Single Slot SMT Connectors for Card-Bus Based PC Cards

Transcription

1 Single Slot SMT onnectors for ard-us ased P ards I14 Series P ard Standard ompliant oard Space-Saving SMT Unit Guide Unit Secure board retention Features 1. Space-Saving design facilitates pattern routing Responding to the need for the equipment miniaturization, the board mounting area has been further reduced by relocation of the mounting screws away from the possible routing of the conductive traces. 2. ard insertion shock protection Total of 6 board retention points assures that there is no transfer of card insertion forces to the solder terminations.. New Pop-Up button card ejection mechanism The button does not protrude without the card being inserted, preventing it s damage when carrying the notebook computer. 4. ustomized ejection buttons The configuration, color or length can be designed for customer s specific applications. 5. Reliable and balanced card ejection mechanism Hirose s unique ejection mechanism will apply force equally at each edge of the inserted card. In addition, large distance of the ejection allows easy hold on the card. pplications Notebook Ps, audio/video equipment and other devices utilizing P cards. Two anchoring pins SMT Unit Three-stage Pop-Up card ejection mechanism Existing products When the eject button is mistakenly pressed without a P card inserted Protruding button is vulnerable to damage. Equipment outline Four metal fittings I14 oard mounting Standoff Eject button Standard Reverse 1.5mm 2.2mm 2.2mm Left Right Left Right Left Right Left Right Pop-up Folding Rigid Pop-up Pop-up Pop-up Pop-up Folding Rigid Pop-up Pop-up Folding Rigid Pop-up 2

2 Product Specifications Ratings urrent rating Voltage rating V Operating temperature range Operating humidity range -55ç to +85ç (Note 1) Relative humidity 95% max. (No condensation) Storage temperature range Storage humidity range -40ç to +70ç (Note 2) 40% to 70% (Note 2) 1. Insulation resistance 2. Withstanding voltage. ontact resistance 4. Vibration 5. Humidity Item Specifications onditions 6. Temperature cycle 7. Durability (mating/unmating) 8. Resistance to soldering heat 1000 Mø min. No flashover or insulation breakdown. 60 mø max. (Initial value) No electrical discontinuity of 100 ns or more. Insulation resistance: 100 Mø min. Insulation resistance: 100 Mø min. ontact resistance: 20mø max. from initial value No deformation of any component. No affect on contacts. 500 V D 500 V / one minute 1m D Frequency: 10 to 2000 Hz, single amplitude of 1.52 mm or acceleration of 147m/s2 (peak), 4 hours / axis 96 hours at temperature of 40ç±2ç and humidity of 90% to 95% Temperature: -55ç / +5ç to +5ç / +85ç / +5ç to +5ç Duration: 0 / +5 max. / 0 / +5 max. (Minutes) 5 cycles cycles at 400 to 600 cycles per hour Reflow: t the recommended temperature profile Manual soldering: 00ç for seconds Note 1: Includes temperature rise caused by current flow. Note 2: The term storage refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. Materials/Finish SMT unit omponent Insulator ontacts Ground/eject metal fittings Positioning pin Material Finish Remarks Heat resistant thermoplastic compound rass Stainless rass olor: lack ontact area: Gold plated Termination area: Tin-lead plated (Note) Tin-lead plated (Note) UL94V Guide unit omponent Insulator over/eject metal fittings Spring Material Finish Remarks PT Stainless Steel olor: lack UL94V Note: Lead-free specified connectors are tin plated.

