Optimizing Device, Packaging, Test: The Art of Fast Tracking a Design to Production

Transcription

1 Optimizing Device, Packaging, Test: The Art of Fast Tracking a Design to Production Matt Apanius MEMS Technology Symposium May 11, 2016 SMART Microsystems

2 Today s Presentation 1. Market Trends 2. Microelectronics for MEMS Sensors 3. New Product Development 4. Innovative Strategies 5. Case Study SMART Microsystems

3 New Types of Sensors The Definition of Sensor Device Evolves Classical MEMS structures Capacitive touch Biosensors-chemical Other SMART Microsystems

4 SMART Connected Products Evolution of the economy Michael Porter, Harvard Business School IT in products creates new value for the product Devices-networks-clouds The value of information will increase SMART Microsystems

5 What does this mean for us? Evolution of the economy The product hardware is one tenth of the system Microelectronic packaging is the foundational critical path SMART Microsystems

6 Microelectronics for MEMS Sensors SMART Microsystems

7 Microelectronic Packaging The Very First Connection to the Information Microelectronic packaging creates the primary interface between the sensor device, the environment, and the information it collects Components Mechanical interfaces Interconnects Device Information Environment SMART Microsystems

8 Microelectronic Packaging How Do Suppliers Support Emerging Applications Existing high volume microelectronic manufacturing processes may (or may not) support emerging sensor technologies for new niche markets 50% of market share is in consumer applications Significant growth is taking place in niche segments Who becomes the supplier? SMART Microsystems

9 Microelectronic Packaging Market Drivers for New MEMS Sensor Solutions Integration of MEMS die into existing custom package Lower cost, better performance Challenge design team had limited experience working with silicon die Wire bonding for high temperature application Process already developed for custom assembly Challenge package assembly process made wire bond surfaces un-wire bondable SMART Microsystems

10 Microelectronic Packaging Market Drivers Continued Disposable sensors for measuring chemicals in gas and liquid Chemical sensors require use of specialized materials (eg., chemical, biological) Challenge specialized materials have their own manufacturing process outside of the semiconductor supply chain Additional Challenge these materials affect the semiconductor manufacturing process SMART Microsystems

11 Microelectronic Packaging Manufacturing Processes and Supply Chain Therefore, design elements need to be evaluated in a manner so that processes can be quickly understood Design Information Process SMART Microsystems

12 New Product Development SMART Microsystems

13 New Product Development As We Know It Traditionally Design iterations are used to converge on a frozen design Preventable flaws are discovered by processing first samples This requires another design iteration Serial iterations are slow and expensive Additionally, they do not encompass the resources to properly address the process portion of the development Worst case is that manufacturing the product is not sustainable SMART Microsystems

14 New Product Development Traditional NPD Process Design and Prototype Iterations Idea?????? Concept Review Design Review 2 Design Review? Prototype test samples Life Test Process Development Process Testing Life Test Marketing has an Idea A New Product is Launched Designchanges required for product functionality Designchanges required for manufacturability Final Process changes required Process Iterations Test Iterations SMART Microsystems

15 Innovative Strategies SMART Microsystems

16 Test Early, Test Often Let s Address the Flaws in Traditional Methods Targeted testing early in the development cycle shortens the overall process It uncovers weaknesses by testing fundamental design and process assumptions Issues are addressed before finalizing the process Use low cost modular samples, instead of assembled prototypes Rapid prototyping can be used for targeted tests using SLA Learning gained can be incorporated into the design before freezing it SMART Microsystems

17 Test Early, Test Often Examples Wire bonding for high temperature application Process for maintaining wire bonding surfaces developed before freezing design 100% nugget after shear Compatible materials required for chemical sensors Test coupons used for dispense and cure tests Using samples to test chemistry interactions SMART Microsystems

18 Concurrent Engineering Superimpose Process Development with Design Create synergy between design and process engineering groups Design to consider process and process to consider design Concurrent Engineering Design Process SMART Microsystems

19 Concurrent Engineering Example Development of die position tolerances Tolerances stack equipment, fixture, part, bond site Scalable tooling can be used for initial volumes and does not have to be redesigned when volumes increase Incoming Inspect Lot SPC 100% Final Inspect (automated electrical) MRB Conveyor automation required here to support volumes and reduce labor content MRB SMART Microsystems

20 Concurrent Engineering Streamline Process with Fewer Iterations $$$$ Product Design Concept Design Review Concurrent Engineering Model Rapid Prototype test samples Life Test Marketing has an Idea Process Development A New Product is Launched "TestEarly Test Often" SMART Microsystems

21 Case Study SMART Microsystems

22 Case Study Background/Approach Device is a MEMS pressure sensor New application area not a derivative product First prototype samples to be built and tested The components are a PCB with a MEMS sense element and a housing Primary operations are adhesive dispense and assembly SMART Microsystems

23 Case Study Dispense Tests Were Conducted to Understand Adhesive Lines dispensed on coupons Develop and test cure profile Peel test for adhesion quality Use SLA parts for cure testing assemblies SMART Microsystems

24 Case Study Fit and Form was Tested using Automatic Equipment Working height was tested for tooling design Part topography check access and area of dispense locations Dispense tests were used to select needle SLA parts used to develop the programs for two operations SMART Microsystems

25 Case Study Tooling was Designed and Tested in Manufacturing Equipment Scalable tooling was designed and tested using SLA parts Operation 1 Attach PCB sense element to body Operation 2 Attach backside lid SMART Microsystems

26 Case Study A Leak Issue Observed with a Simple Test Leak testing showed incomplete cure of adhesive Developed test with thermocouple to check cure profile The issue was resolved by changing the cure profile SLA parts were used SMART Microsystems

27 Case Study Injection Molded Housings Arrive for Final Tests Initial adhesion tests showed possible issue from mold release An incoming cleaning process was developed and tested A storage protocol was implemented Every other aspect of the process was in place before the injected molded parts arrived SMART Microsystems

28 Case Study Outcomes First prototype samples were built using volume manufacturing processes These samples were designed, built, and put on test in less than 90 days Zero failures after 1000 thermal cycles! SMART Microsystems

29 Conclusions The next generation of products will use sensors and integrated IT SMART Connected Products Microelectronic interfaces will be a part of all of these products As the applications become widely varied, better methods for new product development will be needed Use a test early, test often approach integrated with concurrent engineering to get your new products to market faster and with less cost! SMART Microsystems

30 Thank You! Matt Apanius Managing Director SMART Microsystems Ltd. SMART Microsystems