High Performance Electronics Integration in Flexible Technology

Transcription

1 High Performance Electronics Integration in Flexible Technology February 10,

2 2011 American Semiconductor, Inc. All rights reserved. About American Semiconductor Corporate Headquarters Boise, ID Engineering Design, Process, Modeling Operations/Fab Management Test & Characterization Cleanroom Sales, Marketing, Administration Manufacturing San Jose, CA; Austin, TX Fab/Process Engineering Manufacturing Specialty Process Modules Privately Held Founded November, 2001 Product Lines Design Services Turnkey Design Solutions Custom Fabrication Your Silicon Made. Simple. FleX - Silicon on Polymer ITAR Compliant; Trusted Certification in Progress 2 DoME 45nm CMOS AMERICAN SEMICONDUCTOR INC. This work is sponsored by the 2007 Supplier of the Year Air Force Research Laboratory (AFRL))

3 FleX Process Overview 2011 American Semiconductor, Inc. All rights reserved. 3 Start with a CMOS wafer Polymer CMOS SOI Substrate 4 CMOS Polymer Remove carrier substrate FleX is a substrate conversion process that delivers low cost, high performance CMOS in a flexible format. Add polymer layer FleX enables a new generation of durable, pliable ICs that greatly improves the ability to integrate CMOS functionality in flexible electronics. 3 Carrier Substrate Polymer CMOS Remove original substrate FleX technology combined with Flexfet Advanced CMOS provides an Ultra Low Power solution that further benefits portable and battery powered applications. Carrier Substrate Polymer CMOS 2 SOI Substrate 1 Attach to carrier substrate FleX - Silicon on Polymer

4 FleX Motivaton 2011 American Semiconductor, Inc. All rights reserved. 4 Flexibility. For integration into flexible systems or conformal on mounting of non-flat surfaces. Durability. No silicon substrate improves tolerance to both mechanical and thermal shock. Size. Ultra thin form factor is useful in multi-chip packages and 3DIC. Burghartz Ultra-Thin Chips and Related Applications, A New Paradigm in Silicon Technology, IEEE 2009

5 FleX CMOS Test Setup 2011 American Semiconductor, Inc. All rights reserved. 5 Signatone manual wafer probe station JD Instruments mixed-signal tester Tektronix digital oscilloscope Flexfet SOI CMOS process Planar double gate transistors 3-level metal aluminum interconnect Tungsten contacts and local interconnect 101-stage inverter ring oscillators Independent Double-Gate V Double-Gate (DG) V IDG Flexfet Drain DG Flexfet Drain Top Gate Bottom Gate Gates Source Source

6 Video 2011 American Semiconductor, Inc. All rights reserved. 6 FleX: First circuit test demonstration Feb 2011

7 Flexfet on FleX Test Results 2011 American Semiconductor, Inc. All rights reserved Stage Tunable Inverter Ring Oscillator Operating at 1.8V Tuning range: Full Thickness Wafer -19% to +20% FleX CMOS SOP -19% to +22% Full Thickness SOI CMOS Wafer 40 Gate Delay (ps) Reduced Parasitic Capacitance FleX CMOS Silicon on Polymer 10 0 Max Freq Nom Freq Min Freq

8 Low Power Flexible Electronics State-of-the-Art OTFT 2011 American Semiconductor, Inc. All rights reserved. Proprietary Information 8 Organic Thin Film Transistors Low-Voltage Ring Oscillators Based on Polyelectrolyte-Gated Polymer Thin-Film Transistors, L. Herlogsson, et al, Advanced Materials, 2010, vol. 22, pp

9 Low Power Flexible Electronics FleX CMOS 2011 American Semiconductor, Inc. All rights reserved. Proprietary Information 9 1.0E E E 01 Organic Thin Film Transistors 1.0E E 03 FleX CMOS Feb E E E E E E E E 11 PEALD ZnO TFTs Electron Devices, Feb E Supply Voltage (V)

10 FleX Potential Applications American Semiconductor, Inc. All rights reserved. 10 Flexible Displays Picture from ASU Flexible Display Center Picture from apple.com Flexible Electronics Picture from memagazine.org Burghartz Ultra-Thin Chips and Related Applications, A New Paradigm in Silicon Technology, IEEE 2009 Smart Consumer Electronics 3-D IC Integration Thin Multi-Chip Stacking

11 Thank You 2011 American Semiconductor, Inc. All rights reserved. American Semiconductor Inc., the American Semiconductor logo, Flexfet, FleX, and the Flexfet logo are trademarks of American Semiconductor, Inc. All other trademarks are the property of their respective owners. American Semiconductor, Inc South Vista Avenue, Suite 230 Boise, ID Tel: Fax: