC Market Survey

7 Definitions used in the survey For the surveys, we define a link to be two unidirectional fibers: one each for Tx and Rx.

8 Current Market Technology Attributes Optical Communications - Market Technology Attributes Technology Attributes Emerging Compute Applications Board-backplane Chip-board Chip-chip HPC box-box Emerging Other Apps. Video Auto Systems 10 E-14 to 10 E-15 to 10E-15 to BER 10 E E E-12 10E E-12 Wavelengths , 850 Link Types MM GOF MM GOF, MM, WG Poly MM MM GOF, SM (2), WG Poly MM MM GOF (2) MM GOR, POF Normal Step Index POF (2) Link Lengths 40 cm to 2m 20 cm to 1m 20 cm to 1m 1m m 25 m 30 m Temperature Standards Controlled Environment - RT IEE, HSSG, IEC IEE, HSSG, IEC "-20 Centigrade to 110 IEE, HSSG, IEC Controlled Environment - RT IEE, HSSG, IEC Reliability 10 FITs 3 to 5 FITs 0.3 FITs 10 FITs 0-70 C -40 to 125 HDMI - Display Port MOST is dominant, Bytle Flight is being phased out Don't measure FITs, use MOST's stricit Test Program

9 Data Rate per Link

10 Links per System

11 Aggregate Data Rate Per System

12 Maximum Bandwidth Cost for Adoption

13 Projected Market Revenue and R & D Budget Revenue R&D Market Revenue = ($/Gbps) x (Avg Gbps/System)x(# optically equipped systems) R&D Estimated at 14% of Revenue

14 Connector Characteristics Optical Connector Type Electrical Connector Type Energy Density/ Supply Power Per Link (mw/gbps) Max Price per Link ($/Link) *Fibers/sq. cm Response Range: 1-96 *Transceiver on PWB OR Active Cable Assembly? MTP Mini-MTP HD Parallel HD Parallel Cheap WG Cheap WG Cheap WG Cheap WG LC SFP+ (2) CSFP CSFP CSFP Diff LVDS Diff LVDS Diff LVDS Diff LVDS 15 to to to 10 5 to 7 50 to to to % ACA 100% 100% PWB 100% ACA 100% PWB ACA *Links Per Transceiver * Only one respondent chose to answer this quest

15 Annual Transceiver Volumes Annual Transceiver Volumes Respondent 1 10k 50k 150k 250k Respondent 2 71k 781k 1,289k 3,119k Respondent k