Data Transport: Defining the Problem and the Solution for Photonics in servers

Transcription

1 Ronald Luijten Data Motion Architect IBM Research Lab Switzerland 5 October 2010 Data Transport: Defining the Problem and the Solution for Photonics in servers 1 MIT microphotonics Fall meeting 2010

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3 Disclaimer This is Ronald s personal view not necessarily that of IBM corporation 3 MIT microphotonics Fall meeting 2010

4 Short version The largest challenge for enterprise class servers is power consumption There is a fundamental cause for this BW requirement keeps going up Growing number of cores on a CPU The opportunity for Photonics is to deliver BW at lower power consumption than electronics But has to be at equal or lower cost than electronics 3D packaging will also address the power / BW needs 4 MIT microphotonics Fall meeting 2010

5 5 server walls Memory Multicore programming Energy Resilience Algorithm 5 MIT microphotonics Fall meeting 2010

6 Data Center Energy usage Globally, Data Centers consume 1% of electricity in 2008 [koomey 2008] 2% in US (in 2008) Data Center energy consumption doubled between 2002 and 2007 [McKinsey 2008] Data Center power and cooling costs have doubled from 2000 to 2008 [IDC 2009] Significant improvements are possible in PUE Power Usage Effectiveness: PUE typically > 2.4 PUE of ~1.6 in cold climates PUE = P P tot IT This is achievable by better cooling (liquid, improved airflow etc.) This is a one time effect Virtualization and Cloud computing will improve server productivity This is a one time effect Brouillard, APC, 2006 Good and important work, but not sufficient we also need to work on P IT 6 MIT microphotonics Fall meeting 2010

7 Cost of hardware versus cost of operation Source IDC, MW for one year costs ~1M$ (average in the US) 7 MIT microphotonics Fall meeting 2010

8 Projected datacenter energy consumption Data Center share of total produced electricity (US) Efficiency gain from virtualization: 15-fold 3.5% growth per annum in electricity production percentage DC / no virtualization with virtualization 1 DC w/ trans. to virt Produced electricity year 10% of prod. Electr. 8 MIT microphotonics Fall meeting 2010

9 Key Causes Why are we today in this IT energy challenge? a) CMOS scaling ran into fundamental limit violating Dennard s scaling rules b) Demand for IT scaling is higher than Moore s law can supply c) More s law (yes, with only 1 o) 9 MIT microphotonics Fall meeting 2010

10 An example for a planned 2012 machine: Blue Waters 10 PFlop (10**16) peak operations compute cores = CPU chips = 9375 QCM = 1172 drawers = 98 racks ~ optical ribbon cables 800W / QCM 7.5 MW in CPUs New building 24 transformers@2 MW Blue waters PUE = MIT microphotonics Fall meeting 2010

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12 PERCS Blue Waters is a first incarnation Blue Waters = HPC HPC spearheads commercial to follow 5..7 years later The challenge is to get photonics into Enterprise Class Commercial servers Achieve power savings Cost it s the packaging! timeline 12 MIT microphotonics Fall meeting 2010

13 Memory Capacity & speed 118 pins (72 data) Half of Power consumed in moving data 64 GB 32 GB 16 GB 8 GB 57 Gbps DIMMs per channel vs data rates (using DDR2 standard) (original chart Courtesy Hillery Hunter, IBM Watson with some additions) And 3D packaging does NOT solve this Majorca winter topical: 10x power savings possible 13 MIT microphotonics Fall meeting 2010

14 High Volume, Enterprise Class Servers. Single Socket, 8GB Mem, Redundant Power CPU Circuit board + electronics Power, Packaging&Cooling Commodities Vendor A Vendor B Vendor C 8 core CPU 6 core CPU 6 core CPU 14 MIT microphotonics Fall meeting 2010

15 Timeline to get into servers Enterprise class servers have 4 year life cycles New generation architecture every 4 years technology refresh after 2 years IBM P7 came out 1Q2010 So you can expect the next generation in 2014 Well, this has exited the concept phase already and does not have intrabox optics Your next chance is for the generation after that 2018 To get in, you need to demonstrate function and cost by 2013 (concept close) If you cannot make that date, your next deadline is 2017, for product in MIT microphotonics Fall meeting 2010

16 3D integration Source: 16 MIT microphotonics Fall meeting 2010