THERMAL IMAGER WITH MICROBOLOMETER FOR SMARTPHONE: EVOLUTION & COMPARISON ON THE. Cliquez pour modifier le style du. titre LAST TECHNOLOGIES TRENDS

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1 Electronic Costing & Technology Experts Power electronics MEMS & Sensors LED & Optoelectronics Advanced Packaging System THERMAL IMAGER WITH MICROBOLOMETER FOR Cliquez pour modifier le style du SMARTPHONE: EVOLUTION & COMPARISON ON THE titre LAST TECHNOLOGIES TRENDS Cliquez pour modifier le style des sous-titres du masque 1st Executive Infrared Imaging Forum, September 8 th Romain Fraux Project Manager MEMS & Advanced Packaging

2 THE REVERSE COSTING Reverse Costing is the process of disassembling a device (or a system) in order to identify its technology and calculate its manufacturing cost using in-house models and tools. Why do companies use Reverse Costing? To analyze the cost structure To identify the parameters influencing the cost To compare different technological options To estimate an average selling price To prepare a business plan for a new product 1st Executive Infrared Imaging Forum 2

3 REPORTS SOURCES 10 reports covering 5 IR cameras & 5 Microbolometers for smartphones. 1st Executive Infrared Imaging Forum 3 September 8th, 2016

4 OUTLINE IR Cameras for Smartphone Market Camera Specifications IR Cameras Teardown System Overview Lens Microbolometer Packaging Pixel Manufacturing Cost Comparison Lens Cost Microbolometer Cost IR Camera Cost 1st Executive Infrared Imaging Forum 4

5 IR Cameras for Smartphone Market Specifications 1st Executive Infrared Imaging Forum 5

6 Units THERMAL CAMERA MARKET Market forecast in shipments (units): OPTIMISTIC smartphone scenario The Uncooled Thermal Camera market is expected to exceed 11M cameras by 2021, fueled by a Smartphone market boom that will exceed 9M units. Uncooled thermal cameras market forecast in units - OPTIMISTIC SCENARIO 14,000,000 12,000,000 10,000,000 8,000,000 6,000,000 4,000,000 2,000, Source: Yole Developement 1st Executive Infrared Imaging Forum 6 CAGR Smartphones ,065 1,840,950 9,793, % Military total 79,343 84,737 91,626 98, , , , % Other commercial (UAV, EVS) 2,850 5,415 7,581 9,476 10,898 11,987 12, % Ruggedized smartphones 0 5,000 9,000 16,200 29,160 52,488 94, % Plug-in for smartphones 52,500 78,750 94, , ,871 91,684 73, % Personal Vision Systems (PVS) % Firefighting 20,802 23,922 27,511 30,262 33,288 36,617 40, % Maritime 9,818 10,604 11,452 12,368 13,357 14,426 15, % Automotive 99, , , , , , , % Surveillance total 84, , , , , , , % Thermography total 211, , , , , , , %

7 CONSUMER IR CAMERA SPECIFICATIONS FLIR One 2 nd Gen. Seek Thermal Therm-App Thermal Expert 64 x 29 x 18 mm 44 x 27 x 20 mm 55 x 65 x 40 mm 48 x 26 x 15 mm 160 x 120 pixels 206 x 156 pixels 384 x 288 pixels 384 x 288 pixels 1st Executive Infrared Imaging Forum 7

8 IR Cameras Teardown System Overview Lens Module 1st Executive Infrared Imaging Forum 8

9 FLIR ONE CAMERA TEARDOWN & LENS FLIR One 2 nd Generation Released in 2015, Market Price $250 Lepton 3 rd Generation Module Visible Camera Low Cost Silicon Wafer-Level Optics Thermal Camera + Shutter Visible Camera Wafer-level Silicon Lenses Window (Wafer-level Package) Monolithic VOx microbolometer + ROIC Battery Custom ASIC (Flip-Chip ) 1st Executive Infrared Imaging Forum 9

10 FLIR ONE CAMERA TEARDOWN & LENS Lepton 3 vs Lepton 2 Lenses: Lepton 3 still use silicon lenses, but they are much larger. Lenses are diced with and hexagonal shape in Lepton 3 in order to fit more with the round lens barrel format. Plasma dicing for Lepton 3 lenses vs mechanical saw dicing in Lepton 2 Lens in Lepton 2 Lens in Lepton 3 1st Executive Infrared Imaging Forum 10

11 SEEK THERMAL CAMERA TEARDOWN & LENS Seek Thermal Released in 2014, Market Price $250 Raytheon Microbolometer. Wafer-Level Package, Chip-on-Board integration Chalcogenide Lens Lens Module Shutter Chalcogenide Lens 1st Executive Infrared Imaging Forum 11

