Material Created By: Jeremy Pemberton-Pigott. Technical Marketing Engineer for AXI (Singapore) Page 1

Transcription

1 Material Created By: Jeremy Pemberton-Pigott Technical Marketing Engineer for AXI (Singapore) Page 1

2 Agenda 1. Software release 8.50 preview 2. User Contributed Tools Build Operator Menu Demo codenexus Defect Reporter Demo 3. Q & A Page 2

3 Page 3 Agilent Medalist 5DX v8.50 Software Release Preview

4 8.5 Software Release Release Content Algorithm Enhancements Connector Joint Type Modifications for very heavily shaded components by using gray level analysis. Chip Joint Type T-Shirt Cap updates to reduce false failures. FET (Field Effect Transistor) Joint Type Allows testing of FET type components for Open / Insufficient / Voiding. Uses a special Voiding algorithm that compares a learned image vs. the currently inspected joint. This is superior to the Paste Voiding algorithm. Defect Enhancements Critical / high priority defects as well as some minor new enhancements. Page 4

5 8.5 Software Release Targeted Release Date: August September 2008 Page 5

6 Connector SPC Algorithm Enhancements Page 6

7 Connector SPC Algorithm Enhancements Based on the standard Connector joint type. Special features in the SPC algorithm allow for the inspection of heavily shaded solder joints, where other methods would normally fail. It is based on gray level analysis instead of just solder thicknesses to allow analysis of joints that may not even be visible by the naked eye (without image enhancement). Sample application: Ventura connectors. The 5DX is currently the only automated test system in world, that can detect opens on the bridged-ground pins, for this connector. ICT and AOI are unable to detect opens on the bridged-ground pins in the Ventura connectors, due to pin access limitations. The enhanced Connector joint type is specifically designed to test for Open / Insufficient solder joints on these heavily shaded types of components. Page 7

8 Sample Ventura Connector (female) Large amount of metal in the connector causes shading issues for x-ray Page 8

9 Ventura Connector Pins and PCB Damaged Pins Bridged Ground Pins Bridged Ground Pins Signal Pin Replaceable wafer Signal Pins Page 9

10 Sample Ventura Connector Defect Image Image is heavily shaded. Fail Open Fail Open Pass Short Fail Short Maximum camera brightness and integrations are used. Special averaging technique used to further reduce noise. 2 Bridged-Ground Rows The algorithm s special features allow accurate measurement of the resultant image for insufficient and open defects. Page 10

11 Good Solder Joint vs. Bad Open Solder Joint Comparison Good Solder Joints: - Heel, toe, and side fillets well defined. - Consistent fillet length. Suspect Solder Joints: - Heel, toe, and side fillets not well defined. - Inconsistent fillet length. Page 11

12 Good Solder Joint vs. Bad Cold Solder Joint Good Bad Page 12

13 Good Solder Joint Profile Profile of a good solder joint includes the following: - Well defined heel / toe fillets. - Consistent fillet length. - Steep heel and toe fillet slopes. Page 13

14 Open Solder Joint Profile Profile of an open solder joint includes the following: - No heel / toe fillets, raised center. - Inconsistent fillet length. - Shallow heel and toe fillet slopes. Page 14

15 Chip Enhancements for T-Shirt Capacitors Page 15

16 Side Fillets of Chip T-Shirt Capacitors Adds capability for discrete devices with solder fillets on the sides of the pin not just on the end of the pin. Enhancements to the Chip joint type provide detection of: - Side fillet insufficients - Side fillet opens - Misalignments - Partially lifted bodies - Lower false calls than previous releases Body of package Side fillets with solder Side fillets with solder Page 16

17 New Chip Open Test Uses Maximum Pad Thickness Delta Creates a ratio of pad 1 thickness over pad 2 thickness. Joints are failed when they exceed this ratio: Pad 1 test = (Pad 1 / Pad 2) * 100 Pad 2 test = (Pad 2 / Pad 1) * 100 Note This test will run on either T-Shirt Cap or on normal Cap packages. For T-Shirt Cap packages, the average thickness is taken from the T- Shirt search regions For normal packages, the average thickness is taken from the pad 1 and pad 2 regions of interest. Page 17

18 Side Fillets Enabling the Side Fillet testing Turns on new regions of interest that generate a profile across a joint. Pad Region Width Controls the width of the region of interest. Page 18

19 Sample T-Shirt Caps Acceptable Ideal Cap is between the BGA pins Reject Page 19

20 Sample T-Shirt Caps Insufficient Open Page 20

21 The New FET Joint Type Page 21

22 Why a new joint type? We required a new family of algorithms to improve the detection of defects in nonstandard joint shapes. Some example defect conditions: Insufficient solder and no solder Un-reflowed solder or cold solder Excessive voiding in the solder joint Sample applications: PolarPAK TM and DirectFET TM devices. The FET joint type can be used on any FET type device but it is not restricted to only these devices and can also be used to analyze many other oddly shaped joints. Page 22

