RClamp0501T. Low Capacitance 1-Line ESD protection. PROTECTION PRODUCTS - RailClamp Description. Features. Mechanical Characteristics.

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1 - RailClamp Description RailClamp TS arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). The RClamp 050T has a maximum capacitance of only.5pf. This allows it to be used on circuits operating in excess of 00MHz without signal attenuation. They may be used to meet the ESD immunity requirements of IEC The RClamp050T is in a -pin SLP006PT package measuring.0 x 0.6 x 0.4mm. The leads are spaced at a pitch of 0.65mm and feature a lead-free finish. Each device will protect one high-speed line operating at 5 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of small size, low capacitance, and high ESD surge capability makes them ideal for protection of high speed digital lines in cellular handsets and other portable electronic devices. RClamp050T Low Capacitance -Line ESD protection Features Transient protection for data lines to IEC (ESD) ±5k (air), ±0k (contact) IEC (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package (.0 x 0.6 x 0.4mm) Protects one data or I/O line Low capacitance:.5pf Low clamping voltage Low operating voltage: 5.0 Solid-state silicon-avalanche technology Mechanical Characteristics SLP006PT package Molding compound flammability rating: UL 94-0 Marking: Marking code Packaging: Tape and Reel Lead Finish: NiPdAu Pb-Free, Halogen Free, RoHS/WEEE Compliant Applications Cellular Handsets & Accessories Multimedia Card Interfaces Digital Signal Lines SIM Ports Keypads SD Lines Dimensions Schematic & PIN Configuration Revision /0/00 Maximum Dimensions (mm) SLP006PT (Bottom iew)

2 RClamp050T Absolute Maximum Rating Rating Symbol alue Units Peak Peak Pulse Power (tp = 8/0μs) Pulse Current (tp = 8/0μs) P pk 50 Watts 0 A ESD per IEC (Air) ESD per IEC (Contact) ESD +/- 5 +/- 0 k Operating Temperature T J -55 to +5 C Storage Temperature T STG 55 to C Electrical Characteristics (T=5 o C) Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off oltage RWM 5 Reverse Breakdown oltage R B I t = ma Reverse Leakage Current I R RWM = 5, T=5 C μa Clamping oltage C = 3A, tp = 8/0μs Pin to Clamping oltage C = 0A, tp = 8/0μs Pin to Forward Clamping oltage F = 3A, tp = 8/0μs Pin to Junction Capacitance C R = 0, f = MHz j T = 5 Junction Capacitance C R = 0, f = MHz j T = 0 to +85 o C o C pf pf 00 Semtech Corp.

3 RClamp050T Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping oltage vs. Peak Pulse Current Peak Pulse Power - P PP (kw) Clamping oltage - C () Waveform 4 Parameters: tr = 8µs td = 0µs Pulse Duration - tp (us) Peak Pulse Current - (A) Forward oltage vs. Peak Pulse Current Normalized Capacitance vs. Reverse oltage Forward Clamping oltage () Waveform Parameters: tr = 8µs td = 0µs Peak Pulse Current (A) Cj( R ) / Cj( R =0) f = MHz Reverse oltage ( R ) ESD Clamping (8k Contact per IEC ) Insertion Loss S CH S LOG 6 db / REF 0 db : dB 800 MHz 0 db 5 : dB 900 MHz -6 db - db -8 db 3 4 3: dB.8 GHz 4: dB.5 GHz -4 db -30 db -36 db -4 db Note: Data is taken with a 0x attenuator START. 030 MHz STOP MHz 00 Semtech Corp db MHz 0 MHz 00 MHz GHz 3 GHz

4 RClamp050T Applications Information Device Connection Options These low capacitance TS diodes are designed to provide common mode protection for one high-speed line. The device is unidirectional and may be used on lines where the signal polarity is positive. Equivalent Circuit Diagram Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. 00 Semtech Corp. 4

5 RClamp050T Outline Drawing - SLP006PT A D B aaa C A TOP IEW A E C SEATING PLANE DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX A A b D E e.06 BSC 0.65 BSC L R N aaa bbb PIN ID bxn bbb C A B R e x L BOTTOM IEW NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP006PT (C) G Z X Y DIMENSIONS DIM INCHES MILLIMETERS C (.033) (0.85) G X Y Z NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 00 Semtech Corp. 5

6 RClamp050T Marking Code Ordering Information Part Number Qty per Reel Reel Size RClamp050T.TNT 0,000 7 Inch RailClamp and RClamp are trademarks of Semtech Corporation. Notes: )Marking will also include line matrix date code Carrier Tape Specification Bo Ko Ao Device Orientation in Tape A0 B0 K /-0.05 mm.5 +/-0.05 mm /-0.05 mm Note: All dimensions in mm unless otherwise specified Pin Cathode Location (Towards Sprocket Holes) Contact Information Semtech Corporation Protection Products Division 00 Flynn Rd., Camarillo, CA 930 Phone: (805)498- FAX (805) Semtech Corp. 6