A Test-Centric Approach to ASIC Development for MEMS
|
|
- Felicia Blankenship
- 6 years ago
- Views:
Transcription
1 A Test-Centric Approach to ASIC Development for MEMS MÅRTEN VRÅNES DIRECTOR, CONSULTING SERVICES CONSULTING SERVICES GROUP MEMS JOURNAL, INC. C: th Annual MTR Conference October 2012
2 Outline Introduction ASIC Development Alternative Strategies SSCs Stepwise FPGA Summary
3 Introduction Definition: ASIC for MEMS = Application Specific Integrated Circuit for Micro Electro Mechanical Systems Purpose: To convert analog sensor output to the digital real realm and often a real-world value Note: ASIC is not a standard, off-the-shelf IC Standard ICs for MEMS here referred to as Sensor Signal Conditioner (SSC)
4 ASIC/SSC Block Diagram External Sensor Source: ZMDI
5 Introduction ASIC vs. SSC ASIC SSC High Volume, >10M per year X Low to Medium Volume, < 10M per year X X Proof-of-concept, customer/investor sampling X Monolithic or wafer-level packaging X Size sensitive applications X Cost sensitive applications X Special functionality, eg. sensor fusion, proprietary algorithms X Special application, eg. packaging, harsh environments X Multiple sensor integration X Lowest NRE X Analog output/ uncompensated sensors X
6 ASIC Sourcing In-House Develop the ASIC using predominantly internal resources Full control over test Integrated Device Manufacturer (IDM) IDM supplier's ASIC product is based in large part on proprietary technology such as design tools, IP, packaging, and usually, but not necessarily the process technology IDM responsible for production test Fabless Fabless ASIC suppliers rely largely on outside suppliers for their technology Test responsibilities can vary
7 Outline Introduction ASIC Development Alternative Strategies SSCs Stepwise FPGA Summary
8 ASIC Development Custom Design Define all litho layers Tailor functionality, performance, layout and unit cost High risk and resource intensive development Examples: development cost/time, ASIC to MEMS mismatch, IP infringement issues and testability IP Block Design Use pre-existing, proven IP blocks Examples: analog sensor interface, uc, NVM, I2C/SPI Cost depending on block availability and price Existing blocks are fab dependent Testability already designed into each block
9 ASIC Development Cycle Does the ASIC fit the MEMS? Design Test Simulation Tapeout Layout
10 Does the ASIC fit the MEMS?
11 Ensuring MEMS / ASIC fit Meeting the Design Specification Design, simulation, know-how and existing IP blocks MEMS and ASIC tradeoffs Minimizing Risk Seasoned analog designers Multi-project wafer (MPW) for proof of concept Corner simulations using SPICE and Monte Carlo analysis Multifunctional design and tapeout reviews Test resources should be involved throughout the design process Strict source control Re-using existing, proven IP blocks Design for Test (DFT)
12 Design for Test Analog Circuitry Digitally controlled, analog switches enable monitoring of input and output signals to an analog block.
13 Design for Test Analog Circuitry Digitally controlled, analog switches enable with input test signal. Can be used as self-test and product testing.
14 Example ASIC Development Sensing Pressure Temperature Voltage Motion/Acceleration Control Microcontroller Firmware: State Machine Sensor Interface (ADC) and Processing Oscillators Timers Watchdog Memory RAM, ROM & EEPROM LV Sensors ASIC Inputs Sensor Inputs LF Pick-Up Coil Automatic Gain Control Command Decoder Outputs RF Transmitter 315MHz / 434MHz ASK / FSK Modulation Power Management Battery Management Low-Power Operation
15 Example ASIC Development Design, Integration & Layout Custom RF and LF fabless 3 rd party Custom multi-channel sensor interface in-house Custom analog sensor conditioning in-house Custom (size) NVM IDM Standard uc IDM Integration & layout fabless 3 rd party Layout fabless 3 rd party Test Related Issues Test coverage and testability LV Sensors TPMS Product Design optimized for power, not test. Scan and IDDQ not possible. Unproven design, very comprehensive automotive characterization scheme (-40 C to 125 C) Is it the MEMS or ASIC issues
16 ASIC Development Challenges Design & Application Increasing functionality and complexity Tiny analog signals Signal integrity and noise Integration of multiple sensors Sensor algorithms and sensor fusion Environmental factors: light, humidity, mechanical stress etc. When to tape-out? With ASICs becoming more complex, the time to market shrinking and the expected unit cost declining, how can the ASIC design be improved by testing upstream in the product development?
