Irradiation Results and Transmission on Small Cables/Fiber
|
|
|
- Darleen Houston
- 5 years ago
- Views:
Transcription
1 Irradiation Results and Transmission on Small Cables/Fiber W. Fernando, K.K. Gan, A. Law, H.P. Kagan, R.D. Kass, A. Rau, S. Smith The Ohio State University M.R.M. Lebbai, P.L. Skubic University of Oklahoma B. Abi, F. Rizatdinova Oklahoma State University Dec 11, 2007 K.K. Gan ATLAS Tracker Upgrade Workshop 1
2 Outline Introduction Bandwidth of micro-twisted pairs Bandwidth of fiber Radiation hardness of VCSEL arrays Radiation hardness of PIN arrays Results on compact MT-style opto-packs based on BeO Summary K.K. Gan ATLAS Tracker Upgrade Workshop 2
3 Current Pixel Opto-Link Architecture Optical link of current pixel detector is mounted on patch panels: much reduced radiation level use micro-twisted pairs for transmission between pixel and opto modules simplified the design/production of both types of modules what is the bandwidth of the micro cables? use rad-hard/low-bandwidth SIMM fiber fusion spliced to rad-tolerant/medium-bandwidth GRIN fiber what is the bandwidth of the fiber? K.K. Gan ATLAS Tracker Upgrade Workshop 3
4 Bandwidth of Micro Twisted Pairs (current pixel cable) ~320 Mb/s ~640 Mb/s ~1 Gb/s current pixel cable with thick insulation is quite optimum! K.K. Gan ATLAS Tracker Upgrade Workshop 4
5 Eye Diagrams 127 µm cable 140 cm 100 µm current pixel cable 140 cm 60 cm 640 Mb/s 1280 Mb/s transmission at 640 Mb/s is adequate transmission at 1280 Mb/s may be acceptable 127 µm cable is slightly better K.K. Gan ATLAS Tracker Upgrade Workshop 5
6 Bandwidth of Fiber Preliminary 2 Gb/s 3.2 Gb/s 4.25 Gb/s transmission at 3.2 Gb/s is probably adequate K.K. Gan ATLAS Tracker Upgrade Workshop 6
7 Radiation-Hardness of Silicon PIN 10 8 Pre-irrad Post-irrad 6 Count 4 2 PIN responsivity decreases by 3x at 114 Mrad (SLHC: 69 Mrad) no degradation of rise/fall time Responsivity (A/W) operation at 160 MHz is OK K.K. Gan ATLAS Tracker Upgrade Workshop 7
8 Radiation-Hardness of GaAs PIN all arrays are front side illuminated PIN responsivities decrease by ~10x at 53 Mrad should repeat irradiation to SLHC dosage of 34 Mrad K.K. Gan ATLAS Tracker Upgrade Workshop 8
9 VCSEL LIV Characteristics Optowell Pre-irrad ULM 5G ULM 10G ULM requires higher voltage to operate all arrays have very good optical power K.K. Gan ATLAS Tracker Upgrade Workshop 9
10 VCSEL LIV Characteristics Pre-irrad both arrays have very good optical power K.K. Gan ATLAS Tracker Upgrade Workshop 10
11 VCSEL Power vs Dosage 2006: Two arrays each (2 x 7 channels) all VCSELs still produce optical power at SLHC dosage should irradiate at lower intensity and have more time for annealing K.K. Gan ATLAS Tracker Upgrade Workshop 11
12 VCSEL Power vs Dosage 1st irradiation period 2007: Two arrays each (2 x 7 channels) 2nd irradiation period Optowell & ULM (10 Gb/s) survive to SLHC dosage K.K. Gan ATLAS Tracker Upgrade Workshop 12
13 VCSEL Power vs Dosage 1st irradiation period 2007: Two arrays each (2 x 7 channels) 2nd irradiation period AOC (5 & 10 Gb/s) survive to SLHC dosage K.K. Gan ATLAS Tracker Upgrade Workshop 13
14 Post-Irradiation Analysis all arrays except ULM 5 G still produce optical power post-irradiation analysis (including annealing) in progress K.K. Gan ATLAS Tracker Upgrade Workshop 14