23 Sample PolarPAK FET device Page 23

24 Sample FET Layout Drain Gate Source Drain Land Pattern layout - Single large pad for source pin Page 24

25 FET Overview The SPC Algorithm Along Pad Profile Measures changes in slopes along the region: Generates a 2 nd derivative profile (which identifies a change in slopes). Changes are summed. Finds Opens / Insufficient. Page 25

26 FET Overview SPC Algorithm Gap Along Measurements Activates 2 search regions which identifies & measures gaps in the solder. Gap Across Measurements Same as along, but used for going across the joint. Span Size Number of pixels to smooth the joint profiles with. Eliminates noise from the joint profile to allow for more accurate insufficients testing. Gap Along Gap Across Page 26

27 Sample FET Defects First Device Type Large Gap Insufficient solder on Source / Drain / Gate pins Page 27

28 Sample FET Defects Second Device Type Insufficient solder on Drain / Gate pins Page 28

29 Sample Insufficient Defects (both types of devices) Page 29

30 FET Overview Voiding Algorithm The Voiding algorithm uses a special technique of comparing a known, previously learned, good image to the actual joint. The previously learned image is called an Expected Image. By analyzing the differences, between the images, the voids in the joint can be found no matter what shape the joint is. You do have to take some care not to learn too many voids or defects into the Expected Image. Page 30

31 FET Voiding Expected Image Analysis How it works? The FET Voiding algorithm learns a set of images which are used to create an overall Expected Image that does not contain any voids. 1. The region of each joint that contains solder is identified. 2. Within the soldered region, each pixel is compared to it s corresponding pixel in the Expected Image. 3. Pixels that fall into a void will have a lower gray level value than the current Expected Image. 4. A minimum area of pixels is required to count the area as being a void. 5. The pixels in each area that are identified as being a void are counted and compared to the total number of pixels within the soldered region. 6. The total percentage of voiding is then used to pass or fail the joint. Page 31

32 How Expected Image Works (visually)? Set 1 Set 2 Component 1 Pin Component 1 Pin 2 + Component 2 Pin 1 + Component 2 Pin 2 + Component 3 Pin 1 + Component 3 Pin 2 Expected Image Pin 1 Expected Image Pin 2 Page 32

33 How Expected Image Works (visually)? Pin to be analyzed for voiding The Expected Image Calculated voids are marked in light blue (small voids omitted) > Threshold? Page 33

34 Sample FET Voiding In the next slides we will get a representative step by step approach to how the machine looks for the voids and calculates the voiding area of only the Region of Interest. Page 34

35 Total Pad Area: 86,072 pixels This is how the CAD is setup Joint image to be analyzed Mask created by setting a threshold using the Expected Image Total Un-Masked Area of the Expected Image : 48,413 pixels After processing: Voided Area (Un-Masked): 1,341 pixels Voided Area (Un-Masked): 2.76%

36 Total Pad Area: 86,072 pixels This is how the CAD is setup Joint image to be analyzed Mask created by setting a threshold using the Expected Image Total Un-Masked Area of the Expected Image : 48,413 pixels After processing: Voided Area (Un-Masked): 26,074 pixels Voided Area (Un-Masked): 53.86%

37 Sample FET Voiding Areas excluded (masked) from voiding the analysis Expected learned image of the soldered region. Void identification made from the comparison to the expected image. Page 37

38 Sample FET Voiding Areas excluded from voiding analysis Expected learned image of the soldered region. Void identification made from the comparison to the expected image. Page 38

39 TD3 Defect Fixes Issues reported by customers from v8.30 v8.42 are being incorporated into v8.50. Our focus is on customer reported critical and high priority defects. There are over 35 fixes to the new release of software. Fixes and enhancements have just completed beta testing in Asia and the Americas. Final fixes are being implemented and tested before going out for release worldwide. Page 39

40 Slide 39 TD3 For the comment "list of fixes not available today" - I would replace this with our focus is on Customer Reported Critical/High defects. There are some defects already fixed and waiting on the 8.5 branch. George David should be able to give you this list, however it is really small, so it may not be worth mentioning here. Terri Devlin, 11/29/2007

41 Defect Fixes Short list of fixes: Test Link: Changing the family of a part resets all components test status 5DX / TDW: Excess algorithm added to the PressFitConnector joint type Short threshold Test region is not displaying the correct information when first displayed Review Measurements Default Configuration function is incorrect 5DX: AutoUI compile menu is limited to 500 programs Alignment does not fail all the time for a bad alignment point Duplicate barcodes not checked across multiple boards on a single panel Manual board alignment on multi-board panel allows wrong alignment points Review Defects BGA pin # mismatch between the review defect image and list Panel with x-out board last has no res/log file saved/sent to the ITF server SMEMA outputs incorrectly set in Automatic Review mode Page 40

42 Defect Fixes Short list of fixes continued: 5DX Software hangs when aborting manual alignment Review Defects shows the wrong slice Software reloads previous program during align & map Topside Reference Point from wrong panel is used Align and Map mis-focused images: Surface Map Alignment Views not working Aligning on two-row devices or single caps or resistors fails to work Automatic Reporter re-sends all of the test results to the ITF server upon logging into Windows 5DX Crashes: serialnumberlistselectionchanged error loadpanelasynchronously error setsinglefamilyallalgorithms error setalignmenttimeinmilliseconds error gettopsidemeasuredzheightnanometers error getbottomsidemeasuredzheightnanometers error Page 41