17 Outline Introduction ASIC Development Alternative Strategies SSCs Stepwise FPGA Summary
18 Alternative Strategies Overview Standard Use an off-the-shelf SSC Test existing MEMS Integrated product Stepwise A step-by-step approach to ASIC development Verify ASIC blocks before taping out the entire chip FPGA Leverage the programmability and versatility of FPGA NI PXI-7813R RIO FPGA Source: National Instruments
19 Alternative Strategies Standard Pros Cons Proof of concept Cost, cost and cost Rapid prototyping Customer and investor samples MEMS characterization Performance benchmarking Tested and proven development platform Feature and functionality limitations Overkill Limited programmability Predefined calibration algorithms Unpredictable availability Use as basis for custom ASIC Fixed layout and form factor Launch into a standalone product High-volume limitations
20 Alternative Strategies Standard Development Platform Hardware Main Development Board Daughter / Plug-In Boards Satellite Boards Software Application Development Software Firmware Calibration Software (eg. DLL) Source: ACAM
21 Alternative Strategies Standard R&D Test Engineering Test DLL Production Test
22 Alternative Strategies Standard Supplier Provided Calibration DLL Seamless integration with SSC Implemented in firmware, dedicated circuitry, ROM or other Linking R&D, Engineering and Production testing DLL with calibration algorithm Can be used from a range of programming languages Eg. C, C++, VB, NI LabView, NI LabWindows/CVI Test Data, Ref. Data Scaling Factors etc. INPUTS Supplier Provided Calibration DLL Calibration Coefficients, Calibration Fit, Errors etc. OUTPUTS
23 Example Calibration DLL 1. Configure NVM Calibration Algorithm Output Sensor Resolution Clear Calibration Coefficients 1 2. Collect sensor and reference measurement data 2 3. Scale measurement data 3 Source: ZMDI
24 Example Calibration DLL 4. Set calibration mask 4 5. Call calibration function - Inputs: - # data points - Calibration coefficients - Raw sensor data (scaled) - Ref. data (scaled) - Output - Calculated calibration coefficients - Error code 6. Write calibration coefficients to EEPROM 5 6 Source: ZMDI
25 Standard SSC Example 1 ZMDI s ZSSC3026 Low Power 16 Bit Sensor Signal Conditioner IC Integrated 18-bit calibration math DSP Fully corrected signal at digital output Minimize calibration costs through the one-pass calibration concept No external trimming components required Highly integrated CMOS design Excellent for low-voltage and low-power battery applications Source: ZMDI
26 Standard SSC Example 1 How to use? Test samples MEMS + SSC Digital raw counts Test operating range Multiple temperatures, voltages etc. Plug data into development SW Click and choose calibration algorithms/coefficients Optimize calibration points Evaluate calibration fit and error, calculated automatically by dev. SW Calibrate samples and verify real measurement errors Source: ZMDI
27 Standard SSC Example 2 Si-Ware s Development platform for capacitive MEMS accelerometers and gyros. Integrated SSC, SWS1110 Key Features 1X gyro or accel. interface High-res ADC Gyro drive actuation loop High voltage actuation option Temperature compensation Source: Si-Ware
28 Standard SSC Example 2 How to use? Custom sensor boards plug directly into the main development board. Sensor board can be used as standalone unit for testing on shaker, rate table or other fixture. Source: Si-Ware
29 Alternative Strategies Stepwise Analog Sensor Front-End Design Analog to digital converter (ADC) OPAMPs Comparators CIC Filter Temperature sensor Bandgap references Switches Filters Clock Scheme Source: National Instruments
30 Alternative Strategies Stepwise Analog Sensor Front-End Tapeout Multi-project wafer shuttle (MPW) Analog Sensor Front-End Test High pin count package with test pins available Analog measurements Noise, resolution, range Use known passives Digital simulation/emulation FPGA test setup Real measurements Algorithm development Application testing Source: E2V
31 Alternative Strategies Stepwise FPGA Test Setup Develop and simulate digital circuitry MEMS Front End FPGA Connectors Connectors for power, USB programmer, PC etc.
32 MEMS & FPGA Field Programmable Gate Arrays (FPGAs) are programmable semiconductor devices that are based on a matrix configuration with configurable interconnects. SRAM based FPGAs can be programmed and reprogrammed many times Perfect match for MEMS product development Main Advantages Use of hardware based timing Simulate ASIC design Develop and test sensor algorithms Connect to and test individual ASIC blocks Aid ASIC design for testability Source: Xilinx
33 Alternative Strategies FPGA Factory-integrate analog front-end with an FPGA Ideal for new product development & testing Solution for early ramp-up production, <1M Requires: Partnering with an FPGA provider Xilinx Alterra Lattice or the release of a MEMS FPGA development platform Source: Altera
34 Alternative Strategies FPGA Endless Possibilities Low-cost versions Integrated products Low-volume production ramp-up Value-added versions Product development Multi-sensor input Proof of concept Investor / customer samples Engineering samples Software Development Platform FPGA Analog Front End MEMS Sensors
35 Alternative Strategies FPGA Development Platform Example FPGA with multiple analog input channels Resistive interface Wheatstone bridge Voltage/current driven Capacitance interface Gain/offset based interface Ratiometric based interface Single-ended sensors Differential sensors Use for a multitude of sensors Sensor integration / fusion Develop ASIC for high-volume applications Source: Si-Ware
36 Outline Introduction ASIC Development Alternative Strategies SSCs Stepwise FPGA Summary
37 Summary Limitations with typical ASIC development projects have been presented with a particular focus on test. Three distinct strategies have been discussed as alternatives to: Test upstream in the product development cycle Leverage existing market offerings & technology Minimize product development risk Speed up time to market
38 Consulting Services Strategic Marketing Developed branding and strategic marketing presentations for industry-leading ASIC and SSCs solutions. Competitive Analysis Evaluation and industry benchmarking of sensor interface ASIC devices. Industry analysis Developed detailed production test requirements analysis for a major multinational contactor solutions company. Whitepapers & Marketing Reports Reports on MEMS testing Whitepapers for leading ASIC and SSCs Whitepapers for MEMS processing
39 Contact Information Mårten Vrånes Director, MEMS Testing and Reliability Consulting Services Group MEMS Journal, Inc. C:
High Performance Mixed-Signal Solutions from Aeroflex
High Performance Mixed-Signal Solutions from Aeroflex We Connect the REAL World to the Digital World Solution-Minded Performance-Driven Customer-Focused Aeroflex (NASDAQ:ARXX) Corporate Overview Diversified
More informationl Some materials from various sources! Soma 1! l Apply a signal, measure output, compare l 32-bit adder test example:!