15 Opto-Pack Development current pixel detector uses Taiwan optical packages VCSEL mounted on PCB with poor heat conduction micro soldering of 250 µm leads is difficult Ohio State develops new opto-pack for SLHC uses BeO base with 3D traces for efficient heat removal wire bond to driver/receiver chip OSU Taiwan K.K. Gan ATLAS Tracker Upgrade Workshop 15
16 Results on Opto-Packs 35 VCSEL & 6 PIN opto-packs have been fabricated all VCSEL opto-packs except one have good coupled power principle of new opto-pack has been demonstrated 1 cm MT ferrule VCSEL array K.K. Gan Ceramic guideatlas pin Tracker Upgrade Workshop 16
17 Summary micro twisted-pair cable of current ATLAS pixel detector can be used for transmission up to 1 Gb/s fusion spliced SIMM/GRIN fiber can transmit up to 3 Gb/s Si PIN responsivity is ~3x smaller at 114 Mrad (SLHC: 69 Mrad) : Si PIN can be operated up to 160 MHz GaAs PIN responsivity is ~10x smaller at 53 Mrad (SLHC: 34 Mrad) high speed VCSELs from 3 vendors can survive to SLHC dosage compact MT-style opto-pack based on BeO has been developed K.K. Gan ATLAS Tracker Upgrade Workshop 17
Prototype Opto Chip Results
Prototype Opto Chip Results K.K. Gan, H.P. Kagan, R.D. Kass, J. Moore, S. Smith The Ohio State University Nov 5, 2008 K.K. Gan ATLAS Tracker Upgrade Workshop 1 Outline Introduction VCSEL driver chip PIN
Tracker Optical Link Upgrade Options and Plans
Tracker Optical Link Upgrade Options and Plans K.K. Gan The Ohio State University July 19, 2005 K.K. Gan ATLAS Tracker Upgrade Workshop 1 Outline current pixel/strip opto-links lessons learned upgrade
Summary of Optical Link R&D
Summary of Optical Link R&D K.K. Gan The Ohio State University November 6, 2008 K.K. Gan ATLAS Tracker Upgrade Workshop 1 Outline Introduction Plan for insertable B-layer Status of Versatile Link Project
Radiation-Hard/High-Speed Parallel Optical Links
Radiation-Hard/High-Speed Parallel Optical Links K.K. Gan, H. Kagan, R. Kass, J. Moore, D.S. Smith The Ohio State University P. Buchholz, M. Ziolkowski Universität Siegen July 3, 2013 K.K. Gan RD13 1 Outline
Radiation-Hard ASICS for Optical Data Transmission in the First Phase of the LHC Upgrade
Radiation-Hard ASICS for Optical Data Transmission in the First Phase of the LHC Upgrade A. Adair, W. Fernando, K.K. Gan, H.P. Kagan, R.D. Kass, H. Merritt, J. Moore, A. Nagarkar, S. Smith, M. Strang The
Opto-Packs for On-Detector Pixel Opto-Links
Opto-Packs for On-Detector Pixel Opto-Links K.K. Gan, H. Kagan, R.D. Kass, J. Moore, D. Pignotti, S. Smith, Y. Yang The Ohio State University P. Buchholz, M. Ziolkowski Universität Siegen December 13,
A Possible Redundancy System for Opto-Links
A Possible Redundancy System for Opto-Links A. Adair, W. Fernando, K.K. Gan, H.P. Kagan, R.D. Kass, H. Merritt, J. Moore, A. Nagarkar, S. Smith, M. Strang The Ohio State University P. Buchholz, A. Wiese,
Results on Array-based Opto-Links
Results on Array-based Opto-Links, H.P. Kagan, R.D. Kass, H. Merritt, J. Moore, A. Nagarkar, D. Pignotti, S. Smith, M. Strang The Ohio State University P. Buchholz, A. Wiese, M. Ziolkowski Universität
Electrical Data Transmission
Electrical Data Transmission ACES Workshop Martin Kocian 8 March 2015 Martin Kocian (SLAC) Electrical Data Transmission 8 March 2015 1 / 23 Why copper links? High levels of radiation close to the beam
The Phase-2 ATLAS ITk Pixel Upgrade
The Phase-2 ATLAS ITk Pixel Upgrade T. Flick (University of Wuppertal) - on behalf of the ATLAS collaboration 14th Topical Seminar on Innovative Particle and Radiation Detectors () 03.-06. October 2016
Status Report of the ATLAS SCT Optical Links.
