Smart Card Connectors

Transcription

1 mart Card Connectors with PCB Mount Wiping Contacts eries 02E with board locks, Page 32 dip solder pins and self-cleaning switch with board locks, Page 32 3 mm stand-offs and self-cleaning switch with board locks, Page 33 dual plane, 2 x 8 contacts, dip solder pins and self-cleaning switch with board locks, Page 33 3 mm stand-offs, self-cleaning switch and card guide with board locks, Page 3 self-cleaning switch and card guide with board locks, Page 3,35 self-cleaning switch, double decker crew/rivet mounting Page 36 with board locks Page 36 and dip solder pins with board locks, Page 37 MT and self-cleaning switch with board locks, Page 37 MT, self-cleaning switch and card guide with board locks, Page 38 self-cleaning switch and card guide PCB Mount Wiping Contact mart Card Connectors Typical applications for mart Card Connectors with wiping contacts and PCB mounting are set top boxes, toll road transpoders, parking meters, utility metering systems, etc., where limited numbers of mating cycles are specified. Design features Termination: dip solder pins or MT self-cleaning card presence switch on most models detecting final card position special shape of wiping contacts minimize card scratching and wear Versions acc. to EMV (see page 6) dual plane version with 2 x 8 contacts for chip up & down card handling, suitable for applications with short dwell time of the card Assembly instructions: oldering conditions wave soldering: 260 C; s max. infrared reflow 2 C; s max. (MT versions only) 31

2 02E mart Card Connectors with PCB Mount Wiping Contacts with board lock and IO Dip solder pin 02 M self-cleaning switch, acc. to EMV 2,5 BETÜCKUNGEITE / COMPONENT IDE 8,7 6,7,6 50,5 ±0, ø () 3 x (=7,) IO () 2,9 LEITERPLATTENDICKE / PCB THICKNE = 1, E mart Card Connectors with PCB Mount Wiping Contacts with board lock and IO Dip solder pin 02 M self-cleaning switch and 3 mm stand-offs, acc. to EMV BETÜCKUNGEITE / COMPONENT IDE 7 () 3 8,7 6,7 7,5 50,5 ±0, ø ø5 PLATZBEDARF ZAPFEN PACE FOR GUIDING PIN 2,9 3 x (=7,) 2, 1 1 ø3 26 2,3 25,8 IO () 3,5 LAGE DER ABTANDBOLZEN POITION OF TAND - OFF 17,3 17,3 32 LEITERPLATTENDICKE / PCB THICKNE = 1, - 8

3 02E mart Card Connectors with PCB Mount Wiping Contacts with board lock and IO Dip solder pin 02 M self-cleaning switch, (Data contacts top dual plane, 2 x 8 contacts, and bottom side) acc. to EMV BETÜCKUNGEITE / COMPONENT IDE 12 13,1 8,2,5 1,1,8 8,6 50,5 ±0, 3 x (=7,) ø CHIP OBEN / UP CHIP UNTEN / DOWN () IO (=7,) 3 x () 2,9 2 Kondensator 0,1 F zwischen (VCC) und (GND) bei Kartenlage Chip oben Capacitor 0,1 F between (VCC) and (GND) in card position chip up (2) 5,08 LEITERPLATTENDICKE / PCB THICKNE = 1, E mart Card Connectors with PCB Mount Wiping Contacts with board lock, self-cleaning IO Dip solder pin 02 M switch and card guide, 3 mm stand-offs, acc. to EMV BETÜCKUNGEITE / COMPONENT IDE 3 (66) 2,5 ±0, 7 8,7 6,7 7,5 ø ø5 PLATZBEDARF ZAPFEN PACE FOR GUIDING PIN 2,9 () 3 x (=7,) 2, 25,8 1 IO ,3 3,5,7 66 2, LAGE DER ABTANDBOLZEN 17,3 17,3 POITION OF TAND - OFF ø3 LEITERPLATTENDICKE / PCB THICKNE = 1,

4 02E mart Card Connectors with PCB Mount Wiping Contacts with board lock, self-cleaning IO Dip solder pin 02 M switch and card guide, acc. to EMV BETÜCKUNGEITE / COMPONENT IDE 8,7 6,7,5 2,5 ±0, ø (66) () 3 x (=7,) IO 3,5,7 66 2, LEITERPLATTENDICKE / PCB THICKNE = 1, E mart Card Connectors with PCB Mount Wiping Contacts Description Contact Termination stand dim. A dim. B Part No. position off double decker IO Dip solder pin mm 3.9 mm 02 M with board lock and IO Dip solder pin 3 mm 18.7 mm 6.9 mm 02 M self cleaning switch IO Dip solder pin -.5 mm 3.9 mm 02 M ,,8 B A BETÜCKUNGEITE / COMPONENT IDE 2,5 9 50,5 ±0, ø (),2 3,3 9, ANCHLU OBERER LEER UPPER CONNECTOR ANCHLU UNTERER LEER LOWER CONNECTOR x (=,16) IO (=7,) 3 x () 3 LEITERPLATTENDICKE / PCB THICKNE = 1, - 8

