Tangible Value Can be Realized by Standardizing Probe Interfaces

Transcription

1 Keith Imai Semiconductor Test Consortium (STC) Tangible Value Can be Realized by Standardizing Probe Interfaces June 8-11, San Diego, CA USA

2 STC at a Glance Global non-profit industry organization Main objective: develop & deploy value-added open test standards to benefit the industry Innovative collaboration initiated through technical, industry-driven Working Groups Diverse membership of leading companies, innovators & universities throughout the semiconductor supply chain IEEE SW Test Workshop 2

3 Diversified Board STC Board of Directors Chairman: Don Edenfeld (Intel) Billy Antheunisse (Texas Instruments) Co-chairman: Hideyuki Aoki (Renesas) Paul Roddy (Advantest) Co-chairman: Klaus Luther (Infineon) Steve Wigley (LTX) OPENSTAR WG STIX TM WG Manager Bob Helsel Operations WG Marketing WG Solutions Docking & Interface Probe Card PTIM STIL University Yield Enhancement IEEE SW Test Workshop 3

4 Consumer Driven Market Places great strain on supply chain Time to market/volume/profitability is critical Reduced total cost of test is a necessity Device technology & integration are increasing Product life cycles are shortening Test requirements are increasing exponentially Complexity Cost per X Time IEEE SW Test Workshop 4

5 Volatile Industry Dynamics Chaotic market is detrimental to supply chain Everyone s resources are stretched Efficiencies & economies of scale are critical 7,500 Semiconductor Test System Market $M 5,000 2,500 0 '93 '94 '95 '96 '97 '98 '99 '00 '01 '02 '03 '04 '05 '06 '07 Source: Prime Research Group IEEE SW Test Workshop 5

6 Collaborative Solutions are Necessary Synergistic ecosystem elements Infrastructure enables quick solution deployment True open specifications: Fully leveraged throughout supply chain Enable best-in-class solutions Facilitate innovation Innovative Solutions Drive economies of scale Working Groups STC Ecosystem Support Infrastructure Open Specifications IEEE SW Test Workshop 6

7 STC Evolution Launching a New Era in Semiconductor Test Phase I Phase II Phase III Launch Traction Expansion Established corporate infrastructure & core Working Groups OPENSTAR specs published Achieved critical mass 1 st Third Party module developed OPENSTAR specs improved Established new Working Groups STIX TM formalized Continued focus on providing value to industry Additional Working Groups forming IEEE SW Test Workshop 7

8 STIX TM Expansion Semiconductor Test Interface extensions For areas around ATE Black Box ATE IP remains with Vendors Prober Handler EDA Yield Tools Others IP remains with Vendors IEEE SW Test Workshop 8

9 STIX TM Enabled Opportunities Training Test Test Engineers Product Engineers Techs & Operators Corporate Integration ATE ATE specs to to Design rules ATE ATE to to Planning system Program Development Test Test Programs Characterization Programs Test Test Vectors Data Data Collection Black box ATE Software ATPG Tools Design to to Test Test Tools Conversion Tools Virtual Test Test Tools Factory Integration Hardware Specs Calibration GUI GUI Interface Hardware Support Probe Cards Mechanical Docking Load Boards Spares Inventory IEEE SW Test Workshop 9

10 Probe-centric Groups Hardware Support Probe Cards Mechanical Docking Load Boards Spares Inventory Probe card WG Japan driven Prober task team Part of DIWG Europe driven IEEE SW Test Workshop 10

11 PCWG & DIWG Members Panasonic IEEE SW Test Workshop 11

12 PCWG Efforts initiated by Japanese members Goals: shorten time to procure probe cards & standardize path Achieved general consensus on key points & documentation First Japan/US WG meeting March 13 Follow up meeting June 6 at GSC Vote on Rev. 0 specs ~ Q3 08 IEEE SW Test Workshop 12

13 Probe Card Order Placement Path Users no longer need multiple contacts Probe Card ordering info is managed between vendors Users can get up to date and controlled info from vendors Users Prober Vendors Current Path Proposed Path PC Spec Probe Card Technical Information ATE Vendors Technical Information Probe Card Vendors IEEE SW Test Workshop 13

14 Automatic Deployment of Documented Work Instructions Pad No. NAME 213 DDRAD0 210 DDRAD1 215 DDRAD DDRAD DDRAD DDRAD DDRAD2 221 DDRAD3 219 DDRAD4 216 DDRAD5 218 DDRAD6 DDRDQ User Input Map of Probe point X (μm) Y (μm) Net List Die image sheet DUT2 160 Signal Path Spec. GIOCE5_N Signal Attribute No. Pad order sheet Pad NAME 1 VSSC1 2 VSSHDMI 3TOUTP_A 4TOUTN_A 5REXT_A 6VDDC2 7 RXNC A Map of Probe po X (μm) Power Plane sheet 262 VSSDDR 0V3 265 VSSDDR 0V3 271 VSSDDR 0V3 48 VSSGIO 0V4 56 VSSGIO 0V4 68 VSSGIO 0V4 Y (μm NC VSSGIO IEEE SW Test Workshop 14

15 DIWG: Task Teams Formed Jan in Europe First documents completed Oct Terminology focus Tester Handler DIWG Prober Manipulator Docking & Interface IEEE SW Test Workshop 15

16 Prober Outline Standardized naming conventions are key Headplate R5 FOUP R4 R4 L1 R3 F2 R2 R1 F1 IEEE SW Test Workshop 16

17 Sort Interface Terminology Multiple drawings for various implementations Test Head Pogo Pins Probe Interface Board (PIB) Pogo Tower Probecard TSRP Hardstop Tester Signal Reference Plane (TSRP) Probehead Z Prober Front Index Y X IEEE SW Test Workshop 17

18 2008 Worldwide Calendar 19 global activities 5 regional meetings 5 industry events 4 major shows 4 event meetings 1 GSC Details on web site Month Japan Asia Europe USA Jan ISS (Half Moon Bay) Jan. 15 Infineon Jan. 31 VLSI Chip Insider Live. Jan. 16 Feb. March Apr. May June July Aug. Sept. Oct. GM - Tokyo March 26 GM Sept. 24 Semicon China Mar Semicon Taiwan GM/Dinner event ~Sept. ETS (Italy) May Reliability conference Ingolstadt, Germany Sept Oct. 1 Semicon Europe Dinner meeting Oct. 8 GM (Austin) Mar. 13 Global STC Conference: June 4-6 in San Diego, CA SWTW June 8-11 Semicon West July GM (Boston?) Sept. 18 Dinner event Oct. 27 ITC - Santa Clara Oct Nov. Dec. GM/Dinner event Dec. 4 Semicon Japan Dec. 3-5 IEEE SW Test Workshop 18

19 STC Value Proposition Active Working Groups focused on driving value-added solutions to industry Synergistic ecosystem enables timely, costeffective solutions to meet dynamic market challenges Membership is open to all Innovative Solutions STC Ecosystem Support Infrastructure Working Groups Open Specifications IEEE SW Test Workshop 19

20 Thank you for your attention IEEE SW Test Workshop 20