3 Ordering information SMT unit I14 - PLR - SF - EJR -(71) Series name : I14 2 Standoff type lank : 0 mm : 2.2 mm : 1.5 mm oard mounting type PL: Standard type PLR: Reverse type 4 SF : SMT unit 5 Eject button position EJR : Right-side eject EJL : Left-side eject Number of ground contacts 6 Product specification code lank : Tin-lead plated (71): Lead-free plated Guide unit I14 - G - P EJR Series name : I14 8 Standoff type lank : 0 mm : 2.2 mm : 1.5 mm (Note 1) 9 G: Guide unite 10 Eject button type lank : Rigid button P : Pop-up button F : Folding button 11 Eject button position EJR: Right-side eject EJL: Left-side eject Note 1: In the I14 type, the screw attachment holes in the Guide unit are not threaded. Note 2: In this series the SMT unit and the Guide unit must be used in combinations shown below. Note 2: Other combinations cannot be used. * Series name ( 1 7 ) * Standoffs ( 2 8 ) * Ejection button position ( 5 11 ) 4

4 Standard Right Pop-up button I14, I14 SMT unit(1) MX No.4 Eject metal components movable range SR (Ejector button pushed-in for withdrawal) 85.8(ard fully inserted) 58.9 #2-M2(2X) 61.8 PR Guide unit(2) (7.4) 6 5.5MX 7.5MX No.4.5 utton position for card ejection 4.8 I14 SR PRM 2.5 Stand off height SMT unit 1 L No. Guide unit 2 L No. Weight (g) I14-PL-SF-EJR L I14-G-PEJR L mm I14-PL-SF-EJR L I14-G-PEJR L mm I14-PL-SF-EJR L I14-G-PEJR L : ll illustrations show the SMT unit (1) and Guide unit (2) assemblied. 2 : Dimensions for card insertion are in accordance with P card standard. : Indicated dimensions are symmetrical to the center of the card insertion slot. 5

5 Standard Left Pop-up button I14, I14 Eject metal components movable range 2MX 57.4 No.4 SMT unit(1) 7.5MX 5.5MX SL (ard fully inserted) 84.55(Ejector button pushed-in for withdrawal) #2-M2(2X) P L utton position for card ejection (7.4) No.4 Guide unit(2) 4.8 I14 SL PLM Stand off height SMT unit 1 L No. Guide unit 2 L No. Weight (g) I14-PL-SF-EJL L I14-G-PEJL L mm I14-PL-SF-EJL L I14-G-PEJL L mm I14-PL-SF-EJL L I14-G-PEJL L : ll illustrations show the SMT unit (1) and Guide unit (2) assemblied. 2 : Dimensions for card insertion are in accordance with P card standard. : Indicated dimensions are symmetrical to the center of the card insertion slot. 6

6 Reverse Right Pop-up button 57.4 SMT unit(1) No.4 2MX Eject metal components movable range MX R 7.5MX (Ejector button pushed-in for withdrawal) (ard fully inserted) 85.8 P R Guide unit(2) utton position for card ejection (7.4) No.4 Stand off height 2.2mm SMT unit 1 L No. I14-PLR-SF-EJR L Guide unit 2 L No. Weight (g) I14-G-PEJR L : ll illustrations show the SMT unit (1) and Guide unit (2) assemblied. 2 : Dimensions for card insertion are in accordance with P card standard. : Indicated dimensions are symmetrical to the center of the card insertion slot. 7

7 Reverse Left Pop-up button type Eject metal components movable range 2MX No SMT unit(1) 7.5MX 5.5MX (ard fully inserted) (Ejector button pushed-in for withdrawal) (7.4) Guide unit(2) L P L utton position for card ejection No.4 Stand off height 2.2mm SMT unit 1 L No. I14-PLR-SF-EJL L Guide unit 2 L No. Weight (g) I14-G-PEJL L : ll illustrations show the SMT unit (1) and Guide unit (2) assemblied. 2 : Dimensions for card insertion are in accordance with P card standard. : Indicated dimensions are symmetrical to the center of the card insertion slot. 8

8 Left folding button Eject metal components movable range 2MX 57.4 No.4 5.5MX 7.5MX SL ard fully inserted: L Ejector pushed-in for withdrawal:(9.5) (9.6). 8 Standard SMT unit(1) 74.5 utton position for card ejection (65.45) No.4 Guide unit(2) Stand off height SMT unit 1 L No. Guide unit 2 L No. Weight (g) I14-PL-SF-EJL L I14-G-FEJL L mm I14-PL-SF-EJL L I14-G-FEJL L : ll illustrations show the SMT unit (1) and Guide unit (2) assemblied. 2 : Dimensions for card insertion are in accordance with P card standard. : Indicated dimensions are symmetrical to the center of the card insertion slot. 9