5 02E mart Card Connectors with PCB Mount Wiping Contacts double decker, with board lock IO Dip solder pin 02 M and self cleaning switch, 5mm overhang, bottom part for double thickness cards, upper part, dual plan 2x8 contacts 9,8 29,5 2,6 3, , 68,,8 8, 65 3,9 x (=,16),8 12 ø ANCHLU OBERER LEER UPPER CONNECTOR BETÜCKUNGEITE / COMPONENT IDE 0 ANCHLU UNTERER LEER LOWER CONNECTOR 3,6 IO 0 (=7,) 3 x (6) 6 57,8 0 5,08 5 LEITERPLATTENDICKE / PCB THICKNE = 1, E mart Card Connectors with PCB Mount Wiping Contacts double decker, with board lock IO Dip solder pin 02 M and self cleaning switch, bottom part for double thickness cards upper part, dual plan 2x8 contacts,3 9, BETÜCKUNGEITE / COMPONENT IDE 3,6 29, 2,5,5 6 31,1 11,1 50 ±0, 3,8 x (=,16) 12 ø 0 ANCHLU OBERER LEER UPPER CONNECTOR ANCHLU UNTERER LEER LOWER CONNECTOR IO (=7,) 3 x (6) 3,3,2 2 55,9 0 5,08 LEITERPLATTENDICKE / PCB THICKNE = 1,

6 02E mart Card Connectors with PCB Mount Wiping Contacts crew / IO Dip solder pin 02 M008 1 Rivet mounting AFNOR Dip solder pin 02 M008 2 IO + AFNOR Dip solder pin 02 M008 3 BETÜCKUNGEITE / COMPONENT IDE 8,8 50,5 ±0, ø2,2 () 19,05 7 x (=17,78) 11,92 IO AFNOR 02E mart Card Connectors with PCB Mount Wiping Contacts BETÜCKUNGEITE / COMPONENT IDE,1 +0,00, LEITERPLATTENDICKE / PCB THICKNE =... 2, with board lock IO Dip solder pin 02 M008 6 AFNOR Dip solder pin 02 M008 7 IO + AFNOR Dip solder pin 02 M008 5 () 2,8 50,5 ±0, ø 7 x (=17,78) 11,92 IO AFNOR,1,05 36 LEITERPLATTENDICKE / PCB THICKNE = 1,... 8

7 02E mart Card Connectors with PCB Mount Wiping Contacts with board lock and IO MT 02 M008 2 self-cleaning switch,3 BETÜCKUNGEITE / COMPONENT IDE () 50,5 ±0, ø 5 3 x (=7,) IO 0,1 1,2 2,8 LEITERPLATTENDICKE / PCB THICKNE = 1, E mart Card Connectors with PCB Mount Wiping Contacts with board lock, IO MT 02 M008 2 self-cleaning switch IO + AFNOR MT 02 M and card guide,3 BETÜCKUNGEITE / COMPONENT IDE (66) 2,5 ±0, 5 ø 7 x (=17,78) 11,92 AFNOR IO 1,2 26 0,1 66 () LEITERPLATTENDICKE / PCB THICKNE = 1,

8 02E mart Card Connectors with PCB Mount Wiping Contacts with board lock, IO Dip solder pin 02 M self-cleaning switch IO + AFNOR Dip solder pin 02 M and card guide BETÜCKUNGEITE / COMPONENT IDE (66) 2,5 ±0, ø 7 x (=17,78) 11,92 AFNOR IO 66 26,05 LEITERPLATTENDICKE / PCB THICKNE = 1, E Technical Data Electrical Characteristics tandard Value Contact resistance IEC , Test 2a Data contacts mω without cable or flexprint witch contacts 50 mω Insulation resistance IEC , Test 3a 9 Ω High voltage resistance IEC , Test a 500 VAC;1 min Climatical Characteristics Climatic category IEC / 70 / 21 Operating temperature - 25 C C torage temperature - C C Mechanical Characteristics Card insertion force IEC , Test 13b 5 N 12 N at dual plane 2 x 8 contacts Card extraction force IEC , Test 13b 1 N Mechanical lifetime IEC , Test 9a 0,000 mating cycles (without corrosion stress) Vibration IEC , Test 6d f = Hz 0,35 mm DA f = Hz a = 2.5 g 2 h / axis hock, without disconnection IEC , Test 6c g; 11 ms; halfsine 3 shocks / direction in 3 axis hock, without destruction IEC , Test 6c 0 g; 6 ms; halfsine 2 shocks / direction in 3 axis Contact force cn witch Card presence switch witch sequence Chattering time normally closed The card presence switch is activated after the data contacts have mated with the contact field and before the card reaches its final position. 5 ms 38