Status Report of the ATLAS SCT Optical Links. D.G.Charlton, J.D.Dowell, R.J.Homer, P.Jovanovic, T.J. McMahon, G.Mahout J.A.Wilson School of Physics and Astronomy, University of Birmingham, Birmingham B15
Quad Module Hybrid Development for the ATLAS Pixel Layer Upgrade
Quad Module Hybrid Development for the ATLAS Pixel Layer Upgrade Lawrence Berkeley National Lab E-mail: kedunne@lbl.gov Maurice Garcia-Sciveres, Timon Heim Lawrence Berkeley National Lab, Berkeley, USA
Packaging for parallel optical interconnects with on-chip optical access
Packaging for parallel optical interconnects with on-chip optical access I. INTRODUCTION Parallel optical interconnects requires the integration of lasers and detectors directly on the CMOS chip. In the
Endcap Modules for the ATLAS SemiConductor Tracker
Endcap Modules for the ATLAS SemiConductor Tracker RD3, Firenze, September 29 th, 23 Richard Nisius (MPI Munich) nisius@mppmu.mpg.de (For the ATLAS-SCT Collaboration) The plan of this presentation Introduction
Update: Lambda project
Update: Lambda project Sabine Lange Detector Group DESY meeting, May 29-31, 2012 s1 Lambda project About Lambda: 2 x 6 3 chips (~28 x 85mm) high frame rate (8 read out lines, 2kHz readout) 10 gigabit Ethernet
TECHNOLOGY SYSTEM-LEVEL SIMULATION. S.P. Levitan and D.M. Chiarulli University of Pittsburgh, Pittsburgh, PA USA
MULTI-LEVEL LEVEL MIXED- TECHNOLOGY SYSTEM-LEVEL SIMULATION S.P. Levitan and D.M. Chiarulli University of Pittsburgh, Pittsburgh, PA 15260 USA Collaborators and Support Jose A. Martinez, Mark Kahrs, Jason
Optical Evaluation Kit for the ADN2530 Differential VCSEL Driver EVAL-ADN2530
Optical Evaluation Kit for the ADN2530 Differential VCSEL Driver EVAL-ADN2530 GENERAL DESCRIPTION This data sheet describes the optical evaluation kit for the ADN2530, a 10 Gbps active back-terminated,
I/O Choices for the ATLAS. Insertable B Layer (IBL) Abstract. Contact Person: A. Grillo
I/O Choices for the ATLAS Insertable B Layer (IBL) ATLAS Upgrade Document No: Institute Document No. Created: 14/12/2008 Page: 1 of 2 Modified: 8/01/2009 Rev. No.: 1.00 Abstract The ATLAS Pixel System
Recent R&D Results on a Pixel Detector for Belle. Gary S. Varner University of Hawai, i SVD Upgrades October 23, 2000
Recent R&D Results on a Pixel Detector for Belle Gary S. Varner University of Hawai, i SVD Upgrades October 23, 2000 Presentation Outline Sensor fabrication A dedicated Belle planar sensor has been in
Expected feedback from 3D for SLHC Introduction. LHC 14 TeV pp collider at CERN start summer 2008
Introduction LHC 14 TeV pp collider at CERN start summer 2008 Gradual increase of luminosity up to L = 10 34 cm -2 s -1 in 2008-2011 SLHC - major increase of luminosity up to L = 10 35 cm -2 s -1 in 2016-2017
Versatile Link PLUS Transceiver Development
Versatile Link PLUS Transceiver Development Csaba SOOS EP-ESE-BE on behalf of the VL + collaboration Outline Versatile Link PLUS project introduction Key differences between VL and VL + Link architecture,
Development of Optical Wiring Technology for Optical Interconnects
Development of Optical Wiring Technology for Optical Interconnects Mitsuhiro Iwaya*, Katsuki Suematsu*, Harumi Inaba*, Ryuichi Sugizaki*, Kazuyuki Fuse*, Takuya Nishimoto* 2, Kenji Kamoto* 3 We had developed
First Operational Experience from the LHCb Silicon Tracker
First Operational Experience from the LHCb Silicon Tracker 7 th International Hiroshima Symposium on Development and Application of Semiconductor Tracking Devices The LHCb Silicon Tracker Installation
Investigation of Proton Induced Radiation Effects in 0.15 µm Antifuse FPGA
Investigation of Proton Induced Radiation Effects in 0.15 µm Antifuse FPGA Vlad-Mihai PLACINTA 1,2, Lucian Nicolae COJOCARIU 1, Florin MACIUC 1 1. Horia Hulubei National Institute for R&D in Physics and
The LHCb upgrade. Outline: Present LHCb detector and trigger LHCb upgrade main drivers Overview of the sub-detector modifications Conclusions
The LHCb upgrade Burkhard Schmidt for the LHCb Collaboration Outline: Present LHCb detector and trigger LHCb upgrade main drivers Overview of the sub-detector modifications Conclusions OT IT coverage 1.9
Modules and Front-End Electronics Developments for the ATLAS ITk Strips Upgrade
Modules and Front-End Electronics Developments for the ATLAS ITk Strips Upgrade Carlos García Argos, on behalf of the ATLAS ITk Collaboration University of Freiburg International Conference on Technology
Standard-Area Silicon PIN Photodiodes (500µm)
Standard-Area PD-LD Inc. offers a variety of standard and custom PIN Photodiodes and APDs in fiber coupled packages. The semiconductors offered are of proven manufacture and design. Our Silicon devices
Optical Interconnects: Trend and Applications
Optical Interconnects: Trend and Applications Yi-Jen Chan EOL, ITRI Wireless & Optical Communications conference 2008 April 23, 2008 OUTLINE Background and Motivation Trends of Optical Interconnects Technology
Construction of the Phase I upgrade of the CMS pixel detector
Forward Pixel Barrel Pixel TECHNOLOGY AND INSTRUMENTATION IN PARTICLE PHYSICS 2017, May 22-26, 2017 Construction of the Phase I upgrade of the CMS pixel detector Satoshi Hasegawa Fermi National Accelerator
A Configurable Radiation Tolerant Dual-Ported Static RAM macro, designed in a 0.25 µm CMOS technology for applications in the LHC environment.