9 Left folding button Eject metal components movable range 2MX 57.4 SMT unit(1) 5.5MX 7.5MX 6 L (9.6) ard fully inserted: L 5 8 Reverse No Ejector pushed-in for withdrawal:(9.5) utton position for card ejection (65.45) Guide unit(2) 4.8 No.4 Stand off height 2.2mm SMT unit 1 L No. I14-PLR-SF-EJL L Guide unit 2 L No. Weight (g) I14-G-FEJL L : ll illustrations show the SMT unit (1) and Guide unit (2) assemblied. 2 : Dimensions for card insertion are in accordance with P card standard. : Indicated dimensions are symmetrical to the center of the card insertion slot. 10

10 8 Standard Left rigid button Eject metal components movable range MX No.4 SMT unit(1) 7.5MX 5.5MX SL (ard fully inserted) L 6.5 No.4 Guide unit(2) Stand off height SMT unit 1 L No. Guide unit 2 L No. Weight (g) I14-PL-SF-EJL L I14-G-EJR L mm I14-PL-SF-EJL L I14-G-EJR L : ll illustrations show the SMT unit (1) and Guide unit (2) assemblied. 2 : Dimensions for card insertion are in accordance with P card standard. : Indicated dimensions are symmetrical to the center of the card insertion slot. 11

11 8 Reverse Left rigid button 57.4 Eject metal components movable range 2MX No.4 SMT unit(1) 5.5MX 7.5MX 6 L FL 85.6(ard fully inserted) L Guide unit(2) 4.8 No.4 Stand off height 2.2mm SMT unit 1 L No. I14-PLR-SF-EJL L Guide unit 2 L No. Weight (g) I14-G-EJL L : ll illustrations show the SMT unit (1) and Guide unit (2) assemblied. 2 : Dimensions for card insertion are in accordance with P card standard. : Indicated dimensions are symmetrical to the center of the card insertion slot. 12

12 P mounting pattern Standard Without Standoff (Left button) Without Standoff (Right button) 4.025± ± ± ±0.1 (2.2) 4.25± MX 4.8MIN.5MIN 1.8MX ± ±0.05 ard edge position 54.65± MX Mounting area 2.5MIN 59.1MX Shield plate mounting area 2.5± ± ± ± ±0.1 2-Ø ± (2.2) 2-Ø ± ±0.05 ard edge position 52.2MX 55.2MIN 54.65± MIN 52.2MX 14.4MX 2.5MIN 59.1MX Mounting area 2.5± MIN 4.MIN 1.95MIN Ø Ø MIN ± MIN 4.MIN 1.95 MIN 2.95MIN ±0.05 Shield plate mounting area Standoff 1.5mm (Left button) Standoff 1.5mm (Right button) 50.4±0.05 Mounting area 50.4±0.05 Mounting area 64.8± ± ±0.1 (2.2) 4.025± ± ± MX Shield plate mounting area.5min 2 2 ard edge position 48± MX 59.2MIN.5MIN.5 MIN 2.5± MX 2-Ø MIN 11.5MX 14.6MIN 64.8± ± ±0.1 (2.2).8 MIN 4.025± ± ± MX 2-Ø MIN.5 MIN 2 2 ard edge position 46.2± MX 59.2MIN.5MIN 2.5± MX 11.5MX 14.6MIN Shield plate mounting area 4.4MX 21± ± MIN.5 MIN 2.6MX 7MIN 7.75 MIN 7.75 MIN 7MIN 2.6MX.5 MIN 22.8± ± MIN 4.4MX Standoff 2.2mm (ommon to both Right & left buttons) 50.4±0.05 Mounting area ±0.05 (2.2) 4.025± ± ± MX 14.6MIN 64.75± ±0.1 ard edge position 4.25± ± MX MIN 5.65MIN 2-Ø MIN 1.5MX 1.95MIN 2.95MIN 1.5MX 4.05MIN 7.25MIN.75MIN Shield plate mounting area ±0.05 Note 1) area show the conductive pattern prohibited area. Note.2) 2 Indicated dimensions are symmerical to the center of the card insertion slot. 1