Acknowledgements! Introduction and Overview! Mani Soma! l Some materials from various sources! n Dr. Phil Nigh, IBM! n Principles of Testing Electronic Systems by S. Mourad and Y. Zorian! n Essentials
More informationMixed-Signal. From ICs to Systems. Mixed-Signal solutions from Aeroflex Colorado Springs. Standard products. Custom ASICs. Mixed-Signal modules
A passion for performance. Mixed-Signal solutions from Aeroflex Colorado Springs Standard products Custom ASICs Mixed-Signal modules Circuit card assemblies Mixed-Signal From ICs to Systems RadHard ASICs
More informationDigital Integrated Circuits
Digital Integrated Circuits Lecture 9 Jaeyong Chung Robust Systems Laboratory Incheon National University DIGITAL DESIGN FLOW Chung EPC6055 2 FPGA vs. ASIC FPGA (A programmable Logic Device) Faster time-to-market
More informationFunctional Testing of Electric Vehicle Battery Management Systems (BMS) using a PXI Platform Grant Gothing Project Engineer Bloomy Controls U.S.A.
Functional Testing of Electric Vehicle Battery Management Systems (BMS) using a PXI Platform Grant Gothing Project Engineer Bloomy Controls U.S.A. The Challenge: Design and develop a flexible and cost-effective
More informationECE 480 Team 5 Introduction to MAVRK module
ECE 480 Team 5 Introduction to MAVRK module Team Members Jordan Bennett Kyle Schultz Min Jae Lee Kevin Yeh Definition of MAVRK Component of MAVRK starter Kit Component of umavrk Module design procedure
More informationChapter 5: ASICs Vs. PLDs
Chapter 5: ASICs Vs. PLDs 5.1 Introduction A general definition of the term Application Specific Integrated Circuit (ASIC) is virtually every type of chip that is designed to perform a dedicated task.
More informationOPERATIONAL UP TO. 300 c. Microcontrollers Memories Logic
OPERATIONAL UP TO 300 c Microcontrollers Memories Logic Whether You Need an ASIC, Mixed Signal, Processor, or Peripheral, Tekmos is Your Source for High Temperature Electronics Using either a bulk silicon
More informationEnabling Intelligent Digital Power IC Solutions with Anti-Fuse-Based 1T-OTP
Enabling Intelligent Digital Power IC Solutions with Anti-Fuse-Based 1T-OTP Jim Lipman, Sidense David New, Powervation 1 THE NEED FOR POWER MANAGEMENT SOLUTIONS WITH OTP MEMORY As electronic systems gain
More informationDesign Solutions in Foundry Environment. by Michael Rubin Agilent Technologies
Design Solutions in Foundry Environment by Michael Rubin Agilent Technologies Presenter: Michael Rubin RFIC Engineer, R&D, Agilent Technologies former EDA Engineering Manager Agilent assignee at Chartered
More informationChallenges for Non Volatile Memory (NVM) for Automotive High Temperature Operating Conditions Alexander Muffler
Challenges for Non Volatile Memory (NVM) for Automotive High Temperature Operating Conditions Alexander Muffler Product Marketing Manager Automotive, X-FAB Outline Introduction NVM Technology & Design
More informationFPGA for Dummies. Introduc)on to Programmable Logic
FPGA for Dummies Introduc)on to Programmable Logic FPGA for Dummies Historical introduc)on, where we come from; FPGA Architecture: Ø basic blocks (Logic, FFs, wires and IOs); Ø addi)onal elements; FPGA
More informationEE434 ASIC & Digital Systems Testing
EE434 ASIC & Digital Systems Testing Spring 2015 Dae Hyun Kim daehyun@eecs.wsu.edu 1 Introduction VLSI realization process Verification and test Ideal and real tests Costs of testing Roles of testing A
More informationeasic Technology & Nextreme Architecture
easic Technology & Nextreme Architecture Tomer Kabakov Director of Sales tomer@easic.com Tel: 054-4304032 1 easic at a Glance Fabless Semiconductor Company Provider of Structured ASIC Products Founded
More informationSimplify System Complexity
1 2 Simplify System Complexity With the new high-performance CompactRIO controller Arun Veeramani Senior Program Manager National Instruments NI CompactRIO The Worlds Only Software Designed Controller
More informationS2C K7 Prodigy Logic Module Series
S2C K7 Prodigy Logic Module Series Low-Cost Fifth Generation Rapid FPGA-based Prototyping Hardware The S2C K7 Prodigy Logic Module is equipped with one Xilinx Kintex-7 XC7K410T or XC7K325T FPGA device
More informationAMS 5812 OEM pressure sensor with an analog and digital output
Digital signal conditioning is becoming increasingly common in sensor technology. However, some sensor system states can be monitored more easily using analog values. For redundancy and system safety reasons
More informationDesign Methodologies. Full-Custom Design
Design Methodologies Design styles Full-custom design Standard-cell design Programmable logic Gate arrays and field-programmable gate arrays (FPGAs) Sea of gates System-on-a-chip (embedded cores) Design