A Configurable Radiation Tolerant Dual-Ported Static RAM macro, designed in a 0.25 µm CMOS technology for applications in the LHC environment. 8th Workshop on Electronics for LHC Experiments 9-13 Sept.
FCI-XXXA Large Active Area 970nm Si Monitor Photodiodes
FCI-XXXA Large Active Area 970nm Si Monitor Photodiodes FCI-020A and FCI-040A with active area sizes of 0.5mm and 1.0mm, are parts of OSI Optoelectronics s large active area IR sensitive Silicon detectors
Kotura Analysis: WDM PICs improve cost over LR4
Kotura Analysis: WDM PICs improve cost over LR4 IEEE P802.3bm - 40 Gb/s & 100 Gb/s Fiber Optic Task Force Sept 2012 Contributors: Mehdi Asghari, Kotura Samir Desai, Kotura Arlon Martin, Kotura Recall the
LHC Detector Upgrades
Su Dong SLAC Summer Institute Aug/2/2012 1 LHC is exceeding expectations in many ways Design lumi 1x10 34 Design pileup ~24 Rapid increase in luminosity Even more dramatic pileup challenge Z->µµ event
Prototyping of large structures for the Phase-II upgrade of the pixel detector of the ATLAS experiment
Prototyping of large structures for the Phase-II upgrade of the pixel detector of the ATLAS experiment Diego Alvarez Feito CERN EP-DT On Behalf of the ATLAS Collaboration 2017 IEEE NSS and MIC 26/10/2017
Validation of the front-end electronics and firmware for LHCb vertex locator.
Validation of the front-end electronics and firmware for LHCb vertex locator. Antonio Fernández Prieto Universidade de santiago de compostela, Spain E-mail: antonio.fernandez.prieto@cern.ch Pablo Vázquez
SMAFTI Package Technology Features Wide-Band and Large-Capacity Memory
SMAFTI Package Technology Features Wide-Band and Large-Capacity Memory KURITA Yoichiro, SOEJIMA Koji, KAWANO Masaya Abstract and NEC Corporation have jointly developed an ultra-compact system-in-package
Void Detection in Large Solder Joints of Integrated Power Electronics. Patrick Schuchardt Goepel electronics LLC
Void Detection in Large Solder Joints of Integrated Power Electronics Patrick Schuchardt Goepel electronics LLC What are power electronics Solid-state electronic devices which control and convert electric
Enterprise Network Test Strategies for Network Availability and Performance. A Sitaramaiah Director Fluke Networks India
Enterprise Network Test Strategies for Network Availability and Performance A Sitaramaiah Director Fluke Networks India 1 Why is Enterprise Network Testing becoming increasingly important? IT is increasingly
Epigap FAQs Part packges and form factors typical LED packages
3. packges and form factors 3.1. typical LED packages Radiation from LEDs is generated by a semiconductor chip mounted in a package. LEDs are available in a variety of designs significantly influencing
Design Status of the CERN-SRAM macrocell
Design Status of the CERN-SRAM macrocell IBM 0.25 µm User Group Meeting Imperial College, London June 2002 KLOUKINAS Kostas EP/CME-PS CERN-SRAM specifications Scalable Design Configurable Bit organization
Specifications. Flood Light TF31A Series. Honeycomb briquette burning effect and the whole structure cooling technology;
Specifications Flood Light TF31A Series Features Modular pluggable technology, Easy-tool onsite maintenance; Honeycomb briquette burning effect and the whole structure cooling technology; Ergonomic lighting
Packaging Technology of the SX-9
UMEZAWA Kazuhiko, HAMAGUCHI Hiroyuki, TAKEDA Tsutomu HOSAKA Tadao, NATORI Masaki, NAGATA Tetsuya Abstract This paper is intended to outline the packaging technology used with the SX-9. With the aim of
Silicon Planar PIN Photodiode PD70-01C/TR10
Features High sensitivity Low capacitance Short switching time Wide temperature range Small package Pb free The product itself will remain within RoHS compliant version. Descriptions The is high sensitivity,
OPERATOR MANUAL OSD381 FIBER OPTIC CCTV TRANSMITTER MODULE
OPERATOR MANUAL OSD381 FIBER OPTIC CCTV TRANSMITTER MODULE OSD381 FIBER OPTIC CCTV TRANSMITTER MODULE Document No. 10100902 PAGE 1 INDEX 1 1 TECHNICAL SUMMARY... 3 1.1 BRIEF DESCRIPTION...3 1.1.1 OVERVIEW...
