RClamp3331ZA. Ultra Small RailClamp 1-Line, 3.3V ESD Protection

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1 - RailClamp Description RailClamp TVS diodes are ultra low capacitance devices designed to protect sensitive electronics from damage or latch-up due to ESD, EFT, and EOS. They are designed for use on high speed ports in applications such as cell phones, notebook computers, and other portable electronics. These devices offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. RClamp 3331ZA features extremely good ESD protection characteristics including a low typical dynamic resistance of. Ohms, low peak ESD clamping voltage, and high ESD withstand voltage (+/-18kV contact per IEC 61-4-). Low typical capacitance (.35pF at VR=V) allows the RClamp3331ZA to be used in applications operating in excess of 5GHz without appreciable signal attenuation. Each device will protect one high speed data line operating at 3.3 Volts. RClamp3331ZA is in a -pin SLP63PX3F package measuring.6 x.3 mm with a nominal height of.5mm. Leads are finished with lead-free NiAu. The small package gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of low peak ESD clamping, low dynamic resistance, and low capacitance makes this device suitable for applications such as USB 3., MIPI and V-By-One interfaces in portable devices. RClamp3331ZA Ultra Small RailClamp 1-Line, 3.3V ESD Protection Features High ESD withstand Voltage: +/-18kV (Contact/Air) per IEC Able to withstand over 1 ESD strikes per IEC Level 4 Ultra-small 1 1 package age Protects one high speed data line Working voltage: +/- 3.3V Low capacitance:.35pf typical Extremely low dynamic resistance:. Ohms (Typ) Low ESD clamping voltage Solid-state silicon-avalanche technology Mechanical Characteristics SLP63PX3F Package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions:.6 x.3 x.5 mm Lead Finish: NiAu Marking: Marking Code Packaging: Tape and Reel Applications USB. / USB 3. MIPI / MDDI V-By-One edp MHL LVDS Nominal Dimensions Schematic BSC.5.16 Revision 3/3/15 Nominal Dimensions (in mm) SLP63PX3F (Bottom View) 1

2 Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/ s) M aximum Peak Pulse Current ( tp = 8/ s) P pk 3 Watts I pp 4 Amps ESD per IEC (Air) SD per IEC (Contact) E 1 V ESD +/- 18 +/- 18 kv Operating Temperature T J -4 to +85 C Storage Temperature T STG 55 to C Electrical Characteristics (T=5 o C) Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off Voltage V WM R in 1 to or to 1 P 3. 3 V Breakdown Voltage V BR I BR = 1 A Pin 1 to or to V Reverse Leakage Current I R V RWM = 3.3V, T=5 C Pin 1 to or to 1 Clamping Voltage V C I PP = 1A, tp = 8/ s Pin 1 to or to 1 Clamping Voltage V C I PP = 4A, tp = 8/ s Pin 1 to or to 1 ESD Clamping Voltage V C IPP = 4A, tlp =./1ns ESD Clamping Voltage V C IPP = 16A, tlp =./1ns < 1 5 na V V 4.5 V 7 V, 3 Dynamic Resistance R tp =./1n s. Ohms D Junction Capacitance C j V R = V, f = 1MHz pf Notes 1)ESD gun return path connected to ESD ground reference plane. )Transmission Line Pulse Test (TLP) Settings: t p = 1ns, t r =.ns, I TLP and V TLP averaging window: t 1 = 7ns to t = 9ns. 3) Dynamic resistance calculated from I TLP = 4A to I TLP = 16A 15 Semtech Corporation

3 Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Waveform (tp=1./5us) Peak Pulse Power - P PP (W) T A = 5 O C Clamping Votlage (V) T A = 5 O C Waveform: tp= 1.x5us Rs = Ohms Pulse Duration - tp (μs) TLP Characteristic (Positive) DR Time (us) TLP Characteristic (Negative) 3 5 Transmission Line Pulse Test (TLP) Settings: t p = 1ns, t r =.ns, I TLP and V TLP averaging window: t 1 = 7ns to t = 9ns 5-5 TLP Current (A) 15 1 TLP Current (A) Transmission Line Pulse Test (TLP) Settings: t p = 1ns, t r =.ns, I TLP and V TLP averaging window: t 1 = 7ns to t = 9ns Clamping Voltage (V) Clamping Voltage (V) Clamping Voltage - V C (V) ESD Clamping (+8kV Contact per IEC 61-4-) ESD Clamping (-8kV Contact per IEC 61-4-) Measured with 5 Ohm scope input impedance, GHz bandwidth. Corrected for 5 Ohm, db attenuator. ESD gun return path connected to ESD ground plane Time (ns) 5 Measured with 5 Ohm scope input 6 impedance, GHz bandwidth. Corrected for 5 Ohm, db attenuator. ESD gun return path connected to ESD ground plane Time (ns) 15 Semtech Corporation 3 Clamping Voltage - V C (V)

4 Typical Characteristics Junction Capacitance vs. Reverse Voltage Typical Insertion Loss S1 Junction Capacitance - C J (pf) Loss (db) Voltage (V) f = 1MHz Frequency (GHz) 15 Semtech Corporation 4

5 Applications Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joints. The figure at the right details Semtech s recommended aperture based on the assembly guidelines detailed in the table below. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application Assembly Solder Parameter Stencil Design Recommendation Laser cut, Electro-polishe d.3 Aperture shape Rectangular with rounded corners S older Stencil Thickness.1 mm (.4") Solder Paste Type Type 4 size sphere or smaller Solder Reflow Profile Per JEDEC J-STD- Land Pad Stencil opening Component Recommended Mounting Pattern PCB PCB Solder Pad Design Pad Finish Non-Solder mask defined OSP OR NiAu 15 Semtech Corporation 5

6 Outline Drawing - SLP63PX3F A aaa C A1 D TOP VIEW e/ B E A C R.5 TYP SEATING PLANE DIMENSIONS DIM MILLIMETERS MIN NOM MAX A A b...4 D E e BSC L N aaa.8 bbb.1 bxn bbb C A B X L e BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP63PX3F DIMENSIONS (C) G Z DIM MILLIMETERS C (.385) G.181 X.73 Y.5 Z.59 Y X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES ).. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY 'S MANUFACTURING GUIDELINES ARE MET. 15 Semtech Corporation 6

7 Marking Code Ordering Information Part Number Qty per Reel Pocket Pitch Reel Size m RClamp3331ZATFT 15, mm 7 Inch Notes: RailClamp and RClamp are trademarks of Semtech Corporation Note: Device is electrically symmetrical Carrier Tape Specification m m m Device Orientation in Tape 15 Semtech Corporation 7

8 Contact Information for Semtech International AG Taiwan Branch Tel: Fax: Korea Branch Tel: Fax: Shanghai Office Tel: Fax: Japan Office (Osaka) Tel: Fax: Semtech International AG is a wholly-owned subsidiary of Semtech Corporation, which has its headquarters in the U.S.A. Japan (Tokyo) Office Tel: Fax: Semtech Limited (U.K.) Tel: Fax: Semtech France SARL Tel: 33-() Fax: 33-() Semtech Germany GmbH Tel: 49-() Fax: 49-() Semtech Corporation 8