More informationPresenter Name. Larry Morrell Title or job function. Vice President/GM IP Products
Presenter Name Larry Morrell Title or job function Vice President/GM IP Products AEON Nonvolatile Memory IP Tier 1 customers AEON units shipped 3 6 17 30 11B 1.1B 700M 300M 70M 2005 2006 2007 2008 0.25
More informationSECTION 1 INTRODUCTION. Walt Kester
SECTION 1 INTRODUCTION Walt Kester This book deals with sensors and associated signal conditioning circuits. The topic is broad, but the focus of this book is to concentrate on circuit and signal processing
More informationAddressable Test Chip Technology for IC Design and Manufacturing. Dr. David Ouyang CEO, Semitronix Corporation Professor, Zhejiang University 2014/03
Addressable Test Chip Technology for IC Design and Manufacturing Dr. David Ouyang CEO, Semitronix Corporation Professor, Zhejiang University 2014/03 IC Design & Manufacturing Trends Both logic and memory
More informationWaferBoard Rapid Prototyping
WaferBoard Rapid Prototyping WaferBoard (cover not shown) 1. Select components that are packaged in ball grid array, QFP, TSOP, etc. 2. Place the packaged components FPGAs, ASICs, processors, memories,
More informationPressure Sensor ICs. Motor Controller / Fan Driver ICs. DACOM West GmbH.
Hall Effect Sensor ICs About Melexis Melexis creates, manufactures and delivers advanced Mixed-Signal semiconductors for automotive, industrial and consumer applications. Melexis offers a wide range of
More informationAnalog ASICs in industrial applications
Analog ASICs in industrial applications Customised IC solutions for sensor interface applications in industrial electronics the requirements and the possibilities Synopsis Industrial electronics creates
More informationDG0723 Demo Guide SmartFusion2 Imaging and Video Kit MIPI CSI-2
DG0723 Demo Guide SmartFusion2 Imaging and Video Kit MIPI CSI-2 Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100
More informationIntroduction to LabVIEW and NI Hardware Platform
Introduction to LabVIEW and NI Hardware Platform Corrie Botha Platform-Based Approach 2 With LabVIEW, You Can Program the Way You Think 3 With LabVIEW, You Can Program the Way You Think The graphical,
More informationCrystal Technology, Inc.
Crystal Technology, Inc. Octal Channel AOTF Controller Integration Guide Revision 1.1 2010/08/10 Document #60-00108-01 Reproduction of the contents of this document without the permission of Crystal Technology,
More informationFPGA design with National Instuments
FPGA design with National Instuments Rémi DA SILVA Systems Engineer - Embedded and Data Acquisition Systems - MED Region ni.com The NI Approach to Flexible Hardware Processor Real-time OS Application software
More informationSimplify System Complexity
Simplify System Complexity With the new high-performance CompactRIO controller Fanie Coetzer Field Sales Engineer Northern South Africa 2 3 New control system CompactPCI MMI/Sequencing/Logging FieldPoint
More informationCMOSETR Session C1, July 7 (Macroelectronics)
Universal Flexible Hybrid System Development Kit including MCU, ADC and RFIC Prepared for: CMOSETR Session C1, July 7 (Macroelectronics) Doug Hackler President & CEO doughackler@americansemi.com 208 336-2773
More information3 PHASE FAULT ANALYSIS WITH AUTO RESET FOR TEMPORARY FAULT AND TRIP FOR PREMANENT
e-issn 2455 1392 Volume 3 Issue 4, April 2017 pp. 80 84 Scientific Journal Impact Factor : 3.468 http://www.ijcter.com 3 PHASE FAULT ANALYSIS WITH AUTO RESET FOR TEMPORARY FAULT AND TRIP FOR PREMANENT
More informationArchitecture of an efficient MEMS final test system Dr. Martin Brucke, SPEKTRA Dresden
Architecture of an efficient MEMS final test system Dr. Martin Brucke, SPEKTRA Dresden Architecture of an efficient MEMS final test system Outline Introduction of SPEKTRA What are typical Measurement tasks
More informationenvm in Automotive Modules MINATEC Workshop Grenoble, June 21, 2010 May Marco 28, 2009 OLIVO, ST Automotive Group
envm in Automotive Modules MINATEC Workshop Grenoble, June 21, 2010 May Marco 28, 2009 OLIVO, ST Automotive Group envm in automotive: Outline marketing requirements
More informationSolving Today s Interface Challenge With Ultra-Low-Density FPGA Bridging Solutions
Solving Today s Interface Challenges With Ultra-Low- Density FPGA Bridging Solutions August 2013 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: (503) 268-8000 www.latticesemi.com
More informationCPE/EE 422/522. Introduction to Xilinx Virtex Field-Programmable Gate Arrays Devices. Dr. Rhonda Kay Gaede UAH. Outline
CPE/EE 422/522 Introduction to Xilinx Virtex Field-Programmable Gate Arrays Devices Dr. Rhonda Kay Gaede UAH Outline Introduction Field-Programmable Gate Arrays Virtex Virtex-E, Virtex-II, and Virtex-II