Han-Brid. Contents Han-Brid Features Han-Brid Data interfaces Han-Brid Overview Han-Brid Cu
Contents Page Features... 19.02 Data interfaces... 19.03 Overview... 19.04 Cu... 19.06 F.O.... 19.08 Quintax 3 A... 19.10 RJ45 C... 19.12 USB / FireWire... 19.14 Han 4 A SC... 19.16 Hoods/Housings... 19.18
SpectraTec X. Multi- λ Laser Light Source BLUE SKY RESEARCH WAVELENGTHS
Multi- λ Laser Light Source BLUE SKY RESEARCH Up to four individual laser wavelengths One single mode PM fiber output Ultra-stable power output Compact : 165mm x 125mm x 34mm Integrated control and drive
Photon-to-Photon CMOS Imager: Opto-Electronic 3D Integration
Photon-to-Photon CMOS Imager: Opto-Electronic 3D Integration Outline Key technologies for future CMOS imagers Bottlenecks for high speed imaging Our proposal Take home message Oct 12, 2017 Photon-to-Photon
Technical Data Sheet mm Silicon PIN Photodiode
Technical Data Sheet 2.75 5.25mm Silicon PIN Photodiode Features Fast response times High photo sensitivity Small junction capacitance Pb free Descriptions is a high speed and sensitive PIN photodiode
Optical Engine? What s That?
JANUARY 28-31, 2013 SANTA CLARA CONVENTION CENTER Advances in Onboard Optical Interconnects: A New Generation of Miniature Optical Engines Marc Verdiell CTO Samtec Optical Group Samtec, Inc. 01/29/2013
CS/COE0447: Computer Organization
CS/COE0447: Computer Organization and Assembly Language Terminology and Concepts Sangyeun Cho Dept. of Computer Science Five classic components I am like a control tower I am like a pack of file folders
Electromagnetic Compatibility ( EMC )
Electromagnetic Compatibility ( EMC ) ESD Strategies in IC and System Design 8-1 Agenda ESD Design in IC Level ( ) Design Guide Lines CMOS Design Process Level Method Circuit Level Method Whole Chip Design
Cabling Infrastructure
Introduction Ethernet Banking on Structured Cabling Technology Drivers Classification of Cables Fibre-optic cable Cables in building Cabling Infrastructure Cabling systems address the networking requirements
Return Path Analog CATV Detector Modules. EPM 705 Series
Return Path Analog CATV Detector Modules EPM 705 Series www.lumentum.com Data Sheet The EPM 705 series are high quality analog photodetectors designed for return path AM CATV applications. These coaxial
Quilt Packaging For Power Electronics
Quilt Packaging For Power Electronics 21 March 2013 Jason M. Kulick President, Co-Founder Indiana Integrated Circuits, LLC Overview Introduction Quilt Packaging (QP) technology Concept Examples Advantages
THERMAL IMAGER WITH MICROBOLOMETER FOR SMARTPHONE: EVOLUTION & COMPARISON ON THE. Cliquez pour modifier le style du. titre LAST TECHNOLOGIES TRENDS
Electronic Costing & Technology Experts Power electronics MEMS & Sensors LED & Optoelectronics Advanced Packaging System THERMAL IMAGER WITH MICROBOLOMETER FOR Cliquez pour modifier le style du SMARTPHONE:
POL BMR465 Evaluation Board
User Guide POL BMR465 Evaluation Board ROA 170 64 User Guide User Guide 2 Contents 1 Introduction... 3 1.1 Prerequisites... 3 2 Reference Board ROA 170 64... 4 3 USB-PMBus adapter... 5 3.1 Connection of
APV-25 based readout electronics for the SBS front GEM Tracker
APV-25 based readout electronics for the SBS front GEM Tracker Authors: Evaristo Cisbani, Paolo Musico Date: 26/June/2014 Version: 1.0 APV-25 based readout electronics for the SBS front GEM Tracker...