13 Reverse Standoff 2.2mm (ommon to both Right & left buttons) 50.4±0.05 Mounting area 64.75± ± ±0.1 (2.2) 4.025± ±0.05 ard edge position 4.25± ± MX MIN 2.5± MX 14.6MIN 5.65MIN 2-Ø MIN 1.5MX 1.95MIN 1.5MX 4.05MIN 7.25MIN.75MIN Shield plate mounting area Note 1) P mounting area (Enlarged views) ±0.05 area show the conductive pattern prohibited area. Note.2) 2 Indicated dimensions are symmerical to the center of the card insertion slot. Standard Without Standoff 4.4±0.1 ±0.1 Ø2. 1.9± ± ± ± ± ±0.1(Terminal mounting area) 2±0.1(Terminal mounting area) P=0.65± ±0.0 ± ±0.1 Ø1.8±0.05(Plated through hole) No.4 Ø1.85±0.05(Plated through hole) Ø2.5 Standoff 1.5mm, 2.2mm 4.4±0.1 ±0.1 Ø2. 1.9± ± ± ± ± ±0.1(Terminal mounting area) 2±0.1(Terminal mounting area) P=0.65± ±0.0 No.4 ± ± MIN 2.7MIN Ø MIN Ø1.8±0.05(Plated through hole) MIN Ø1.85±0.05(Plated through hole) 58.4MIN Reverse Standoff 2.2mm 4.4±0.1 ±0.1 Ø2. 1.9± ± ±0.05 No ± ± ±0.1(Terminal mounting area) 2±0.1(Terminal mounting area) P=0.65± ±0.0 ± ± MIN 2.7MIN Ø2.5 Ø1.8±0.05(Plated through hole) 1.05MIN MIN 1.05MIN Ø1.85±0.05(Plated through hole) 14

14 ssembly of units and board placement procedures (1) Mount the SMT unit on the P board. Guide unit SMT unit SR PRM Push rod P Stroke arm PR PR Fig. 1 Note 1: Verify and make sure that the position of the stroke arm of the SMT unit and the push rod of the Guide unit are at the positions indicated in Fig. 1. (as delivered). If needed, position them as shown. orrect position of the push rod and the stroke arm is required for correct assembly of both units. Note 2: Make sure that the SMT unit is positioned securely. Note : Soldering will not be possible with the Guide unit attached first. The Guide unit must be attached and secured to the P board FTER the SMT unit is attached to the P. SR SR Interference Interference Fig. 2 15

15 (2) lign both arrow marks (stamped on the shield plate) on the Guide unit with the corresponding grooves on the (mounted on the board) SMT unit (as illustrated of Fig. and -1). SR PRM Fig. -1 PR PR Fig. -2 Fig. rrow mark Shield plate Insulator part SR Position Position Groove Fig. -1 Gide unit SMT unit Fig. -2 P 16

16 Note : Place the Guide unit over the installed SMT unit, (exercising caution NOT to touch the spring, push rod or the stroke arm).ref. Fig.4 PRM Guide unit holding areas PR PR Fig. 4 17

17 () Slide the Guide unit forward until it is locked with the SMT unit. Fully locked units should be as shown on Fig. 5. Slide forward Shiel plate SMT unit SR PRM Spring portion Slide forward Guide unit holding areas PR PR Fully locked SR Visible insulator Locking area No space Fig. 5 18