More informationImplementing the Top Five Control-Path Applications with Low-Cost, Low-Power CPLDs
Implementing the Top Five Control-Path Applications with Low-Cost, Low-Power CPLDs WP-01146-1.2 White Paper Since their introduction in the mid-1980s and across all end markets, CPLDs have been design
More informationUsing ASIC circuits. What is ASIC. ASIC examples ASIC types and selection ASIC costs ASIC purchasing Trends in IC technologies
Using ASIC circuits What is this machine? ASIC examples ASIC types and selection ASIC ASIC purchasing Trends in IC technologies 9.3.2004 Turo Piila 1 9.3.2004 Turo Piila 2 What is ASIC Floorplan and layout
More informationBetrouwbare Elektronica ontwerpen en Produceren
Betrouwbare Elektronica ontwerpen en Produceren Verbeter betrouwbaarheid, time to market en winstgevendheid met boundary scan JTAG Technologies B.V. Rik Doorneweert rik@jtag.com Boundary scan Testing HW
More informationWhite Paper. The Case for Developing Custom Analog. Custom analog SoCs - real option for more product managers.
The Case for Developing Custom Analog Custom analog SoCs - real option for more product managers. White Paper The contents of this document are owned or controlled by S3 Group and are protected under applicable
More informationSolving Integration Challenges for Printed and Flexible Hybrid Electronics
Solving Integration Challenges for Printed and Flexible Hybrid Electronics SEMICON West 16 July 2015 Proprietary Information www.americansemi.com What are Flexible Hybrid Electronics 2 Flexible Hybrid
More informationCollaborate to Innovate FinFET Design Ecosystem Challenges and Solutions
2013 TSMC, Ltd Collaborate to Innovate FinFET Design Ecosystem Challenges and Solutions 2 Agenda Lifestyle Trends Drive Product Requirements Concurrent Technology and Design Development FinFET Design Challenges
More informationIC Testing and Development in Semiconductor Area
IC Testing and Development in Semiconductor Area Prepare by Lee Zhang, 2004 Outline 1. Electronic Industry Development 2. Semiconductor Industry Development 4Electronic Industry Development Electronic
More informationDesignWare IP for IoT SoC Designs
DesignWare IP for IoT SoC Designs The Internet of Things (IoT) is connecting billions of intelligent things at our fingertips. The ability to sense countless amounts of information that communicates to
More informationIMU Axis Gyro Evaluation Board Application Note
IMU-3000 3-Axis Gyro Evaluation Board Application Note A printed copy of this document is NOT UNDER REVISION CONTROL unless it is dated and stamped in red ink as, REVISION CONTROLLED COPY. InvenSense,
More informationCompany Overview March 12, Company Overview. Tuesday, October 03, 2017
Company Overview Tuesday, October 03, 2017 HISTORY 1987 2001 2008 2016 Company started to design and manufacture low-cost, highperformance IC packages. Focus on using advanced organic substrates to reduce
More informationWireless Infrastructure Solutions to Enhance the Digital Media Experience
WIRELESS INFRASTRUCTURE SOLUTIONS Wireless Infrastructure Solutions to Enhance the Digital Media Experience IDT ADDRESSES NEXT GENERATION WIRELESS BY ACCELERATING THE DATA PATH AND OFFLOADING FUNDAMENTAL
More informationTeledyne Imaging Sensors SIDECAR ASIC Development Kit & Focal Plane Electronics
Teledyne Imaging Sensors SIDECAR ASIC Development Kit & Focal Plane Electronics The SIDECAR ASIC is designed to manage all aspects of imaging array operation and output digitization. SIDECAR ASIC Hardware:
More informationMelon S3 FPGA Development Board Product Datasheet
Melon S3 FPGA Development Board Product Datasheet The Melon S3 FPGA is open-source, expandable development board perfect for the learning digital circuit design and prototyping of your unique ideas. You
More informationAgilent Strain Measurement Application Using Agilent U2300A Series Data Acquisition Devices With Agilent VEE Pro. Application Note
Agilent Strain Measurement Application Using Agilent U2300A Series Data Acquisition Devices With Agilent VEE Pro Application Note Introduction This application note is designed for users who wish to test
More informationRad-Hard Microcontroller For Space Applications
The most important thing we build is trust ADVANCED ELECTRONIC SOLUTIONS AVIATION SERVICES COMMUNICATIONS AND CONNECTIVITY MISSION SYSTEMS Rad-Hard Microcontroller For Space Applications Fredrik Johansson
More informationMPU-6000/MPU Axis Evaluation Board User Guide
MPU-6000/MPU-6050 9-Axis Evaluation Board User Guide InvenSense, Inc., 1197 Borregas Ave., Sunnyvale, Ca 94089, USA 1 AN-MPU-6000EVB-00 Table of Contents 1. REVISION HISTORY... 3 2. PURPOSE... 4 2.1 USAGE...