TORX177(F,T) TORX177(F,T) TENTATIVE FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO INTERFACE. 1. Maximum Ratings (Ta = 25 C)
TENTATIVE FIBER OPTIC RECEIVING MODULE TORX177(F,T) FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO INTERFACE Unit: mm For JEITA Standard CP- 1212 (Digital Audio Optical Interface for Consumer Equipment).
STS Spectrometer Getting Started
STS Spectrometer Getting Started STS is a family of compact, low-cost spectrometers ideal for embedding into OEM devices. STS provides remarkable performance for a spectrometer of its size (just 40 mm
Managing the Digital Connection
Managing the Digital Connection Strategies to Build Successful Systems 09 May 2013 Biju Pillai Senior Technical Manager, Middle East Extron Electronics Analog AV Signals Composite Video Y/C VGA / RGBHV
HAMBURG INDUSTRIES CO., LTD.
SPECIFICATION OF IC CARD ACCEPTOR Model No.: ICA-616 Revision: 1.1 Issue Date: OCT. 25, 2007 HAMBURG INDUSTRIES CO., LTD. 6FL., NO.12, Lane 270, SEC. 3, Pei Shen RD., Shen Keng Hsiang, Taipei Hsien, Taiwan
Advanced CSP & Turnkey Solutions. Fumio Ohyama Tera Probe, Inc.
Advanced CSP & Turnkey Solutions Fumio Ohyama Tera Probe, Inc. Tera Probe - Corporate Overview 1. Company : Tera Probe, Inc. 2. Founded : August, 2005 3. Capital : Approx. USD118.2 million (as of March
TORX178B TORX178B FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO INTERFACE. 1. Maximum Ratings (Ta = 25 C) FIBER OPTIC RECEIVING MODULE
FIBER OPTIC RECEIVING MODULE TORX178B FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO INTERFACE Unit: mm Conforms to EIAJ Standard CP 1201 (For Digital Audio Interface including Fiber Optic inter connections).
TORX147(F,T) TORX147(F,T) FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO INTERFACE. 1. Absolute Maximum Ratings (Ta = 25 C) 2.
FIBER OPTIC RECEIVING MODULE TORX147(F,T) FIBER OPTIC RECEIVING MODULE FOR DIGITAL AUDIO INTERFACE Unit: mm For JEITA Standard CP 1212 (Digital Audio Optical Interface for Consumer Equipment). A self tapping
FIBER OPTIC TRANSMITTING MODULE TOTX147(F,T)
FIBER OPTIC TRANSMITTING MODULE TOTX147(F,T) FIBER OPTIC TRANSMITTING MODULE FOR DIGITAL AUDIO EQUIPMENT Unit: mm Conforms to JEITA Standard CP 1212 (Digital Audio Optical Interface for Consumer Equipment).
SPECIFICATION OF IC CARD ACCEPTOR. Model No.: ICA-610 Revision: 1.0 Issue Date: MAR. 09, 2006
SPECIFICATION OF IC CARD ACCEPTOR Model No.: ICA-610 Revision: 1.0 Issue Date: MAR. 09, 2006 HAMBURG INDUSTRIES CO., LTD. 6FL., No.12, Lane 270, Sec. 3, Pei Shen Rd., Shen Keng Hsiang, Taipei Hsien, Taiwan
TERALINK TM A cross-linked thermoplastic polymer for Optical Components that can withstand SMT processes
TERALINK TM A cross-linked thermoplastic polymer for Optical Components that can withstand SMT processes Sumitomo Electric Fine Polymer, Inc. Innovation Core SEI, Inc. (ICS) Sumitomo Electric Industries,
Standards Update. by Paul Kish NORDX/CDT
Standards Update by Paul Kish NORDX/CDT Standards overview Category 5e cabling new transmission parameters patch cord return loss Category 6 cabling cable choices backwards compatibility Summary Outline
Area Array Probe Card Interposer. Raphael Robertazzi IBM Research 6/4/01. 6/4/01 IBM RESEARCH Page [1]
![Area Array Probe Card Interposer. Raphael Robertazzi IBM Research 6/4/01. 6/4/01 IBM RESEARCH Page [1]](/thumbs/78/78371092.jpg "Area Array Probe Card Interposer. Raphael Robertazzi IBM Research 6/4/01. 6/4/01 IBM RESEARCH Page [1]")
Area Array Probe Card Interposer Raphael Robertazzi IBM Research 6/4/01 6/4/01 IBM RESEARCH Page [1] Motivation: Outline Probe Cards for Testing Complex ICs in the Developmental Stage. Hand Wired Space
Package (1C) Young Won Lim 3/20/13