18 Note 5: It is assumed that the Guide unit and the SMT unit will be mounted on the same P. However, in some applications the Guide unit may be mounted directly on the device s case/housing. It is critical that the miss-alignment of the Guide unit must be kept within ± 0.15 mm. The side clearance between the case/housing and the shield plate should be 0.15mm minimum. Ref. Fig. 6 Note 5. learance between body and shield: 0.15 mm minimum. ±0.15 PRM SR ±0.15 PR PR Fig. 6 Device case/housing Note 6: DO NOT insert/eject the P card before the SMT unit and the Guide unit are fully mounted and locked, with the push rod and stroke arm connected. 19

19 (4) The Guide unit should be securely attached with two screws. (4-1) I14 and I14 Types Fig. 7 (From the bottom of the P) PR Fig. 7 (4-2) I14 Type Fig. 8 (From the top of the P) PR PR Fig. 8 Note 7: The I14 and I14 assemblies do not require separate hex nuts. Note 8: Hex nuts and screws are required for the I14 assemblies. Max. length of the screw thread is 1.4mm. Screw size onnector type Recommended tightening torque (N m) I14 type 0.12~0.16 M2 0.4 I14 and I14 type 0.14~

20 Recommended procedure for removal of the Guide unit (1) Remove the 2 screws attaching the Guide unit to the P. (2) Make sure that the stroke arm of the SMT unit and the pushrod of the Guide unit are at the positions indicated in Fig. 1. Guide unit SMT unit Remove screws SR PRM Push rode Stroke arm PR PR Fig. 1 P () s illustrated in Fig. 2, the lock between the shield plate and the ribs of the insulated case can be released. Press the insulator on both side of the installed assembly and carefully slide the Guide unit. Pull guide unit in this direction Shield plate Detail Press Range of retaining position Left side Right side Pull guide unit in this direction PRM SR Press Release pressure points (each side) PR PR Release pressure points (each side) Fig. 2 21

21 Note 1: s illustrated in the enlarged view of Fig., the lock is released by deflecting the insulator approximately 0.5 mm. Detail lock release condition Insulator (deflect) Shield plate Fig. detail - enlarged view Note 2: ssure that the push rod remains in its original position. Moving it from this position may cause it to fall-out. SR PRM Original push rod position Do not move in this position Fig. 4 22

22 Recommended opening dimensions for the device housing (ard Insertion Slot and Ejection button guide) 1 (55) 1 (6) (28.5) (.2) 1 : P ard center Line dimensions Handling Precautions (1) Metal components of these connector assemblies have sharp edges. Use caution when handling, installing or dis-assembling. (2) The design of the device s case/housing should incorporate sufficient guide and support for the ejection button. () Slight tool marks or cleaning liquid residue the surfaces of the Guide unit will not affect form, fit or function of the assemblies. 2

23 Recommended temperature profile Using Typical Solder Paste 5S max Temperature (ç) Start 60~90S 0S 20~0S Preheating Soldering Time (Seconds) Recommended conditions Reflow system Solder composition Test board Metal mask : IR reflow : Paste, 6%Sn/7%Pb (Flux content 9wt%) : Glass epoxy 80mm 125mm 1.6mm thick : 0.15mm thick Using Lead-free Solder Paste Temperature (ç) ç 250ç(PEK) 220ç 170ç 60s(MX) Recommended conditions Reflow system Solder composition Test board Metal mask : IR reflow : Paste, 96.5%Sn/.0%g/0.5%u (Flux content 10.5wt%) : Glass epoxy 80mm 125mm 1.6mm thick : 0.15mm thick 50 0 Start 25ç 60~120s Preheating Soldering The temperature profiles are based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. onsult your solder paste and equipment manufacturer for specific recommendations. Time (Seconds) 24

24 Mouser Electronics uthorized Distributor lick to View Pricing, Inventory, Delivery & Lifecycle Information: Hirose Electric: I14-PL-SF-EJR(71) I14-PL-SF-EJR(71) I14-PL-SF-EJR(71) I14-G-PEJR(10) I14-G-PEJL I14-G- PEJR I14-G-PEJR I14-PLR-SF-EJL(71) I14-PL-SF-EJL(71) I14-PLR-SF-EJR(71) I14-PL-SF-EJL(71) I14-PLR-SF-EJR