Agilent 5DX 8.50 Software Release Notes

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1 Agilent 5DX 8.50 Software Release Notes This information is found in the What s New In This Release Bulletin link on the 5DX and TDW. Highlights As part of our continuing software enhancement and support service, Agilent Technologies is releasing the new 5DX 8.5 software to our valued customers. This is part of Agilent's software update service that provides additional value to the 5DX system by offering new or improved algorithms, new user interface capability, and correcting known software defects. The highlights of the 8.5 software release include: A new algorithm called "FET". A new FET algorithm family has been developed to address leadless design MOSFET packages that have large pads for efficient heat dissipation. Some pad designs for the source pin of the device may have gaps inbetween, or consist of isolated sub-pads. The ability of the algorithm to perform slope and gap measurements helps to detect potential Open and Insufficient defects. The Voiding algorithm for FET family uses the learned or Expected image concept to determine how an x-ray image of a good joint compares with the one under analysis, highlight the potential void areas, and calculates the void area percent. Update to the Chip algorithm. A new pad design shaped like a letter T allows chip components to be oriented at a 45-degree angle and placed closer together, thus maximizing real estate on the PCB. This T-shirt pad design produces a solder profile that is different from conventional chip components due to presence of side fillets on both pads. New thresholds under the Chip algorithm family allows additional side fillet measurements to be performed so as to detect potential defects such as Open and Insufficient more effectively. Update to the Connector algorithm. Certain x-ray images of SMT connectors may show excessive shading such that default solder thickness measurements do not give an accurate profile and thus produces false calls. New thresholds have been added to enable gray level measurements so as to effectively capture the actual solder profile and therefore results in more accurate measurements and better defect detection. Update to Review Defects showing the incorrect slice. This update allows the Repair Tool v4.1 to automatically display the correct slice to the user, as well as the Review Defects mode in the 5DX Auto UI. This fix requires users to re-compile all 5DX programs in order to generate a new MixView.xml file in the RTF directory. Users may experience an error titled Error in the Auto UI, if this file does not exist. The XML file will be copied over to the RES results directory, during a test, and later sent to the Repair Tool by a change in the Automatic Reporter trcmdpro.cmd script.

2 Change Request Overview The "CR" numbers used below refer to the Change Request numbers in Agilent's software tracking system. CR Testlink: changing the family of a part rests all test status. Status of a component marked as "No Load" or "No Test" is reset when user changing the family of the component in assign package. The test status and load status that set before will not change when user changing the family in assign package. CR AXI 5DX: Software reloads previous program during align & map System is changing the name of the program to the previously run production program after operator chooses a different program from the Load Programs list and started an alignment. A checking is added that when user performs Align & Map, system will check if loaded panel program name and the actual panel program in machine are the same. If it is not the same, system will prompt a dialog and user has the choice to choose YES or NO. If YES, system will continue perform Align & Map with the newly loaded panel program. If NO, system will not perform Align & Map. CR Assert: SurfaceMapPoint.getTopSideMeasuredZHeightNanoMeters #1 When performing Surface Mapping for a panel for a second time, a Java Assert is thrown. Fix is done to eliminate the Java Assert. CR Assert: SurfaceMapPoint. getbottomsidemeasuredzheightnanometers #2 When performing Surface Mapping for a panel for a second time, a Java Assert is thrown. Fix is done to eliminate the Java Assert.

3 CR Main UI compile menu is limited to 500 programs. The program list in the compile menu in the main UI is limited to 500 programs. The load panel program menu allows for up to 2000 panels to be picked. The compile menu should show the same number of flies as the load panel menu. A checking is added to allow the number of programs to display in the UI up to 2000 programs. CR Alignment does not fail all the time for a bad alignment point. System did not detect bad alignment points for gray level. System should prompt message detecting bad alignment has failed. CR Duplicate barcodes not checked across multiple boards on a single panel. Duplicate serial number checking feature only checks for sequential duplicates. The checking does not detect duplicates on the panel as a whole. A checking is added to detect duplicate serial numbers across the whole panel, instead of consecutive duplicate serial numbers. This changes apply to barcode serial numbers and manual input board serial numbers. CR Manual board alignment on multiboard panel allows wrong alignment points. During initial manual alignment, it is possible to align to the wrong board on a multiple board panel. Added a checking in Manual Alignment to allow user to only align within 1 inch of distance from original location. If align more than 1 inch, system will prompt a warning message and user will be brought back to the affected view. CR AXI Review Defects: BGA pin number mismatch between review defect image and list. BGA pin number shown in Image Window does not tally with the BGA pin number shown in Review Defect component list. Pin number that shows in the review defect will same as the Image Window.