Copyright (c) 2011-2013 Young W. Lim. Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published
Introduction. Bill Cooper LDC Meeting May 25,
The Vertex Detector in the SiD Concept Bill Cooper Fermilab (Layer 1) (Layer 5) VXD Introduction SiD is a closely integrated detector. Designs of the outer tracker and the vertex detector have been developed
CMX Hardware Status. Chip Brock, Dan Edmunds, Philippe Yuri Ermoline, Duc Bao Wojciech UBC
Hardware Status Chip Brock, Dan Edmunds, Philippe Laurens@MSU Yuri Ermoline, Duc Bao Ta @CERN Wojciech Fedorko @ UBC Michigan State University 25-Oct-2013 Outline Review of hardware project (Some) hardware
HFRD REFERENCE DESIGN High-Frequency XFP Host Board. Reference Design: (Includes Integrated RS-232 to I 2 C Conversion)
Reference Design: HFRD-18.0 Rev. 7; 11/09 REFERENCE DESIGN High-Frequency XFP Host Board (Includes Integrated RS-232 to I 2 C Conversion) Reference Design: High-Frequency XFP Host Board Table of Contents
Package (1C) Young Won Lim 3/13/13
Copyright (c) 2011-2013 Young W. Lim. Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published
VACUUM FLUORESCENT DISPLAY MODULE SPECIFICATION SPECIFICATION NO. : DS DATE OF ISSUE : Dec., 04, 1995 (00)
RoHS 2002/95/EC VACUUM FLUORESCENT DISPLAY MODULE SPECIFICATION MODEL CU20025ECPB-W1J SPECIFICATION NO. : DS-551-0000-05 DATE OF ISSUE : Dec., 04, 1995 (00) R E V I S I O N : Dec., 18, 1995 (01) : Aug.,
Ting Wu, Chi-Ying Tsui, Mounir Hamdi Hong Kong University of Science & Technology Hong Kong SAR, China
CMOS Crossbar Ting Wu, Chi-Ying Tsui, Mounir Hamdi Hong Kong University of Science & Technology Hong Kong SAR, China OUTLINE Motivations Problems of Designing Large Crossbar Our Approach - Pipelined MUX
Lecture 20: Package, Power, and I/O
Introduction to CMOS VLSI Design Lecture 20: Package, Power, and I/O David Harris Harvey Mudd College Spring 2004 1 Outline Packaging Power Distribution I/O Synchronization Slide 2 2 Packages Package functions
LEAD Fiber Optics PRODUCT CATALOGUE
LEAD Fiber Optics PRODUCT CATALOGUE FIBER OPTIC ATTENUATOR Fixed plug-in type TEL:+886-2-8672-2371 FAX:+886-2-8672-3275 Web:http://www.twfiberoptic.com Fixed plug in type Attenuator Fixed plug in fiber
SoLID GEM Detectors in US
SoLID GEM Detectors in US Kondo Gnanvo University of Virginia SoLID Collaboration Meeting @ JLab, 08/26/2016 Outline Design Optimization U-V strips readout design Large GEMs for PRad in Hall B Requirements
Optoelectronic Multi-Chip Modules Based on Imaging Fiber Bundle Structures
Optoelectronic Multi-Chip Modules Based on Imaging Fiber Bundle Structures Donald M. Chiarulli a, Steven P. Levitan b, Matt Robinson c Departments of a Computer Science and b Electrical Engineering, University
Chip Infrared LED With Right Angle Lens IR12-21C/TR8
Features Small double-end package Low forward voltage Good spectral matching to Si photo detector Pb free The product itself will remain within RoHS compliant version Compliance with EU REACH Descriptions.
VCSEL-based solderable optical modules
4th Symposium on Optical Interconnect for Data Centres VCSEL-based solderable optical modules Hideyuki Nasu FITEL Products Division Furukawa Electric Co., Ltd. H. Nasu/ FITEL Products Division, Furukawa
InfiniBand FDR 56-Gbps QSFP+ Active Optical Cable PN: WST-QS56-AOC-Cxx
Data Sheet PN: General Description WaveSplitter s Quad Small Form-Factor Pluggable Plus (QSFP+) active optical cables (AOC) are highperformance active optical cable with bi-directional signal transmission
PDINV300 Series 300 Micron InGaAs Detectors for Fiber Optics
PD-LD Inc. offers a variety of standard and custom PIN Photodiodes and APDs is fiber coupled packages. The semiconductors offered are of proven manufacture and design. Our Silicon devices cover the optical
HAMBURG INDUSTRIES CO., LTD.