More informationMULTI PURPOSE SECURITY SYSTEM USING GSM
International Journal of Scientific & Engineering Research, Volume 3, Issue 10, October-2012 1 MULTI PURPOSE SECURITY SYSTEM USING GSM Manjula B.M Madhu Patil,Prasanna Paga,Naina Karkal Department of Electronics
More informationFinal Presentation P14452
Final Presentation P14452 Overview MSDI Review Customer Needs Requirements Functional Decomposition Concept Selection Detailed Design MSDII Detailed Design Revisited Build Test Reflect What Remains Lessons
More informationPXI Tsunami in Semiconductor ATE Michael Dewey Geotest Marvin Test Systems Silicon Valley Test Conference
PXI Tsunami in Semiconductor ATE Michael Dewey Geotest Marvin Test Systems miked@geotestinc.com Silicon Valley Test Conference 2012 1 Agenda Geotest background Semiconductor market and trends PXI for semiconductor
More informationPXI Digital Pattern Instruments
Have a question? Contact Us. PRODUCT FLYER PXI Digital Pattern Instruments CONTENTS PXI Digital Pattern Instruments Detailed View of PXIe-6570 Digital Pattern Instrument Key Features NI-Digital Pattern
More informationMEMS Sensors for Industrial Automation: Megatrends and Sourcing Options Charles Chung, Ph.D. February, 2017
MEMS Sensors for Industrial Automation: Megatrends and Sourcing Options Charles Chung, Ph.D. February, 2017 Overview About AMFitzgerald What are MEMS? Industrial Applications Technical & Business Macrotrends
More informationVLSI Test Technology and Reliability (ET4076)
VLSI Test Technology and Reliability (ET4076) Lecture 8(2) I DDQ Current Testing (Chapter 13) Said Hamdioui Computer Engineering Lab Delft University of Technology 2009-2010 1 Learning aims Describe the
More informationInternet users are continuing to demand
Tutorial Digital Modems Xilinx at Work in Digital Modems How Xilinx high-volume programmable devices can be used to implement complex system-level glue logic. by Robert Bielby, Strategic Applications,
More informationDFT-3D: What it means to Design For 3DIC Test? Sanjiv Taneja Vice President, R&D Silicon Realization Group
I N V E N T I V E DFT-3D: What it means to Design For 3DIC Test? Sanjiv Taneja Vice President, R&D Silicon Realization Group Moore s Law & More : Tall And Thin More than Moore: Diversification Moore s
More informationUNIT 4 INTEGRATED CIRCUIT DESIGN METHODOLOGY E5163
UNIT 4 INTEGRATED CIRCUIT DESIGN METHODOLOGY E5163 LEARNING OUTCOMES 4.1 DESIGN METHODOLOGY By the end of this unit, student should be able to: 1. Explain the design methodology for integrated circuit.
More informationCHAPTER 1 INTRODUCTION
CHAPTER 1 INTRODUCTION Rapid advances in integrated circuit technology have made it possible to fabricate digital circuits with large number of devices on a single chip. The advantages of integrated circuits
More informationTEXAS INSTRUMENTS ANALOG UNIVERSITY PROGRAM DESIGN CONTEST MIXED SIGNAL TEST INTERFACE CHRISTOPHER EDMONDS, DANIEL KEESE, RICHARD PRZYBYLA SCHOOL OF
TEXASINSTRUMENTSANALOGUNIVERSITYPROGRAMDESIGNCONTEST MIXED SIGNALTESTINTERFACE CHRISTOPHEREDMONDS,DANIELKEESE,RICHARDPRZYBYLA SCHOOLOFELECTRICALENGINEERINGANDCOMPUTERSCIENCE OREGONSTATEUNIVERSITY I. PROJECT
More informationGroup 10 Programmable Sensor Output Simulator Progress Report #2
Department of Electrical Engineering University of Victoria ELEC 499 Design Project Group 10 Programmable Sensor Output Simulator Progress Report #2 March 5, 2005 Submitted by: Group No.: 10 Team: Exfour
More informationAdvances in Flexible Hybrid Electronics Reliability
Advances in Flexible Hybrid Electronics Reliability LOPEC Smart & Hybrid Systems Munich 3/29/17 This work sponsored in part by Air Force Research Laboratory, Wright-Patterson AFB, for supporting reliability
More informationApproximately half the power consumption of earlier Renesas Technology products and multiple functions in a 14-pin package
Renesas Technology to Release R8C/Mx Series of Flash MCUs with Power Consumption Among the Lowest in the Industry and Powerful On-Chip Peripheral Functions Approximately half the power consumption of earlier
More informationNew Embedded NVM architectures