12 THERM-APP CAMERA TEARDOWN & LENS Therm-App Released in 2014, Market Price $1,000 ULIS Microbolometer with ceramic package High Cost Germanium Lens No shutter Lens Module Microbolometer Germanium Lens 12 Lens Module Cross-Section 1st Executive Infrared Imaging Forum

13 TERMAL EXPERT CAMERA TEARDOWN & LENS Thermal Expert Released in 2014, Market Price $820 I3system Microbolometer with ceramic package Chalcogenide Lens Lens Module Microbolometer Chalcogenide Lens 1st Executive Infrared Imaging Forum 13

14 Microbolometer Packaging Pixel 1st Executive Infrared Imaging Forum 14

15 MICROBOLOMETER PACKAGING Packaging Comparison: Package size of Raytheon in Seek Thermal is >20 times smaller compared to ULIS package featured in the Therm-App WLP for FLIR & Raytheon Ceramic Package for ULIS & i3system ULIS PICO384P Ceramic, Au/Sn solder i3system I3BOL384 Ceramic, Sn solder FLIR Lepton 3 Raytheon EXC001 WLP, Au/Sn bonding WLP, Au/Sn bonding FLIR Lepton 3 in FLIR One Gen. 2 Raytheon Sensor in Seek Thermal 15 ULIS PICO384P in Opgal Therm-App i3system I3BOL384 in Thermal Expert 1st Executive Infrared Imaging Forum

16 MICROBOLOMETER PIXEL ARRAY Sensor Dies: IR sensor die in Seek Thermal is 78% smaller than i3system die in the Thermal Expert camera. 12µm pixel for FLIR & Raytheon 17µm pixel for ULIS & i3system FLIR One 2 nd Gen. 12µm Pixel, VOx 160 x 120 pixels Seek Thermal 12µm Pixel, VOx 206 x 156 pixels Therm-App Thermal Expert 17µm Pixel, a-si 17µm Pixel, TiOx 384 x 288 pixels 384 x 288 pixels IR Sensor Die in FLIR Lepton 3 IR Sensor Die in Seek-Thermal IR Sensor Die in Opgal Therm-App IR Sensor Die in Thermal Expert 1st Executive Infrared Imaging Forum 16

17 Manufacturing Cost Comparison Lens Microbolometer 1st Executive Infrared Imaging Forum 17

18 IR CAMERA LENS COST COMPARISON Lens Cost Comparison $2 $25 $125 $50 1st Executive Infrared Imaging Forum 18

19 Wafer Cost MICROBOLOMETER COST Microbolometer Wafer Cost: The wafer cost strongly depends on the production volume. FLIR announce 10 6 production capacity for Lepton which gives ~1000 wafers (8-inch). Even with a larger sensor die, we estimate a production of ~150 wafers per years for i3system with the Thermal Expert. Avg. wafer cost value: ~$8,000 (8-inch) $6 000 $5 000 $4 000 Microbolometer $3 000 Wafer Cost ($) $2 000 $1 000 $ Production 1000 Volume (units per year) st Executive Infrared Imaging Forum

20 IR CAMERA COST IR Camera Estimated Manufacturing Cost Comparison FLIR One 2 nd Gen. Seek Thermal Therm-App Thermal Expert $50 $80 $370 $230 Small Sensor Small Sensor Large Sensor Large Sensor WLP, Silicon WLO WLP, Chalcogenide Lens Large Germanium Lens Chalcogenide Lens 1st Executive Infrared Imaging Forum 20

21 CONCLUSION Seek Thermal developed with Raytheon a very optimized microbolometer (12µm pixel, WLP), but the lens module is thick (configuration difficult to be integrated in a smartphone). Therm-App with ULIS sensor and Thermal Expert with i3system sensor chose to give advantage to performances with high resolution sensors and good optics. These choices lead to professional usage without any possibility for future smartphone integration. FLIR, with a compact core integrating WLP microbolometer and Wafer-Level Optics offers the lowest quality but is the only to propose a solution able to be integrated in a smartphone, which could lead to a very high volume production. 1st Executive Infrared Imaging Forum 21

22 CONCLUSION Caterpillar Cat S60 World s first thermal imaging smartphone. FLIR Lepton core. 1st Executive Infrared Imaging Forum 22

23 Thank You! Reverse Costing Teardown + Cost Analysis Customer Specific Catalog Costing Tools Training 1st Executive Infrared Imaging Forum 23