4 CR Panel with x-out board tested last then no res/log file saved/sent to ITF. If you have a panel with three boards and the third board tested is x-out then no.log file is created for this third board serial number. After each test, all res files and log files should be created for each board on the panel. CR Casper SMEMA outputs incorrectly set in Automatic Review mode. Panel results not updated in Auto-Review mode. Changes added in BoardInspectionEnd function in TestExecution file to update panel test result based on current board RES file. CR Short threshold "Test region" not showing correct information when first shown. During execution of Algorithm Tuner, the Test Region parameter under Short threshold will be displayed as default value. In original code in Algorithm Tuner, if column not editable, it will update all columns to default value, including user settings during runtime (column not editable). Changes made to only update the default column and not user settings. CR DX X-ray Scan Calibration. X-ray Scan calibration does not always start from 400 FOV (base FOV). X-ray Scan Calibration will always adjust 400 FOV (Base FOV) before adjust other FOV. CR AXI 5DX: Software hangs when aborting manual alignment. If we set to trigger Auto-Review after each inspection, 5DX hangs when automatic alignment fails. occurred when user triggered Auto-Review feature for inspection. When user aborted the inspection half-way through Alignment/Surface Mapping, Test Execution will hang. Changes made to fix the hang problem.

5 CR AXI Testlink: Review Measurement "Default Configuration" function is incorrect. In Review Measurement, when selecting Options > Default Configuration, this will incorrectly change the algmet.cfg file from FilterPath=\5DX\FILTER to FilterPath=\FILTER. In review measurement, default configuration will always set the FilterPath to \5DX\FILTER CR Misfocused images: Topside Reference Point from wrong panel is used. Any view that does not use 400 FOV will be very misfocused when running Align and Map. Surface-Map-Alignment is not running as it should as part of Align and Map process. Fix is done to get the current panel reference offset. CR Align and Map misfocused images: surface-map-alignment-views not working. Any view that does not use 400 FOV will be very misfocused when running Align and Map. Surface-Map-Alignment is not running as it should as part of Align and Map process. Fix is done to get the current panel reference offset. CR Aligning on two-row components or single caps or resistors does not work. If you have an alignment view that uses pads from a single component, and that component has only two rows of pins, you can get an alignment failure or it will lock onto the wrong pins. Fixed. CR Assert: loadpanelasynchronously(panelloadingserver.java:66). Java assert is thrown if board width is smaller than width specification. Panel size checking added when user loads board into 5DX machine. If board width out of spec, system will throw an exception.

6 CR AXI 5DX: Review defect shows wrong image. Wrong slice of image shown in Review Defect. i) Generating an external XML file every time compiling the project from ndf to rtf. ii) This XML file store the valid slices to test for each view. iii) In every time in review defect (5dx menu / tdw), each defect pin will trace the records in xml file to get the valid slices index before show in the image window. If there is no record found in xml files, it will show the original slices index in res file. CR Assert: setsinglefamilyallalgorithms(paneltestsettings.java:92). Java assert. Fixed. CR Assert: setalignmenttimeinmilliseconds(imageanalysisserver.java:300). Java assert. Fixed. CR New edge port drivers are not a part of the current 5DX software release. New edge port drivers are not included in 5DX software installer. Every time install the 5dx, it will delete the old version of edge port driver, and install the new driver (for 5000 series). CR Excess algorithm be added to the PressFit Connector algorithm. Unable to detect open pins when a corner of a package is lifted, leaving just the solder on the pad. A new Excess algorithm added into PressfitConnector. At a high level, it should work in opposite from the way that the PressfitConnector Missing Algorithm (like Insufficient) works.

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