New Embedded NVM architectures for Secure & Low Power Microcontrollers Jean DEVIN, Bruno LECONTE Microcontrollers, Memories & Smartcard Group STMicroelectronics 11 th LETI Annual review, June 24th, 2009
More informationAccelerometer with Analog and Digital I/O for StackableUSB USB1600
The USB1600 accelerometer module provides the ideal mix of sensing ranges, resolutions, and sampling rates for rugged, compact embedded systems. The module stacks directly onto any StackableUSB Host computer
More informationTrends in Prototyping Systems. ni logic Pvt. Ltd., Pune, India
Trends in Prototyping Systems ni logic Pvt. Ltd., Pune, India Focus of design dept. Electronic system & Flow Design problems Educating design Prototype USDP Features Applications Conclusion Agenda Faster
More informationLecture 2 VLSI Testing Process and Equipment
Lecture 2 VLSI Testing Process and Equipment Motivation Types of Testing Test Specifications and Plan Test Programming Test Data Analysis Automatic Test Equipment Parametric Testing Summary VLSI Test:
More informationMEMS & Advanced Analog
MEMS & Advanced Analog Benedetto Vigna General Manager, MEMS, Sensors and High-Performance Analog Division MicroElectroMechanical Systems (MEMS) MEMS take advantage of the electrical and mechanical properties
More information0.1 Slow Monitoring and Recording System
0.1 Slow Monitoring and Recording System A slow monitoring and control system is required to control systematic effects that could impact the experiment, to allow automated scans of parameters such as
More informationElectronic Control systems are also: Members of the Mechatronic Systems. Control System Implementation. Printed Circuit Boards (PCBs) - #1
Control System Implementation Hardware implementation Electronic Control systems are also: Members of the Mechatronic Systems Concurrent design (Top-down approach?) Mechanic compatibility Solve the actual
More informationImproving Prototype Validation with NI Multisim and LabVIEW. Bhavesh Mistry, Product Manager National Instruments
Improving Prototype Validation with NI Multisim and LabVIEW Bhavesh Mistry, Product Manager National Instruments bhavesh.mistry@ni.com 1 Modern Design Having to Do More Time to market continues to shrink
More informationEECS150 - Digital Design Lecture 6 - Field Programmable Gate Arrays (FPGAs)
EECS150 - Digital Design Lecture 6 - Field Programmable Gate Arrays (FPGAs) September 12, 2002 John Wawrzynek Fall 2002 EECS150 - Lec06-FPGA Page 1 Outline What are FPGAs? Why use FPGAs (a short history
More informationAli Karimpour Associate Professor Ferdowsi University of Mashhad
AUTOMATIC CONTROL SYSTEMS Ali Karimpour Associate Professor Ferdowsi University of Mashhad Main reference: Christopher T. Kilian, (2001), Modern Control Technology: Components and Systems Publisher: Delmar
More informationGAUSS OBC ABACUS 2017
[] Table of contents Table of contents... 1 1. Introduction... 3 1.1. ABACUS Features... 3 1.2. Block Diagram... 6 2. Pinouts... 7 3. Inertial Measurement Unit Details... 10 3.1. Orientation of Axes...
More informationDigitization of non-volatility Jean-Pascal BOST, CEO
D a t a - e f f i c i e n t w o r l d Digitization of non-volatility Jean-Pascal BOST, CEO www.evaderis.com Lab spin-off Incorporated 2014 17 people IP Fabless Non volatile Semiconductor IP emram erram
More informationEmbedded Applications. COMP595EA Lecture03 Hardware Architecture
Embedded Applications COMP595EA Lecture03 Hardware Architecture Microcontroller vs Microprocessor Microprocessor is a term used to describe all programmed computational devices. Microcontroller is a term
More informationSynopsys Design Platform
Synopsys Design Platform Silicon Proven for FDSOI Swami Venkat, Senior Director, Marketing, Design Group September 26, 2017 2017 Synopsys, Inc. 1 Synopsys: Silicon to Software Software Application security
More informationKITRONYX KITRONYX. Kironyx, Inc. FORCE PRESSURE TOUCH SOLUTION PROVIDER. Force & Touch Solution
www.kitronyx.com KITRONYX FORCE PRESSURE TOUCH SOLUTION PROVIDER Kironyx, Inc. www.kitronyx.com 1310, Teheran-ro 313, Gangnam-gu, Seoul, Korea contact@kitronyx.com T: +82-70-7847-9778 F: +82-2-2179-9625
More informationOutline. EECS150 - Digital Design Lecture 6 - Field Programmable Gate Arrays (FPGAs) FPGA Overview. Why FPGAs?