43 End of 8.50 Preview Page 42

44 Page 43 Questions?

45 User Contributed Disclaimer Since this software is user contributed software it may be outdated or unmaintained in future releases. You may use it at your own risk. We are not responsible for any damages incurred from the use of this software. This software is offered as a free service to our customers. We take no responsibility for the infringement of any proprietary rights or of any export or security restrictions caused by the distribution or of the items contained in it. In addition, we may not have reviewed or modified these items and do not make any claims as to the suitability or fitness of this software for any purpose. Page 44

46 Build Operator Menu Demo Multiple menu & user configuration control for the 5DX AutoUI Page 45

47 BLDOPMNU DOS Command The Build Operator Menu software replaces and extends the functionality found in the BLDOPMNU DOS command. BLDOPMNU DOS Program Page 46

48 Build Operator Menu Features Same features as the BLDOPMNU DOS command for enabling / disabling menu items in a single menu setup (default mode). Extends this functionality to allow for different menu items to be configured (enabled / disabled) by the group that a user belongs to. Security features like password protection for each user as well as generating security logs. Security logs track program startup, shutdown, user login/out, and wrong password entry attempts. Ability to run from a single network share directory and setup different users on different 5DXs or run in different configuration modes. Ability to set different S user passwords while locking the S user out from the Auto UI. This ensures that there is an audit trail for the S user, if configured. Page 47

49 Build Operator Menu 2 Modes of Operation Single User Menu Mode Runs in tandem with the 5DX Auto UI interface. Does not change any system settings. Users can optionally log into the Build Operator Menu software for tracking purposes, user name is automatically entered into the Auto UI. Multiple User Menu Mode Runs in tandem with the 5DX Auto UI interface. Changes the system settings so that all users must log into the Auto UI through the Build Operator Menu interface. Allows the disabling of different menu items for different users depending on the group that they belong to. Optionally locks out the S user if it is added to the SUPERVISOR group. Page 48

50 Build Operator Menu How It Works Log in Screen shot of the 5DX Auto UI interface and the Build Operator Menu about to enter a user name into Auto UI. Page 49

51 Build Operator Menu How It Works Log in Screen shot of the 5DX Auto UI interface and the Build Operator Menu after entering a user name into Auto UI. 1 2 Page 50

52 Build Operator Menu How It Works Log out Log out of the 5DX before trying to log out of the Build Operator Menu software. 2 1 Page 51

53 Build Operator Menu Multiple User Menu Mode Configure Users and Menus Groups and users. Configured menu items Double click a group or user to configure a group s menu access in the AutoUI. The F2 key will enable / disable the menu item. Page 52

54 Build Operator Menu Interface File Menu Items Multiple User Menu Mode Enable Single User Menu mode features Set Administrator password for access to the system s configuration screen View the security audit log file Page 53

55 End of Build Operator Menu Demo Page 54

56 What is the codenexus Defect Reporter? A User Contributed tool for the 5DX that replaces functionality found in: Defect Reporter (DOS based) Some Review Measurements graphing (DOS based) Page 55

57 What does the codenexus Defect Reporter do? It is a graphical user interface of the DOS Defect Reporter. It provides some basic graphing / exporting functionality: Different graph types for the test results A Defects Only view of the test results for production tuning Measurement filtering and graphing Exporting filtered defect / measurement data to CSV Basic chart printing, zooming, and copying functions Page 56

58 What does the interface look like? Page 57

59 Results List View Switch viewing mode Choose any result folder Select a result file from the list to view the results Details of the selected result file

60 Results Plot View Auto. refresh test results Remotely monitor results on a 5DX Optionally: Select any results file from the graph to view the test results

61 Defect Results List View Grouping by the selected attribute Load a graph of the data Export Defects to CSV Switch viewing mode

62 Defect Results Plot View (#) of failures in Joint Type - Subtype Chart failures grouped by Joint Type - Subtype

63 Measurements Filtering / Charting View Measurement filters to filter any measurement Plot multiple slices at once Export filtered data to CSV

64 Show all or only defective measurements Zoom In / Out +/- 3σ Passing Range +/- 1σ Mean Defective joints always show up no matter which measurement filter is selected Menu for Copy / Print / Save Picture

65 Utilization Test result chart for selected program name Machine Operation Summary Report Click the program name to view test result chart data for it

66 End of codenexus Defect Reporter Demo Page 65

67 FAQ on User Contributed Software What does it cost to buy? Nothing. What versions of 5DX software does it work on? All versions from v7.xx to v8.xx What versions of Microsoft Windows does it work on? All versions of Windows NT to Windows XP Provided.NET 2.0 can be installed on it Page 66

68 EUP ( Update Program) Please subscribe to the Agilent Update Program to receive the latest notices of software updates / articles / application notes and other monthly technical content. To subscribe by or RSS simply go to: and click on one of subscription links Page 67

69 Page 68 Questions?