Driving Leading Edge Microprocessor Technology

Transcription

1 Driving Leading Edge Microprocessor Technology Dr. Hans Deppe Corporate Vice President & General Manager AMD in Dresden

2 AMD Overview A leading global supplier of innovative semiconductor solutions for the personal and enterprise computing, communications and consumer electronic markets Founded: 1969 Headquarters: Sunnyvale, California Employees: ~16,700 worldwide Sales 2004: $ 5.0 billion Revenue increase 2003/2004: 42 % Sales Mix: 78% international Products: - Microprocessors & Personal Connectivity Solutions - Flash Memory Products 2

3 AMD worldwide Sunnyvale, California AMD global HQ Spansion global HQ Submicron Development Center Boston, Massachusetts Boston Design Center ~ $ 5 billion investment Aizu-Wakamatsu/ Tokyo, Japan Flash Memory Fabs Spansion Japan HQ Japan Engineering Lab Longmont, CO Design Center Dresden, Germany Fab 30 Fab 36 Microprocessors Dresden Design Center Bangkok, Thailand Flash Memory Assembly and Test Suzhou, China Microprocessor and Flash Memory Assembly and Test Austin, Texas Fab 25 Flash Memory Computation Product Group Personal Connectivity Solutions Group Banglore, India Engineering Center Singapore Microprocessor Test, Mark and Pack Penang/ Kuala Lumpur, Malaysia Microprocessor and Flash Assembly Test and Packaging 3

4 AMD Fab 30 Leading Edge for Microprocessor Technology AMD Fab 30 runs full product range in high volume production Leadership: First to volume copper First to volume SOI First to volume low-k AMD Opteron processor and AMD Athlon 64 processor running mature yields 90 nm in volume production 4

5 AMD Fab 36 AMD s next flagship Based on the superior manufacturing performance of AMD in Dresden Planned for 65nm, 45nm and 32nm technology generations Technology alliance between AMD & IBM Planned investment until 2007: $2.5 Billion November 2003: Groundbreaking November 2004: Ready for Equipment March 2005: First wafer started October 2005: Grand Opening 2006: Volume shipments to market AMD Fab 36 AMD Fab 30 5

6 Highly Successful 90nm Technology Transition High yield at start of volume production Builds on 130nm SOI success Increased thermal efficiencies Significant die-size reductions Addition of strained silicon transistor technology 130nm 193mm 2 130nm 145mm 2 90nm 115mm 2 90nm 84mm 2 6

7 SOI: Dramatically Improved Performance and Power Efficiencies Silicon-on-Insulator Advantages: At equivalent Off current, SOI can provides up to 18% performance improvement over bulk-si technology Vertical Cj component is eliminated thus RC delay can be decreased Higher Reliability due to elimination of latch-up effect and higher radiation hardness Delay/Stage (ps) Bulk S V DD =1.4V T=25 o C PD/SOI Bulk-Si G P-substrate I D-off (n+2p) (na/μm) D SOI S G SiO2 BOX D 7

8 Eliminating Architectural Bottlenecks CPU CPU CPU CPU 8 GB/S 8 GB/S 8 GB/S I/O I/O Hub Hub Memory Controller PCI-E PCI-E Bridge Bridge Hub Hub PCI-E PCI-E Bridge PCI-E Bridge PCI-E Bridge PCI-E Bridge PCI-E Bridge Bridge PCI-E PCI-E Bridge Bridge PCI-E PCI-E Bridge Bridge 8 GB/S I/O I/O Hub Hub USB USB PCI PCI Legacy x86 Architecture 20-year old front-side bus architecture CPUs, Memory, I/O all share a bus Major bottleneck to performance Faster CPUs or more cores performance AMD64 Technology with Direct Connect Architecture Industry-standard AMD64 technology AMD s revolutionary Direct Connect Architecture eliminates FSB bottleneck HyperTransport Technology interconnect for high bandwidth and low latency 8

9 Transistor Roadmap Source: AMD and ITRS-Roadmap from the SIA SOI and Copper Technology Lg = 32 nm Lg = 13 nm Transistor For 90 nm Lg = 22 nm 45nm-Generation 32nm-Generation 65nm-Generation 1.5 B Transistors per Chip 90nm-Generation 380 M Transistors per Chip (2003) (2005) 180 M Transistors per Chip (2007) (2009) 22nm-Generation (2011) 3.01 B Transistors per Chip 9

10 APM: Unique Technology Framework Over 400 AMD patented or patent-pending technologies Yield Management Systems Integrated Production Scheduling Equipment Performance Optimization APM Framework Advanced Process Control Product Performance Targeting Highly automated and synchronized decision making Five integrated algorithmic analysis systems much more than just APC Includes proprietary technologies, logic and business processes Fed by fab-wide tool and data integration 10

11 APM is More than Great Technology Seamless blending of the best people and the best technologies is what makes APM so successful Unique Technology Framework APM Unique Employee Skill Sets 11

12 Ongoing Success in Saxony Dresden: One of Europe s largest microelectronics clusters Center of operations for AMD microprocessor fabrication Tremendous ongoing success for AMD, The Free State of Saxony, and Germany Over 7,000 jobs directly or indirectly created by AMD since

13 Delivering on the Promise: Balance of AMD s engagement in Dresden Plan 1995 Plan 2007 Direct jobs ~3.000 Indirect jobs* ~2.100 ~4.500 Jobs created ~3.500 ~7.500 Investment in $ billions 1,9 ~5,0 * Creation of ~ 1.5 indirect jobs per each direct AMD job Source: DIW, AMD We have made commitments we have met our commitments. 13

14 AMD, the AMD Arrow logo and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other product names used in this presentation are for identification purposes only and may be trademarks of their respective companies. Copyright 2005 Advanced Micro Devices, Inc. All rights reserved. 14