SPECIFICATION OF IC CARD ACCEPTOR Model No.: ICA-703 Revision: 1.1 Issue Date: OCT. 25, 2007 HAMBURG INDUSTRIES CO., LTD. 6FL., NO.12, Lane 270, SEC. 3, Pei Shen RD., Shen Keng Hsiang, Taipei Hsien, Taiwan
Current status of SOI / MPU and ASIC development for space
The 23rd Microelectronics Workshop Current status of SOI / MPU and ASIC development for space Nov. 11 th 2010 Electronic Devices and Materials Group Aerospace Research and Development Directorate, JAXA
Silicon Based Packaging for 400/800/1600 Gb/s Optical Interconnects
Silicon Based Packaging for 400/800/1600 Gb/s Optical Interconnects The Low Cost Solution for Parallel Optical Interconnects Into the Terabit per Second Age Executive Summary White Paper PhotonX Networks
PSM4 Technology & Relative Cost Analysis Update
PSM4 Technology & Relative Cost Analysis Update Jon Anderson, Oclaro Kiyo Hiramoto, Oclaro IEEE P802.3bm TF, Phoenix, AZ, January 21-24, 2013 1 Supporters Chris Bergey, Luxtera Tom Palkert, Luxtera John
Industrial Media Converters
Wireless AP Industrial s Introduction & Features Fiber s Ethernet s Serial s s Distance Extension With Higher Immunity Introduction The media converters have incorporated SUNIX advanced technologies such
Electrical Interconnection
Electrical Interconnection Edition 208/ Rail-Mount Terminal Block Systems Full Line Catalog, Volume Edition 207/208 PCB Terminal Blocks and Connectors Full Line Catalog, Volume 2 Edition 207/208 2 Automation
Programmable Dual LDO Output Voltage and WLED Current with I 2 C Interface. Figure 1. Dual LDO Camera Supply Input Applicaiton Circuit
Programmable Dual LDO Output Voltage and W Current with I 2 C Interface 1. Introduction Bear Huang, August 2007 The RT9367A is an integrated solution for panel backlighting and phone camera application.
Interconnect Challenges in a Many Core Compute Environment. Jerry Bautista, PhD Gen Mgr, New Business Initiatives Intel, Tech and Manuf Grp
Interconnect Challenges in a Many Core Compute Environment Jerry Bautista, PhD Gen Mgr, New Business Initiatives Intel, Tech and Manuf Grp Agenda Microprocessor general trends Implications Tradeoffs Summary
Update on PRad GEMs, Readout Electronics & DAQ
Update on PRad GEMs, Readout Electronics & DAQ Kondo Gnanvo University of Virginia, Charlottesville, VA Outline PRad GEMs update Upgrade of SRS electronics Integration into JLab DAQ system Cosmic tests
GLAST. Prototype Tracker Tower Construction Status
Prototype Tracker Tower Construction Status June 22, 1999 R.P. Johnson Santa Cruz Institute for Particle Physics University of California at Santa Cruz 1 1 11 2 3 5 4 Prototype Tracker Tower Configuration
Data sheet PM PCC OpDAT patch cord LC-D/LC-D OM3 aqua, 20.0 m
Illustrations Dimensional drawing Page 1/5 See enlarged drawings at the end of document Product specification patch cord for the METZ CONNECT Patch Management System multi mode patch cord I-V(ZN)H 50/125
Lecture 12. Building an LED Display
Lecture 12 Building an LED Display Copyright 2017 by Mark Horowitz 1 By the End of Lecture, You Should Be Able To: Use LEDs in simple circuits Use time division multiplexing to control LEDs Control n 2
HPS128-LT-S Hybrid pyroelectric linear array with 128 responsive elements and integrated CMOS multiplexer
HPS128-LT-S Hybrid pyroelectric linear array with 128 responsive elements and integrated CMOS multiplexer Description The pyroelectric linear array 128-LT is a hybrid detector with 128 responsive elements
Introduction to Integrated Photonic Devices
Introduction to Integrated Photonic Devices Class: Integrated Photonic Devices Time: Wed. 1:10pm ~ 3:00pm. Fri. 10:10am ~ 11:00am Classroom: 資電 106 Lecturer: Prof. 李明昌 (Ming-Chang Lee) Block Diagram of
1250Mbps 850nm MF SFP Transceiver 550m HOLS-PG85Z-LN-CV/PG85Z-LD-CV
Features: Compliant with SFP MSA standard Compliant with IEEE 802.3z 3.3V DC power supply 850nm, VCSEL, 1250Mbps, 550m; Compliance with 10 Base-FL, 100Base-SX and 1000Base-SX Difference LVPECL inputs and
3D Integration & Packaging Challenges with through-silicon-vias (TSV)
NSF Workshop 2/02/2012 3D Integration & Packaging Challenges with through-silicon-vias (TSV) Dr John U. Knickerbocker IBM - T.J. Watson Research, New York, USA Substrate IBM Research Acknowledgements IBM