EECS150 - Digital Design Lecture 6 - Field Programmable Gate Arrays (FPGAs) September 12, 2002 John Wawrzynek Outline What are FPGAs? Why use FPGAs (a short history lesson). FPGA variations Internal logic
More informationAchieve Easy Plug & Play 1/ 6
Achieve Easy Plug & Play 1/ 6 2/ 6 Master Control Unit Temp. Control Unit 20V Heater UART /USB Temp. Controller Sensor ED Control Unit ED Driver Red ED White ED Fan Control Unit FAN Driver FAN Communication
More informationMPXHZ6130A, 15 to 130 kpa, Absolute, Integrated Pressure Sensor
Freescale Semiconductor Document Number: Data Sheet: Technical Data Rev. 1.2, 06/2015, 15 to 130 kpa, Absolute, Integrated Pressure Sensor The series sensor integrates on-chip, bipolar op amp circuitry
More informationDigital Control for Space Power Management Devices
Template reference : 100182079N-EN Digital Control for Space Power Management Devices Work conducted under ESA Contract nr.21826/08/nl/lvh DIGITAL POWER CONTROL Management of power devices via digital
More informationIncorporating a Capacitive Touch Interface into Your Design
Incorporating a Capacitive Touch Interface into Your Design Renesas Electronics America Inc. Renesas Technology & Solution Portfolio 2 Microcontroller and Microprocessor Line-up 2010 2012 32-bit 8/16-bit
More informationUniversal Data Logger System for Environmental Monitoring Applications
Indonesian Journal of Electrical Engineering and Informatics (IJEEI) Vol. 5, No. 2, June 2017, pp. 131~136 ISSN: 2089-3272, DOI: 10.11591/ijeei.v5i2.289 131 Universal Data Logger System for Environmental
More informationNetwork on Chip round table European Space Agency, ESTEC Noordwijk / The Netherlands 17 th and 18 th of September 2009
Network on Chip round table European Space Agency, ESTEC Noordwijk / The Netherlands 17 th and 18 th of September 2009 Ph. Armbruster Head of Data Systems Division European Space Agency - ESTEC 17 th of
More informationCMPE 415 Programmable Logic Devices Introduction
Department of Computer Science and Electrical Engineering CMPE 415 Programmable Logic Devices Introduction Prof. Ryan Robucci What are FPGAs? Field programmable Gate Array Typically re programmable as
More informationControl System Implementation
Control System Implementation Hardware implementation Electronic Control systems are also: Members of the Mechatronic Systems Concurrent design (Top-down approach?) Mechanic compatibility Solve the actual
More informationApplication note Differential Pressure Sensor Type D6F-PH (Rev 1.0)
Application note Differential Pressure Sensor Type D6F-PH (Rev 1.0) Introduction This document provides application information for the thermal flow sensor. This is preliminary and may be changed without
More informationEvaluation Board for the AD Bit, Low Power Sigma-Delta ADC (3 Channels) EVAL-AD7798
Evaluation Board for the AD7798 16-Bit, Low Power Sigma-Delta ADC (3 Channels) EVAL-AD7798 FEATURES Full-featured evaluation board for the AD7798 Standalone USB interface Various linking options PC software
More informationOverview of Microcontroller and Embedded Systems
UNIT-III Overview of Microcontroller and Embedded Systems Embedded Hardware and Various Building Blocks: The basic hardware components of an embedded system shown in a block diagram in below figure. These
More informationUnlocking the Potential of Your Microcontroller
Unlocking the Potential of Your Microcontroller Ethan Wu Storming Robots, Branchburg NJ, USA Abstract. Many useful hardware features of advanced microcontrollers are often not utilized to their fullest
More informationBattery Stack Management Makes another Leap Forward
Battery Stack Management Makes another Leap Forward By Greg Zimmer Sr. Product Marketing Engineer, Signal Conditioning Products Linear Technology Corp. Any doubts about the viability of electric vehicles
More informationTIRIAS RESEARCH. Lowering Barriers to Entry for ASICs. Why ASICs? Silicon Business Models
Technology industry Reporting Insights Advisory Services Whitepaper by TIRIAS Research June 20, 2017 There has never been a better time to build your own custom application specific integrated circuit
More informationMS BA Micro Barometric Module
MS5605-02A Micro arometric Module High resolution module, 20cm Fast conversion down to ms Low power, µa (standby < 0.5 µa) QFN package 5.0 x 3.0 x.6 mm 3 Supply voltage.8 to 3.6 V Integrated digital pressure
More informationHow to validate your FPGA design using realworld
How to validate your FPGA design using realworld stimuli Daniel Clapham National Instruments ni.com Agenda Typical FPGA Design NIs approach to FPGA Brief intro into platform based approach RIO architecture
More informationEMBEDDED VISION AND 3D SENSORS: WHAT IT MEANS TO BE SMART
EMBEDDED VISION AND 3D SENSORS: WHAT IT MEANS TO BE SMART INTRODUCTION Adding embedded processing to simple sensors can make them smart but that is just the beginning of the story. Fixed Sensor Design
More informationReverse Engineering Techniques in CMOS Based Non-Volatile Memory (NVM)
Reverse Engineering Techniques in CMOS Based Non-Volatile Memory (NVM) EMBEDDED SRAM & NVM LOGIC LIBRARIES EMBEDDED T&R MEMORY DEVELOPMENT SW INTERFACE IP Agenda Applications Requiring Standard CMOS NVM
More informationPedometer 3 Click. PID: MIKROE 3259 Weight: 24 g
Pedometer 3 Click PID: MIKROE 3259 Weight: 24 g The Pedometer 3 click is a tri-axis acceleration sensing Click board utilizing the KX126-1063. An advanced three-axis acceleration sensor, the KX126-1063
More information